Baking, Ovens, Moisture Control



These programs cover batch and inline baking, curing, ovens, moisture control, vacuum sealing and more.
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Moisture Barrier Bag Issues
Moisture Barrier Bag Issues
Moisture sensitive chip components have been exposed to the atmosphere beyond specification. Can they be packaged and sealed with desiccant?
Board Talk

What is the Suggested Humidity Level for Electronics Assembly?
What is the Suggested Humidity Level for Electronics Assembly?
I am aware of the suggested humidity level for an electronics assembly facility. Do the same limits apply within a 100,000 class clean room?
Board Talk

Component Moisture Question?
Component Moisture Question?
We mistakenly assembled circuit boards using BGA components that were not properly stored. Can we now rebake the assemblies?
Board Talk

Questions About Humidity Indicator Cards and Baking Components?
Questions About Humidity Indicator Cards and Baking Components?
We run small jobs so a reel of MSD components could be opened a number of times. If the humidity cards are not pink, do we have to bake the components?
Board Talk

Generalizations About Component Flatness
Generalizations About Component Flatness
Failure to have completely flat components and circuit boards can lead to opens, shorts, head on pillow, weakened solder joints and stressed solder joints.
Analysis Lab

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