| Board Talk |
Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
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Phil Zarrow - With over 50 years of experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials, and processes.
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Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment, and process basics. He is a pioneer in the science of reflow.
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Intrusive Soldering Through-Hole Connector
We are SMT soldering a through-hole PC 104 connector. We have tried preforms and are unable to get all of the pins soldered. Phil Zarrow and Jim Hall, The Assembly Brothers, share their own suggestions in this scenario.
Board Talk
Solder Paste Transfer Efficiency - What/Why
I've heard the term transfer efficiency relating to printing. What does this term refer to? What actions impact solder paste transfer efficiency?
Board Talk
Help With Lead to Hole Ratio
What is the minimum gap between a round conductor lead and the PCB hole that will allow proper solder fill? Where can I find the recommended guideline? The Assembly Brothers, Jim Hall and Phil Zarrow, share their own expertise and sugggestions finding the requested guidelines.
Board Talk
Going Beyond Your Solder Paste Work Life
Solder paste used for a problem batch of board exceeded the 12 hour work life by one hour. Could this cause soldering problems for small chip components?
Board Talk
Vapor Phase and Backward Compatibility
We use lead-free solder paste with a melting point of 217 degrees C, along with 230 degree C Galden. We have a new project that uses tin-lead solder. The Assembly Brothers, Phil Zarrow and Jim Hall, offer their suggestions.
Board Talk
Cause of Damage During Through-hole Component Insertion
During automatic insertion and clinching of two pin components we encounter small cracks in the lands or the walls of plated holes. How can we eliminate this?
Board Talk
How to Cost a Board
My boss has asked me to provide a cost matrix so we can quickly quote labor machine time component for the SMT board assembly. The Assembly Brothers, Phil Zarrow and Jim Hall, share their suggestions and experience with creating a cost matrix.
Board Talk
Flux Residue Causing Test Issues
We are having issues with flux residues. After wave, we experience many incomplete readings due to flux residues on connector pins.
Board Talk
Variations in SAC 305 Solder
We use SAC 305 bar solder. We want to use a different supplier. Can we mix the new solder in with the current solder in our wave soldering systems? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this scenario and share their suggestions.
Board Talk
Tenting Via In Pad - Yes or No?
Should the thermal vias on the bottom terminated components be tented on both sides to prevent flux trapping or is it okay to tent the top side only?
Board Talk
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