Technical Papers
Cleaning Performance Evaluations for Jettable Pastes for Advanced SMT Assembly Processes
Dispensing 2-Part Adhesives
Advanced Materials in Power Electronics
The Impact of Thermocouple Attachment Methods on Thermal Profiling Accuracy
Utilizing SIR and Analytical Tools to Determine Impact to Reliability for Process Improvements
Factors Affecting the Cost of PCB Fabrication
The Critical Role of RHSD in High-Reliability Applications
Advanced High Frequency PCB Materials
MORE TECHNICAL PAPERS
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
MORE ASK THE EXPERTS
Latest Industry News
Foxconn Upgrades 2024 Outlook on Soaring AI Server Demand
Indian PC vendors to meet production targets by fiscal 2023 under IT hardware PLI
Laid-off techies face 'sense of impending doom' with job cuts at highest since dot-com crash
China and Norway Lead the World's EV Switchover
Advancing Bluetooth Technology: The Telink Innovation
MORE INDUSTRY NEWS
March 19, 2024
Should Apertures be Home Plate or Inverted Home Plate?
Should Apertures be Home Plate or Inverted Home Plate?
Should stencil the aperture be home plate or inverted home plate? You know the performance difference between the two types. Which one is better? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their own insights.
Board Talk
Automation for Traceability and Reliability
In this study it was demonstrated how process traceability records need to deal with complex and variable inputs as well as challenges among our machine processes.
Production Floor
There Actually is an 'I' in Team
There Actually is an 'I' in Team
Robotic arms handle repetitive and precision movements. This change relieves operators of mundane work. They must adjust to the new work environment.

Technology Briefing
Metallurgical and Mechanical Analysis of Castellated Via Rigid-Flex Connection
The reliability of castellated vias as a rigid-flex interconnection method is evaluated. This is split into metallurgical aging of joints and investigating mechanical robustness/integrity.
Analysis Lab
Novel TIM Solution with Chain Network Solder Composite
Novel TIM Solution with Chain Network Solder Composite
A novel epoxy SAC solder paste TIM system has been developed with the use of non-volatile epoxy flux. Cu filler was added to the solder paste.
Materials Tech
Wearable Electronics & Big Data = High Volume, High Mix SMT
This paper explores the conflicting requirements of achieving low cost while meeting high volume, high mix requirements.
Production Floor
A Method to Investigate PCB Supplier Rework Processes and Best Practices
This paper investigates PCB supplier rework processes, including identifying rework procedures that have potential implications to PCB functionality.
Analysis Lab
Is Customer Approval Required for Class 3 Repair?
Is Customer Approval Required for Class 3 Repair?
A non-aerospace customer's board was repaired without authorization. Does an IPC document state that customer approval is required for class 3 repairs?
Board Talk
New High-Performance Organophosphorus Flame Retardant
A non-halogen flame retardant has been developed for high performance applications. Resin performance data are presented.
Materials Tech
AI and Precision Agriculture Address Farming Problems
AI and Precision Agriculture Address Farming Problems
Automation with biology and chemistry to create a farming revolution which enabled a fraction of the population to deliver more than had formerly produced.
Technology Briefing
Influence of Copper Conductor Surface Treatment for High Frequency PCB
Paper provides results of adhesion performance and electrical properties using certain types of dielectric material for high frequency PCBs.
Production Floor
EOS Exposure of Components in the Soldering Process
Examines the consequences of electrical overstress caused by electromagnetic interference on power lines and ground in the manufacturing environment.
Analysis Lab
The Hot Chip Scale Package
The Hot Chip Scale Package
A team building the world's first high-density Chip Scale Package needed to get it out the door. It was still hot when it shipped.
Mysteries of Science
Challenges on ENEPIG Finished PCBs
Through extensive investigation, using 8D and Kepner-Tregoe problem solving methods, solutions were discovered in the majority of cases.
Production Floor
Energy-Efficient Method for Transferring Data Over Fiber-Optic Cables
Energy-Efficient Method for Transferring Data Over Fiber-Optic Cables
Researchers demonstrated an energy-efficient method for transferring data over fiber-optic cables that connect computing nodes used to train AI.
Technology Briefing
Board Level Reliability of Large Body Size WlCSP for Automotive Applications
This paper will outline the board-level assembly development and reliability that was undertaken to demonstrate this WLCSP could meet the demands of automotive.
Analysis Lab
Dynamic Bending Reliability of Chip-In Fabrics (CIF) Packaging
Dynamic Bending Reliability of Chip-In Fabrics (CIF) Packaging
In this study, flexible Chip-In-Fabric (CIF) assemblies using anisotropic conductive films (ACFs) and cover layer structure were demonstrated.
Materials Tech
Surface Treatment Enabling Low Temperature Soldering to Aluminum
An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on Polyester (Al-PET) substrates.
Production Floor
Board Talk
Should Apertures be Home Plate or Inverted Home Plate?
Is Customer Approval Required for Class 3 Repair?
Selective Solder Pot Temperatures
Solder Pallets With Titanium Inserts - Yes/No?
Top Side Reflow Causing Solder Balls
Trends for Printing Ultra Miniature Chips
Removing Warpage from PCBAs
Cleaning R.F. Circuits - Aqueous or Vapor?
MORE BOARD TALK
Questions and Comments
Removing Warpage from PCBAs
Put warpage board in dry cabinet or in baking oven ...
Sanket Mehta, Optimus electronic ltd
PCBA Cleaning with Sodium Bicarbonate
I cant speak to rigid PCBs, but we have been ...
Jason Michaud, Miraco Inc.
PCBA Cleaning with Sodium Bicarbonate
10-15 years ago we recovery cleaned hundreds of PCBAs with ...
Eric Camden, Foresite
MORE COMMENTS
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