Board Talk
Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
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Phil Zarrow - With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.
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Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
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Printing vs. Dispensing
Do people size their stencil for the larger components, then use a needle dispenser for the smaller components? It seems more flexible than step stencils. The Assembly Brothers, Jim Hall and Phil Zarrow, share their own expertise.
Board Talk
Soldering Relays Intrusively in Lead Free Process
We use intrusive reflow soldering on relays using a lead process. We are challenged to solder relays intrusively in a lead-free process.
Board Talk
Is There a Spacing Spec for SMD Components?
Is there a minimum spacing requirement or should we apply SMT components to comply with SMT pick and place systems on the market? The Assembly Brothers, Jim Hall and Phil Zarrow, discuss this question.
Board Talk
Maximum Board Temperature During Tin-Lead
IPC discusses the maximum top-side board temperature for BGAs to be 150 degrees C during a tin-lead wave solder. How is this temperature was determined?
Board Talk
Is HASL a Good Choice for Surface Finish?
We are using a lead-free hot air solder leveling board finish. Our boards have bottom-terminated components. Is this the best choice? Jim Hall and Phil Zarrow, The Assembly Brothers, reflect on this situation.
Board Talk
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