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Reflow Soldering, Profiling | ||||||||||
These programs cover reflow soldering, vapor phase, profiling, thermocouples, data collection and more. | ||||||||||
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After moving a reflow oven to a different site, what steps do you need to perform on the machine for the machine to be certified? Jim Hall and Phil Zarrow, The Assembly Brothers, address this question and share their own experiences. Board Talk This paper describes and characterizes an unusual open circuit failure mechanism in Pb-free ball grid array (BGA) solder joints. Analysis Lab We are setting up an assembly line for small line production. We prefer a 5-zone oven. Will five zones be enough to ensure a reliable reflow process? Board Talk Board flexing has started to occur on one of our circuit board assemblies, yet our process has remained the same. We are using a three-zone reflow oven. Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this scenario and share their recommendations. Board Talk This paper describes the planning and progress of the experimental program designed to assess the effect of a 60-minute temperature cycling dwell time. Analysis Lab This paper explores equipment that has been developed to achieve void-free joints using modern condensation reflow technology. Production Floor We have a new PCB assembly that includes a section of flex cable and FR4 circuit board. What are the reflow rules I need to consider? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss the most important reflow guidelines in this scenario. Board Talk What is the proper exhaust pressure for a reflow over? Where should we measure the pressure? How should we measure pressure? Board Talk With OSP coated circuit boards, what is the maximum allowable time interval between reflow of the first and second sides to insure proper wetting. Board Talk To improve attachment yield rates, an evaluation several PCB design variables that are believed to contribute to warpage during reflow is proposed. Analysis Lab |
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