Solders, Fluxes, Pastes



These programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more.
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Electrochemical Reliability as a Function of Component Standoff
Electrochemical Reliability as a Function of Component Standoff
The purpose of this paper is to research the activity of flux residues as a function of the standoff height using insulation resistance.
Analysis Lab

Nanocopper Based Paste for Solid Copper Via Fill
Nanocopper Based Paste for Solid Copper Via Fill
This paper discusses a nano copper based paste for use in via filling.
Materials Tech

New-Generation, Low-Temperature Lead-Free Solder
New-Generation, Low-Temperature Lead-Free Solder
In this paper, the roles of additive and bismuth content will be discussed. Eutectic SnBi and three newly designed SnBi-based alloys were experimented upon.
Materials Tech

Low Temperature Solder Interconnect Reliabiilty in Enterprise Computer and Automotive Electronics
Low Temperature Solder Interconnect Reliabiilty in Enterprise Computer and Automotive Electronics
This article studies a new low melting temperature solder interconnect application and reliability on various product categories.
Analysis Lab

Has My Flux Expired?
Has My Flux Expired?
What specific attributes occur in an expired flux? How do you know if a flux is bad and shouldn't be used? Are there any simple tests? The Assembly Brothers, Jim Hall and Phil Zarrow, answer these questions and share their own experiences.
Board Talk

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