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Guidelines for stencil designs and aperture placement in cavities are presented, including stencil design, paste material, experimentation, and results. Production Floor
Materials Informatics is one of the hottest technologies because of its potential to reduce the time and costs of discovering innovative materials. Materials Tech
This paper assesss PCB vendor drill registration capability and will also evaluate PCB reliability using electrochemical migration and via reliability testing. Analysis Lab
3 copper powders were tested for their feasibility to use as die attach material for pressure sintering process without prior treatment with reducing agents. Materials Tech
We are going forward with assemblies that use 01005 components. We're wondering if you have some input as to the challenges we will face. Board Talk
This paper presents a bio-based, expandable, thermoset solution, a low density, light weight method to effectively encapsulate and protect electronic components. Materials Tech
The analytics of big data could help us to understand that process better. We can buy better equipment and select the parameters more carefully. Analysis Lab
The approach involves spending a little more money than normal at the start of project and the results show savings of many times more than this outlay. Production Floor
This paper will use high temperature warpage metrology to evaluate the impact that PCB manufacturing, design, and material has on BGA and panel area PCB warpage. Analysis Lab
This paper focuses on the In-Mold Electronics approach, which facilitates the transition from subtractive to additively printed, robust, and 3D electronic structures. Production Floor |
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