circuit insight
Pin-in-Ball and Non-Solder Ball Grid Arrays Demonstrate Advancements
This paper will focus on the research and development of the Next Gen Pin-in-Ball Grid Array connectors, and the non-solder ball versions.
Technical Paper
Qualitative Model Describing Hot Tear Above VIPPO and Other Design Elements
The mechanism for the formation of Hot Tears is discussed and applied to other design elements that can be found on Printed Circuit Board Assemblies.
Technical Paper
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
Can Silver Cause Solder Embrittlement?
A few of our components have leads with a silver finish. Will silver cause solder embrittlement? Is removal of silver needed or can it be soldered using 63/37 solder? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this question and scenario.
Board Talk
Superior Thermal Cycling Reliability of PB-Free Solder Alloy
Alternative solders meet stringent environmental regulations, requirements for greater mechanical reliability, and high temperature service environments.
Technical Paper
Non-Contact Measurement of Conformal Coating Thickness
This study aims to highlight the application of chromatic confocal microscopy (CCM), an optical technique used to characterize 2D/3D surfaces. In this work, conformal coating wet and dry thicknesses were measured using CCM and traditional methods. FR4 boards with varied color solder masks and components were created for realistic use cases.
Technical Paper
Sponsor
Circuit-Technology-Center

Safely Remove Underfilled BGAs Without Damaging the Circuit Board
Learn how cold precision milling techniques enable the removal of underfilled BGAs while minimizing risk to components, circuit traces, and board integrity.
Circuit Technology Center
Solder Paste: Fundamental Material Property / SMT Performance
Aggressive form factors, reducing pitch, thinner packages, and larger die to package ratios are leading to higher package warpage during SMT reflow.
Technical Paper
D-PAK Voiding: A Study to Determine the Origins of D-PAK Voiding
This study looks at an analysis of why a D-PAK exhibits more voiding than other types of BTCs. Voiding results based on an analysis of several process variables.
Technical Paper
Sponsor
Advanced-Interconnections

Need Improved Solder Joint Visibility?
Solder Peel-A-Wayš Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.
What is Considered Acceptable PCB Rework and Repair?
An operator attempted to repair three damaged conductors using bus wire overcoated with epoxy. Do you consider this repair acceptable?
Board Talk
Why Uneven Conformal Coating?
We are experiencing an issue with our conformal coating. On matte finish boards the coating is vibrating away from some others and building up in others.
Board Talk
Rheology of Solder Paste: Shelf Life Study
This study offers a better understanding of the correlation between rheological properties and shelf life of solder paste exposed to extreme conditions.
Technical Paper
Sponsor
DL-Technology

Buy SMT Dispensing Needles Online
EZ-FLO needles are machined from stainless steel with smoother internal profile for improved material flow. Chamfered needle tip is finely ground for better release. Buy online.
DL Technology
A Fracture Mechanics-Based Approach to Simulate Die Pick-up Process
This paper provides a procedure to simulate die pick-up process based on contact-debonding fracture mechanics approach.
Technical Paper
Surface Insulation Resistance of No-Clean Flux Residues
No-clean fluxes present great benefits, but the activity of the unwashed process residues must be tightly controlled in order to meet reliability standards.
Technical Paper
Sponsor
EOS-ESDA-Association

Reimagined EOS/ESD Symposium 2026
Experience the enhanced EOS/ESD Symposium with expanded learning, collaboration, and industry connections. Join experts exploring challenges and solutions in EOS/ESD control. September 28-30.
EOS/ESD Association
Protecting the Reliability and Integrity of Electronic Products and Assemblies
The COVID-19 crisis has prompted increasing inquiries on how to disinfect electronic equipment and assemblies without detrimental impact on the electronics.
Technical Paper
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Master-Bond
Sponsor
Viscom

Discover the power of vAI ProVision from Viscom
Create and optimize 3D AOI and AXI programs in minutes. vAI ProVision boosts inspection depth, quality, and speed. Viscom develops & produces premium inspection systems.
Viscom
AI-Technology-Inc
Sponsor
Circuitnet

Circuitnet Advertising Delivers Results!
Introduce your technology, new products or services in our daily e-mail newsletter & website to see how a digital advertising campaign can deliver results. Reach over 200,000 professionals.
Circuitnet LLC
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