Board Talk
Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
|
Phil Zarrow - With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.
|
|
Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
|
|
|
Previous
Page 1 of 48
Next
|
|
Component Moisture Question?
We mistakenly assembled circuit boards using BGA components that were not properly stored. Can we now rebake the assemblies? Phil Zarrow and Jim Hall, The Assembly Brothers, dicsuss this scenario and offer their suggestions.
Board Talk
5 vs 8-Zone Ovens
We are setting up an assembly line for small line production. We prefer a 5-zone oven. Will five zones be enough to ensure a reliable reflow process?
Board Talk
How To Verify Cleanliness After Rework and Prior to Re-coating?
Rework on a coated assembly happens often. How do you verify cleanliness of the rework site prior to re-coating? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this question and share their own experiences.
Board Talk
BGA Components and Coplanarity
We have a PCB with a HASL surface finish, the assembly includes a 256 ball BGA. The component balls are .6 mm pitch. Is coplanarity a concern?
Board Talk
Demise of the Plated-Through Hole?
How long will the industry continue to use through hole components? I can envision connectors being used for some time, what about component types? Phil Zarrow and Jim Hall, The Assembly Brothers, answer these questions.
Board Talk
|
|
Previous
Page 1 of 48
Next
|
|
|
