Board Talk
Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
Phil Zarrow
Phil Zarrow - With over 50 years of experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials, and processes.
Jim Hall
Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment, and process basics. He is a pioneer in the science of reflow.
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How Long Solder Paste Can Be Left On a Stencil Without Activity
How Long Solder Paste Can Be Left On a Stencil Without Activity
How long can we leave solder paste on a stencil without any activity? If activity means not printing, then we are talking about a pause or abandoned time. The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this scenario and share their own experiences.
Board Talk

Should We Invest in 3D Optical Inspection?
Should We Invest in 3D Optical Inspection?
We are correcting many solder defects. The search for defects is taking too long. Should we go with a 3D AOI system to save inspection time?
Board Talk

Intrusive Soldering vs. Wave Solder
Intrusive Soldering vs. Wave Solder
We are wave soldering with top and bottom side preheat. Would a pin in paste, or intrusive soldering, be a better option than wave soldering? The Assembly Brothers, Phil Zarrow and Jim Hall, address this question.
Board Talk

Issues With BGA Rework Residue
Issues With BGA Rework Residue
After BGA rework there is an outline of residue on around the pads. Is it necessary to remove this residue to reinstall a new BGA?
Board Talk

Limits for HASL with Complex Products
Limits for HASL with Complex Products
What are the limits for the future with more complex products? HASL and the actual HASL process, hot air solder leveling, has been with us since the mid-70s. The original methodology was a vertical methodology where the board is vertically immersed in a pot of molten solder.
Board Talk

Reliability of Tin Lead Solder vs. Lead Free Solder
Reliability of Tin Lead Solder vs. Lead Free Solder
The issue of tin-lead solder versus lead-free solder reliability and whether lead in solders used for circuit board assembly impacts the reliability.
Board Talk

What Is the Recommended Component Storage Environment?
What Is the Recommended Component Storage Environment?
What do you recommend for component storage to prohibit oxidation including relative humidity, nitrogen atmosphere, temperature? The Assembly Brothers, otherwise known as Jim Hall and Phil Zarrow, share their own recommendations and suggestions.
Board Talk

How To Prevent Mid-chip Solder Balls?
How To Prevent Mid-chip Solder Balls?
Is there a mathematical calculation that can be used to predict solder balling for a given package size?
Board Talk

The Best Storage Method to Protect Against Corrosion
The Best Storage Method to Protect Against Corrosion
Which storage method will better protect against corrosion, nitrogen or super dry? Regardless of the methodology you use, you want to do it in compliance with IPC 1602, which covers storage and handling of circuit boards. Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk

Risks Using Flux Only for Soldering BGAs
Risks Using Flux Only for Soldering BGAs
What are the risks using flux only versus solder paste for placing BGAs in a hybrid lead-free environment? Why would you only use flux, why not solder paste?
Board Talk