Soldering, Selective, Wave
These programs cover manual and automated soldering, selective soldering, wave soldering and more.
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The Dynamics of Low Stress Epoxy Curing
The Dynamics of Low Stress Epoxy Curing
This study compares uniform variable frequency microwave (VFM) field cure to standard oven curing at temperatures below Tg (transition temperature).
Production Floor

Effect of EPIG Plating Thicknesses on Solder Joint and Wire Bond Reliability
Effect of EPIG Plating Thicknesses on Solder Joint and Wire Bond Reliability
This study focuses on determining the effects of palladium and gold thicknesses to ensure dependable solder joints and wire bonds.
Analysis Lab

Causes of Blowholes
Causes of Blowholes
Are old components such as resistors and circuit breakers more likely to cause blowholes during wave soldering compared to newer components?
Board Talk

Reliability of New SAC-Bi Solder Alloys in Thermal Cycling with Aging
Reliability of New SAC-Bi Solder Alloys in Thermal Cycling with Aging
The effect of micro-alloying to SAC based solder materials on component reliability was studied, considering various factors of solder paste and surface finish.
Materials Tech

Converting Cable Assembly Manufacturing to Lead Free Solder
Converting Cable Assembly Manufacturing to Lead Free Solder
This paper reviews soldering applications associated with cable assembly, including process modification and qualification with lead free solders.
Production Floor

Reliability Improvements by the Creation of Intermetallic Connections
Reliability Improvements by the Creation of Intermetallic Connections
The possibilities to combine small and large passive components, and new devices for active components with an increase in reliability is discussed.
Materials Tech

Simple Test for Flux Penetration
Simple Test for Flux Penetration
What is a good test for flux penetration through plated hole barrels on plated through hole circuit boards? Jim Hall and PHil Zarrow, also known as The Assembly Brothers, answer this question and share their own experiences and knowledge.
Board Talk

Drop/Shock Behavior of Low Temperature Solder BGA
Drop/Shock Behavior of Low Temperature Solder BGA
This study examines challenges posed by aging, a critical factor influencing the long-term performance of solder joints.
Analysis Lab

Voiding Control On Bottom Terminated Components Using Preforms
Voiding Control On Bottom Terminated Components Using Preforms
This paper looks at a new approach using readily available solder fortification preforms.
Production Floor

Problem Meeting Minimum Hole Fill During Wave Soldering
Problem Meeting Minimum Hole Fill During Wave Soldering
We are having problems achieving the minimum hole fill of 75% on electrolytic capacitors using our wave soldering. What do you suggest? The Assembly Brothers, Jim Hall and Phil Zarrow, discuss this question and share their own advice.
Board Talk