Soldering, Selective, WaveThese programs cover manual and automated soldering, selective soldering, wave soldering and more. |
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IPC discusses the maximum top-side board temperature for BGAs to be 150 degrees C during a tin-lead wave solder. How is this temperature was determined? Board Talk
A model that enables the scaling of solder joint failure cycles for board and die or substrate thickness effects under thermal cycling conditions is discussed. Analysis Lab
This paper presents data showing that localized distribution of recrystallized grains is an accurate indicator of solder joint life-cycle degradation and enhancement. Analysis Lab
We have experienced solder balls during automated reflow. Now we are finding solder balls during the hand soldering. Board Talk
In this paper, the reliability of lead-free SAC solder alloys at high temperature and vibration for pristine and thermally aged assemblies is analyzed. Materials Tech |
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