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We developed a Cu paste that can be used as a filling material for a through-glass via (TGV). A TGV substrate can be filled with Cu paste without voids by using the vacuum-press method. A Cu film with the lowest volume resistivity of approximately 3.5 μΩ･cm was obtained at 350 °C or higher in a hydrogen atmosphere. Materials Tech
Guidelines for stencil designs and aperture placement in cavities are presented, including stencil design, paste material, experimentation, and results. Production Floor
America holds a dominant position the Deep-Tech sectors from Artificial Intelligence to Biotechnology. This dominant position is not a byproduct of geography. Technology Briefing
This study investigated the cause of tombstoning for 0402 capacitors in surface mount technology. Statistical analysis methods were used to determine if there was any difference. Analysis Lab
A novel lead-free solder paste, Durafuse® HR (DFHR), has been developed using Durafuse® technology. Materials Tech
To miniaturize electronics conformal coating removal solution needs to provide fine cut resolutions, without compromising quality, cost, and throughput. Production Floor
The recent evolution of data analytics allows correlation analysis from wafer fab to wafer test to assembly and packaging to product level test and field performance. Analysis Lab
Our wave solder pallets are made from Durastone. Can we use the same wave solder pallets for leaded and lead-free? Board Talk
To better understand OSP and de-flux interactions, a study of OSP with four different de-flux cleaning chemistries is discussed. Materials Tech
Buildings made of 3D-printed concrete offer quick construction, possible use of recycled materials, reduced labor costs and less waste. Technology Briefing |
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