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Machine Vision-based Defect Inspection Model for Plated Through Hole Components
Machine Vision-based Defect Inspection Model for Plated Through Hole Components
This study delineates the conceptualization and implementation of a machine vision-based defect inspection model, meticulously engineered to confront the intricacies of high-throughput PCB assembly environments. The framework of the proposed system is underpinned by three phase computational framework.
Production Floor

Direct Imaging and Direct Jetting of Solder Mask
Direct Imaging and Direct Jetting of Solder Mask
PCB manufacturers are challenged to fabricate denser solder mask patterns with smaller features to accommodate advanced electronic components.
Production Floor

Advanced in Packaging for Emerging Technologies
Advanced in Packaging for Emerging Technologies
A review about latest advances in packaging and drivers for the development of novel packaging technologies will be given in this paper.
Analysis Lab

Analysis of Mechanism About Data Retention Characteristic in TANOS Structure
Analysis of Mechanism About Data Retention Characteristic in TANOS Structure
The long-term evaluation of TANOS structure is investigated and the prediction of retention characteristic can be evaluated through the accelerated tests.
Analysis Lab

Contactless Technology for High Resolution, Speed, Solder Paste Deposition
Contactless Technology for High Resolution, Speed, Solder Paste Deposition
Ideally, we would have a solder ball dispensing solution that had the throughput of analog solutions with the accuracy of traditional digital solutions.
Materials Tech

Temperature Cycling with Bending to Reproduce Typical Product Loads
Temperature Cycling with Bending to Reproduce Typical Product Loads
A new methodology for solder joint reliability prediction taking into account the mechanical load as well as the thermal mismatch load between component, solder & PCB is proposed.
Production Floor

The Impact of VIA and Pad Design on QFN Assembly
The Impact of VIA and Pad Design on QFN Assembly
This paper discusses the impact of the via size and design on QFN voiding and solder protrusion. Do small vias prevent the solder from flowing onto the other side?
Analysis Lab

Processing Circuit Boards with BGAs On Both Sides
Processing Circuit Boards with BGAs On Both Sides
What is the best way to process a 30 mil circuit board assembly that has micro BGAs that need to be soldered to both sides?
Board Talk

Essential Tools to Combat the Ingress of Counterfeit Materials
Essential Tools to Combat the Ingress of Counterfeit Materials
The tools to ensure that counterfeits are not polluting any given supply chain have not kept pace with the changing needs.
Materials Tech

Vapor Degreasing Chemistries Remove Lead-Free and No-Clean Fluxes
Vapor Degreasing Chemistries Remove Lead-Free and No-Clean Fluxes
The purpose of this paper is to present a cleaning process for difficult no-clean, lead-free and high temperature flux residues on reflowed PCBs.
Production Floor

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