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| Reflow Soldering, Profiling | ||||||||||
| These programs cover reflow soldering, vapor phase, profiling, thermocouples, data collection and more. | ||||||||||
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Some of the zones or our oven profiler are competing to get to the correct temperature. How do I prevent the oven from having competing zones? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question. Board Talk
Is it necessary to replicate thermal profiling during long-term mass production? Is it necessary to recheck accuracy of reflow oven profiles periodically? Board Talk
This study investigates the evaporation of chemicals during the reflow process from preheating until cooling. Different solder pastes are compared. Analysis Lab
We are having issues with our no-clean pin in paste process caused by flux residue on the surface of the solder joint. Should all flux vaporize off during reflow? Board Talk
With the introduction of lead-free soldering operating temperatures increased, and the chemistry of solder paste has been modified. Production Floor
I have a connector that is bowing during lead-free soldering. When the connector is put through an oven on its own no bowing takes place. What is causing this? Board Talk
What is the life span of a profile board? How many times can I use one test board to profile a reflow oven before throwing it away and why? Board Talk
Today's state of the art single-phase vapor phase provide the solutions needed for lead-free soldering and requirements for a void-less solder joint. Production Floor
The goal of this study was to identify a non-destructive method for thermocouple attachment that provides a small offset to the "actual temperature under a BGA." Analysis Lab
I'm concerned about voiding in the central ground planes of my QFN components. What can I do and how concerned should I be? Board Talk |
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