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| Reflow Soldering, Profiling | ||||||||||
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This paper describes the planning and progress of the experimental program designed to assess the effect of a 60-minute temperature cycling dwell time. Analysis Lab
I'm concerned about voiding in the central ground planes of my QFN components. What can I do and how concerned should I be? Board Talk
To improve attachment yield rates, an evaluation several PCB design variables that are believed to contribute to warpage during reflow is proposed. Analysis Lab
After moving a reflow oven to a different site, what steps do you need to perform on the machine for the machine to be certified? Jim Hall and Phil Zarrow, The Assembly Brothers, address this question and share their own experiences. Board Talk
The influence of Pd film thickness in electroless Ni/Pd/Au plating on the solder ball joint reliability after reflow cycles and thermal aging was investigated. Analysis Lab
We are setting up an assembly line for small line production. We prefer a 5-zone oven. Will five zones be enough to ensure a reliable reflow process? Board Talk
Board flexing has started to occur on one of our circuit board assemblies, yet our process has remained the same. We are using a three-zone reflow oven. Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this scenario and share their recommendations. Board Talk
We have a new PCB assembly that includes a section of flex cable and FR4 circuit board. What are the reflow rules I need to consider? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss the most important reflow guidelines in this scenario. Board Talk
What is the proper exhaust pressure for a reflow over? Where should we measure the pressure? How should we measure pressure? Board Talk
With OSP coated circuit boards, what is the maximum allowable time interval between reflow of the first and second sides to insure proper wetting. Board Talk |
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