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We have over 1000 programs in this database. | ||||||||||
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We have experienced solder balls during automated reflow. Now we are finding solder balls during the hand soldering. Phil Zarrow and Jim Hall, The Assembly Brothers, offer their own suggestions and recommendations for eliminating solder balls. Board Talk This paper describes the use of embedded die technologies and the development of work in the on power electronic applications. Production Floor A research team has developed a wireless communication network that can transmit, receive and decode data from thousands of microelectronic chips. Technology Briefing Current work seeks to better understand how the indium (In) bump size affects the respective interface kinetics and subsequent mechanical properties. Analysis Lab This paper studies the effect of several factors on the shear strength of a wide range of components assembled using LTS paste. Materials Tech With the introduction of lead-free soldering operating temperatures increased, and the chemistry of solder paste has been modified. Production Floor This paper addresses the influence of voids on reliability of microvias, as well as the interface delamination issue. Analysis Lab Is there a minimum spacing requirement or should we apply SMT components to comply with SMT pick and place systems on the market? Board Talk This paper presents harsh environment reliability test results for lead-free solder pastes with and without the presence of a variety of dopant elements. Materials Tech Researchers have created a potential alternative to traditional petroleum-based plastic made from carbon dioxide, plus lignin, a component of wood. Technology Briefing |
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