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2036 program listings.

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How Long Solder Paste Can Be Left On a Stencil Without Activity
How Long Solder Paste Can Be Left On a Stencil Without Activity
How long can we leave solder paste on a stencil without any activity? If activity means not printing, then we are talking about a pause or abandoned time. The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this scenario and share their own experiences.
Board Talk

Direct Metallization for Printed Circuit Board Manufacturing
Direct Metallization for Printed Circuit Board Manufacturing
Since Multi-Layer Printed Circuit Boards with holes appeared, the processes making holes conductive have played critical roles to achieve MLB’s function.
Production Floor

AI, Digitalization, & the Outlook for the U.S. Economy
AI, Digitalization, & the Outlook for the U.S. Economy
Trends in U.S. demography are poised to complement the deployment of maturing AI and digitalization. This will transform industries and create new ones.
Technology Briefing

Tin-Bismuth Low Temperature Solder Electromigration Behavior
Tin-Bismuth Low Temperature Solder Electromigration Behavior
This paper reviews results reported from accelerated testing compared with cross-sectional results from components on functional systems with known time in service.
Analysis Lab

Insertion Loss Comparisons of High Frequency PCBs
Insertion Loss Comparisons of High Frequency PCBs
PCBs have been used for many years in low loss, high frequency microwave applications and many have become increasingly complex.
Materials Tech

Rework Challenges for Leading Edge Components BGA, QFN and LED
Rework Challenges for Leading Edge Components BGA, QFN and LED
This paper outlines rework processes for many challenging components including BGA, QFN/BTC, and LED packages.
Production Floor

TOF SIMS Analysis for SnO Determination
TOF SIMS Analysis for SnO Determination
During the production of Lead-Free Hot Air Solder Leveling (LF HASL), non-wetting issues in several components were found including BGA pad.
Analysis Lab

Should We Invest in 3D Optical Inspection?
Should We Invest in 3D Optical Inspection?
We are correcting many solder defects. The search for defects is taking too long. Should we go with a 3D AOI system to save inspection time?
Board Talk

Essential Tools to Combat the Ingress of Counterfeit Materials
Essential Tools to Combat the Ingress of Counterfeit Materials
The tools to ensure that counterfeits are not polluting any given supply chain have not kept pace with the changing needs.
Materials Tech

Humanoid Robots are Finally on the Way
Humanoid Robots are Finally on the Way
Over three years, there has been an explosion of companies racing to integrate the hardware and software that will constitute a viable humanoid robot.
Technology Briefing

Programs



Board Talk


Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
Phil Zarrow
Phil Zarrow - With over 50 years of experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials, and processes.
Jim Hall
Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment, and process basics. He is a pioneer in the science of reflow.

Defect of the Month


Bob Willis
Defect of the month is presented by Bob Willis. For decades Bob has been providing solutions for process and product failure troubleshooting, in-house training, process engineering support, and product failure analysis.

Mysteries of Science


Dr. Gilleo
Mysteries of Science are written by Dr. Ken Gilleo. Dr. Gilleo is a chemist, inventor, and general problem solver. Ken has been tracking industrial forensics and collecting case histories for decades.

Technology Briefing


Technology Briefing
Brought to you by association with Audio-Tech, publishers of Tends Magazine where you'll learn about big ideas, new products, breakthrough concepts, and trailblazing technologies.

Channels



Adhesives, Coating, Dispensing


These programs cover adhesives, epoxies, bonding, coatings, tapes, jetting, dispensing and more.

Assembly, Printing, Pick & Place


These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more.

Baking, Ovens, Moisture Control


These programs cover batch and inline baking, curing, ovens, moisture control, vacuum sealing and more.

Cleaning, Washing, Solvents


These programs cover manual and automated cleaning systems, water and other solvent based cleaning and cleaning solutions.

Contamination, Defects, Whiskers


These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.

Environment, RoHS, Recycling


These programs cover the environment, RoHS, recycling, pollution, storage, ESD, waste and more.

Flip-Chip, MEMS, Semiconductors


These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more.

Operations, Productivity, Supply


These programs cover overall operations, plan productivity, issues with the supply chain and more.

PC Fab, Board Design, Laminates


These programs cover bare PC board fabrication, circuit board design, laminates and more.

Reflow Soldering, Profiling


These programs cover reflow soldering, vapor phase, profiling, thermocouples, data collection and more.

Rework, Repair, Modification


These programs cover BGA rework, BGA reballing, tinning, damage repair, jumper wires, modifications and more.

Soldering, Selective, Wave


These programs cover manual and automated soldering, selective soldering, wave soldering and more.

Solders, Fluxes, Pastes


These programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more.

Test, Inspection, X-Ray


These programs cover manual and automated test, manual and automated optical inspection, x-ray and more.