Board TalkBoard Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
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With OSP coated circuit boards, what is the maximum allowable time interval between reflow of the first and second sides to insure proper wetting. The Assembly Brothers, Jim Hall and Phil Zarrow, address this situation. Board Talk
Prior to conformal coating, how long can we keep assemblies in an open condition before they will be impacted by moisture absorption? Board Talk
When our PCBs are wave soldered and then pass through reflow most had issues with delamination. Where should we look to solve this? Jim Hall and Phil Zarrow, The Assembly Brothers, address this question and share their own experiences. Board Talk
We currently clean reballed BGAs using an ultrasonic cleaner followed by baking to remove moisture. Is this an acceptable practice? Board Talk
Rework can never be as controlled or consistent as original assembly, should we use more paste during BGA rework to compensate for irregularities or flatness? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this question. Board Talk |
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