| Board Talk |
Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
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Phil Zarrow - With over 50 years of experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials, and processes.
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Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment, and process basics. He is a pioneer in the science of reflow.
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What Causes Solder Balls During Hand Soldering?
We have experienced solder balls during automated reflow. Now we are finding solder balls during the hand soldering. Phil Zarrow and Jim Hall, The Assembly Brothers, offer their own suggestions and recommendations for eliminating solder balls.
Board Talk
Is There a Spacing Spec for SMD Components?
Is there a minimum spacing requirement or should we apply SMT components to comply with SMT pick and place systems on the market?
Board Talk
Wet-Based vs. Dry-Based Cleaning
For automatic under-stencil cleaning there are many cleaning methods including dry vacuum cleaning, wet dry vacuum cleaning. What factors should we consider to select wet based cleaning versus dry based cleaning? The Assembly Brothers, Jim Hall and Phil Zarrow, discuss this scenario and offer their suggestions.
Board Talk
Connector Bowing During Reflow Process
I have a connector that is bowing during lead-free soldering. When the connector is put through an oven on its own no bowing takes place. What is causing this?
Board Talk
Seeking Alternatives to Solvent Cleaning
We are using a mix of trichloroethylene and IPA for cleaning in the ratio of 10 to 90. We are looking to eliminate the use of trichloroethylene. Phil Zarrow and Jim Hall, The Assembly Brothers, offer their suggestions.
Board Talk
Long Term Component Storage
We need to store SMD components for at least 10 years. What do you recommend for a humidity and temperature settings?
Board Talk
Solder Boards Not Holding Up to Shock Testing
We are using a vapor phase oven. Recently we have experienced problems with a no-lead BGA that has low silver solder balls. The problem is that the solder boards do not hold up to shock testing. Jim Hall and Phil Zarrow, The Assembly Brothers, share their insights and experiences.
Board Talk
Has My Flux Expired?
What specific attributes occur in an expired flux? How do you know if a flux is bad and shouldn't be used? Are there any simple tests?
Board Talk
Common PCB Design Decisions that Cause Manufacturing Problems
What are the most common design decisions that can have a negative impact on the PCB assembly manufacture and how could we correct them during the design? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this scenario and share their suggestions.
Board Talk
Processing Circuit Boards with BGAs On Both Sides
What is the best way to process a 30 mil circuit board assembly that has micro BGAs that need to be soldered to both sides?
Board Talk
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