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| Solders, Fluxes, Pastes | ||||||||||
| These programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more. | ||||||||||
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It was the goal of this paper to overcome myths and misunderstandings within the PCB manufacturing environment regarding the HP ENIG finish. Materials Tech
On average, how many locations should we measure our PCBs to confirm our solder paste thickness? Our PCBs are approximately 10" by 10". Board Talk
A systematic study is presented to address the effect of Bi content on soldering and mechanical performance of low silver SAC alloys. Materials Tech
This paper reviews 3 lead-free solder alloys to assess the mechanical and thermal cycle properties by implementing drop tests and thermal cycle tests. Materials Tech
This paper evaluates the effect of particle size distribution and oxidation on the reflow performance of solder paste. Analysis Lab
The effect of joint length on the fracture of copper-solder-copper joints is investigated using double cantilever-beam specimens of various joint lengths. Analysis Lab
The primary objective of this study was to baseline the solder-joint thermal fatigue life for the POR (plan of record) package. Analysis Lab
This presentation surveys the landscape of alternatives to solder in interconnect, packaging, and assembly. Materials Tech
While susceptibility to tin whisker growth remains a barrier to the transition to Pb-free, there is now general acceptance that there are reliable alternatives. Materials Tech
Accelerated temperature cycling was used to assess the thermal fatigue reliability of a Pb free grid array package assembled. Production Floor |
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