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How do we determine what is the best under stencil wipe frequency? The Assembly Brothers share their own insights and experiences on this matter. Board Talk
We have a formula stencil that had the apertures enlarged to maintain volume while overprinting the ends to keep solder away from the 0201 nozzle. Board Talk
When should we use adhesive to bond SMT components to the bottom-side of a double-sided PWA before going through reflow soldering? Board Talk
I've seen a problem with the 3-mil step. Is there a rule of thumb regarding the amount of step that can used in a step stencil? Board Talk
We inspect PCBAs on a relatively hard ESD mat. Will moving the PCBs on the mat will scratch and stress the soldered components on the bottom side? Board Talk
With nano coatings on stencils evolving, what is the best method to measure the thickness? How do you know if the coating degrades over time? Board Talk
We attach travelers to every group of MSD components taken out of the moisture barrier bag. Is this enough documents on our MSD program? Board Talk
We are experiencing delamination on printed circuit boards, is there a way to determine that this is caused by moisture or some other defect? Board Talk
After wave soldering we find dross particles on the circuit board surface. We cleaned and have the same problem. Do we have contamination? Board Talk
We are going forward with assemblies that use 01005 components. We're wondering if you have some input as to the challenges we will face. Board Talk |
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