| Board Talk |
Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
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Phil Zarrow - With over 35 years of experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials, and processes.
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Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment, and process basics. He is a pioneer in the science of reflow.
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Intrusive Soldering vs. Wave Solder
We are wave soldering with top and bottom side preheat. Would a pin in paste, or intrusive soldering, be a better option than wave soldering? The Assembly Brothers, Phil Zarrow and Jim Hall, address this question.
Board Talk
Reliability of Tin Lead Solder vs. Lead Free Solder
The issue of tin-lead solder versus lead-free solder reliability and whether lead in solders used for circuit board assembly impacts the reliability.
Board Talk
Limits for HASL with Complex Products
What are the limits for the future with more complex products? HASL and the actual HASL process, hot air solder leveling, has been with us since the mid-70s. The original methodology was a vertical methodology where the board is vertically immersed in a pot of molten solder.
Board Talk
How To Prevent Mid-chip Solder Balls?
Is there a mathematical calculation that can be used to predict solder balling for a given package size?
Board Talk
What Is the Recommended Component Storage Environment?
What do you recommend for component storage to prohibit oxidation including relative humidity, nitrogen atmosphere, temperature? The Assembly Brothers, otherwise known as Jim Hall and Phil Zarrow, share their own recommendations and suggestions.
Board Talk
Risks Using Flux Only for Soldering BGAs
What are the risks using flux only versus solder paste for placing BGAs in a hybrid lead-free environment? Why would you only use flux, why not solder paste?
Board Talk
The Best Storage Method to Protect Against Corrosion
Which storage method will better protect against corrosion, nitrogen or super dry? Regardless of the methodology you use, you want to do it in compliance with IPC 1602, which covers storage and handling of circuit boards. Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk
Gooey Flux Residue Left Behind
After selective soldering connectors there is a small amount of no-clean flux residue left behind. How can I judge how much flux residue can be left behind?
Board Talk
Solder Paste Printing First Pass
Is it recommended to print one cycle before printing the first production board? I could use a scrap board or blank plastic card for the first print. Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this question and share their expertise.
Board Talk
Modify Rework Procedures for Assemblies Fabricated Using OSP?
Should we modify any rework or repair procedures for circuit board assemblies fabricated using OSP, organic solderability preservatives, bare boards?
Board Talk
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