Board Talk
Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
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Phil Zarrow - With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.
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Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
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Causes of Blowholes
Are old components such as resistors and circuit breakers more likely to cause blowholes during wave soldering compared to newer components? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this question.
Board Talk
Tips When Moving a Reflow Oven
After moving a reflow oven to a different site, what steps do you need to perform on the machine for the machine to be certified?
Board Talk
Assembling Boards with BGAs on Both Sides
What are the pros and cons of assembling circuit boards with BGA components on both sides? Should we first place BGAs on side one or side two? Does it make a difference? The Assembly Brothers, Jim Hall and Phil Zarrow, answer these questions.
Board Talk
Larger Stencil Apertures and Type 4 Paste
What is your experience with larger size apertures and type four solder paste for non-collapsible BGA and CGA type solder joints?
Board Talk
5 vs 8-Zone Ovens
We are setting up an assembly line for small line production. We prefer to purchase a 5-zone oven but our concern is that five zones may not be enough to ensure a reliable reflow process compared to an 8-zone oven. Jim Hall and Phil Zarrow, The Assembly Brothers, share their insight.
Board Talk
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