Solders, Fluxes, PastesThese programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more. |
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The effect of joint length on the fracture of copper-solder-copper joints is investigated using double cantilever-beam specimens of various joint lengths. Analysis Lab
A systematic study is presented to address the effect of Bi content on soldering and mechanical performance of low silver SAC alloys. Materials Tech
The primary objective of this study was to baseline the solder-joint thermal fatigue life for the POR (plan of record) package. Analysis Lab
This paper reviews 3 lead-free solder alloys to assess the mechanical and thermal cycle properties by implementing drop tests and thermal cycle tests. Materials Tech
This study reviewed electrochemical methods on four flux systems used in a SIR study to determine if EIS data findings have commonality with SIR data findings. Analysis Lab |
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