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Research Index
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2093 program listings.

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Effect of Temperature and Current Stressing  on Low Temperature Solder BGA Drop Performance
Effect of Temperature and Current Stressing on Low Temperature Solder BGA Drop Performance
Simultaneous temperature and current stressing affect the performance of LTS BGA solder joints in drop testing, with both increased temperature and current level showing larger impacts for the same stress duration.
Analysis Lab

How to Set Up a Successful Blind Via Hole Fill DC Plating Process
How to Set Up a Successful Blind Via Hole Fill DC Plating Process
Successful via fill plating requires a specific electrolyte; the copper concentration is as high 50 - 60 g/L copper with low sulfuric acid at 30 - 60 g/L.
Production Floor

Heterogeneous Data Teaches Robots Range of Tasks
Heterogeneous Data Teaches Robots Range of Tasks
Researchers have developed a technique that combines heterogeneous data from many sources into one system that can teach any robot a wide range of tasks.
Technology Briefing

Non-Contact Measurement of Conformal Coating Thickness
Non-Contact Measurement of Conformal Coating Thickness
This study aims to highlight the application of chromatic confocal microscopy (CCM), an optical technique used to characterize 2D/3D surfaces.
Analysis Lab

Investigation of Copper Sinter Material for Die Attach
Investigation of Copper Sinter Material for Die Attach
3 copper powders were tested for their feasibility to use as die attach material for pressure sintering process without prior treatment with reducing agents.
Materials Tech

Extending 3D MRS Sensor Technology to Address Challenging Applications
Extending 3D MRS Sensor Technology to Address Challenging Applications
There is an increasing need for highly accurate 3D inspection and measurement capabilities for applications in SMT, semiconductor and metrology markets.
Production Floor

Additive Manufacturing-Enabled Wireless Flexible Hybrid Electronics
Additive Manufacturing-Enabled Wireless Flexible Hybrid Electronics
This paper reports an ensemble of strategies for the successful miniaturization of EEG in a fully-flexible, wearable and wireless platform.
Analysis Lab

Intrusive Soldering vs. Wave Solder
Intrusive Soldering vs. Wave Solder
We are wave soldering with top and bottom side preheat. Would a pin in paste, or intrusive soldering, be a better option than wave soldering? The Assembly Brothers, Phil Zarrow and Jim Hall, address this question.
Board Talk

Reliability of New SAC-Bi Solder Alloys in Thermal Cycling with Aging
Reliability of New SAC-Bi Solder Alloys in Thermal Cycling with Aging
The effect of micro-alloying to SAC based solder materials on component reliability was studied, considering various factors of solder paste and surface finish.
Materials Tech

Stacking Multiple Surfaces of Transistors and Semiconducting Elements
Stacking Multiple Surfaces of Transistors and Semiconducting Elements
Chip manufacturers are looking to build up rather than out. The industry is aiming to stack multiple surfaces of transistors and semiconducting elements.
Technology Briefing

Programs



Board Talk


Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
Phil Zarrow
Phil Zarrow - With over 50 years of experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials, and processes.
Jim Hall
Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment, and process basics. He is a pioneer in the science of reflow.

Defect of the Month


Bob Willis
Defect of the month is presented by Bob Willis. For decades Bob has been providing solutions for process and product failure troubleshooting, in-house training, process engineering support, and product failure analysis.

Mysteries of Science


Dr. Gilleo
Mysteries of Science are written by Dr. Ken Gilleo. Dr. Gilleo is a chemist, inventor, and general problem solver. Ken has been tracking industrial forensics and collecting case histories for decades.

Technology Briefing


Technology Briefing
Brought to you by association with Audio-Tech, publishers of Tends Magazine where you'll learn about big ideas, new products, breakthrough concepts, and trailblazing technologies.

Channels



Adhesives, Coating, Dispensing


These programs cover adhesives, epoxies, bonding, coatings, tapes, jetting, dispensing and more.

Assembly, Printing, Pick & Place


These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more.

Baking, Ovens, Moisture Control


These programs cover batch and inline baking, curing, ovens, moisture control, vacuum sealing and more.

Cleaning, Washing, Solvents


These programs cover manual and automated cleaning systems, water and other solvent based cleaning and cleaning solutions.

Contamination, Defects, Whiskers


These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.

Environment, RoHS, Recycling


These programs cover the environment, RoHS, recycling, pollution, storage, ESD, waste and more.

Flip-Chip, MEMS, Semiconductors


These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more.

Operations, Productivity, Supply


These programs cover overall operations, plan productivity, issues with the supply chain and more.

PC Fab, Board Design, Laminates


These programs cover bare PC board fabrication, circuit board design, laminates and more.

Reflow Soldering, Profiling


These programs cover reflow soldering, vapor phase, profiling, thermocouples, data collection and more.

Rework, Repair, Modification


These programs cover BGA rework, BGA reballing, tinning, damage repair, jumper wires, modifications and more.

Soldering, Selective, Wave


These programs cover manual and automated soldering, selective soldering, wave soldering and more.

Solders, Fluxes, Pastes


These programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more.

Test, Inspection, X-Ray


These programs cover manual and automated test, manual and automated optical inspection, x-ray and more.
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