Solders, Fluxes, Pastes
These programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more.
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Solder Paste Selection for Bottom Termination Components Attach
Solder Paste Selection for Bottom Termination Components Attach
Two solder paste chemistries and several printing parameters were evaluated in order to achieve consistent solder paste deposition across the assembly.
Materials Tech

Improved Flux Reliability of Lead-Free Solder Alloy Solder Paste
Improved Flux Reliability of Lead-Free Solder Alloy Solder Paste
This paper covers a type of 'crack free' flux paste designed to inhibit cracking under extreme environments. Includes electro-chemical migration tests dew ...
Materials Tech

Rheology of Solder Paste: Shelf Life Study
Rheology of Solder Paste: Shelf Life Study
This study offers a better understanding of the correlation between rheological properties and shelf life of solder paste exposed to extreme conditions.
Materials Tech

Determination of Total Halogen Content in Halogen-Free Fluxes
Determination of Total Halogen Content in Halogen-Free Fluxes
It is important for laboratories to follow robust methods to assure commercial products meet the safety requirements established.
Analysis Lab

Implementation of Assembly Processes for Low-Melting Point Solder Pastes
Implementation of Assembly Processes for Low-Melting Point Solder Pastes
This paper discusses the need for low-temperature solders and process-ability of solder pastes with three novel alloys against the industry standard.
Materials Tech

The Effects of Phosphorus in Lead-Free Solders
The Effects of Phosphorus in Lead-Free Solders
This paper reports on experiments to determine the effects of phosphorus additions on the behavior of a widely used lead-free solder.
Production Floor

How Does Printed Solder Paste Volume Affect Solder Joint Reliability?
How Does Printed Solder Paste Volume Affect Solder Joint Reliability?
Solder paste and stencil technology has been well studied. It is the aim of this work to correlate printed solder paste volume to solder joint reliability.
Materials Tech

Stencil Quality & Technology on Solder Paste Printing Performance
Stencil Quality & Technology on Solder Paste Printing Performance
We evaluate the impact of stencil quality by comparing the printing performance of 0.35mm pitch and 01005 pads from different stencil suppliers.
Analysis Lab

Isothermal Aging of BGA Packages Using Doped Lead Free Solder Alloys
Isothermal Aging of BGA Packages Using Doped Lead Free Solder Alloys
This paper evaluates the long term aging effect of various doped lead free solders built using Megtron6 substrate under other, different aging conditions.
Materials Tech

Flux Residue Influence on Surface Insulation Resistance
Flux Residue Influence on Surface Insulation Resistance
Two liquid flux and two newly developed products build up the basic models. The results also provide a scientific approach to design highly reliable products.
Analysis Lab