Flip-Chip, MEMS, Semiconductors
These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more.
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Innovative Panel Plating for Heterogeneous Integration
Innovative Panel Plating for Heterogeneous Integration
This paper will show that improvements in feature density, deposition uniformity and void free via filling can be achieved in large panel processing.
Production Floor

CGA Trends and Capabilities
CGA Trends and Capabilities
The Column Grid Array (CGA) module is a high reliability JEDEC format package, with several options adaptable to end user needs.
Production Floor

Advanced Substrate Technology for Heterogeneous Integration
Advanced Substrate Technology for Heterogeneous Integration
The development of semiconductor technology and multi-function demands of end products has driven IC foundry industry toward 7nm node process.
Analysis Lab

Cost Effective 3D Glass Microfabrication
Cost Effective 3D Glass Microfabrication
In this extended abstract we present 3D Glass Solutions' efforts in using our proprietary APEX Glass ceramic to create various interposer technologies.
Production Floor

Reliability of Fine Pitch Flip Chip BGA Packages for Automotive Applications
Reliability of Fine Pitch Flip Chip BGA Packages for Automotive Applications
The board level reliability of different FCBGA packages was evaluated in the automotive thermal cycling environment.
Materials Tech

Process Development to Achieve a High Yield Wafer-to-Wafer Hybrid Bond
Process Development to Achieve a High Yield Wafer-to-Wafer Hybrid Bond
Discussed are ethodologies that ensure high yielding Cu-based wafer to wafer hybrid bonding includig the test vehicle used, chemical mechanical planarization.
Analysis Lab

Material Selection for Reliable TMV Pop Assembly
Material Selection for Reliable TMV Pop Assembly
This paper investigates selected aspects of the above mentioned processes to better understand the critical factors associated with successful TMV PoP assembly.
Materials Tech

Glass Panel Packaging: Technologies and Applications
Glass Panel Packaging: Technologies and Applications
This paper describes the critical glass packaging technologies, their R&D and commercialization status as well as all the current and future applications.
Production Floor

Piezoelectric Sensors for Measuring Stress in Semiconductor Applications
Piezoelectric Sensors for Measuring Stress in Semiconductor Applications
Advances in semiconductor technology and device complexity are stepping up the pressure on monitoring and controlling for semiconductor packaging processes.
Analysis Lab

Solder Joint Reliability on Mixed Ball Grid Array Solder Joints
Solder Joint Reliability on Mixed Ball Grid Array Solder Joints
Due to the decreasing size of consumer electronics, ultrathin flip chip ball grid array packages are needed to with lower z-heights for slimmer form factors.
Production Floor