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| Solders, Fluxes, Pastes | ||||||||||
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Recent advances in alloy "doping" have opened the door to revisit Sn/Bi alloys as a possible alternative to SAC-305 for many applications. Production Floor
This paper describes the development and testing procedure of a new lead-free low melting point alloy. Materials Tech
This study focuses on two major bonding techniques: Cu nanoparticle (Cu NP) sintering and Cu-Sn3.0Ag0.5Cu (Cu-SAC305) hybrid paste bonding. Both methods aim to address the limitations of conventional soldering processes, especially in high-temperature, high-power applications. Materials Tech
The study compares a paste that barely passes SIR at 85C/85RH with polymeric material, Silicone conformal, and acrylic conformal coating. Materials Tech
Thermal cycling fatigue is one of the main reliability concerns for solder. For the introduction of low temperature solders with reflow peak temperatures below 200℃, their thermal cycle fatigue life must be characterized. This paper presents a multiple component type test and time to failure data for solder interconnects formed with low temperature solders for BGAs, QFNs, and SMR component types. Materials Tech
In this paper, the effect of mixing solder sphere alloys with Bi-based solder pastes on the component reliability in accelerated thermal cycling is studied. Materials Tech
The types of rheology measurements studied here show trends that mirror the print volume and volume reproduceability for three pastes. Production Floor
The advantage of engineered flux for low temperature solders in achieving critical properties of the solder paste is summarized in this paper. Materials Tech
This paper presents progress-to-date using supercooled solder pastes of core-shell bismuth-tin (BiSn) particles to accomplish solder interconnects below the melting point of the alloy. Comparisons between supercooled BiSn solder pastes and traditional BiSn pastes are discussed. Materials Tech
This paper studies the process-performance-reliability relationships for Sn-Bi-Ag and Sn-In solders on additively printed copper metallization. Analysis Lab |
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