Technical Papers
Cold Underfill Component Removal
Cleaning Performance Evaluations for Jettable Pastes for Advanced SMT Assembly Processes
Dispensing 2-Part Adhesives
Advanced Materials in Power Electronics
The Impact of Thermocouple Attachment Methods on Thermal Profiling Accuracy
Utilizing SIR and Analytical Tools to Determine Impact to Reliability for Process Improvements
Factors Affecting the Cost of PCB Fabrication
The Critical Role of RHSD in High-Reliability Applications
MORE TECHNICAL PAPERS
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
MORE ASK THE EXPERTS
Latest Industry News
North American EMS Industry Up 4.1% in February
Apple pushes foldable iPhone to 2027, moves Vision Pro engineers into the project
Bridge Collapse Adds to Shipping Disruption
A New Alliance Is Advancing Augmented Reality
Scientists made implantable batteries that are powered by your body's oxygen
MORE INDUSTRY NEWS
March 28, 2024
What is Ideal Humidity for Final Assembly?
What is Ideal Humidity for Final Assembly?
What is ideal humidity within a final assembly facility? No soldering involved. The facility is used for final box build. Phil Zarrow and Jim Hall, The Assembly Brothers, answer this question and offer their own insights.
Board Talk
Implementing Automation and Ai for Electronic Card Assembly
AI solutions could be integrated into the automation process to further improve the production operation. This paper discusses the challenges in implementation.
Production Floor
Humanoid Robots are Finally on the Way
Humanoid Robots are Finally on the Way
Over the past three years, there has been an explosion of companies racing to integrate the hardware and software that will constitute a viable humanoid robot.
Technology Briefing
Component Pressure Exposure Validation in An Inline Wash System
The purpose of this research is to measure what circuit cards and parts on those assemblies are exposed to during the wash and rinse process of inline cleaning.
Analysis Lab
Managing blooming in an adhesives process
Managing blooming in an adhesives process
If you have ever used a cyanoacrylate adhesive, you may have seen blooming — a chalky, white residue on the surface of your part.
Materials Tech
Risk Mitigation in Hand Soldering
A new validation technology in concert with visual inspection represents a change to the status quo in hand soldering.
Production Floor
Oxide Alternative Process for High Frequency Bonding Applications
This paper highlights the challenges made with conventional Sulphuric-Peroxide based Oxide Replacement bonding enhancement system.
Analysis Lab
Step Stencil Setup
Step Stencil Setup
When shifting from standard solder paste stencils to step stencils, should we change the pressure or attack angle?
Board Talk
New-Generation, Low-Temperature Lead-Free Solder for SMT Assembly
The roles of additive and bismuth content will be discussed. Eutectic SnBi and three newly designed SnBi-based alloys were experimented upon.
Materials Tech
AI, Digitalization, & the Outlook for the U.S. Economy
AI, Digitalization, & the Outlook for the U.S. Economy
Trends in U.S. demography are poised to complement the deployment of maturing AI and digitalization. This will transform industries and create new ones.
Technology Briefing
Cost Comparison of Complex PCB Fabrication
The authors present an alternative to sequential lamination for fabricating complex PCBs, where conductive paste is used as interconnect between cores.
Production Floor
Failure Modes in Wire Bonded and Flip Chip Packages
Overview of typical defects and failure modes seen in flip chip package assembly, and efforts to understand new failure modes during assembly.
Analysis Lab
The Puzzling Z-Axis Adhesive
The Puzzling Z-Axis Adhesive
A new type of z-axis conductive adhesive was mysteriously switching on and off. The cycle was endlessly repeated. What was the cause?
Mysteries of Science
Breakthrough Technology to Improve X-Ray results
The paper contains comparison data from Nano Focus tube, plus data from reliability and stability tests using a real-life system and not test rigs.
Production Floor
Implementing 3D Integration with 2D Materials
Implementing 3D Integration with 2D Materials
In a new study, researchers identify a potentially game-changing remedy: seamlessly implementing 3D integration with 2D materials.
Technology Briefing
Optimization of PCB SI Coupon Design that Minimizes Discontinuity
In this study, we tried to minimize the discontinuous path of Delta-L coupon by using the VIPPO (Via In Pad Plated Over) technique to improve the signal integrity.
Analysis Lab
Atomristors: Non-Volatile Resistance Switching in 2D Monolayers
Atomristors: Non-Volatile Resistance Switching in 2D Monolayers
Researchers discovered the first two-dimensional material, graphene, which consists of only a single layer of atoms13.
Materials Tech
Investigation into Lead-Free Low Silver Solder Wire for Electronics
This paper show results using a lead-free solder rework wire alloy in terms of wetting, reduced solder iron tip erosion, reduced IMC growth and reliability.
Production Floor
Board Talk
What is Ideal Humidity for Final Assembly?
Step Stencil Setup
Is No-Clean the Trend for QFN Components?
Acceptable Rate for Head in Pillow?
Why Do Our Boards Warp During Reflow?
What Rate is World Class for SMT Machines?
Should Apertures be Home Plate or Inverted Home Plate?
Is Customer Approval Required for Class 3 Repair?
MORE BOARD TALK
Questions and Comments
Is No-Clean the Trend for QFN Components?
I love these questions…always anonymous (I think Phil makes them ...
Ike Sedberry, ISEDS
Why Do Our Boards Warp During Reflow?
After reading all the comments, I didn’t see anyone mention ...
Andy Monson, Hayward Industries
Removing Warpage from PCBAs
Put warpage board in dry cabinet or in baking oven ...
Sanket Mehta, Optimus electronic ltd
MORE COMMENTS
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