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This paper presents a bio-based, expandable, thermoset solution, a low density, light weight method to effectively encapsulate and protect electronic components. Materials Tech
This paper introduces line confocal technology that was developed to characterize 3D features of surface and material types at sub-micron resolution. Analysis Lab
A press-fit roadmap team including press-fit manufacture, OEM/ODM and EMS are getting together every two years to identify the future technology trend, future technical challenges and needs and then to find potential solution for next 5 to 10 years in the horizon. Analysis Lab
As assemblies, undergo temperature/power changes during use CTE mismatch causes added stress and strain on the solder joint. Production Floor
This paper provides a procedure to simulate die pick-up process based on contact-debonding fracture mechanics approach. Production Floor
It is easier and more economical to manufacture multiple assemblies simultaneously on a larger panel and then singularize them once they’ve been populated. Analysis Lab
The mechanism for the formation of Hot Tears is discussed and applied to other design elements that can be found on Printed Circuit Board Assemblies. Production Floor
A study on the rubber standoffs and gaskets. The effectiveness of rubber standoffs and rubber gaskets as shock/vibration mitigation have been evaluated. Analysis Lab
Researchers discovered the first two-dimensional material, graphene, which consists of only a single layer of atoms13. Materials Tech
The paper focuses on all aspects of SMT assembly of the MaxQFP. The robustness of the assembly in automotive type board-level thermal cycling will be demonstrated. Production Floor |
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