Assembly, Printing, Pick & Place
These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more.
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Implementing Automation and Ai for Electronic Card Assembly
Implementing Automation and Ai for Electronic Card Assembly
AI solutions could be integrated into the automation process to further improve the production operation. This paper discusses the challenges in implementation.
Production Floor

Step Stencil Setup
Step Stencil Setup
When shifting from standard solder paste stencils to step stencils, should we change the pressure or attack angle?
Board Talk

Optimization of PCB SI Coupon Design that Minimizes Discontinuity
Optimization of PCB SI Coupon Design that Minimizes Discontinuity
In this study, we tried to minimize the discontinuous path of Delta-L coupon by using the VIPPO (Via In Pad Plated Over) technique to improve the signal integrity.
Analysis Lab

Atomristors: Non-Volatile Resistance Switching in 2D Monolayers
Atomristors: Non-Volatile Resistance Switching in 2D Monolayers
Researchers discovered the first two-dimensional material, graphene, which consists of only a single layer of atoms13.
Materials Tech

How X-Ray Technology is Improving the Electronics Assembly Process
How X-Ray Technology is Improving the Electronics Assembly Process
X-ray inspection of electronic components is now standard practice for any company working in the electronics industry.
Production Floor

Hand Printing using Nanocoated and other High End Stencil Materials
Hand Printing using Nanocoated and other High End Stencil Materials
This study details the effectiveness of nanocoating materials, high end stainless steel stencil materials, as they relate to the manual SMT printing.
Production Floor

What Rate is World Class for SMT Machines?
What Rate is World Class for SMT Machines?
What rate is considered world class when it comes to pick performance for SMT placement machines? Can you define pick performance?
Board Talk

Should Apertures be Home Plate or Inverted Home Plate?
Should Apertures be Home Plate or Inverted Home Plate?
Should stencil the aperture be home plate or inverted home plate? You know the performance difference between the two types. Which one is better? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their own insights.
Board Talk

Wearable Electronics & Big Data = High Volume, High Mix SMT
Wearable Electronics & Big Data = High Volume, High Mix SMT
This paper explores the conflicting requirements of achieving low cost while meeting high volume, high mix requirements.
Production Floor

Dynamic Bending Reliability of Chip-In Fabrics (CIF) Packaging
Dynamic Bending Reliability of Chip-In Fabrics (CIF) Packaging
In this study, flexible Chip-In-Fabric (CIF) assemblies using anisotropic conductive films (ACFs) and cover layer structure were demonstrated.
Materials Tech