Circuit Insight Programs

Research Index

PRIOR

Page 1 of 204

2035 program listings.

Tips When Moving a Reflow Oven
After moving a reflow oven to a different site, what steps do you need to perform on the machine for the machine to be certified? Jim Hall and Phil Zarrow, The Assembly Brothers, address this question and share their own experiences.
Board Talk

Characterization, Prevention and Removal of Particulate Matter on PCBs
This paper describes a means of measuring the DRH of minute quantities of particulate matter (1 mg or less) found on PCBs.
Production Floor

Humanoid Robots are Finally on the Way
Over three years, there has been an explosion of companies racing to integrate the hardware and software that will constitute a viable humanoid robot.
Technology Briefing

Conformal Coating Prevention and Analysis of Resistor Silver Sulfide Corrosion
This paper covers all the long-term test results as a follow-up to an earlier publication reporting interim results and preliminary conclusions.
Analysis Lab

Pb-Free Water-Soluble Solder Paste Improves Reliability
This paper details a water-soluble lead-free solder paste that has improved voiding performance and washability over previous generations of solder paste.
Materials Tech

Engineered Tin-Copper Alloys in Selective Soldering
The performance with one alloy under design conditions that make soldering difficult demonstrate the need to evaluate the performance differences.
Production Floor

Collaboration to Combat Head on Pillowing Defects
This project was designed to evaluate AXI results from different machine platforms by analyzing results from similar platforms at different facilities.
Analysis Lab

Issues With SMT Component Alignment
During automatic optical inspection our chip components are shifting. This is not limited to single components and changes daily.
Board Talk

High Thermo-Mechanical Fatigue and Drop Shock Resistant Alloys
High-Ag, low-Ag: Which alloy fits best certain application? Here we present a report on the thermal and mechanical reliability of alloys.
Materials Tech

Unleash the Unexpected for Radical Innovation
The accelerometer chip is ubiquitous in today's digital devices. Its true impact didn't become apparent until many of today's most valued applications were developed.
Technology Briefing

Programs

Board Talk

Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.

Phil Zarrow - With over 35 years of experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials, and processes.

Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment, and process basics. He is a pioneer in the science of reflow.

Defect of the Month

Defect of the month is presented by Bob Willis. For decades Bob has been providing solutions for process and product failure troubleshooting, in-house training, process engineering support, and product failure analysis.

Mysteries of Science

Mysteries of Science are written by Dr. Ken Gilleo. Dr. Gilleo is a chemist, inventor, and general problem solver. Ken has been tracking industrial forensics and collecting case histories for decades.

Technology Briefing

Brought to you by association with Audio-Tech, publishers of Tends Magazine where you'll learn about big ideas, new products, breakthrough concepts, and trailblazing technologies.

Channels

Adhesives, Coating, Dispensing

These programs cover adhesives, epoxies, bonding, coatings, tapes, jetting, dispensing and more.

Assembly, Printing, Pick & Place

These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more.

Baking, Ovens, Moisture Control

These programs cover batch and inline baking, curing, ovens, moisture control, vacuum sealing and more.

Cleaning, Washing, Solvents

These programs cover manual and automated cleaning systems, water and other solvent based cleaning and cleaning solutions.

Contamination, Defects, Whiskers

These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.

Environment, RoHS, Recycling

These programs cover the environment, RoHS, recycling, pollution, storage, ESD, waste and more.

Flip-Chip, MEMS, Semiconductors

These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more.

Operations, Productivity, Supply

These programs cover overall operations, plan productivity, issues with the supply chain and more.

PC Fab, Board Design, Laminates

These programs cover bare PC board fabrication, circuit board design, laminates and more.

Reflow Soldering, Profiling

These programs cover reflow soldering, vapor phase, profiling, thermocouples, data collection and more.

Rework, Repair, Modification

These programs cover BGA rework, BGA reballing, tinning, damage repair, jumper wires, modifications and more.

Soldering, Selective, Wave

These programs cover manual and automated soldering, selective soldering, wave soldering and more.

Solders, Fluxes, Pastes

These programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more.

Test, Inspection, X-Ray

These programs cover manual and automated test, manual and automated optical inspection, x-ray and more.