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A series of flux systems have been developed which would result in a reduced viscosity after reflow. This enables a high viscosity, high tack flux to be used. Production Floor
Ideally, we would have a solder ball dispensing solution that had the throughput of analog solutions with the accuracy of traditional digital solutions. Materials Tech
The electromigration rates and behavior of eutectic Sn-Bi alloy in planar and in BTC solder joints were compared and shown to be similar. Analysis Lab
A new generation of indium TIM has a protective layer to suppress surface oxidation. This work examines the performance of indium as TIM for BGA packaging. Materials Tech
This study focuses on determining the effects of palladium and gold thicknesses to ensure dependable solder joints and wire bonds. Analysis Lab
There is a need for a more extensive coverage of voiding in standards where customer specifications often contain requirements for voiding in SMT solder joints. Production Floor
This paper discusses the results of a comparative study for solder joint performance - under shock - for ENIG and ENEPIG surface plated tester PCBs. Analysis Lab
This paper discusses attributes within the solder families that the preforms are composed of and considerations when considering solder preforms. Production Floor
This paper presents the performance of AOI systems when applied to PCBs soldered with SAC305 and a third-generation, low-silver, bismuth-containing alloy. Analysis Lab
This study examines challenges posed by aging, a critical factor influencing the long-term performance of solder joints. Analysis Lab |
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