Authored By:
David Torp
Mechnano
AZ, USA
Summary
Discrete carbon nanotubes (CNTs) have shown promise in various applications, including electronics manufacturing operations for Electrostatic Discharge (ESD) tooling fixtures and assemblies. ESD is a critical concern in electronics manufacturing, as it can lead to damage or malfunction of sensitive electronic components. Traditional ESD protection methods involve using materials with high electrical conductivity to dissipate and neutralize static charges.
Carbon nanotubes possess unique electrical, mechanical, and thermal properties that make them suitable for ESD protection. Specifically for protection of highly sensitive electronic devices such as low voltage chiplets, large AI chips as well as system in package (SIP) components. Currently, there is an issue with localized ESD hotspots in ESD component carrier trays and waffle packs. As electronics assemblies become more sensitive, there is a need for better uniformity of ESD trays and carriers.
This research illustrates the improvement in volume and surface resistivity for trays and tooling fixtures that are manufactured incorporating discrete functionalized carbon nanotubes. In addition, the research shows that discrete carbon nanotubes can be used in conjunction with additive manufacturing technologies to make “on-demand” SMT carriers, trays and tooling fixtures for use in electronic manufacturing operations.
Conclusions
This study indicates that current materials being used for ESD applications may have too much variation to protect high performance electronic devices from electrostatic discharge events. Advanced technology devices may require a new materials set for minimizing ESD related defects within the manufacturing operations. The large variation found with carbon fiber filled plastics may no longer be acceptable. This study indicates that advanced materials such as carbon nanotubes may play a role in solving some of the upcoming needs for more consistent electrostatic performance in surface resistance.
Initially Published in the SMTA Proceedings
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