| Board Talk |
Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
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Phil Zarrow - With over 50 years of experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials, and processes.
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Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment, and process basics. He is a pioneer in the science of reflow.
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How To Verify Cleanliness After Rework and Prior to Re-coating?
Rework on a coated assembly happens often. How do you verify cleanliness of the rework site prior to re-coating? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their expertise.
Board Talk
Causes of Blowholes
Are old components such as resistors and circuit breakers more likely to cause blowholes during wave soldering compared to newer components?
Board Talk
Demise of the Plated-Through Hole?
How long will the industry continue to use through hole components? I can envision connectors being used for some time, what about component types? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this question.
Board Talk
Assembling Boards with BGAs on Both Sides
What are the pros and cons of assembling circuit boards with BGA components on both sides? Should we first place BGAs on side one or side two?
Board Talk
Simple Test for Flux Penetration
What is a good test for flux penetration through plated hole barrels on plated through hole circuit boards? Jim Hall and PHil Zarrow, also known as The Assembly Brothers, answer this question and share their own experiences and knowledge.
Board Talk
5 vs 8-Zone Ovens
We are setting up an assembly line for small line production. We prefer a 5-zone oven. Will five zones be enough to ensure a reliable reflow process?
Board Talk
Problem Meeting Minimum Hole Fill During Wave Soldering
We are having problems achieving the minimum hole fill of 75% on electrolytic capacitors using our wave soldering. What do you suggest? The Assembly Brothers, Jim Hall and Phil Zarrow, discuss this question and share their own advice.
Board Talk
BGA Components and Coplanarity
We have a PCB with a HASL surface finish, the assembly includes a 256 ball BGA. The component balls are .6 mm pitch. Is coplanarity a concern?
Board Talk
What is Ideal Humidity for Final Assembly?
What is ideal humidity within a final assembly facility? No soldering involved. The facility is used for final box build. Phil Zarrow and Jim Hall, The Assembly Brothers, answer this question and offer their own insights.
Board Talk
What is Solder Paste Working Life on a Stencil?
Our solder paste has an exposure life of ten hours. After ten hours of operation do we need to remove all of the paste on the stencil and scrap it?
Board Talk
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