Electronics Manufacturing and Electronics Assembly

Sponsor

Need a Profiler Plan B?
Tired of having to share a thermal profiler across different soldering operations? Add the affordable V-M.O.L.E. 2 four-channel profiler to the mix for time-saving efficiency.
ECD

Technical Papers

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

Understanding Solder Dross: Causes and Control Strategies

Optimizing BGA Rework: Challenges, Techniques and Quality Control

Maintenance: The Basics of Cleaning Series Part 4

MORE TECHNICAL PAPERS

Ask the Experts

Step Stencil Squeegee Angle

Dross Particles Sticking to PCBs

Rework or Repair?

BGA Component Grounding Problem

Aluminum Trays and Rapid Static Discharge

Use of Nitrogen for Hand Soldering

Environment Impact on Assembly, Printing and Reflow

IPC-A-610 Class 3 - IPC-A-600 Class 2

MORE ASK THE EXPERTS

October 21, 2025

Conformal Coating Prevention and Analysis of Resistor Silver Sulfide Corrosion

This paper covers all the long-term test results as a follow-up to an earlier publication reporting interim results and preliminary conclusions. Physical analyses were completed to investigate possible differences in the failure mode at the various FoS test temperatures.
Analysis Lab

Low Temperature SMT Solder Evaluation
Recent advances in alloy "doping" have opened the door to revisit Sn/Bi alloys as a possible alternative to SAC-305 for many applications.
Production Floor

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e-media Advertising Delivers Results!
Introduce your technology, new products or services in our e-mail newsletter & website to see how a digital advertising campaign can deliver results. Reach over 125,000 professionals.
Circuitnet Media LLC

Enhanced Cleanability Using Fluxes with Decreased Viscosity after Reflow
A series of flux systems have been developed which would result in a reduced viscosity after reflow. This enables a high viscosity, high tack flux to be used.
Production Floor

Copper Foil Elements Affecting Transmission Loss with High Speed Circuits
This study examines possible factors for these inconsistencies such as etched signal trace shape, surface treatment, and grain size.
Analysis Lab

Contactless Technology for High Resolution, Speed, Solder Paste Deposition
Ideally, we would have a solder ball dispensing solution that had the throughput of analog solutions with the accuracy of traditional digital solutions.
Materials Tech

Sponsor

Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron

Dispensing EMI Shielding Materials: An Alternative to Sputtering
The development of a spray coating process to apply EMI shielding materials to the exterior surfaces of components on strips and larger SiP packages.
Production Floor

Electromigration in Tin-Bismuth Planar and Bottom Terminated Solder Joints
The electromigration rates and behavior of eutectic Sn-Bi alloy in planar and in BTC solder joints were compared and shown to be similar.
Analysis Lab

Sponsor

EPA Verified Stencil Cleaning Systems
Low power density ultrasonic cleaners combined with 440-R-SMT detergent provide safe and effective cleaning of stencils, pallets, oven radiators, misprints and SMD adhesives.
Smart Sonic

Suggested Stencil Wipe Frequency?
How do we determine what is the best under stencil wipe frequency? The Assembly Brothers share their own insights and experiences on this matter.
Board Talk

Development and Testing of a Lead-Free Low Melting Point Alloy
This paper describes the development and testing procedure of a new lead-free low melting point alloy.
Materials Tech

Advancing Bonding Techniques for Electronic Interconnects
This study focuses on two major bonding techniques: Cu nanoparticle (Cu NP) sintering and Cu-Sn3.0Ag0.5Cu (Cu-SAC305) hybrid paste bonding. Both methods aim to address the limitations of conventional soldering processes, especially in high-temperature, high-power applications.
Materials Tech

Sponsor

Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.

Counterfeit Electronics Component Conundrum with Smart Labeling
Electronics manufacturers hurting from supply chain disruptions and component shortages are challenged by the rise in counterfeit components.
Production Floor

Effect of Bias Voltage on Surface Insulation Resistance Measurements
In this study, we analyzed the effect that voltage bias has on dendrite growth both in clean PCBs and PCBs that were contaminated.
Analysis Lab

Sponsor

Understanding Solder Dross: Causes and Control Strategies
This article outlines the main contributors to dross formation, examines how alloy refining methods play a role, and explores practical ways to reduce dross through process control and equipment optimization.
AIM Solder

Tied Up Telephone Lines
One day a of network phone links between several major plants became tied up. What was causing this phone link problem?
Mysteries of Science

Innovative Panel Plating for Heterogeneous Integration
This paper will show that improvements in feature density, deposition uniformity and void free via filling can be achieved in large panel processing.
Production Floor

Development of Si-Interposers for 3D Heterogeneous Integration
This paper will review the status of the ongoing interposer development program and provide details on the process capabilities that have been established.
Analysis Lab

Solder Joint Void Metrology to Monitor Solder Joint Quality

We are showing what could be done when using a 2D X-ray system to collect high resolution images and process them with Deep Learning using AI.
Analysis Lab

2nd Generation of indium TIM
A new generation of indium TIM has a protective layer to suppress surface oxidation. This work examines the performance of indium as TIM for BGA packaging.
Materials Tech

Pick-and-Place Feeder density within SMT and Electronics Assembly

To keep up, P&P machine suppliers must increase feeder density in traditional ways or new creative innovations to better serve the end user.
Production Floor

Latest Industry News

Nvidia's Push Into 'Physical AI' Signals a New Era for Autonomous Vehicles

Apple's Foldable iPhone Might Be Delayed Till 2027, Report Claims

Apple scales back iPhone Air production, other iPhone 17 models keep shining

X lawsuit vs. Apple and OpenAI stays in Fort Worth, Texas; judge suggests they move there

US and China agree to fresh trade talks

MORE INDUSTRY NEWS

Sponsor

Tech Paper - Keys to Component Lead Tinning Success
This paper examines the challenges and best practices of component tinning, with a focus on temperature control, flux selection, and soldering techniques.
Circuit Technology Center

Questions and Comments

Supercooled Solder Pastes in Low-Temperature Attach Applications

Interesting work toward very low temperature soldering. While it resulted ...
Jaye Waas, Renkus-Heinz

PCBA Inspection Concerns

A rule to follow, is; do not slide the boards ...
Jaye Waas, Renkus-Heinz

Can Conductive Ink Shrink?

The statements presented hit the key points. Conductive inks shrink ...
Jaye Waas, Renkus-Heinz

MORE COMMENTS

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Thermally Conductive Epoxy
Master Bond Supreme 11AOHTLP is a two component adhesive featuring thermal conductivity and electrical insulation for high performance bonding, sealing and coating.
Master Bond