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The paper will discuss the integration of 3D printing and inkjet printing fabrication technologies for microwave and millimeter-wave applications. With the recent advancements in 3D and inkjet printing technology, achieving resolution down to 50 um, it is feasible to fabricate electronic components and antennas operating in the millimeter-wave regime. Production Floor
The importance of calibration for two-wire measurement setups is reaffirmed. For tweezer meters, this issue is critical due to the higher offset values, which can be as large as 19 nH. Production Floor
In this paper, we evaluate and compare the print performance of four different step technologies: Chemically etched, Laser weld, Milled, and Electroform. Analysis Lab
This paper proposes a test method and vehicle to characterize soldering materials, assembly process steps, and conformal coating to determine reliability. Analysis Lab
This paper describes the IMCs that occur typically in eutectic, Sn63Pb37, near-eutectic SAC305, and high-performance tin-based Pb-free solder alloys. Materials Tech
This work focuses on one aspect of reducing dust accumulation on electronic equipment, specifically by optimizing the cooling air flow. Production Floor
This study analyzes the impact of electroplating parameters of matte-Sn terminal layer on the thermo-mechanical reliability of solder joints. Analysis Lab
During wave solder some of the vias have concave fillets giving them a dimple effect. What can we do to create flatter fillets on via holes? Board Talk
This paper examines process changes and the material properties or performance of polymer composites used in semiconductor packaging and board assembly. Materials Tech
In this paper, a detailed study of the electrical and mechanical degradation of wirebonds under high temperature exposure is presented. Materials Tech |
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