Board Talk
Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
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Phil Zarrow - With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.
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Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
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Reflow For Rigid Flex
We have a new PCB assembly that includes a section of flex cable and FR4 circuit board. What are the reflow rules I need to consider? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss the most important reflow guidelines in this scenario.
Board Talk
Solder Paste Volume for BGA Rework
Rework can never be as controlled or consistent as original assembly, should we use more paste during BGA rework to compensate for irregularities or flatness?
Board Talk
Problems With Starved "J" Lead Joints
We have insufficient solder joint heel fillets with a PLCC J lead component. We cannot increase the stencil thickness. What do you advise? Jim Hall and Phil Zarrow, The Assembly Brothers, share their thoughts and experiences with this scenario.
Board Talk
Delay Before Cleaning Partial Assemblies
We're assembling circuit boards with a water soluble flux. Is it acceptable to leave these partially assembled boards for 3 to 4 days before finishing them?
Board Talk
Can a CTE Mismatch Cause Reliability Problems?
Does usage of BGAs, QFNs or SONs have an increased risk for reliability of solder joints due to the CTE mismatch with the base board material FR4? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this scenario.
Board Talk
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