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Research Index
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2093 program listings.

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Development of a High-Density Adaptive Redistribution Technology for Embedded High I/O Components
Development of a High-Density Adaptive Redistribution Technology for Embedded High I/O Components
Improving the performance of semiconductor chips and advancing packaging features are critical. One solution to producing high performance electrical systems to perform computationally intensive functions in volume constrained products is the use of miniaturized packages with advanced embedded components.
Production Floor

Utilizing an Alternative Solder Paste to Improve the PCB Assembly Process
Utilizing an Alternative Solder Paste to Improve the PCB Assembly Process
Results from an investigation that studied and characterized a novel lead-free solder paste as compared to traditional solder materials will be presented.
Production Floor

America Risks Losing Its Status As the Most Innovative Place on Earth
America Risks Losing Its Status As the Most Innovative Place on Earth
America holds a dominant position the Deep-Tech sectors from Artificial Intelligence to Biotechnology. This dominant position is not a byproduct of geography.
Technology Briefing

D-PAK Voiding: A Study to Determine the Origins of D-PAK Voiding
D-PAK Voiding: A Study to Determine the Origins of D-PAK Voiding
This study looks at an analysis of why a D-PAK exhibits more voiding than other types of BTCs. Voiding results based on an analysis of several process variables.
Analysis Lab

Expandable Bio-based Polymers: Future for Electronics Ruggedization
Expandable Bio-based Polymers: Future for Electronics Ruggedization
This paper presents a bio-based, expandable, thermoset solution, a low density, light weight method to effectively encapsulate and protect electronic components.
Materials Tech

Homogeneous Low Temperature Soldering Technology
Homogeneous Low Temperature Soldering Technology
This paper presents key findings of enabling LTS technology on AMD’s Client BGA Packages using surface mount technology (SMT).
Production Floor

Non-Contact Measurement of Conformal Coating Thickness
Non-Contact Measurement of Conformal Coating Thickness
This study aims to highlight the application of chromatic confocal microscopy (CCM), an optical technique used to characterize 2D/3D surfaces.
Analysis Lab

Issues With BGA Rework Residue
Issues With BGA Rework Residue
After BGA rework there is an outline of residue on around the pads. Is it necessary to remove this residue to reinstall a new BGA?
Board Talk

Discrete Carbon Nanotube Implementation for use in ESD Tooling
Discrete Carbon Nanotube Implementation for use in ESD Tooling
This research illustrates the improvement in volume and surface resistivity for trays and tooling fixtures manufactured usin functionalized carbon nanotubes.
Materials Tech

Leveraging America's Enormous Deep Tech Advantage
Leveraging America's Enormous Deep Tech Advantage
At the same time that America’s ability to manufacture and build has atrophied, its advantage in so-called “Deep Technologies” has exploded.
Technology Briefing

Programs



Board Talk


Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
Phil Zarrow
Phil Zarrow - With over 50 years of experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials, and processes.
Jim Hall
Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment, and process basics. He is a pioneer in the science of reflow.

Defect of the Month


Bob Willis
Defect of the month is presented by Bob Willis. For decades Bob has been providing solutions for process and product failure troubleshooting, in-house training, process engineering support, and product failure analysis.

Mysteries of Science


Dr. Gilleo
Mysteries of Science are written by Dr. Ken Gilleo. Dr. Gilleo is a chemist, inventor, and general problem solver. Ken has been tracking industrial forensics and collecting case histories for decades.

Technology Briefing


Technology Briefing
Brought to you by association with Audio-Tech, publishers of Tends Magazine where you'll learn about big ideas, new products, breakthrough concepts, and trailblazing technologies.

Channels



Adhesives, Coating, Dispensing


These programs cover adhesives, epoxies, bonding, coatings, tapes, jetting, dispensing and more.

Assembly, Printing, Pick & Place


These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more.

Baking, Ovens, Moisture Control


These programs cover batch and inline baking, curing, ovens, moisture control, vacuum sealing and more.

Cleaning, Washing, Solvents


These programs cover manual and automated cleaning systems, water and other solvent based cleaning and cleaning solutions.

Contamination, Defects, Whiskers


These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.

Environment, RoHS, Recycling


These programs cover the environment, RoHS, recycling, pollution, storage, ESD, waste and more.

Flip-Chip, MEMS, Semiconductors


These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more.

Operations, Productivity, Supply


These programs cover overall operations, plan productivity, issues with the supply chain and more.

PC Fab, Board Design, Laminates


These programs cover bare PC board fabrication, circuit board design, laminates and more.

Reflow Soldering, Profiling


These programs cover reflow soldering, vapor phase, profiling, thermocouples, data collection and more.

Rework, Repair, Modification


These programs cover BGA rework, BGA reballing, tinning, damage repair, jumper wires, modifications and more.

Soldering, Selective, Wave


These programs cover manual and automated soldering, selective soldering, wave soldering and more.

Solders, Fluxes, Pastes


These programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more.

Test, Inspection, X-Ray


These programs cover manual and automated test, manual and automated optical inspection, x-ray and more.
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