Electronics Manufacturing and Electronics Assembly

Sponsor

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS

Technical Papers

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

Understanding Solder Dross: Causes and Control Strategies

MORE TECHNICAL PAPERS

Ask the Experts

Depaneling circuit board that contain BGA components

Legend Marking Discoloration

Conformal Coating Bubbles

Stainless Steel Benches and ESD

Full Aqueous Clean or Local Spot Clean

HASL Surface Finish and Coplanarity

Dam & Fill vs. Conformal Coating

Mixed MSL Baking

MORE ASK THE EXPERTS

Effect of Thermal Cycling on Subsequent Drop Behavior of Assemblies
This paper presents the effect of a priori thermal cycle on subsequent drop to failure behavior of CGAs with 1272 columns.
Technical Paper

Alloy Composition and Aging on the Survivability of Lead-Free Solders
A comparison of failure modes for different packaging architectures at elevated test temperatures and vibration has been presented in this study.
Technical Paper

Sponsor

BGA Component Rework Simplified
When you're confronted with tough BGA rework, who do you turn to? Discover the #1 resource used by military contractors. We have solutions for all your BGA rework and repair needs.
Circuit Technology Center

What is Considered Acceptable PCB Rework and Repair?
An operator attempted to repair three damaged conductors using bus wire overcoated with epoxy. Do you consider this repair acceptable?
Board Talk

Design Variables of Thermoforming Process on Printed Electronic Traces
This experiment provides insight into future design guidelines and process intellectual property for manufacturing printed electronic products.
Technical Paper

Assembly Reliability of TSOP/DFN PoP Stack Package
This paper presents thermal cycle reliability evaluations of 2-high and 4-high 3D stacks built with a mix of TSOP and DFN daisy-chain package assembly.
Technical Paper

Sponsor

Unitech PCB Cleaners
The basic PCB cleaning equipment from Unitech Corp., includes a large surface vacuum that sucks up dust and particles, a small brush to pick up dirt and a soft cloth for wiping down.
Seika

AOI Capabilities Study with 03015 Components
Paper covers tests working with five AOI vendors to ensure successful testing of 03015 components, with emphasis on optimizing algorithm threshold settings.
Technical Paper

Evaluation of the Use of ENEPIG in Small Solder Joints
In this study, the impact of industry standard Pd thicknesses on thin solder joints is evaluated through shear testing.
Technical Paper

Sponsor

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura

Why Uneven Conformal Coating?
We are experiencing an issue with our conformal coating. On matte finish boards the coating is vibrating away from some others and building up in others.
Board Talk

Selective Solder Paste Printing for BGA Components
Could we print paste only on the pads that have functional requirements? Could we skip printing on 50 or more of the interior pads since they serve no function? The Assembly Brother, Phil Zarrow and Jim Hall, discuss this topic and share their own experiences.
Board Talk

Conformal Coating - Performance Comparison Environmental Testing
The experiment compares the behavior of acrylic coating used on large scale in various applications and a specific super-hydrophobic nano conformal coating.
Technical Paper

Sponsor

Micro Dispensing Technology Leader
DL Technology LLC develops customized dispensing needles and valves for the electronics assembly, industrial assembly, semiconductor packaging and medical industries.
DL Technology

Electrochemical Methods to Measure Corrosion Potential of Flux Residue
This study reviewed electrochemical methods on four flux systems used in a SIR study to determine if EIS data findings have commonality with SIR data findings.
Technical Paper

Effect of Area Shape and Area Ratio on Solder Paste Printing Performance
The effect of aperture shape and orientation on solder paste printing performance is analyzed using stencil thicknesses, solder paste types and manufacturers.
Technical Paper

Sponsor

Get the Revisiting Underfill Handbook
Today's underfill applications are constantly evolving. As chip populations increase, dispensing applications must deliver smaller amounts of fluid with precision. Read this handbook.
Nordson Electronics Solutions

Circuit Material Performance for PCBs at Millimeter Wave Frequencies
This paper gives an overview of which circuit material properties are important to mmWave frequency applications using PCBs.
Technical Paper

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MORE INDUSTRY NEWS

Sponsor

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD

Sponsor

3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
Plasma Etch