Contamination, Defects, Whiskers



These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.
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Collaboration to Combat Head on Pillowing Defects
Collaboration to Combat Head on Pillowing Defects
This project was designed to evaluate AXI results from different machine platforms by analyzing results from similar platforms at different facilities.
Analysis Lab

Characterization, Prevention and Removal of Particulate Matter on PCBs
Characterization, Prevention and Removal of Particulate Matter on PCBs
This paper describes a means of measuring the DRH of minute quantities of particulate matter (1 mg or less) found on PCBs.
Production Floor

Acceptable Rate for Head in Pillow?
Acceptable Rate for Head in Pillow?
We have rejects in 2-3 per 15,000 PCBs that look like Head in Pillow. Should we tinker with the reflow process, or is this reject rate acceptable?
Board Talk

OEM and EMS to Combat Head on Pillowing Defects
OEM and EMS to Combat Head on Pillowing Defects
This paper evaluates AXI results from different machine platforms and results from similar platforms operating at different facilities.
Analysis Lab

Predicting Mid-Chip Solder Balling
Predicting Mid-Chip Solder Balling
Is there a calculation that can be used to predict solder balling? We would like to design our stencil apertures to ensure no mid-chip solder balls.
Board Talk

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