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After wave soldering we find dross particles on the circuit board surface. We cleaned and have the same problem. Do we have contamination? Board Talk
We are going forward with assemblies that use 01005 components. We're wondering if you have some input as to the challenges we will face. Board Talk
We plan to install a nitrogen environment around the wave soldering tank. Is this likely to improve our defective parts-per-million level? Board Talk
We are finding a tacky substance under a large SMT component. Is this common when no-clean leaded solder paste is used with no clearance parts? Board Talk
What is the best method for removing an SMT array package that has been under-filled and cured. Is there an industry approved method? Board Talk
We use intrusive reflow soldering on relays using a lead process. We are challenged to solder relays intrusively in a lead-free process. Board Talk
Recognizing the limitations of ROSE testing versus localized contamination, what can I use to validate the cleanliness of my finished product? Board Talk
IPC discusses the maximum top-side board temperature for BGAs to be 150 degrees C during a tin-lead wave solder. How is this temperature was determined? Board Talk
We are having issues with our no-clean pin in paste process caused by flux residue on the surface of the solder joint. Should all flux vaporize off during reflow? Board Talk
Resistivity readers of the de-ionized water are above 15 megohms. Resistivity results of the samples tested by the outside lab have been approximately 1 megohm. Board Talk |
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