Contamination, Defects, WhiskersThese programs cover problems and solutions associated with contamination, defects, tin whiskers and more. |
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Pad cratering is laminate fracturing under the copper pads of a surface mount component. Two novel approaches to minimize pad cratering are presented. Production Floor
Paper offers results of void experiments using an in-line convection reflow oven and three types of bottom terminated components. Analysis Lab
At our SMT facility we currently control ambient temperature, relative humidity and particle count. Is particle count a good parameter to control? Board Talk
Models for copper interconnect degradation are needed for life prediction modeling to ensure 10-year, 100,000 mile reliability for automotive applications. Analysis Lab
We have an operational circuit board that was accidentally exposed to rainwater for a few hours. Is there a greater likelihood of failure? Board Talk |
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