Board Talk
Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
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Phil Zarrow - With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.
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Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
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01005 Component Challenges and Bugs
We are going forward with assemblies that use 01005 components. We're wondering if you have some input as to the challenges we will face. The Assembly Brothers, Phil Zarrow and Jim Hall, share their own insight and suggestions.
Board Talk
Insulation Between Overhanging Component Lead and Circuit Conductor
We have a long lead SMT component overhanging the pad. Can solder mask provide insulation between the overhanging component and the circuit conductor?
Board Talk
Sticky Residue Under Low Clearance Parts
We are finding a tacky substance under a large SMT component. Is this common when no-clean leaded solder paste is used with no clearance parts? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk
Finding the Cause of Cold Solder Joints
We have problems with our wave soldering system, especially cold solder joints. Could this be caused by using a selective soldering frame?
Board Talk
Soldering Relays Intrusively in Lead Free Process
We use intrusive reflow soldering on relays using a lead process. We are challenged to solder relays intrusively in a lead-free process. Jim Hall and Phil Zarrow, The Assembly Brothers, share their own suggestions and recommendations.
Board Talk
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