Electronics Manufacturing and Electronics Assembly

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Tough Engineering Changes? Where Can You Turn?
Engineering changes are a reality that need to be dealt with. Do you have qualified rework technicians to do the job efficiently and reliably?
Circuit Technology Center

Technical Papers

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

Understanding Solder Dross: Causes and Control Strategies

Optimizing BGA Rework: Challenges, Techniques and Quality Control

Maintenance: The Basics of Cleaning Series Part 4

The Economics of Electronic Component Salvage and Reuse

MORE TECHNICAL PAPERS

Ask the Experts

Confused About IPC-A-610 Class 2 vs. Class 3

Copper Dissolution Rate

Burned Chip Repair

What is the IPC Definition of Uncommonly Harsh?

PCBA Inspection Process Causing Damage

Is Component Lead Damage Reparable?

Type III vs. Type IV solder paste

MORE ASK THE EXPERTS

September 30, 2025

Performance Comparison: Liquid and Pad Thermal Interface Material

This study tested the hypothesis that a liquid TIM with the same effective thermal conductivity as a gap pad will have lower thermal resistance in application due to its ability to wet out the interface better than a solid pad. Also hypothesize here, bondline thickness has a significant effect over total thermal resistance.
Analysis Lab

Direct Imaging and Direct Jetting of Solder Mask
PCB manufacturers are challenged to fabricate denser solder mask patterns with smaller features to accommodate advanced electronic components.
Production Floor

Sponsor

Underfill Epoxy Offers Thermal Conductivity
Master Bond EP29LPTCHT is a low viscosity adhesive that can be used for underfill & encapsulation apps. It offers thermal conductivity & electrical insulation.
Master Bond

Selective Removal of Conformal Coatings by Pulsed Ultraviolet Lasers
To miniaturize electronics conformal coating removal solution needs to provide fine cut resolutions, without compromising quality, cost, and throughput.
Production Floor

Effect of Thermal Cycling Dwell Time on High-Performance Solder Alloys
This paper describes the planning and progress of the experimental program designed to assess the effect of a 60-minute temperature cycling dwell time.
Analysis Lab

Low Temperature Solder “Reverse Hybrid” Method
This paper will review the implementation of LTS “Reverse Hybrid”, which is the assembly of a ball grid array component with LTS solder balls to the motherboard.
Materials Tech

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Need a Profiler Plan B?
Tired of having to share a thermal profiler across different soldering operations? Add the affordable V-M.O.L.E. 2 four-channel profiler to the mix for time-saving efficiency.
ECD

Machine Vision-based Defect Inspection for Plated Through Hole Components
This study delineates the conceptualization of a machine vision-based defect inspection model, meticulously engineered to confront the intricacies of high-throughput PCB assembly.
Production Floor

Single Device Traceability in Assembly without ECID
The recent evolution of data analytics allows correlation analysis from wafer fab to wafer test to assembly and packaging to product level test and field performance.
Analysis Lab

Sponsor

Reclaim Your Factory's Future
Space is a precious resource. With SELECT Synchro, reclaim it, and reimagine your factory's workflow for greater efficiency and scalability.
Nordson Electronic Solutions

Keys for Moisture Sensitive Device Control
We attach travelers to every group of MSD components taken out of the moisture barrier bag. Is this enough documents on our MSD program?
Board Talk

Effect of Bi-Addition on the High Strain Rate Properties of SnAgCu Solders
This paper focuses on the effects of sustained high temperatures on the high strain rate of doped lead-free solders operating between -65°C to 200°C.
Materials Tech

The Effect of Strain Rate on the Ductility of Bismuth-Containing Solders
In this paper the authors report some preliminary results from a wider study of the effects of bismuth on the properties and behaviour of solder alloys.
Materials Tech

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Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron

Reservoir Printing in Deep Cavities
Guidelines for stencil designs and aperture placement in cavities are presented, including stencil design, paste material, experimentation, and results.
Production Floor

Analyzing 0402 Capacitor Defects With Stencil Printing Misalignment
This study investigated the cause of tombstoning for 0402 capacitors in surface mount technology. Statistical analysis methods were used to determine if there was any difference.
Analysis Lab

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Your Domestic PCB Solution
Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on.
Summit Interconnect

Eavesdropping on the Enemy
The military wanted to listen to the enemy from overhead. What type of aircraft would be quiet enough to make listening possible?
Mysteries of Science

Kinetics of a Layer of Bismuth at the Anode of a Sn-Bi Based Solder Joint
Electrical resistance of low temperature solder during current stressing was shown to have the thickness of continuous layers of Bi accumulated at the anode.
Production Floor

Temperature Cycling with Bending to Reproduce Typical Product Loads

A new methodology for solder joint reliability prediction taking into account the mechanical load as well as the thermal mismatch load between component, solder & PCB is proposed.
Production Floor

Optimization of Robotic Soldering Process: Solder Spread and Spattering
Robotic soldering is a growing market. We will present how cored wires with different flux percentages will affect robotic soldering performance.
Analysis Lab

Pb-Free Water-Soluble Solder Paste Improves Reliability
This paper details a water-soluble lead-free solder paste that has improved voiding performance and washability over previous generations of solder paste.
Materials Tech

Thermal Radiographic Failure Analysis of Capacitor Encapsulant Fracturing

Multiple tantalum capacitors are SMT attached to PCBs. Failures or fractures were observed at contractor SMT assembly lines and not on RTX lines.
Production Floor

Latest Industry News

A Reputation Crisis Can Hit Anytime — and Cost You Everything. Here’s How to Prepare.

Ex-Google CEO Eric Schmidt says work-from-home culture means US struggles to compete with China

What's the 'natural demand' for EVs in the U.S.? We're about to find out

Apple May Have 6 More Product Launches Coming In 2025

India roundup: Taiwan deepens trade links with fast-growing India

MORE INDUSTRY NEWS

Sponsor

Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.

Questions and Comments

Concerns with Flux During Vapor Phase Reflow

Flux density is lighter than the Galden, so any melted ...
Mike Cummings, TSI

Is There a Spacing Spec for SMD Components?

Another significant spacing issue arises if you have a mixed-technology ...
Alan Ritter, MtRitter.com, LLC

Influence of Salt Contamination and RH on Creep Corrosion of Immersion Silver

In the 1980s a consortium of companies sponsored research under ...
Pat Lees, Littelfuse

MORE COMMENTS

Sponsor

Bismuth in Solder Alloys
Bismuth is a primary constituent in many low-temp solders. It also serves as an additive element in SAC solders that reinforces joint durability & optimizes wetting characteristics.
AIM Solder

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