Electronics Manufacturing and Electronics Assembly

Sponsor

Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
ECD

Technical Papers

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

MORE TECHNICAL PAPERS

Ask the Experts

Solder Paste Print Test Boards

Removing Cleaning Residues Under BTC Packages

BGA Solder Ball Wetting

Requirements for Installing Leaded vs. Lead-free Press Fit Connectors

Maximum Allowable Time Prior to Washing When Using Water Soluble Paste

What's Causing Cloudy Conformal Coating

What Is Causing Slanted Pins After Reflow

Components Falling Off During Wave Soldering

MORE ASK THE EXPERTS

Challenges Reliably Soldering Large Ground Pad on LGAs
We are experiencing difficulties reliably soldering large ground pad on land grid array packages using a single large window as a stencil. Should we use all four windows?
Board Talk

The Sir Reliability of Fine Pitch QFN Components Under Harsh Condition
A variety of dummy QFNs are assembled on PCBs whose surface finish is OSP by reflow in air, they are tested under 5V bias voltage and 85, 85%RH condition.
Technical Paper

Sponsor

Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron

Healthcare Gaps That Only Technology Can Fill
Digital Health is comprised of wearable, implantable technology, web and email, mobile technology, software, social networking, data management and analytics.
Technical Paper

A Case Study of Nickel Dendritic Growth on Printed Circuit Boards
This paper is a case study of nickel dendritic growth under moisture condensation condition on freshly produced circuit boards contaminated with sulfuric acid etchant.
Technical Paper

Electrochemical Reliability as a Function of Component Standoff
The purpose of this paper is to research the activity of flux residues as a function of the standoff height using insulation resistance.
Technical Paper

Sponsor

Tech Paper - Keys to Component Lead Tinning Success
This paper examines the challenges and best practices of component tinning, with a focus on temperature control, flux selection, and soldering techniques.
Circuit Technology Center

Finding the Cause of Cold Solder Joints
We have problems with our wave soldering system, especially cold solder joints. Could this be caused by using a selective soldering frame?
Board Talk

Quantifying Environmental Life Cycle Impacts for ICT Products
This paper describes a simplified approach for estimating the environmental impact of Information and Communications Technology (ICT) products.
Technical Paper

Sponsor

The Industry Standard Solder Paste
Looking to Avoid the Void® and enhance SIR performance? Indium8.9HF is your proven, versatile and stable, no-clean, halogen-free, Pb-free solder paste solution.
Indium Corporation

Cavity Board SMT Assembly Challenges
This study is to identifies the challenges related to assembly of a package into a cavity on the board, and establish the best known method for SMT assembly success.
Technical Paper

Risk for Ceramic Component Cracking Dependent
The paper discusses the differences of the alloy, based stress in ceramic components due to passive cycle tests, real customer tests, and stress analyses.
Technical Paper

Room Temperature Fast Flow Reworkable Underfill for LGA
With the miniaturization of electronics, Land Grid Array has been widely used in consumer electronics, leaving only 20-30 microns gap left between LGA and the substrate.
Technical Paper

Sponsor

Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering

Solder Balls on Neighboring Components After Rework
During the rework of SMT components on conformal coating boards we see solder balls occurring on neighboring components. How can this be eliminated?
Board Talk

Protocol Development for Testing Solder Reliability
This paper updates progress in the development of methods for investigating solder joint reliability in a combined environment of vibration and thermal cycle testing.
Technical Paper

Sponsor

High power atmospheric plasma system
Our 1000 Atmospheric Plasma System is available with PC or PLC control for lab or high speed production use with the same high powered systems. Remove contaminants and increase bond strength!
Plasma Etch

Failure Analysis - Using Chromatography and Ion Chromatopgraphy/Mass Spec
From component and fabrication to complete electronic assemblies, IC analysis has been the de facto method for evaluating ionic cleanliness of electronic hardware.
Technical Paper

Latest Industry News

Apple Makes About 25% of iPhones in India After China Pivot

Consumer Tablet Shipments Grow 19.7% in 2025, While Delays in Manifesto Deals Weigh on Overall Market

Laptops could soon cost 40% more, and you already know why

Elon Musk's xAI wins permit to build power plant in Mississippi despite pollution concerns

Beyond Bandwidth: The Industry is Striving for Custom Memory (Part 1)

MORE INDUSTRY NEWS

Sponsor

Flexibilized LED Curable Adhesive System
Master Bond LED415DC90 is a one part, dual curing adhesive with excellent strength properties that is used to bond both similar and dissimilar substrates.
Master Bond

Sponsor

Viscom: Next Level of Inspection at APEX
Viscom Inc. presents its AI-powered inspection software vAI ProVision at APEX Expo 2026 in Anaheim. See live demos of faster AOI and AXI programming at Booth #2836.
Viscom SE

"I need help! I was thinking outside of the box and I let my mind wander too far and now I can't find my way back!"
Copyright © Randy Glasbergen