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| Flip-Chip, MEMS, Semiconductors | ||||||||||
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This paper will show that improvements in feature density, deposition uniformity and void free via filling can be achieved in large panel processing. Production Floor
This paper describes the critical glass packaging technologies, their R&D and commercialization status as well as all the current and future applications. Production Floor
Due to the decreasing size of consumer electronics, ultrathin flip chip ball grid array packages are needed to with lower z-heights for slimmer form factors. Production Floor
The recent evolution of data analytics allows correlation analysis from wafer fab to wafer test to assembly and packaging to product level test and field performance. Analysis Lab
There are many options on the market for unpackaged, bare die with advanced capabilities, however these chips are often designed for wire bonding interconnection. This paper discusses three designs successfully transitioned from previously wire-bonded die to bare die direct-to-circuit attachment using standard SMT pick-and-place equipment. Analysis Lab
The persistent push for electronics miniaturization calls for a different approach to make packages smaller, higher performance and lower cost. Fan-out (FO) packages are well suited to serve this market trend. Via interconnects between the chip and package RDL (redistribution layers) provide higher interconnect density and lower inductance. Materials Tech
This paper examines the use of second generation embedded die packaging to drive further size reduction in custom hearing instruments. Production Floor
When a semiconductor component becomes obsolete or has a lead time that is beyond 52 weeks, finding a direct replacement that fits the existing system’s footprint can be challenging. Interposers act as a bridge between the new component and the old system, allowing the integration of modern semiconductors into legacy systems without the need for extensive redesign. Production Floor
Initially motivated by the demand for smaller, more efficient and feature rich mobile electronics, this trend has expanded across numerous applications. Production Floor
Improving the performance of semiconductor chips and advancing packaging features are critical. One solution to producing high performance electrical systems to perform computationally intensive functions in volume constrained products is the use of miniaturized packages with advanced embedded components. Production Floor |
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