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1885 program listings.

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What is Considered Acceptable PCB Rework and Repair?
What is Considered Acceptable PCB Rework and Repair?
An operator attempted to repair three damaged conductors using bus wire overcoated with epoxy. Do you consider this repair acceptable? Is there an IPC spec we should follow? Jim Hall and Phil Zarrow, The Assembly Brothers, address this question.
Board Talk

Corrosion Resistant Servers for Free-Air Cooling Data Centers
Corrosion Resistant Servers for Free-Air Cooling Data Centers
This paper describes a corrosion resistant server design suitable for reliable operation in a free-air cooling data center.
Production Floor

Microchips Could Be Used to Activate Excess Dopants
Microchips Could Be Used to Activate Excess Dopants
As microchips continue to shrink, silicon must be doped, or mixed, with higher concentrations of phosphorus to produce the desired current.
Technology Briefing

Cross-Sectioning of SMT and PCB Related Architectures
Cross-Sectioning of SMT and PCB Related Architectures
Techniques in performing precision and analytical micro-sections, which fuse the techniques common in preparation of silicon wafers and bulk materials are discussed.
Analysis Lab

Digitally Printed Battery Design
Digitally Printed Battery Design
Battery operated devices have grown smaller while energy demands have increased. This paper provides a review of battery construction.
Materials Tech

Void-Free Soldering with a New Vapor-Phase with Vacuum Technology
Void-Free Soldering with a New Vapor-Phase with Vacuum Technology
Equipment has been developed to achieve void-free joints under these conditions utilizing modern condensation reflow technology.
Production Floor

Electrochemical Reliability as a Function of Component Standoff
Electrochemical Reliability as a Function of Component Standoff
The purpose of this paper is to research the activity of flux residues as a function of the standoff height using insulation resistance.
Analysis Lab

Why Uneven Conformal Coating?
Why Uneven Conformal Coating?
We are experiencing an issue with our conformal coating. On matte finish boards the coating is vibrating away from some others and building up in others.
Board Talk

Lead-Free Alloys with Ultra-High Thermo-Mechanical Reliability
Lead-Free Alloys with Ultra-High Thermo-Mechanical Reliability
Alpha focused on improving the properties of the bulk solder as well as controlled growth of interfacial IMCs and alloy microstructure.
Materials Tech

Chip-Based Optical Phased Arrays for Steering Laser Beams in Lidar
Chip-Based Optical Phased Arrays for Steering Laser Beams in Lidar
Devices known as chip-based optical phased arrays can quickly and precisely steer light in a non-mechanical way for lidar systems.
Technology Briefing

Programs



Board Talk


Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
Phil Zarrow
Phil Zarrow - With over 35 years of experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials, and processes.
Jim Hall
Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment, and process basics. He is a pioneer in the science of reflow.

Defect of the Month


Bob Willis
Defect of the month is presented by Bob Willis. For decades Bob has been providing solutions for process and product failure troubleshooting, in-house training, process engineering support, and product failure analysis.

Mysteries of Science


Dr. Gilleo
Mysteries of Science are written by Dr. Ken Gilleo. Dr. Gilleo is a chemist, inventor, and general problem solver. Ken has been tracking industrial forensics and collecting case histories for decades.

Technology Briefing


Technology Briefing
Brought to you by association with Audio-Tech, publishers of Tends Magazine where you'll learn about big ideas, new products, breakthrough concepts, and trailblazing technologies.

Channels



Adhesives, Coating, Dispensing


These programs cover adhesives, epoxies, bonding, coatings, tapes, jetting, dispensing and more.

Assembly, Printing, Pick & Place


These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more.

Baking, Ovens, Moisture Control


These programs cover batch and inline baking, curing, ovens, moisture control, vacuum sealing and more.

Cleaning, Washing, Solvents


These programs cover manual and automated cleaning systems, water and other solvent based cleaning and cleaning solutions.

Contamination, Defects, Whiskers


These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.

Environment, RoHS, Recycling


These programs cover the environment, RoHS, recycling, pollution, storage, ESD, waste and more.

Flip-Chip, MEMS, Semiconductors


These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more.

Operations, Productivity, Supply


These programs cover overall operations, plan productivity, issues with the supply chain and more.

PC Fab, Board Design, Laminates


These programs cover bare PC board fabrication, circuit board design, laminates and more.

Reflow Soldering, Profiling


These programs cover reflow soldering, vapor phase, profiling, thermocouples, data collection and more.

Rework, Repair, Modification


These programs cover BGA rework, BGA reballing, tinning, damage repair, jumper wires, modifications and more.

Soldering, Selective, Wave


These programs cover manual and automated soldering, selective soldering, wave soldering and more.

Solders, Fluxes, Pastes


These programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more.

Test, Inspection, X-Ray


These programs cover manual and automated test, manual and automated optical inspection, x-ray and more.