Solders, Fluxes, Pastes



These programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more.
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Bending Strength of Solder Joints as a Function of Joint Length
Bending Strength of Solder Joints as a Function of Joint Length
The effect of joint length on the fracture of copper-solder-copper joints is investigated using double cantilever-beam specimens of various joint lengths.
Analysis Lab

Effect of Bi Content on Properties of Low Silver SAC Solders
Effect of Bi Content on Properties of Low Silver SAC Solders
A systematic study is presented to address the effect of Bi content on soldering and mechanical performance of low silver SAC alloys.
Materials Tech

Solder-Joint Reliability of a 0.65 mm Pitch Molded Array Package for Automotive
Solder-Joint Reliability of a 0.65 mm Pitch Molded Array Package for Automotive
The primary objective of this study was to baseline the solder-joint thermal fatigue life for the POR (plan of record) package.
Analysis Lab

Improving properties of a Lead-free Solder Alloy with Doping of Copper
Improving properties of a Lead-free Solder Alloy with Doping of Copper
This paper reviews 3 lead-free solder alloys to assess the mechanical and thermal cycle properties by implementing drop tests and thermal cycle tests.
Materials Tech

Electrochemical Methods to Measure Corrosion Potential of Flux Residue
Electrochemical Methods to Measure Corrosion Potential of Flux Residue
This study reviewed electrochemical methods on four flux systems used in a SIR study to determine if EIS data findings have commonality with SIR data findings.
Analysis Lab

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