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We found that BGAs exhibit minimum warpage at a reflow temperature of 200-220°C, not MAPSP 210oC the lower temperature of about 180°C that tin-bismuth solders require. The best process production window can be obtained by using a solder alloy with a melting point of 200°C Production Floor
This paper will show that improvements in feature density, deposition uniformity and void free via filling can be achieved in large panel processing. Production Floor
This paper will review the status of the ongoing interposer development program and provide details on the process capabilities that have been established. Analysis Lab
We are showing what could be done when using a 2D X-ray system to collect high resolution images and process them with Deep Learning using AI. Analysis Lab
A new generation of indium TIM has a protective layer to suppress surface oxidation. This work examines the performance of indium as TIM for BGA packaging. Materials Tech
To keep up, P&P machine suppliers must increase feeder density in traditional ways or new creative innovations to better serve the end user. Production Floor
This study focuses on determining the effects of palladium and gold thicknesses to ensure dependable solder joints and wire bonds. Analysis Lab
We have a formula stencil that had the apertures enlarged to maintain volume while overprinting the ends to keep solder away from the 0201 nozzle. Board Talk
The study compares a paste that barely passes SIR at 85C/85RH with polymeric material, Silicone conformal, and acrylic conformal coating. Materials Tech
The tools to ensure that counterfeits are not polluting any given supply chain have not kept pace with the changing needs. Materials Tech |
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