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| Solders, Fluxes, Pastes | ||||||||||
| These programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more. | ||||||||||
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In this study, we developed a Cu paste that can be used as a filling material for through silicon via (TSV), through glass via (TGV), and organic substrates. Materials Tech
This paper presents performance/process capability of various low/no silver alloy solder pastes. Production Floor
This paper discusses a nano copper based paste for use in via filling. Materials Tech
The differences between jet printing and dispensing will be highlighted and technical challenges with broad band technology will be discussed. Production Floor
Paper outlines the evolution of flux chemistry and details the challenges in developing flux chemistries for current and future application. Analysis Lab
In this paper, the roles of additive and bismuth content will be discussed. Eutectic SnBi and three newly designed SnBi-based alloys were experimented upon. Materials Tech
Data is presented on the intermetallic strengths and failure modes of two bond pull test methods. Analysis Lab
The experiment should find the optimum printer parameters, compare type 4 vs. 4.5 vs. 5 solder paste and 4 different stencils. Materials Tech
The roles of additive and bismuth content will be discussed. Eutectic SnBi and three newly designed SnBi-based alloys were experimented upon. Materials Tech
This paper show results using a lead-free solder rework wire alloy in terms of wetting, reduced solder iron tip erosion, reduced IMC growth and reliability. Production Floor |
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