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| Reflow Soldering, Profiling | ||||||||||
| These programs cover reflow soldering, vapor phase, profiling, thermocouples, data collection and more. | ||||||||||
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The influence of Pd film thickness in electroless Ni/Pd/Au plating on the solder ball joint reliability after reflow cycles and thermal aging was investigated. Analysis Lab
We are having issues with our no-clean pin in paste process caused by flux residue on the surface of the solder joint. Should all flux vaporize off during reflow? Board Talk
I have a connector that is bowing during lead-free soldering. When the connector is put through an oven on its own no bowing takes place. What is causing this? Board Talk
What is the life span of a profile board? How many times can I use one test board to profile a reflow oven before throwing it away and why? Board Talk
With the introduction of lead-free soldering operating temperatures increased, and the chemistry of solder paste has been modified. Production Floor
Today's state of the art single-phase vapor phase provide the solutions needed for lead-free soldering and requirements for a void-less solder joint. Production Floor
I'm concerned about voiding in the central ground planes of my QFN components. What can I do and how concerned should I be? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this question and share their own recommendations. Board Talk
After moving a reflow oven to a different site, what steps do you need to perform on the machine for the machine to be certified? Board Talk
This study investigates the evaporation of chemicals during the reflow process from preheating until cooling. Different solder pastes are compared. Analysis Lab
We are setting up an assembly line for small line production. We prefer a 5-zone oven. Will five zones be enough to ensure a reliable reflow process? The Assembly Brothers, Jim Hall and Phil Zarrow, address this question and share their own knowledge. Board Talk |
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