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1944 program listings.

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Should Apertures be Home Plate or Inverted Home Plate?
Should Apertures be Home Plate or Inverted Home Plate?
Should stencil the aperture be home plate or inverted home plate? You know the performance difference between the two types. Which one is better? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their own insights.
Board Talk

Automation for Traceability and Reliability
Automation for Traceability and Reliability
In this study it was demonstrated how process traceability records need to deal with complex and variable inputs as well as challenges among our machine processes.
Production Floor

There Actually is an 'I' in Team
There Actually is an 'I' in Team
Robotic arms handle repetitive and precision movements. This change relieves operators of mundane work. They must adjust to the new work environment.

Technology Briefing

Metallurgical and Mechanical Analysis of Castellated Via Rigid-Flex Connection
Metallurgical and Mechanical Analysis of Castellated Via Rigid-Flex Connection
The reliability of castellated vias as a rigid-flex interconnection method is evaluated. This is split into metallurgical aging of joints and investigating mechanical robustness/integrity.
Analysis Lab

Novel TIM Solution with Chain Network Solder Composite
Novel TIM Solution with Chain Network Solder Composite
A novel epoxy SAC solder paste TIM system has been developed with the use of non-volatile epoxy flux. Cu filler was added to the solder paste.
Materials Tech

Wearable Electronics & Big Data = High Volume, High Mix SMT
Wearable Electronics & Big Data = High Volume, High Mix SMT
This paper explores the conflicting requirements of achieving low cost while meeting high volume, high mix requirements.
Production Floor

A Method to Investigate PCB Supplier Rework Processes and  Best Practices
A Method to Investigate PCB Supplier Rework Processes and Best Practices
This paper investigates PCB supplier rework processes, including identifying rework procedures that have potential implications to PCB functionality.
Analysis Lab

Is Customer Approval Required for Class 3 Repair?
Is Customer Approval Required for Class 3 Repair?
A non-aerospace customer's board was repaired without authorization. Does an IPC document state that customer approval is required for class 3 repairs?
Board Talk

New High-Performance Organophosphorus Flame Retardant
New High-Performance Organophosphorus Flame Retardant
A non-halogen flame retardant has been developed for high performance applications. Resin performance data are presented.
Materials Tech

AI and Precision Agriculture Address Farming Problems
AI and Precision Agriculture Address Farming Problems
Automation with biology and chemistry to create a farming revolution which enabled a fraction of the population to deliver more than had formerly produced.
Technology Briefing

Programs



Board Talk


Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
Phil Zarrow
Phil Zarrow - With over 35 years of experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials, and processes.
Jim Hall
Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment, and process basics. He is a pioneer in the science of reflow.

Defect of the Month


Bob Willis
Defect of the month is presented by Bob Willis. For decades Bob has been providing solutions for process and product failure troubleshooting, in-house training, process engineering support, and product failure analysis.

Mysteries of Science


Dr. Gilleo
Mysteries of Science are written by Dr. Ken Gilleo. Dr. Gilleo is a chemist, inventor, and general problem solver. Ken has been tracking industrial forensics and collecting case histories for decades.

Technology Briefing


Technology Briefing
Brought to you by association with Audio-Tech, publishers of Tends Magazine where you'll learn about big ideas, new products, breakthrough concepts, and trailblazing technologies.

Channels



Adhesives, Coating, Dispensing


These programs cover adhesives, epoxies, bonding, coatings, tapes, jetting, dispensing and more.

Assembly, Printing, Pick & Place


These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more.

Baking, Ovens, Moisture Control


These programs cover batch and inline baking, curing, ovens, moisture control, vacuum sealing and more.

Cleaning, Washing, Solvents


These programs cover manual and automated cleaning systems, water and other solvent based cleaning and cleaning solutions.

Contamination, Defects, Whiskers


These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.

Environment, RoHS, Recycling


These programs cover the environment, RoHS, recycling, pollution, storage, ESD, waste and more.

Flip-Chip, MEMS, Semiconductors


These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more.

Operations, Productivity, Supply


These programs cover overall operations, plan productivity, issues with the supply chain and more.

PC Fab, Board Design, Laminates


These programs cover bare PC board fabrication, circuit board design, laminates and more.

Reflow Soldering, Profiling


These programs cover reflow soldering, vapor phase, profiling, thermocouples, data collection and more.

Rework, Repair, Modification


These programs cover BGA rework, BGA reballing, tinning, damage repair, jumper wires, modifications and more.

Soldering, Selective, Wave


These programs cover manual and automated soldering, selective soldering, wave soldering and more.

Solders, Fluxes, Pastes


These programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more.

Test, Inspection, X-Ray


These programs cover manual and automated test, manual and automated optical inspection, x-ray and more.