Electronics Manufacturing and Electronics Assembly

Sponsor

Counterfeit Components Identified With X-ray Inspection
Automated component sourcing and procurement platform relies on real-time X-ray inspection to remove counterfeit components from supply chain.
Glenbrook Technologies

Technical Papers

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

MORE TECHNICAL PAPERS

Ask the Experts

D-PAK With Exposed Copper

Cleanliness Testing

Hand Sanitizer Contamination

Epoxy Wicking up Wire Insulation

Out-gassing and Cleaning

Contamination From Anti-static Foam

Organic Flux Residue Concerns

Lifted Lead on SOT Component

MORE ASK THE EXPERTS

Investigation of Copper Sinter Material for Die Attach
3 copper powders were tested for their feasibility to use as die attach material for pressure sintering process without prior treatment with reducing agents.
Technical Paper

Does HASL or ENIG Reduce Creep Corrosion in Corrosive Environments?
We make electronics equipment used in corrosive environments. Do you recommend the use of HASL versus immersion gold for our application? The Assembly Brothers, Phil Zarrow and Jim Hall, answer this question.
Board Talk

Sponsor

High power atmospheric plasma system
Our 1000 Atmospheric Plasma System is available with PC or PLC control for lab or high speed production use with the same high powered systems. Remove contaminants and increase bond strength!
Plasma Etch

Developments of the X-ray Inspection Technology for PCBAs
This paper provides an overview of some of the latest technical developments in the X-ray inspection technology for the electronics industry.
Technical Paper

Structural Electronics for Automotive Interiors
This project evaluates structural electronics for automotive interior use. The car interior application is back-seat-control-panel and the structural electronics.
Technical Paper

Cu Conductive Paste as Via Filling Materials for Various Substrates
In this study, we developed a Cu paste that can be used as a filling material for through silicon via (TSV), through glass via (TGV), and organic substrates.
Technical Paper

Sponsor

Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.

The Effect of Sb and Ag Addition on the Behavior of Sn-Bi LTS
This study focuses on the changes in melting and solidification behavior of near-eutectic Sn-Bi alloys with Sb (0.5-2wt%) and Ag (0-1wt%) additions.
Technical Paper

Opens With Assembled QFN Components
We are experiencing opens on assembled QFN components at a rate of 9%. The failure only appears in rows near the component center. What is happening?
Board Talk

Sponsor

Maintenance: The Basics of Cleaning Series Part 4
This is the final paper in a series and discusses some of the common mistakes in maintenance cleaning applications found in electronic assembly operations.
KYZEN

Miniaturization of Hearing Aid Electronics Using Embedded Die Packaging
This paper examines the use of second generation embedded die packaging to drive further size reduction in custom hearing instruments.
Technical Paper

AI to Predict Compatibility Between Solder Paste Residues and Coatings
This paper shows how AI is used to predict compatibility results between solder paste residues and coatings. A physical compatibility study is carried out to benchmark some combinations of solder pastes and coatings of the market. Results between AI prediction and the physical tests are compared to choose the right AI model for a good prediction of the compatibilities.
Technical Paper

Metallurgical and Mechanical Analysis of Castellated Via Rigid-Flex Connection
The reliability of castellated vias as a rigid-flex interconnection method is evaluated. This is split into metallurgical aging of joints and investigating mechanical robustness/integrity.
Technical Paper

Sponsor

5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.

Design for Manufacturability - Perspectives from a Manufacturing Engineer
This paper will examine a few key areas of PCB design and manufacturing that can have a substantial impact on product reliability and how to mitigate reliability risks by deploying design for manufacturability (DFM) best practices. It will also explore the dependencies between the design and manufacturing processes.
Technical Paper

No-Clean Residue Shorts
We have a PCBA with a QFN 44 using no-clean flux. We have many test failures during testing. Are the failures due to flux reside between terminations? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk

Sponsor

Fast PCBs, Fully Assembled
Need it fast? Summit delivers quick-turn PCB fabrication and assembly on compressed timelines—no shortcuts, just speed and precision from one source.
Summit Interconnect

Issues With SMT Component Alignment
During automatic optical inspection our chip components are shifting. This is not limited to single components and changes daily.
Board Talk

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MORE INDUSTRY NEWS

Sponsor

From Slave to Master: flexible ISM integrations
ESSEGI AUTOMATION's ISM software integrates with 250+ brands, connecting ERP, MES, WMS, Pick & Place and X-Ray systems. Flexible logic allows it to operate as master or slave in any production flow.
Essegi Automation

Sponsor

Micro Dispensing Technology Leader
DL Technology LLC develops customized dispensing needles and valves for the electronics assembly, industrial assembly, semiconductor packaging and medical industries.
DL Technology