Circuit Insight Programs

Research Index

PRIOR

Page 1 of 204

2037 program listings.

What Causes Solder Balls During Hand Soldering?
We have experienced solder balls during automated reflow. Now we are finding solder balls during the hand soldering. Phil Zarrow and Jim Hall, The Assembly Brothers, offer their own suggestions and recommendations for eliminating solder balls.
Board Talk

Electronic Packages and Modules Based on Embedded Die Technologies
This paper describes the use of embedded die technologies and the development of work in the on power electronic applications.
Production Floor

Wireless Network Transmits Data from Microelectronic Chips
A research team has developed a wireless communication network that can transmit, receive and decode data from thousands of microelectronic chips.
Technology Briefing

Interconnect Mechanical Performance with Variable UBM and Decreasing Bump Size
Current work seeks to better understand how the indium (In) bump size affects the respective interface kinetics and subsequent mechanical properties.
Analysis Lab

Low Temperature Solder Joint Shear Strength of Components
This paper studies the effect of several factors on the shear strength of a wide range of components assembled using LTS paste.
Materials Tech

Methods to Get Volatile Compounds Out of Reflow Process
With the introduction of lead-free soldering operating temperatures increased, and the chemistry of solder paste has been modified.
Production Floor

Influence of Plating Quality on Reliability of Microvias
This paper addresses the influence of voids on reliability of microvias, as well as the interface delamination issue.
Analysis Lab

Is There a Spacing Spec for SMD Components?
Is there a minimum spacing requirement or should we apply SMT components to comply with SMT pick and place systems on the market?
Board Talk

Reliability of Doped Lead-Free Solder Joints Under Isothermal Aging
This paper presents harsh environment reliability test results for lead-free solder pastes with and without the presence of a variety of dopant elements.
Materials Tech

Carbon Dioxide and Lignin Offer Alternative to Traditional Plastic
Researchers have created a potential alternative to traditional petroleum-based plastic made from carbon dioxide, plus lignin, a component of wood.
Technology Briefing

Programs

Board Talk

Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.

Phil Zarrow - With over 50 years of experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials, and processes.

Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment, and process basics. He is a pioneer in the science of reflow.

Defect of the Month

Defect of the month is presented by Bob Willis. For decades Bob has been providing solutions for process and product failure troubleshooting, in-house training, process engineering support, and product failure analysis.

Mysteries of Science

Mysteries of Science are written by Dr. Ken Gilleo. Dr. Gilleo is a chemist, inventor, and general problem solver. Ken has been tracking industrial forensics and collecting case histories for decades.

Technology Briefing

Brought to you by association with Audio-Tech, publishers of Tends Magazine where you'll learn about big ideas, new products, breakthrough concepts, and trailblazing technologies.

Channels

Adhesives, Coating, Dispensing

These programs cover adhesives, epoxies, bonding, coatings, tapes, jetting, dispensing and more.

Assembly, Printing, Pick & Place

These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more.

Baking, Ovens, Moisture Control

These programs cover batch and inline baking, curing, ovens, moisture control, vacuum sealing and more.

Cleaning, Washing, Solvents

These programs cover manual and automated cleaning systems, water and other solvent based cleaning and cleaning solutions.

Contamination, Defects, Whiskers

These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.

Environment, RoHS, Recycling

These programs cover the environment, RoHS, recycling, pollution, storage, ESD, waste and more.

Flip-Chip, MEMS, Semiconductors

These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more.

Operations, Productivity, Supply

These programs cover overall operations, plan productivity, issues with the supply chain and more.

PC Fab, Board Design, Laminates

These programs cover bare PC board fabrication, circuit board design, laminates and more.

Reflow Soldering, Profiling

These programs cover reflow soldering, vapor phase, profiling, thermocouples, data collection and more.

Rework, Repair, Modification

These programs cover BGA rework, BGA reballing, tinning, damage repair, jumper wires, modifications and more.

Soldering, Selective, Wave

These programs cover manual and automated soldering, selective soldering, wave soldering and more.

Solders, Fluxes, Pastes

These programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more.

Test, Inspection, X-Ray

These programs cover manual and automated test, manual and automated optical inspection, x-ray and more.