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| Flip-Chip, MEMS, Semiconductors | ||||||||||
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A robust board assembly recipe is demonstrated for thin FCCSP packages with reflow warpage values of up to 110μm or higher. Production Floor
This paper will show that improvements in feature density, deposition uniformity and void free via filling can be achieved in large panel processing. Production Floor
This paper describes the critical glass packaging technologies, their R&D and commercialization status as well as all the current and future applications. Production Floor
Due to the decreasing size of consumer electronics, ultrathin flip chip ball grid array packages are needed to with lower z-heights for slimmer form factors. Production Floor
The recent evolution of data analytics allows correlation analysis from wafer fab to wafer test to assembly and packaging to product level test and field performance. Analysis Lab
This paper examines the use of second generation embedded die packaging to drive further size reduction in custom hearing instruments. Production Floor
Initially motivated by the demand for smaller, more efficient and feature rich mobile electronics, this trend has expanded across numerous applications. Production Floor
A pin transfer process was adapted to assemble flip-chip CSP LEDs with fine pitch solder paste to assemble lateral and vertical LEDs on flat substrates. Production Floor
A technology featuring Copper Pillar Bond-On-Lead (BOL) with Enhanced processes delivers cost effective, high performance packaging solution. Production Floor
Wire bonding is extensively used in the electronic packaging industry. One of the difficulties with flip chip technology is testing its reliability. Analysis Lab |
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