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Assembly, Printing, Pick & Place | ||||||||||
These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more. | ||||||||||
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AI solutions could be integrated into the automation process to further improve the production operation. This paper discusses the challenges in implementation. Production Floor When shifting from standard solder paste stencils to step stencils, should we change the pressure or attack angle? Board Talk In this study, we tried to minimize the discontinuous path of Delta-L coupon by using the VIPPO (Via In Pad Plated Over) technique to improve the signal integrity. Analysis Lab Researchers discovered the first two-dimensional material, graphene, which consists of only a single layer of atoms13. Materials Tech X-ray inspection of electronic components is now standard practice for any company working in the electronics industry. Production Floor This study details the effectiveness of nanocoating materials, high end stainless steel stencil materials, as they relate to the manual SMT printing. Production Floor What rate is considered world class when it comes to pick performance for SMT placement machines? Can you define pick performance? Board Talk Should stencil the aperture be home plate or inverted home plate? You know the performance difference between the two types. Which one is better? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their own insights. Board Talk This paper explores the conflicting requirements of achieving low cost while meeting high volume, high mix requirements. Production Floor In this study, flexible Chip-In-Fabric (CIF) assemblies using anisotropic conductive films (ACFs) and cover layer structure were demonstrated. Materials Tech |
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