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The paper will discuss the integration of 3D printing and inkjet printing fabrication technologies for microwave and millimeter-wave applications. With the recent advancements in 3D and inkjet printing technology, achieving resolution down to 50 um, it is feasible to fabricate electronic components and antennas operating in the millimeter-wave regime. Production Floor
In this paper, we evaluate and compare the print performance of four different step technologies: Chemically etched, Laser weld, Milled, and Electroform. Analysis Lab
This work focuses on one aspect of reducing dust accumulation on electronic equipment, specifically by optimizing the cooling air flow. Production Floor
In this paper, a detailed study of the electrical and mechanical degradation of wirebonds under high temperature exposure is presented. Materials Tech
With high frequency and high-speed transmission in information industry, PCB customers demand stricter signal transmission integrity of PCB. Analysis Lab
The re-classification and regulation of EDCs and bioaccumulative substances is expected to multiply the materials that require control or replacement. Materials Tech
We use lead-free solder and store it at a temperature of 4 to 5 degrees Celsius. What is the best practice for prepping this stored paste before use? Board Talk
This paper will share details about multiple medical sensing applications and the advanced materials and processes used to assemble them for optimal functionality. Production Floor
This study examines possible factors for these inconsistencies such as etched signal trace shape, surface treatment, and grain size. Analysis Lab
How do we determine what is the best under stencil wipe frequency? The Assembly Brothers share their own insights and experiences on this matter. Board Talk |
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