Electronics Manufacturing and Electronics Assembly

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Performance Meets Savings
Switch to REL61 & experience lower material costs plus enhanced soldering perform-ance: superior hardness, reduced IMC growth & better thermal cycling reliability compared to SAC305.
AIM Solder

Technical Papers

The Economics of Electronic Component Salvage and Reuse

Cutting Without Contact: How Laser Depanelling Redefines PCB Manufacturing

The "Fried Egg" Effect in Soldering

Flux Technology Development for Solder Paste Compatible with Formic Acid Reflow Ovens for Power Devices

Innovative Power Module Assembly Solutions

Unlocking the Potential of Nanoscale Conformal Coatings

Recycling vs Circularity: Minimising E-Waste in Manufacturing

Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components

MORE TECHNICAL PAPERS

Ask the Experts

Manual or Automated Assembly?

Inspection for Hidden Solder Joints

Flux Residue During Pin-in-Paste

Soldering Station Calibration

Design Considerations and Impact on Assembly

What Causes Component Rotation During Reflow?

Through Hole Connector Solder Joint Hole Fill

How To Remove Oxidation On SMT Components

MORE ASK THE EXPERTS

Keys to Reliable Tin Mitigation

Unlock the secret to component lead tinning for tin mitigation using robotic hot solder dip.

Download our free whitepaper and discover all the secrets.

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May 20, 2025

Development of a High-Density Adaptive Redistribution Technology for Embedded High I/O Components

Improving the performance of semiconductor chips and advancing packaging features are critical. One solution to producing high performance electrical systems to perform computationally intensive functions in volume constrained products is the use of miniaturized packages with advanced embedded components.
Production Floor

Utilizing an Alternative Solder Paste to Improve the PCB Assembly Process
Results from an investigation that studied and characterized a novel lead-free solder paste as compared to traditional solder materials will be presented.
Production Floor

Sponsor

Touchless Solder Ball Removal
Watch our video showcasing touch-free BGA component deballing. This revolutionary approach achieves unparalleled reliability and precision when preparing BGA components for re-balling.
Circuit Technology Center

America Risks Losing Its Status As the Most Innovative Place on Earth
America holds a dominant position the Deep-Tech sectors from Artificial Intelligence to Biotechnology. This dominant position is not a byproduct of geography.
Technology Briefing

D-PAK Voiding: A Study to Determine the Origins of D-PAK Voiding
This study looks at an analysis of why a D-PAK exhibits more voiding than other types of BTCs. Voiding results based on an analysis of several process variables.
Analysis Lab

Expandable Bio-based Polymers: Future for Electronics Ruggedization
This paper presents a bio-based, expandable, thermoset solution, a low density, light weight method to effectively encapsulate and protect electronic components.
Materials Tech

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Eliminate Worry of Cross Contamination
While Models 529 and 1550 are similar semi-automatic cleaners with single wash and rinse tanks, the Model 2003 includes 2 wash tanks for cleaning multiple applications in one machine.
Smart Sonic

Homogeneous Low Temperature Soldering Technology
This paper presents key findings of enabling LTS technology on AMD’s Client BGA Packages using surface mount technology (SMT).
Production Floor

Non-Contact Measurement of Conformal Coating Thickness
This study aims to highlight the application of chromatic confocal microscopy (CCM), an optical technique used to characterize 2D/3D surfaces.
Analysis Lab

Sponsor

Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.

Issues With BGA Rework Residue
After BGA rework there is an outline of residue on around the pads. Is it necessary to remove this residue to reinstall a new BGA?
Board Talk

Discrete Carbon Nanotube Implementation for use in ESD Tooling
This research illustrates the improvement in volume and surface resistivity for trays and tooling fixtures manufactured usin functionalized carbon nanotubes.
Materials Tech

Leveraging America's Enormous Deep Tech Advantage
At the same time that America’s ability to manufacture and build has atrophied, its advantage in so-called “Deep Technologies” has exploded.
Technology Briefing

Sponsor

Epoxy Changes Color Under UV Light
Watch this video to see how Master Bond's UV15RCL goes from red to clear with exposure to UV light, ensuring a thorough and effective curing process.
Master Bond

Protecting the Reliability and Integrity of Electronic Products and Assemblies
This paper offers guidance for protecting the integrity of electronic products and assemblies when disinfecting equipment surfaces for SARS-CoV-2 virus.
Production Floor

High-Speed 3D Surface Imaging Technology in Electronics Manufacturing
This paper introduces line confocal technology that was developed to characterize 3D features of surface and material types at sub-micron resolution.
Analysis Lab

Sponsor

EPA Verified Stencil Cleaning Systems
Low power density ultrasonic cleaners combined with 440-R-SMT detergent provide safe and effective cleaning of stencils, pallets, oven radiators, misprints and SMD adhesives.
Smart Sonic

The Disappearing Ink
UV lamps were bleaching out the blue color so that a new ink looked like a clear coating. Why didn't this happen in the lab?
Mysteries of Science

Impact of Alloy Composition on Shear Strength for Low Temperature Lead Free Alloys
As assemblies, undergo temperature/power changes during use CTE mismatch causes added stress and strain on the solder joint.
Production Floor

Muscle-Powered Robotic Leg More Efficient than Conventional Ones

Muscle-powered robotic is energy efficient. It can also perform high jumps and fast movements as well as detect and react to obstacles without complex sensors.
Technology Briefing

Microalloying Effects of Sb and Ag on the Microstructural of Eutectic Sn-Bi Alloys
In this paper, we will compare the bulk microstructure of eutectic Sn-Bi with Sb and Ag additions to solder joints on Cu substrates and ENIG surface finishes.
Analysis Lab

New-Generation, Low-Temperature Lead-Free Solder
In this paper, the roles of additive and bismuth content will be discussed. Eutectic SnBi and three newly designed SnBi-based alloys were experimented upon.
Materials Tech

A Fracture Mechanics-Based Approach to Simulate Die Pick-up Process

This paper provides a procedure to simulate die pick-up process based on contact-debonding fracture mechanics approach.
Production Floor

Latest Industry News

China Semiconductor Ambition and Adversity

11 Myths About Electronic Design Automation

Microsoft introduces GitHub AI agent that can code for you

How AI Can Help You Cut Through Tariff Chaos — in Just 3 Simple Steps

Prototype Computer Uses Noise to Its Advantage

MORE INDUSTRY NEWS

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Low Outgassing, Silver Filled Silicone
Master Bond MasterSil 323S-LO is an electrically and thermally conductive, addition cured adhesive designed for bonding applications where low stress is critical.
Master Bond

Questions and Comments

A Comparison of Thermal Cycling and Thermal Shock for Evaluating Solder Joint Reliability

In re-reading this study, the results, of course are well ...
Jaye Waas, Renkus-Heinz

Electronic Assembly Rework Best Practices: No-Clean and Cleaning Conditions

There really, at present, no such thing as "selective cleaning". ...
Phil Zarrow, ITM Consulting

Palm Size Portable 3 Printer

Impressive start. I look forward to further reports on the ...
Jaye Waas, Renkus-Heinz

MORE COMMENTS

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"Ask the Experts" Program by Circuitnet
Do you have a question or process issue in PCB assembly? The Circuitnet "Ask the Expert's" program has over 100 panel members waiting to answer your question. Submit question now.
Circuitnet Media LLC

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