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| Solders, Fluxes, Pastes | ||||||||||
| These programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more. | ||||||||||
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Two solder paste chemistries and several printing parameters were evaluated in order to achieve consistent solder paste deposition across the assembly. Materials Tech
This paper covers a type of 'crack free' flux paste designed to inhibit cracking under extreme environments. Includes electro-chemical migration tests dew ... Materials Tech
This study offers a better understanding of the correlation between rheological properties and shelf life of solder paste exposed to extreme conditions. Materials Tech
It is important for laboratories to follow robust methods to assure commercial products meet the safety requirements established. Analysis Lab
This paper discusses the need for low-temperature solders and process-ability of solder pastes with three novel alloys against the industry standard. Materials Tech
This paper reports on experiments to determine the effects of phosphorus additions on the behavior of a widely used lead-free solder. Production Floor
Solder paste and stencil technology has been well studied. It is the aim of this work to correlate printed solder paste volume to solder joint reliability. Materials Tech
We evaluate the impact of stencil quality by comparing the printing performance of 0.35mm pitch and 01005 pads from different stencil suppliers. Analysis Lab
This paper evaluates the long term aging effect of various doped lead free solders built using Megtron6 substrate under other, different aging conditions. Materials Tech
Two liquid flux and two newly developed products build up the basic models. The results also provide a scientific approach to design highly reliable products. Analysis Lab |
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