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We leave masking and Kapton tapes that fall off during cleaning in the bottom of our wash tank. Can the adhesives contaminate the recycled solution? Jim Hall and Phil Zarrow, The Assembly Brothers, address these question and share their own experiences. Board Talk
There is a need for a more extensive coverage of voiding in standards where customer specifications often contain requirements for voiding in SMT solder joints. Production Floor
The increasing data requirements of technologies like autonomous vehicles and 6G mobile communications are fast reaching the limits of today’s devices. Technology Briefing
This paper investigates a number of low (or no) Silver (Ag), Bi-containing Pb-free alloys for performance in accelerated thermal cycling (ATC). Analysis Lab
Micro Trace Resistor Technology allows thin film resistors to be built within a printed circuit trace that is less than 100 microns wide. Materials Tech
Substrates have become more critical with regard to pitch and density leading to increased use of buried components. This paper reviews testing for buried capacitors. Production Floor
The recent evolution of data analytics allows correlation analysis from wafer fab to wafer test to assembly and packaging to product level test and field performance. Analysis Lab
Is it necessary to replicate thermal profiling during long-term mass production? Is it necessary to recheck accuracy of reflow oven profiles periodically? Board Talk
There is a drive to miniaturize solder paste deposits. A key element to success is the incorporation of smaller solder particles in the solder paste. Materials Tech
Photonic chips have only demonstrated an ability to classify and infer information from data. Researchers have made it possible to speed up the training step. Technology Briefing |
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