|
|
|
|
|
|
|
|
| Assembly, Printing, Pick & Place | ||||||||||
| These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more. | ||||||||||
|
||||||||||
|
|
||||||||||
Paper addresses durability of coatings in relation to the number of print cycles and underside wipe cycles and materials used on the underside wipe process. Production Floor
Paper covers SMT challenges including practical stencil design recommendations to eliminate defects and improve yields during the printing process. Production Floor
A reader wonders about the current trends and practices for printing ultra-miniature chips, a la 01005. Seeking advice, they contacted Board Talk. Board Talk
This paper covers issues of printing for challenging area ratio components and their associated aspect ratio will be investigated. Production Floor
Liquid Metal Ink technology allows a very dense thin catalytic seed layer that can then be used as a base for a much thicker electrolytic copper layer. Materials Tech
This work aims to provide guidance for the potential trade-offs between thermal performances and second level interconnect reliability. Analysis Lab
This paper presents assembly challenges and reliability evaluation of Three-Dimensional Through- Mold Via and System in Package in fine pitch ball grid arrays. Production Floor
The tendencies of commonly used RF connector polymeric materials to absorb and desorb moisture under various humidity and temperatures are characterized. Analysis Lab
This paper provides a methodology for a potential TIM2 material for applications including automotive, personal computers and internet of things. Materials Tech
We have seen as many as 180 fiducials per stencil with a step and repeat. How many fiducials are recommended for a solder paste stencil? The Assembly Brothers, Phil Zarrow and Jim Hall, address this question and share their own experiences. Board Talk |
|
|
|
|
|
|
|
|