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Increased electronics manufacturing results in an increased amount of condensate residue. The problem is not only to meet the increased cleaning requirements with increasing production, it is much more the absence of knowledge about the condensate residue formation process and how this residue can be minimized and inhibited in its formation. Production Floor
Implementation of metric 0201 or M0201 size surface mount passives will help enable the next generation form factor electronic packaging. Production Floor
The effects of PCB pad design, stencil aperture design, the flux formulation in the assembly of 0201 BTC diodes using high temperature lead free solder are examined. Analysis Lab
Bismuth (Bi)-containing solder alloys have emerged as prime candidates to replace traditional lead (Pb)-free alloys such as SAC 305 (Sn-3.0Ag-0.5Cu). Analysis Lab
A novel epoxy SAC solder paste TIM system has been developed with the use of non-volatile epoxy flux. Cu filler was added to the solder paste. Materials Tech
This paper provides insight into the impact of irregularities on BGA package surface mount yield, and guidance on design and to limit their impact. Production Floor
We have categorized together 10 of the best software tools for PCB outlook for electronics engineers – to buy you time while you are working on your projects. Analysis Lab
Recognizing the limitations of ROSE testing versus localized contamination, what can I use to validate the cleanliness of my finished product? Board Talk
The objective of this paper was to identify a solder and thick film combination to improve overall reliability of thick film hybrids. Materials Tech
In this paper, the reliability of lead-free SAC solder alloys at high temperature and vibration for pristine and thermally aged assemblies is analyzed. Materials Tech |
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