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| Solders, Fluxes, Pastes | ||||||||||
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Results from an investigation that studied and characterized a novel lead-free solder paste as compared to traditional solder materials will be presented. Production Floor
In this paper, the roles of additive and bismuth content will be discussed. Eutectic SnBi and three newly designed SnBi-based alloys were experimented upon. Materials Tech
The experiment should find the optimum printer parameters, compare type 4 vs. 4.5 vs. 5 solder paste and 4 different stencils. Materials Tech
In this study, AI was used to predict the results of the key characteristics to better select the choice of formulas, to understand the relationship between molecules and to spend time on other aspects of the developments. To be able to exploit AI data in a relevant way, we highlight that the input database itself is crucial to generating reliable output data. Materials Tech
The issue of tin-lead solder versus lead-free solder reliability and whether lead in solders used for circuit board assembly impacts the reliability. Board Talk
The roles of additive and bismuth content will be discussed. Eutectic SnBi and three newly designed SnBi-based alloys were experimented upon. Materials Tech
This paper shows alloy and flux properties as well as temperature cycle test results comparing SAC305 and Innolot® solder pastes. Materials Tech
The main objective of this paper was to identify a solder (specifically Sn-based and high reliability) and thick film combination to improve overall reliability of thick film hybrids. This was done by conducting rigorous thermal testing. The work conducted for this paper served as an initial exploration into this area of study. Materials Tech
A novel epoxy SAC solder paste TIM system has been developed with the use of non-volatile epoxy flux. Cu filler was added to the solder paste. Materials Tech
What are the risks using flux only versus solder paste for placing BGAs in a hybrid lead-free environment? Why would you only use flux, why not solder paste? Board Talk |
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