Solders, Fluxes, Pastes



These programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more.
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Flux for Cleanable and No-Clean Solder Pastes
Flux for Cleanable and No-Clean Solder Pastes
Paper provides a description of flux and the role of their constituting ingredients and a tin-bismuth-silver solder paste with cleanable residues.
Materials Tech

Acceptance Testing Of Low-Ag Reflow Solder Alloys
Acceptance Testing Of Low-Ag Reflow Solder Alloys
This paper describes initial test results for low-silver alloys using solder paste alloy assessment protocols for BGAs and leaded components.
Analysis Lab

Solder Paste Selection for Bottom Termination Components Attach
Solder Paste Selection for Bottom Termination Components Attach
Two solder paste chemistries and several printing parameters were evaluated in order to achieve consistent solder paste deposition across the assembly.
Materials Tech

Jetting Solder Paste Opens Up New Possibilities
Jetting Solder Paste Opens Up New Possibilities
Today Jet Printing is no longer seen as a futuristic technology but it has proven itself and the technology is still gaining momentum.
Production Floor

Surface Insulation Resistance of No-Clean Flux Residues
Surface Insulation Resistance of No-Clean Flux Residues
No-clean fluxes present great benefits, but the activity of the unwashed process residues must be tightly controlled in order to meet reliability standards.
Materials Tech

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