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Improving the performance of semiconductor chips and advancing packaging features are critical. One solution to producing high performance electrical systems to perform computationally intensive functions in volume constrained products is the use of miniaturized packages with advanced embedded components. Production Floor
Results from an investigation that studied and characterized a novel lead-free solder paste as compared to traditional solder materials will be presented. Production Floor
America holds a dominant position the Deep-Tech sectors from Artificial Intelligence to Biotechnology. This dominant position is not a byproduct of geography. Technology Briefing
This study looks at an analysis of why a D-PAK exhibits more voiding than other types of BTCs. Voiding results based on an analysis of several process variables. Analysis Lab
This paper presents a bio-based, expandable, thermoset solution, a low density, light weight method to effectively encapsulate and protect electronic components. Materials Tech
This paper presents key findings of enabling LTS technology on AMD’s Client BGA Packages using surface mount technology (SMT). Production Floor
This study aims to highlight the application of chromatic confocal microscopy (CCM), an optical technique used to characterize 2D/3D surfaces. Analysis Lab
After BGA rework there is an outline of residue on around the pads. Is it necessary to remove this residue to reinstall a new BGA? Board Talk
This research illustrates the improvement in volume and surface resistivity for trays and tooling fixtures manufactured usin functionalized carbon nanotubes. Materials Tech
At the same time that America’s ability to manufacture and build has atrophied, its advantage in so-called “Deep Technologies” has exploded. Technology Briefing |
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