Solders, Fluxes, PastesThese programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more. |
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The purpose of this paper is to research the activity of flux residues as a function of the standoff height using insulation resistance. Analysis Lab
This paper discusses a nano copper based paste for use in via filling. Materials Tech
In this paper, the roles of additive and bismuth content will be discussed. Eutectic SnBi and three newly designed SnBi-based alloys were experimented upon. Materials Tech
This article studies a new low melting temperature solder interconnect application and reliability on various product categories. Analysis Lab
What specific attributes occur in an expired flux? How do you know if a flux is bad and shouldn't be used? Are there any simple tests? The Assembly Brothers, Jim Hall and Phil Zarrow, answer these questions and share their own experiences. Board Talk |
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