Programs
We have over 1000 programs in this database.
PRIOR
 Page 1 of 204 
NEXT

To search a phrase, place it in quotes.
Minimum Lead to Lead Spacing for Wave Soldered Through-Hole Components
Minimum Lead to Lead Spacing for Wave Soldered Through-Hole Components
What is the recommended minimum lead-to-lead spacing for through-hole components run through a wave soldering system? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their own suggestions.
Board Talk

Continuous Improvement: The Task That Never Ends in the Cleaning World
Continuous Improvement: The Task That Never Ends in the Cleaning World
This paper investigates new processes that achieve cleaning effectiveness while balancing the environmental, human, and machine impacts for longevity.
Production Floor

Unleash the Unexpected for Radical Innovation
Unleash the Unexpected for Radical Innovation
The accelerometer chip is ubiquitous in digital devices. Its true impact didn't become apparent until many of today's most valued applications were developed.
Technology Briefing

BTC-QFN Test Board Design for Qualifying Soldering Materials
BTC-QFN Test Board Design for Qualifying Soldering Materials
This research uses a non-standard test board with sensors placed at the bottom termination to study cleanliness and contamination effects under QFN components.
Analysis Lab

Dissolution Rate of Specific Elements in SAC305 Solder
Dissolution Rate of Specific Elements in SAC305 Solder
This paper describes the approach for measuring the solder dissolution that can be used to optimize soldering process profiles for electronic assemblies.
Materials Tech

High Thermal, High Temperature Interconnects for Ultra High Power LEDs
High Thermal, High Temperature Interconnects for Ultra High Power LEDs
For high performance applications, ultra-high power offers cost reduction through fewer LEDs, smaller PCBs, smaller heat sinks and lighter load bearing.
Production Floor

Reliability Study of Bottom Terminated Components
Reliability Study of Bottom Terminated Components
This paper covers the impact of voiding on solder joint reliability and the impact of voiding on the heat transfer characteristics for BTC components.
Analysis Lab

Moisture Barrier Bag Issues
Moisture Barrier Bag Issues
Moisture sensitive chip components have been exposed to the atmosphere beyond specification. Can they be packaged and sealed with desiccant?
Board Talk

Rosin vs. Non-Rosin Wave Flux? - More Reliable Electronic Assemblies
Rosin vs. Non-Rosin Wave Flux? - More Reliable Electronic Assemblies
This paper focuses on the surface insulation resistance (SIR) differences between rosin-containing and rosin-free flux formulations.
Materials Tech

Humanoid Robots are Finally on the Way
Humanoid Robots are Finally on the Way
Over three years, there has been an explosion of companies racing to integrate the hardware and software that will constitute a viable humanoid robot.
Technology Briefing