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Flip-Chip, MEMS, Semiconductors | ||||||||||
These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more. | ||||||||||
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This paper will show that improvements in feature density, deposition uniformity and void free via filling can be achieved in large panel processing. Production Floor The Column Grid Array (CGA) module is a high reliability JEDEC format package, with several options adaptable to end user needs. Production Floor The development of semiconductor technology and multi-function demands of end products has driven IC foundry industry toward 7nm node process. Analysis Lab In this extended abstract we present 3D Glass Solutions' efforts in using our proprietary APEX Glass ceramic to create various interposer technologies. Production Floor The board level reliability of different FCBGA packages was evaluated in the automotive thermal cycling environment. Materials Tech Discussed are ethodologies that ensure high yielding Cu-based wafer to wafer hybrid bonding includig the test vehicle used, chemical mechanical planarization. Analysis Lab This paper investigates selected aspects of the above mentioned processes to better understand the critical factors associated with successful TMV PoP assembly. Materials Tech This paper describes the critical glass packaging technologies, their R&D and commercialization status as well as all the current and future applications. Production Floor Advances in semiconductor technology and device complexity are stepping up the pressure on monitoring and controlling for semiconductor packaging processes. Analysis Lab Due to the decreasing size of consumer electronics, ultrathin flip chip ball grid array packages are needed to with lower z-heights for slimmer form factors. Production Floor |
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