Circuit Insight Programs

Contamination, Defects, Whiskers

These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.

PRIOR

Page 1 of 8

Nickel Hydroxide Corrosion Residues on Ceramic Packages
The findings of this study should help process engineers resolve package-related problems when nickel-gold finishes are utilized.
Analysis Lab

An FEA and DOE Analysis to Predict Deformation and Warpage of Optoelectronics Package Lids
Deformation in optoelectronics lidded electronics packages is studied. Experimental methods provide more realistic measurements of the deformation for actual packages.
Analysis Lab

What Causes Board Delamination?
We are experiencing delamination on printed circuit boards, is there a way to determine that this is caused by moisture or some other defect? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question and share their own experiences.
Board Talk

A Case Study of Nickel Dendritic Growth on Printed Circuit Boards
This paper is a case study of nickel dendritic growth under moisture condensation condition on freshly produced circuit boards contaminated with sulfuric acid etchant.
Analysis Lab

Sticky Residue Under Low Clearance Parts
We are finding a tacky substance under a large SMT component. Is this common when no-clean leaded solder paste is used with no clearance parts? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk

Insulation Between Overhanging Component Lead and Circuit Conductor
We have a long lead SMT component overhanging the pad. Can solder mask provide insulation between the overhanging component and the circuit conductor?
Board Talk

Novel Approaches for Minimizing Pad Cratering
Pad cratering is laminate fracturing under the copper pads of a surface mount component. Two novel approaches to minimize pad cratering are presented.
Production Floor

Void Reduction in Bottom Terminated Components Using Vacuum Assist
Paper offers results of void experiments using an in-line convection reflow oven and three types of bottom terminated components.
Analysis Lab

Adding OSP to Pads that are Missing ENIG Plating Process
A fabricator recently notified us that during the ENIG plating process, several pads had been “skipped” and missed on a number of boards. The fabricator would like to add OSP to the pads that are missing the ENIG. Is this acceptable?
Board Talk

Corrosion and Contaminant Diffusion Multi-Physics Model
Models for copper interconnect degradation are needed for life prediction modeling to ensure 10-year, 100,000 mile reliability for automotive applications.
Analysis Lab