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| Contamination, Defects, Whiskers | ||||||||||
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In this study, we analyzed the effect that voltage bias has on dendrite growth both in clean PCBs and PCBs that were contaminated. Analysis Lab
Multiple tantalum capacitors are SMT attached to PCBs. Failures or fractures were observed at contractor SMT assembly lines and not on RTX lines. Production Floor
We are experiencing delamination on printed circuit boards, is there a way to determine that this is caused by moisture or some other defect? Board Talk
With high density interconnection designs, advanced packaging, localised self heating, sources of thermomechanical stress are introducing complex failures. Production Floor
We are finding a tacky substance under a large SMT component. Is this common when no-clean leaded solder paste is used with no clearance parts? Board Talk
This paper will present scenarios where environmental factors played a role in inducing various degradation mechanisms to Rockwell products. The paper will attempt to concentrate on the unusual scenarios, or where assumptions were made too early in the analytical process that likely hindered efficient determination of root cause. Analysis Lab
We have a long lead SMT component overhanging the pad. Can solder mask provide insulation between the overhanging component and the circuit conductor? Board Talk
Deformation in optoelectronics lidded electronics packages is studied. Experimental methods provide more realistic measurements of the deformation for actual packages. Analysis Lab
The added benefit of using overprinting stencil design strategy is that this should compel further improvement in paste transfer efficiency and uniformity by raising its area ratio. In this study the circle shape overprint apertures were designed for 0.5mm pitch BGA land patterns that measured to an area ratio value of 0.70. Analysis Lab
This paper is a case study of nickel dendritic growth under moisture condensation condition on freshly produced circuit boards contaminated with sulfuric acid etchant. Analysis Lab |
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