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Master-Bond

Silver Filled, Heat Curing Epoxy
Master Bond EP4S-80 is a one part, electrically conductive, silver filled adhesive for bonding, sealing and coating with a low curing temperature of 80°C.
Master Bond

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Circuit-Technology-Center

Tech Paper - The Economics of Electronic Component Salvage and Reuse
This paper examines the economic and environmental benefits of salvaging and reusing high-value electronic components. Download this free tech paper.
Circuit Technology Center