Board Talk
Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
Phil Zarrow
Phil Zarrow - With over 35 years of experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials, and processes.
Jim Hall
Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment, and process basics. He is a pioneer in the science of reflow.
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Should Apertures be Home Plate or Inverted Home Plate?
Should Apertures be Home Plate or Inverted Home Plate?
Should stencil the aperture be home plate or inverted home plate? You know the performance difference between the two types. Which one is better? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their own insights.
Board Talk

Is Customer Approval Required for Class 3 Repair?
Is Customer Approval Required for Class 3 Repair?
A non-aerospace customer's board was repaired without authorization. Does an IPC document state that customer approval is required for class 3 repairs?
Board Talk

Selective Solder Pot Temperatures
Selective Solder Pot Temperatures
What temperature should the solder pot in our selective soldering machine be? Should the temperature be different from our wave system? Jim Hall and Phil Zarrow, also known as The Assembly Brothers, address these questions and share their expertise.
Board Talk

Solder Pallets With Titanium Inserts - Yes/No?
Solder Pallets With Titanium Inserts - Yes/No?
Our pallet manufacturer recommends titanium inserts to allow larger apertures near closely spaced surface mount components. Are they worth it?
Board Talk

Top Side Reflow Causing Solder Balls
Top Side Reflow Causing Solder Balls
When selective soldering the secondary side, we are producing solder balls on the primary side. What can be done to prevent this from happening? The Assembly Brothers, Phil Zarrow and Jim Hall, address this questions and share their own experiences.
Board Talk

Trends for Printing Ultra Miniature Chips
Trends for Printing Ultra Miniature Chips
A reader wonders about the current trends and practices for printing ultra-miniature chips, a la 01005. Seeking advice, they contacted Board Talk.
Board Talk

Removing Warpage from PCBAs
Removing Warpage from PCBAs
We have populated boards with components on both sides that are warped. Components are varied height. What methods can we use to flatten them? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss their recommendations.
Board Talk

Cleaning R.F. Circuits - Aqueous or Vapor?
Cleaning R.F. Circuits - Aqueous or Vapor?
We clean R.F. assemblies by hand but want to switch to an automated process. Which process would be better vapor degreasing or aqueous?
Board Talk

Predicting Mid-Chip Solder Balling
Predicting Mid-Chip Solder Balling
Is there a calculation that can be used to predict solder balling? We would like to design our stencil apertures to ensure no mid-chip solder balls. The Assembly Brothers, Jim Hall and Phil Zarrow, discuss design suggestions to prevent solder balling.
Board Talk

Should We Measure Solder Paste Thickness?
Should We Measure Solder Paste Thickness?
On average, how many locations should we measure our PCBs to confirm our solder paste thickness? Our PCBs are approximately 10" by 10".
Board Talk