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1937 program listings.

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How Do You Remove Oxidation from PCBs?
How Do You Remove Oxidation from PCBs?
What is the best method for cleaning bare PCBs with small amounts of oxidation? I know that proper storage and handling may help. Jim Hall and Phil Zarrow, The Assembly Brothers, share their suggestions for this scenario.
Board Talk

Rheology and Wetting Characterizations of Flux and Solder Paste
Rheology and Wetting Characterizations of Flux and Solder Paste
In this paper, we will discuss a solder paste wetting method. A high resolution solder wetting balance was used for the solder paste wettability analysis.
Production Floor

System to Efficiently Produce Solar Thermochemical Hydrogen
System to Efficiently Produce Solar Thermochemical Hydrogen
In a study recently published, engineers lay out the conceptual design for a system that can efficiently produce “solar thermochemical hydrogen.”
Technology Briefing

Accelerated Corrosion Testing of DRAM Modules for Data Centers
Accelerated Corrosion Testing of DRAM Modules for Data Centers
To investigate corrosion problems in electronic products for server applications, mixed flowing gas (MFG) is widely used as an accelerated testing method.
Analysis Lab

Conformal Coatings in Preventing Resistor Silver Sulfide Corrosion
Conformal Coatings in Preventing Resistor Silver Sulfide Corrosion
The evaluation of conformal coatings to mitigate silver sulfide corrosion of thick film resistors is discussed.
Materials Tech

Durable Conductive Inks for Robust Printed Electronics
Durable Conductive Inks for Robust Printed Electronics
Polymer Thick Film based printed electronics has improved in durability and is now a proven alternative to copper circuitry in many applications.
Production Floor

Tin Whisker Testing and Modeling
Tin Whisker Testing and Modeling
The elimination of lead from consumer electronics has resulted in an increase in tin whisker risk mitigation using dual-use commercial/aerospace components.
Analysis Lab

Why Should We Consider Smart Feeders?
Why Should We Consider Smart Feeders?
In selecting a new pick and place line, why should we consider smart feeders? How can we justify the added cost?
Board Talk

Signal Transmission Loss Due to Surface Roughness
Signal Transmission Loss Due to Surface Roughness
In this research, parameters of various types of transmission line structures on an evaluation board were measured and analyzed in detail.
Materials Tech

Zinc-Air Batteries as an Alternative to Lithium-Ion Batteries
Zinc-Air Batteries as an Alternative to Lithium-Ion Batteries
Zinc-air batteries are a better alternative to lithium-ion batteries because of their low cost, environmental friendliness, high theoretical energy density, and safety.
Technology Briefing

Programs



Board Talk


Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
Phil Zarrow
Phil Zarrow - With over 35 years of experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials, and processes.
Jim Hall
Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment, and process basics. He is a pioneer in the science of reflow.

Defect of the Month


Bob Willis
Defect of the month is presented by Bob Willis. For decades Bob has been providing solutions for process and product failure troubleshooting, in-house training, process engineering support, and product failure analysis.

Mysteries of Science


Dr. Gilleo
Mysteries of Science are written by Dr. Ken Gilleo. Dr. Gilleo is a chemist, inventor, and general problem solver. Ken has been tracking industrial forensics and collecting case histories for decades.

Technology Briefing


Technology Briefing
Brought to you by association with Audio-Tech, publishers of Tends Magazine where you'll learn about big ideas, new products, breakthrough concepts, and trailblazing technologies.

Channels



Adhesives, Coating, Dispensing


These programs cover adhesives, epoxies, bonding, coatings, tapes, jetting, dispensing and more.

Assembly, Printing, Pick & Place


These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more.

Baking, Ovens, Moisture Control


These programs cover batch and inline baking, curing, ovens, moisture control, vacuum sealing and more.

Cleaning, Washing, Solvents


These programs cover manual and automated cleaning systems, water and other solvent based cleaning and cleaning solutions.

Contamination, Defects, Whiskers


These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.

Environment, RoHS, Recycling


These programs cover the environment, RoHS, recycling, pollution, storage, ESD, waste and more.

Flip-Chip, MEMS, Semiconductors


These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more.

Operations, Productivity, Supply


These programs cover overall operations, plan productivity, issues with the supply chain and more.

PC Fab, Board Design, Laminates


These programs cover bare PC board fabrication, circuit board design, laminates and more.

Reflow Soldering, Profiling


These programs cover reflow soldering, vapor phase, profiling, thermocouples, data collection and more.

Rework, Repair, Modification


These programs cover BGA rework, BGA reballing, tinning, damage repair, jumper wires, modifications and more.

Soldering, Selective, Wave


These programs cover manual and automated soldering, selective soldering, wave soldering and more.

Solders, Fluxes, Pastes


These programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more.

Test, Inspection, X-Ray


These programs cover manual and automated test, manual and automated optical inspection, x-ray and more.