Flip-Chip, MEMS, Semiconductors
These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more.
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Glass Panel Packaging: Technologies and Applications
Glass Panel Packaging: Technologies and Applications
This paper describes the critical glass packaging technologies, their R&D and commercialization status as well as all the current and future applications.
Production Floor

Status and Outlooks of Flip Chip Technology
Status and Outlooks of Flip Chip Technology
Status of flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill is presented in this study.
Materials Tech

Multilayer Ceramic Capacitors: Mitigating Rising Failure Rates
Multilayer Ceramic Capacitors: Mitigating Rising Failure Rates
The multilayer ceramic capacitor (MLCC) has become a widely used electronics component both for surface mount and embedded PCB applications.
Materials Tech

Three Dimensional Integration Focusing on Device Embedded Substrate
Three Dimensional Integration Focusing on Device Embedded Substrate
In this paper, EDA tools, TEG chips, and several evaluation equipment developed in Fukuoka are explained.
Materials Tech

Solder Joint Reliability on Mixed Ball Grid Array Solder Joints
Solder Joint Reliability on Mixed Ball Grid Array Solder Joints
Due to the decreasing size of consumer electronics, ultrathin flip chip ball grid array packages are needed to with lower z-heights for slimmer form factors.
Production Floor

Fluxless Die Attach by Activated Forming Gas
Fluxless Die Attach by Activated Forming Gas
As demonstrated in the study, the fluxless and oxide-free technology using EA has made it possible to achieve a high quality die attach with zero or near-zero voids.
Production Floor

Silicon V-Groove Alignment Bench for Optical Component Assembly
Silicon V-Groove Alignment Bench for Optical Component Assembly
In this paper, a Silicon Interposer is described that provides electrical interconnects to an edge emitting laser die and a laser monitor detector die.
Analysis Lab

Assessment of 2nd Level Interconnect Quality in Flip Chip Ball Grid Array Package
Assessment of 2nd Level Interconnect Quality in Flip Chip Ball Grid Array Package
Wire bonding is extensively used in the electronic packaging industry. One of the difficulties with flip chip technology is testing its reliability.
Analysis Lab

Miniaturization of Hearing Aid Electronics Using Embedded Die Packaging
Miniaturization of Hearing Aid Electronics Using Embedded Die Packaging
This paper examines the use of second generation embedded die packaging to drive further size reduction in custom hearing instruments.
Production Floor

Panel Level Packaging
Panel Level Packaging
In this paper a wide variety of technologies are described that allow the generation of maximum miniaturized microsystems or SiPs.
Production Floor