Circuit Insight Programs

Research Index

PRIOR

Page 1 of 205

2047 program listings.

How To Verify Cleanliness After Rework and Prior to Re-coating?
Rework on a coated assembly happens often. How do you verify cleanliness of the rework site prior to re-coating? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their expertise.
Board Talk

Jetting Conductive Adhesives with Silver Coated Polymer Particles
Tests performed in this study demonstrate that a conductive adhesive using spherical, polymer silver particles can be used for no-contact jet printing.
Production Floor

Computing After Moore's Law
The gap between computing demand and supply is growing. We are seeing a revolution due to the development of deep artificial neural networks.
Technology Briefing

Reexamination of Thermal Cycling Reliablity of BGA Components
A direct comparison was conducted between SnPb and lead-free solder joints focused on long-term thermal cycling reliability after being exposed to high-temperature aging
Analysis Lab

High Thermo-Mechanical Fatigue and Drop Shock Resistant Alloys
High-Ag, low-Ag: Which alloy fits best certain application? Here we present a report on the thermal and mechanical reliability of alloys.
Materials Tech

Engineered Tin-Copper Alloys in Selective Soldering
The performance with one alloy under design conditions that make soldering difficult demonstrate the need to evaluate the performance differences.
Production Floor

A Standardized Reliability Evaluation Framework for Connections
The iNEMI Connector Reliability Test Recommendations team recommends work to define test conditions to evaluate the expected degradation of connectors under the stress levels.
Analysis Lab

Causes of Blowholes
Are old components such as resistors and circuit breakers more likely to cause blowholes during wave soldering compared to newer components?
Board Talk

Pb-Free Water-Soluble Solder Paste Improves Reliability
This paper details a water-soluble lead-free solder paste that has improved voiding performance and washability over previous generations of solder paste.
Materials Tech

Method Produces Metals with Low Thermal Expansion without Emitting CO2
Production of metals with low thermal expansion, called Invar, are critical for the aerospace, cryogenic transport, energy, and precision instrument sectors.
Technology Briefing

Programs

Board Talk

Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.

Phil Zarrow - With over 50 years of experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials, and processes.

Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment, and process basics. He is a pioneer in the science of reflow.

Defect of the Month

Defect of the month is presented by Bob Willis. For decades Bob has been providing solutions for process and product failure troubleshooting, in-house training, process engineering support, and product failure analysis.

Mysteries of Science

Mysteries of Science are written by Dr. Ken Gilleo. Dr. Gilleo is a chemist, inventor, and general problem solver. Ken has been tracking industrial forensics and collecting case histories for decades.

Technology Briefing

Brought to you by association with Audio-Tech, publishers of Tends Magazine where you'll learn about big ideas, new products, breakthrough concepts, and trailblazing technologies.

Channels

Adhesives, Coating, Dispensing

These programs cover adhesives, epoxies, bonding, coatings, tapes, jetting, dispensing and more.

Assembly, Printing, Pick & Place

These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more.

Baking, Ovens, Moisture Control

These programs cover batch and inline baking, curing, ovens, moisture control, vacuum sealing and more.

Cleaning, Washing, Solvents

These programs cover manual and automated cleaning systems, water and other solvent based cleaning and cleaning solutions.

Contamination, Defects, Whiskers

These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.

Environment, RoHS, Recycling

These programs cover the environment, RoHS, recycling, pollution, storage, ESD, waste and more.

Flip-Chip, MEMS, Semiconductors

These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more.

Operations, Productivity, Supply

These programs cover overall operations, plan productivity, issues with the supply chain and more.

PC Fab, Board Design, Laminates

These programs cover bare PC board fabrication, circuit board design, laminates and more.

Reflow Soldering, Profiling

These programs cover reflow soldering, vapor phase, profiling, thermocouples, data collection and more.

Rework, Repair, Modification

These programs cover BGA rework, BGA reballing, tinning, damage repair, jumper wires, modifications and more.

Soldering, Selective, Wave

These programs cover manual and automated soldering, selective soldering, wave soldering and more.

Solders, Fluxes, Pastes

These programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more.

Test, Inspection, X-Ray

These programs cover manual and automated test, manual and automated optical inspection, x-ray and more.