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| Soldering, Selective, Wave | ||||||||||
| These programs cover manual and automated soldering, selective soldering, wave soldering and more. | ||||||||||
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This paper discusses attributes within the solder families that the preforms are composed of and considerations when considering solder preforms. Production Floor
This paper addresses methods to enhance solderability including: component solderability test methodologies, gold embrittlement and removal of gold plating. Analysis Lab
After wave soldering we find dross particles on the circuit board surface. We cleaned and have the same problem. Do we have contamination? Board Talk
We plan to install a nitrogen environment around the wave soldering tank. Is this likely to improve our defective parts-per-million level? Board Talk
QFN SMT components continue to be increasingly used and also becoming smaller for applications further requiring a high level of thermal performance and reliability. Production Floor
This paper will review the formation of copper-tin intermetallics, their growth rate, their effect on thermal cycle life, and drop shock performance. Analysis Lab
The thermal cycling reliability characteristics of solder containing a small amount of Bismuth which is below 4wt% in accordance with the new requirements were investigated. Analysis Lab
We use intrusive reflow soldering on relays using a lead process. We are challenged to solder relays intrusively in a lead-free process. Jim Hall and Phil Zarrow, The Assembly Brothers, share their own suggestions and recommendations. Board Talk
IPC discusses the maximum top-side board temperature for BGAs to be 150 degrees C during a tin-lead wave solder. How is this temperature was determined? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this scenario. Board Talk
We have problems with our wave soldering system, especially cold solder joints. Could this be caused by using a selective soldering frame? Board Talk |
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