Contamination, Defects, Whiskers
These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.
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Acceptable Rate for Head in Pillow?
Acceptable Rate for Head in Pillow?
We have rejects in 2-3 per 15,000 PCBs that look like Head in Pillow. Should we tinker with the reflow process, or is this reject rate acceptable?
Board Talk

OEM and EMS to Combat Head on Pillowing Defects
OEM and EMS to Combat Head on Pillowing Defects
This paper evaluates AXI results from different machine platforms and results from similar platforms operating at different facilities.
Analysis Lab

Predicting Mid-Chip Solder Balling
Predicting Mid-Chip Solder Balling
Is there a calculation that can be used to predict solder balling? We would like to design our stencil apertures to ensure no mid-chip solder balls. The Assembly Brothers, Jim Hall and Phil Zarrow, discuss design suggestions to prevent solder balling.
Board Talk

Tin Whisker Testing and Modeling
Tin Whisker Testing and Modeling
The elimination of lead from consumer electronics has resulted in an increase in tin whisker risk mitigation using dual-use commercial/aerospace components.
Analysis Lab

Surface Mount Warpage Case Study
Surface Mount Warpage Case Study
A quantity of surface mount packages were measured by shadow moire metrology to capture warpage levels, as they were heated through a reflow profile.
Analysis Lab

We Bake, But Still Have Delamination, Why?
We Bake, But Still Have Delamination, Why?
When our PCBs are wave soldered and then pass through reflow most had issues with delamination. Where should we look to solve this?
Board Talk

Risk and Solution for No-Clean Flux Not Dried Under Components
Risk and Solution for No-Clean Flux Not Dried Under Components
In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed.
Production Floor

Innovative BGA Defect Detection Method for Transient Discontinuity
Innovative BGA Defect Detection Method for Transient Discontinuity
This paper summarized the development of this innovative in-situ, real time methodology, which is capable of detecting BGA transient discontinuity.
Analysis Lab

Process Control of Ionic Contamination in Assembly of Electronic Circuits
Process Control of Ionic Contamination in Assembly of Electronic Circuits
This paper reviews a testing protocol based on IPC-TM 650 2.3.25 to enable monitoring of ionic contamination within series production.
Analysis Lab

Nickel Hydroxide Corrosion Residues on Ceramic Packages
Nickel Hydroxide Corrosion Residues on Ceramic Packages
The findings of this study should help process engineers resolve package-related problems when nickel-gold finishes are utilized.
Analysis Lab