Board Talk



Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
Phil Zarrow
Phil Zarrow - With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.
Jim Hall
Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
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Max Interval Between Reflow for OSP Boards
Max Interval Between Reflow for OSP Boards
With OSP coated circuit boards, what is the maximum allowable time interval between reflow of the first and second sides to insure proper wetting. The Assembly Brothers, Jim Hall and Phil Zarrow, address this situation.
Board Talk

Shelf Life Before Conformal Coating
Shelf Life Before Conformal Coating
Prior to conformal coating, how long can we keep assemblies in an open condition before they will be impacted by moisture absorption?
Board Talk

We Bake, But Still Have Delamination, Why?
We Bake, But Still Have Delamination, Why?
When our PCBs are wave soldered and then pass through reflow most had issues with delamination. Where should we look to solve this? Jim Hall and Phil Zarrow, The Assembly Brothers, address this question and share their own experiences.
Board Talk

Cleaning Reballed BGA Components
Cleaning Reballed BGA Components
We currently clean reballed BGAs using an ultrasonic cleaner followed by baking to remove moisture. Is this an acceptable practice?
Board Talk

Solder Paste Volume for BGA Rework
Solder Paste Volume for BGA Rework
Rework can never be as controlled or consistent as original assembly, should we use more paste during BGA rework to compensate for irregularities or flatness? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this question.
Board Talk

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