Board Talk
Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
Phil Zarrow
Phil Zarrow - With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.
Jim Hall
Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
PRIOR
 Page 1 of 25 
NEXT

To search a phrase, place it in quotes.
Issues Mixing Silicone and Acrylic Conformal Coatings
Issues Mixing Silicone and Acrylic Conformal Coatings
Our repair PWA assemblies have a silicone based conformal coating. During repair some of the coating is removed. Is there be a compatibility problem? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this question.
Board Talk

Solder Paste Transfer Efficiency - What/Why
Solder Paste Transfer Efficiency - What/Why
I've heard the term transfer efficiency relating to printing. What does this term refer to? What actions impact solder paste transfer efficiency?
Board Talk

What is the Best Way to Clean Solder Stencils?
What is the Best Way to Clean Solder Stencils?
Every 4 hours we remove each solder paste stencil and wipe both sides using IPA lint free wipes and then blow drying. Is this the proper procedure? Jim Hall and Phil Zarrow, The Assembly Brothers, address this question.
Board Talk

Going Beyond Your Solder Paste Work Life
Going Beyond Your Solder Paste Work Life
Solder paste used for a problem batch of board exceeded the 12 hour work life by one hour. Could this cause soldering problems for small chip components?
Board Talk

V-Score and Depanel in One Step
V-Score and Depanel in One Step
Can we score and de-panel assembled PCBs in one step to create a card edge connector on the PCB. Is there a precedence for doing this? The Assembly Brothers, Jim Hall and Phil Zarrow, share their own experiences with this scenario and offer suggestions.
Board Talk

Cause of Damage During Through-hole Component Insertion
Cause of Damage During Through-hole Component Insertion
During automatic insertion and clinching of two pin components we encounter small cracks in the lands or the walls of plated holes. How can we eliminate this?
Board Talk

Intrusive Soldering Through-Hole Connector
Intrusive Soldering Through-Hole Connector
We are SMT soldering a through-hole PC 104 connector. We have tried preforms and are unable to get all of the pins soldered. Phil Zarrow and Jim Hall, The Assembly Brothers, share their own suggestions in this scenario.
Board Talk

Help With Lead to Hole Ratio
Help With Lead to Hole Ratio
What is the minimum gap between a round conductor lead and the PCB hole that will allow proper solder fill? Where can I find the recommended guideline?
Board Talk

Flux Residue Causing Test Issues
Flux Residue Causing Test Issues
We are having issues with flux residues. After wave, we experience many incomplete readings due to flux residues on connector pins. Jim Hall and Phil Zarrow, The Assembly Brothers, share their own experiences and offer suggestions in this situation.
Board Talk

Questions About Humidity Indicator Cards and Baking Components?
Questions About Humidity Indicator Cards and Baking Components?
We run small jobs so a reel of MSD components could be opened a number of times. If the humidity cards are not pink, do we have to bake the components?
Board Talk