Flip-Chip, MEMS, Semiconductors



These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more.
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BVA: Molded Cu Wire Contact Solution
BVA: Molded Cu Wire Contact Solution
This paper addresses the primary technological challenges for reducing contact pitch and package-on-package interface technology.
Materials Tech

Low-Cost & High Performance Silicon Interposers
Low-Cost & High Performance Silicon Interposers
The Low-Cost Silicon Interposer industry consortium addresses limitations of organic packages as well as wafer-based silicon interposers.
Materials Tech

Leadless Flip Chip PLGA for Networking Applications
Leadless Flip Chip PLGA for Networking Applications
Initially motivated by the demand for smaller, more efficient and feature rich mobile electronics, this trend has expanded across numerous applications.
Production Floor

Advanced Substrate Technology for Heterogeneous Integration
Advanced Substrate Technology for Heterogeneous Integration
The development of semiconductor technology and multi-function demands of end products has driven IC foundry industry toward 7nm node process.
Analysis Lab

New Approaches to Develop a Scalable 3D IC Assembly Method
New Approaches to Develop a Scalable 3D IC Assembly Method
In this paper, we will discuss various assembly options and the challenges posed by each.
Production Floor

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