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The main objective of this paper was to identify a solder (specifically Sn-based and high reliability) and thick film combination to improve overall reliability of thick film hybrids. This was done by conducting rigorous thermal testing. The work conducted for this paper served as an initial exploration into this area of study. Materials Tech
AI has been deployed in the verification tool with studies conducted to compare the effectiveness and efficiency of the tool versus human operation. Production Floor
Researchers have developed a technique that combines heterogeneous data from many sources into one system that can teach any robot a wide range of tasks. Technology Briefing
It was confirmed that ENEPES with a Ag thickness of 0.3 μm had good reliability both for the solder joint and Ag sintering joint. Analysis Lab
A novel epoxy SAC solder paste TIM system has been developed with the use of non-volatile epoxy flux. Cu filler was added to the solder paste. Materials Tech
The study elaborates the parameters with the solder separation failure per board design configuration, and also provides the potential solution to mitigate the failure. Production Floor
This paper reviews results reported from accelerated testing compared with cross-sectional results from components on functional systems with known time in service. Analysis Lab
Which storage method will better protect against corrosion, nitrogen or super dry? You want to do it in compliance with IPC 1602, which covers storage and handling of circuit boards. Board Talk
In this study, flexible Chip-In-Fabric (CIF) assemblies using anisotropic conductive films (ACFs) and cover layer structure were demonstrated. Materials Tech
At the same time that America’s ability to manufacture and build has atrophied, its advantage in so-called “Deep Technologies” has exploded. Technology Briefing |
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