Electronics Manufacturing and Electronics Assembly

Sponsor

Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron

Technical Papers

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

Understanding Solder Dross: Causes and Control Strategies

MORE TECHNICAL PAPERS

Ask the Experts

SMT Target Component Placement

Old Components and Blow Holes

Pin in Paste Solder Dropping

Reusing recovered solder paste

Bottom Side Chip Bonding

Pick Performance for SMT Placement Machines

Overlap Solder Joint Failures

How to Re-qualify BGA Spheres

MORE ASK THE EXPERTS

How the Chip Shortage Reshaped the Electronics Supply Chain
The global chip shortage that started in 2020 sent shockwaves through the electronics manufacturing industry, disrupting production lines and forcing companies to rethink their supply chain strategies. This shortage not only delayed production but also highlighted critical vulnerabilities in the electronics supply chain.
Technical Paper

Process Control of Ionic Contamination in Assembly of Electronic Circuits
This paper reviews a testing protocol based on IPC-TM 650 2.3.25 to enable monitoring of ionic contamination within series production.
Technical Paper

Sponsor

Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.

How To Rework Warped PCBAs?
From a large lot, 20 populated boards with components of varied heights on both sides are warped. What methods can they use to flatten them?
Board Talk

Novel Pogo-Pin Socket Design for Automated Linearity Testing
A novel pogo-pin block array and corresponding motorized test socket has been designed to stimulate the MCM and acquire full functional test data.
Technical Paper

Jetting Conductive Adhesives with Silver Coated Polymer Particles
Tests performed in this study demonstrate that a conductive adhesive using spherical, polymer silver particles can be used for no-contact jet printing.
Technical Paper

Sponsor

Silver Filled Electrically Conductive Epoxy
Master Bond EP3HTSDA-2Med is a silver filled adhesive system with high electrical and thermal conductivity that passes ISO 10993-5 for cytotoxicity.
Master Bond

Reduce Pollution of Process Gasses in an Air Reflow Oven
This paper gives detailed information of catalyst systems designed and implemented in SMD production lines to reduce pollution of process gasses.
Technical Paper

The Development of Hybrid Therma-EMI Solutions for Electronics
Test methods to measure the thermal and electromagnetic properties of a material in an application and as fundamental material properties are discussed.
Technical Paper

Sponsor

Buy SMT Dispensing Needles Online
EZ-FLO needles are machined from stainless steel with smoother internal profile for improved material flow. Chamfered needle tip is finely ground for better release. Buy online.
DL Technology

How Long Solder Paste Can Be Left On a Stencil Without Activity
How long can we leave solder paste on a stencil without any activity? If activity means not printing, then we are talking about a pause or abandoned time.
Board Talk

Intrusive Soldering vs. Wave Solder
We are wave soldering with top and bottom side preheat. Would a pin in paste, or intrusive soldering, be a better option than wave soldering? The Assembly Brothers, Phil Zarrow and Jim Hall, address this question.
Board Talk

The Dynamics of Low Stress Epoxy Curing
This study compares uniform variable frequency microwave (VFM) field cure to standard oven curing at temperatures below Tg (transition temperature).
Technical Paper

Sponsor

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp

Design for Testability to Overcome Functional Board Test Complexities
In this paper the author reviews how Design for Testability techniques can be an effective way to reduce functional board test programming complexity.
Technical Paper

Engineered Tin-Copper Alloys in Selective Soldering
The performance with one alloy under design conditions that make soldering difficult demonstrate the need to evaluate the performance differences.
Technical Paper

Sponsor

Circuitnet Advertising Delivers Results!
Introduce your technology, new products or services in our daily e-mail newsletter & website to see how a digital advertising campaign can deliver results. Reach over 200,000 professionals.
Circuitnet LLC

Strain During Press Fit Connector Insertion in PCB Assembly
Locations closer to the insertion site experienced the highest level of strain, which progressively decreased further from the insertion location.
Technical Paper

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MORE INDUSTRY NEWS

Sponsor

Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
ECD

Sponsor

Prototyping to High-Speed Production
From first builds to 22,000 CPH, Manncorp pick & place machines scale with your budget, space, and output goals—so your line grows as you do. Backed by lifetime support.
Manncorp Inc.