| Research Index |
|
PRIOR
Page 1 of 192
NEXT
INDEX
1915 program listings.
|
|
|
|
Intrusive Soldering vs. Wave Solder
We are wave soldering with top and bottom side preheat. Would a pin in paste, or intrusive soldering, be a better option than wave soldering? The Assembly Brothers, Phil Zarrow and Jim Hall, address this question.
Board Talk
Enabling High-Speed Printing Using Low Cost Materials
Building on our expertise and testing, this paper will highlight the two trains of thought with specific focus on how low-cost materials affect print performance.
Production Floor
Turning Plastic into Carbon Nanotubes
Likely only 5% of plastic is being recycled. A team is using "flash Joule heating technique" to turn plastic into carbon nanotubes and hybrid nanomaterials.
Technology Briefing
Bending Strength of Solder Joints as a Function of Joint Length
The effect of joint length on the fracture of copper-solder-copper joints is investigated using double cantilever-beam specimens of various joint lengths.
Analysis Lab
Solder Joint Embrittlement Mechanisms, Solutions and Standards
The paper describes four case studies of solder joint embrittlement, three with Sn63Pb37 and one with SnAg3.7 solder alloy.
Materials Tech
An Introduction to the Process of Printed Electronics
While following best practices, researchers aim to create processes that ramp up the scale of production for simple circuits and integrated conductive structures.
Production Floor
3D Printed Electronics for Printed Circuit Structures
This paper shows working demonstrations of printed circuit structures, the obstacles, and the potential future of 3D printed electronics.
Analysis Lab
Reliability of Tin Lead Solder vs. Lead Free Solder
The issue of tin-lead solder versus lead-free solder reliability and whether lead in solders used for circuit board assembly impacts the reliability.
Board Talk
Effects of Mixing Solder Sphere Alloys with Bismuth-Based Pastes
In this paper, the effect of mixing solder sphere alloys with Bi-based solder pastes on the component reliability in accelerated thermal cycling is studied.
Materials Tech
Lithium-Air Battery Offers Longer Range for Vehicles
Researchers have developed a lithium-air battery that could make that a reality that could power an electric vehicle for more than a thousand miles.
Technology Briefing
|
Programs
Board Talk
Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
|
Phil Zarrow - With over 35 years of experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials, and processes.
|
|
Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment, and process basics. He is a pioneer in the science of reflow.
|
|
Defect of the Month
Defect of the month is presented by Bob Willis. For decades Bob has been providing solutions for process and product failure troubleshooting, in-house training, process engineering support, and product failure analysis.
|
Mysteries of Science
Mysteries of Science are written by Dr. Ken Gilleo. Dr. Gilleo is a chemist, inventor, and general problem solver. Ken has been tracking industrial forensics and collecting case histories for decades.
|
Technology Briefing
Brought to you by association with Audio-Tech, publishers of Tends Magazine where you'll learn about big ideas, new products, breakthrough concepts, and trailblazing technologies.
|
|
Channels
Adhesives, Coating, Dispensing
These programs cover adhesives, epoxies, bonding, coatings, tapes, jetting, dispensing and more.
|
Assembly, Printing, Pick & Place
These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more.
|
Baking, Ovens, Moisture Control
These programs cover batch and inline baking, curing, ovens, moisture control, vacuum sealing and more.
|
Cleaning, Washing, Solvents
These programs cover manual and automated cleaning systems, water and other solvent based cleaning and cleaning solutions.
|
Contamination, Defects, Whiskers
These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.
|
Environment, RoHS, Recycling
These programs cover the environment, RoHS, recycling, pollution, storage, ESD, waste and more.
|
Flip-Chip, MEMS, Semiconductors
These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more.
|
Operations, Productivity, Supply
These programs cover overall operations, plan productivity, issues with the supply chain and more.
|
PC Fab, Board Design, Laminates
These programs cover bare PC board fabrication, circuit board design, laminates and more.
|
Reflow Soldering, Profiling
These programs cover reflow soldering, vapor phase, profiling, thermocouples, data collection and more.
|
Rework, Repair, Modification
These programs cover BGA rework, BGA reballing, tinning, damage repair, jumper wires, modifications and more.
|
Soldering, Selective, Wave
These programs cover manual and automated soldering, selective soldering, wave soldering and more.
|
Solders, Fluxes, Pastes
These programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more.
|
Test, Inspection, X-Ray
These programs cover manual and automated test, manual and automated optical inspection, x-ray and more.
|
|
|
