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| Reflow Soldering, Profiling | ||||||||||
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This paper describes the planning and progress of the experimental program designed to assess the effect of a 60-minute temperature cycling dwell time. Analysis Lab
To improve attachment yield rates, an evaluation several PCB design variables that are believed to contribute to warpage during reflow is proposed. Analysis Lab
We are having issues with our no-clean pin in paste process caused by flux residue on the surface of the solder joint. Should all flux vaporize off during reflow? Board Talk
We have been seeing tiny solder balls across our boards after reflow. It appears that the solder is exploding as the balls are in areas where there is no paste or components. Board Talk
The influence of Pd film thickness in electroless Ni/Pd/Au plating on the solder ball joint reliability after reflow cycles and thermal aging was investigated. Analysis Lab
I have a connector that is bowing during lead-free soldering. When the connector is put through an oven on its own no bowing takes place. What is causing this? Board Talk
In this study, numerical methods are used to model board warpage during the soler reflow process. Multiple techniques are compared for modeling the printed circuit board (PCB) substrate with different levels of fidelity. Experimental warpage validation techniques are discussed. Inputs to the PCB modeling approaches and the results of the various modeling techniques are reviewed. Production Floor
Modern electronic assemblies are far more susceptible to this phenomenon. Among the critical issues affecting these assemblies is ionic contamination, which can lead to a series of deleterious processes, including electrochemical migration (ECM). Analysis Lab
What is the life span of a profile board? How many times can I use one test board to profile a reflow oven before throwing it away and why? Board Talk
This study investigates the evaporation of chemicals during the reflow process from preheating until cooling. Different solder pastes are compared. Analysis Lab |
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