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This paper presents key findings of enabling LTS technology on AMD’s Client BGA Packages using surface mount technology (SMT). Production Floor
This study aims to highlight the application of chromatic confocal microscopy (CCM), an optical technique used to characterize 2D/3D surfaces. Analysis Lab
In this paper, we will compare the bulk microstructure of eutectic Sn-Bi with Sb and Ag additions to solder joints on Cu substrates and ENIG surface finishes. Analysis Lab
What are the limits for the future with more complex products? HASL and the actual HASL process, hot air solder leveling, has been with us since the mid-70s. Board Talk
A range of condensate samples were taken from different process zones of reflow soldering systems and were analyzed using FT-IR spectrometry. Analysis Lab
The objective of this study to be discussed in this paper is to determine a solution for component attach in a formic acid environment with the appropriate combination of soldering material and equipment. A particular focus will be placed on a material and equipment combination which will provide acceptable soldering using a low-residue solder paste. Analysis Lab
The adoption of LTS presents compatibility challenges. This study explores the reliability of different ball-paste combinations for LTS soldering. Analysis Lab
This study focusses on the IMC phase growth in rolled Cu- electroplated Sn system during the temperature range from 398K to 473K. Analysis Lab
This paper has discussed some of the issues faced by organizations in the high reliability sector when adopting COTS and lead-free components. Analysis Lab
Is there a mathematical calculation that can be used to predict solder balling for a given package size? Board Talk |
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