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| Flip-Chip, MEMS, Semiconductors | ||||||||||
| These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more. | ||||||||||
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This paper describes the critical glass packaging technologies, their R&D and commercialization status as well as all the current and future applications. Production Floor
Status of flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill is presented in this study. Materials Tech
The multilayer ceramic capacitor (MLCC) has become a widely used electronics component both for surface mount and embedded PCB applications. Materials Tech
In this paper, EDA tools, TEG chips, and several evaluation equipment developed in Fukuoka are explained. Materials Tech
Due to the decreasing size of consumer electronics, ultrathin flip chip ball grid array packages are needed to with lower z-heights for slimmer form factors. Production Floor
As demonstrated in the study, the fluxless and oxide-free technology using EA has made it possible to achieve a high quality die attach with zero or near-zero voids. Production Floor
In this paper, a Silicon Interposer is described that provides electrical interconnects to an edge emitting laser die and a laser monitor detector die. Analysis Lab
Wire bonding is extensively used in the electronic packaging industry. One of the difficulties with flip chip technology is testing its reliability. Analysis Lab
This paper examines the use of second generation embedded die packaging to drive further size reduction in custom hearing instruments. Production Floor
In this paper a wide variety of technologies are described that allow the generation of maximum miniaturized microsystems or SiPs. Production Floor |
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