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This study delineates the conceptualization and implementation of a machine vision-based defect inspection model, meticulously engineered to confront the intricacies of high-throughput PCB assembly environments. The framework of the proposed system is underpinned by three phase computational framework. Production Floor
PCB manufacturers are challenged to fabricate denser solder mask patterns with smaller features to accommodate advanced electronic components. Production Floor
A review about latest advances in packaging and drivers for the development of novel packaging technologies will be given in this paper. Analysis Lab
The long-term evaluation of TANOS structure is investigated and the prediction of retention characteristic can be evaluated through the accelerated tests. Analysis Lab
Ideally, we would have a solder ball dispensing solution that had the throughput of analog solutions with the accuracy of traditional digital solutions. Materials Tech
A new methodology for solder joint reliability prediction taking into account the mechanical load as well as the thermal mismatch load between component, solder & PCB is proposed. Production Floor
This paper discusses the impact of the via size and design on QFN voiding and solder protrusion. Do small vias prevent the solder from flowing onto the other side? Analysis Lab
What is the best way to process a 30 mil circuit board assembly that has micro BGAs that need to be soldered to both sides? Board Talk
The tools to ensure that counterfeits are not polluting any given supply chain have not kept pace with the changing needs. Materials Tech
The purpose of this paper is to present a cleaning process for difficult no-clean, lead-free and high temperature flux residues on reflowed PCBs. Production Floor |
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