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After BGA rework there is an outline of residue on around the pads. Is it necessary to remove this residue to reinstall a new BGA? Board Talk
What are the limits for the future with more complex products? HASL and the actual HASL process, hot air solder leveling, has been with us since the mid-70s. Board Talk
The issue of tin-lead solder versus lead-free solder reliability and whether lead in solders used for circuit board assembly impacts the reliability. Board Talk
What do you recommend for component storage to prohibit oxidation including relative humidity, nitrogen atmosphere, temperature? Board Talk
Is there a mathematical calculation that can be used to predict solder balling for a given package size? Board Talk
Which storage method will better protect against corrosion, nitrogen or super dry? You want to do it in compliance with IPC 1602, which covers storage and handling of circuit boards. Board Talk
What are the risks using flux only versus solder paste for placing BGAs in a hybrid lead-free environment? Why would you only use flux, why not solder paste? Board Talk
Is it recommended to print one cycle before printing the first production board? I could use a scrap board or blank plastic card for the first print. Board Talk
After selective soldering connectors there is a small amount of no-clean flux residue left behind. How can I judge how much flux residue can be left behind? Board Talk
Are there any special requirements for depaneling and rescoring separate panel circuit boards if they contain BGA components? Board Talk |
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