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Silver Filled, Heat Curing Epoxy
Master Bond EP4S-80 is a one part, electrically conductive, silver filled adhesive for bonding, sealing and coating with a low curing temperature of 80°C.
Master Bond
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About Us
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Jeff Ferry
Publisher |
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Ken Cavallaro
Business Manager |
| Circuit Insight is a twice weekly email publication. Each issue is loaded with feature articles, technical papers, discussions, and expert opinions on topics relating to the world of electronics manufacturing. Every Tuesday and Thursday, we deliver Circuit Insight to the inbox of subscribers around the globe. The information provided in each issue is highly prized and valuable, but subscription is free.
Why Circuit Insight?
Isn't it time someone created a simple email newsletter providing knowledge, vision, and wisdom for the circuit board assembly professional? Information that will help you stay ahead of the competition and help you do your job better.
Jeff Ferry
Publisher
jferry@circuitinsight.com
Phone: 843-682-4755
Ken Cavallaro
Business Manager
kcavallaro@circuitinsight.com
Phone: 978-363-2176
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