Contamination, Defects, Whiskers



These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.
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Characterization, Prevention and Removal of Particulate Matter on PCBs
Characterization, Prevention and Removal of Particulate Matter on PCBs
This paper describes a means of measuring the DRH of minute quantities of particulate matter (1 mg or less) found on PCBs.
Production Floor

Predicting Mid-Chip Solder Balling
Predicting Mid-Chip Solder Balling
Is there a mathematical calculation that can be used to predict solder balling for a given package size? We would like to design our stencil apertures to ensure no mid-chip solder balls. The Assembly Brothers, Phil Zarrow and Jim Hall, offer their insight.
Board Talk

Preparation for Mitigating Tin Whiskers in Alternative Lead-Free Alloys
Preparation for Mitigating Tin Whiskers in Alternative Lead-Free Alloys
The understanding of the growth mechanism for tin whiskers and what mitigation strategies can be employed to reduce their propagation.
Analysis Lab

Analysis of Laminate Material Properties for Correlation to Pad Cratering
Analysis of Laminate Material Properties for Correlation to Pad Cratering
In this study, two Pb-free-compatible laminates were tested, with one dicy-cure non-Pb-free-compatible as control.
Analysis Lab

Testing PCBs for Creep Corrosion
Testing PCBs for Creep Corrosion
This paper covers the iNEMI technical subcommittee test for creep corrosion using a flowers-of-sulfur based qualification test.
Analysis Lab

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