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| Solders, Fluxes, Pastes | ||||||||||
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The main objective of this paper was to identify a solder (specifically Sn-based and high reliability) and thick film combination to improve overall reliability of thick film hybrids. This was done by conducting rigorous thermal testing. The work conducted for this paper served as an initial exploration into this area of study. Materials Tech
A novel epoxy SAC solder paste TIM system has been developed with the use of non-volatile epoxy flux. Cu filler was added to the solder paste. Materials Tech
What are the risks using flux only versus solder paste for placing BGAs in a hybrid lead-free environment? Why would you only use flux, why not solder paste? Board Talk
The novel Alloy 10 solder alloy presented here exhibits exemplary thermomechanical and mechanical reliability in extreme operating conditions, ideal for the future needs of high-reliability electronics, such as in the automotive industry. Materials Tech
It was the goal of this paper to overcome myths and misunderstandings within the PCB manufacturing environment regarding the HP ENIG finish. Materials Tech
After selective soldering connectors there is a small amount of no-clean flux residue left behind. How can I judge how much flux residue can be left behind? Board Talk
The miniaturization trend is driving components with large pads. To alleviate the voiding challenge, a voiding-free solder paste will be the solution. Materials Tech
Alternative solders meet stringent environmental regulations, requirements for greater mechanical reliability, and high temperature service environments. Materials Tech
Recent advances in alloy "doping" have opened the door to revisit Sn/Bi alloys as a possible alternative to SAC-305 for many applications. Production Floor
Electronic Assembly reliability must consider process residues and cleanliness. IPC J-STD-001J—Section 8 requires assemblers to qualify soldering and/or cleaning processes that result in acceptable levels of flux and other process residues. This research aims to study the electrical effects of flux and process residues following the rework process. Materials Tech |
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