Soldering, Selective, Wave



These programs cover manual and automated soldering, selective soldering, wave soldering and more.
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Maximum Board Temperature During Tin-Lead
Maximum Board Temperature During Tin-Lead
IPC discusses the maximum top-side board temperature for BGAs to be 150 degrees C during a tin-lead wave solder. How is this temperature was determined?
Board Talk

Board, Package and Die Thickness Effects Under Thermal Cycling Conditions
Board, Package and Die Thickness Effects Under Thermal Cycling Conditions
A model that enables the scaling of solder joint failure cycles for board and die or substrate thickness effects under thermal cycling conditions is discussed.
Analysis Lab

Reworkable Edgebond Applied Wafer-Level Chip-Scale Package
Reworkable Edgebond Applied Wafer-Level Chip-Scale Package
This paper presents data showing that localized distribution of recrystallized grains is an accurate indicator of solder joint life-cycle degradation and enhancement.
Analysis Lab

What Causes Solder Balls During Hand Soldering?
What Causes Solder Balls During Hand Soldering?
We have experienced solder balls during automated reflow. Now we are finding solder balls during the hand soldering.
Board Talk

Sustained High-Temperature Vibration Reliability of Thermally Aged Lead-Free Assemblies in Automotive Environments
Sustained High-Temperature Vibration Reliability of Thermally Aged Lead-Free Assemblies in Automotive Environments
In this paper, the reliability of lead-free SAC solder alloys at high temperature and vibration for pristine and thermally aged assemblies is analyzed.
Materials Tech

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