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Research Index
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2129 program listings.

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Performance Comparison: Liquid and Pad Thermal Interface Material
Performance Comparison: Liquid and Pad Thermal Interface Material
This study tested the hypothesis that a liquid TIM with the same effective thermal conductivity as a gap pad will have lower thermal resistance in application due to its ability to wet out the interface better than a solid pad. Also hypothesize here, bondline thickness has a significant effect over total thermal resistance.
Analysis Lab

Direct Imaging and Direct Jetting of Solder Mask
Direct Imaging and Direct Jetting of Solder Mask
PCB manufacturers are challenged to fabricate denser solder mask patterns with smaller features to accommodate advanced electronic components.
Production Floor

Selective Removal of Conformal Coatings by Pulsed Ultraviolet Lasers
Selective Removal of Conformal Coatings by Pulsed Ultraviolet Lasers
To miniaturize electronics conformal coating removal solution needs to provide fine cut resolutions, without compromising quality, cost, and throughput.
Production Floor

Effect of Thermal Cycling Dwell Time on High-Performance Solder Alloys
Effect of Thermal Cycling Dwell Time on High-Performance Solder Alloys
This paper describes the planning and progress of the experimental program designed to assess the effect of a 60-minute temperature cycling dwell time.
Analysis Lab

Low Temperature Solder “Reverse Hybrid” Method
Low Temperature Solder “Reverse Hybrid” Method
This paper will review the implementation of LTS “Reverse Hybrid”, which is the assembly of a ball grid array component with LTS solder balls to the motherboard.
Materials Tech

Machine Vision-based Defect Inspection for Plated Through Hole Components
Machine Vision-based Defect Inspection for Plated Through Hole Components
This study delineates the conceptualization of a machine vision-based defect inspection model, meticulously engineered to confront the intricacies of high-throughput PCB assembly.
Production Floor

Single Device Traceability in Assembly without ECID
Single Device Traceability in Assembly without ECID
The recent evolution of data analytics allows correlation analysis from wafer fab to wafer test to assembly and packaging to product level test and field performance.
Analysis Lab

Keys for Moisture Sensitive Device Control
Keys for Moisture Sensitive Device Control
We attach travelers to every group of MSD components taken out of the moisture barrier bag. Is this enough documents on our MSD program?
Board Talk

Effect of Bi-Addition on the High Strain Rate Properties of SnAgCu Solders
Effect of Bi-Addition on the High Strain Rate Properties of SnAgCu Solders
This paper focuses on the effects of sustained high temperatures on the high strain rate of doped lead-free solders operating between -65°C to 200°C.
Materials Tech

The Effect of Strain Rate on the Ductility of Bismuth-Containing Solders
The Effect of Strain Rate on the Ductility of Bismuth-Containing Solders
In this paper the authors report some preliminary results from a wider study of the effects of bismuth on the properties and behaviour of solder alloys.
Materials Tech

Programs



Board Talk


Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
Phil Zarrow
Phil Zarrow - With over 50 years of experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials, and processes.
Jim Hall
Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment, and process basics. He is a pioneer in the science of reflow.

Defect of the Month


Bob Willis
Defect of the month is presented by Bob Willis. For decades Bob has been providing solutions for process and product failure troubleshooting, in-house training, process engineering support, and product failure analysis.

Mysteries of Science


Dr. Gilleo
Mysteries of Science are written by Dr. Ken Gilleo. Dr. Gilleo is a chemist, inventor, and general problem solver. Ken has been tracking industrial forensics and collecting case histories for decades.

Technology Briefing


Technology Briefing
Brought to you by association with Audio-Tech, publishers of Tends Magazine where you'll learn about big ideas, new products, breakthrough concepts, and trailblazing technologies.

Channels



Adhesives, Coating, Dispensing


These programs cover adhesives, epoxies, bonding, coatings, tapes, jetting, dispensing and more.

Assembly, Printing, Pick & Place


These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more.

Baking, Ovens, Moisture Control


These programs cover batch and inline baking, curing, ovens, moisture control, vacuum sealing and more.

Cleaning, Washing, Solvents


These programs cover manual and automated cleaning systems, water and other solvent based cleaning and cleaning solutions.

Contamination, Defects, Whiskers


These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.

Environment, RoHS, Recycling


These programs cover the environment, RoHS, recycling, pollution, storage, ESD, waste and more.

Flip-Chip, MEMS, Semiconductors


These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more.

Operations, Productivity, Supply


These programs cover overall operations, plan productivity, issues with the supply chain and more.

PC Fab, Board Design, Laminates


These programs cover bare PC board fabrication, circuit board design, laminates and more.

Reflow Soldering, Profiling


These programs cover reflow soldering, vapor phase, profiling, thermocouples, data collection and more.

Rework, Repair, Modification


These programs cover BGA rework, BGA reballing, tinning, damage repair, jumper wires, modifications and more.

Soldering, Selective, Wave


These programs cover manual and automated soldering, selective soldering, wave soldering and more.

Solders, Fluxes, Pastes


These programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more.

Test, Inspection, X-Ray


These programs cover manual and automated test, manual and automated optical inspection, x-ray and more.
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