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| Baking, Ovens, Moisture Control | ||||||||||
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Moisture sensitive chip components have been exposed to the atmosphere beyond specification. Can they be packaged and sealed with desiccant? Board Talk
I am aware of the suggested humidity level for an electronics assembly facility. Do the same limits apply within a 100,000 class clean room? Board Talk
We mistakenly assembled circuit boards using BGA components that were not properly stored. Can we now rebake the assemblies? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their own experiences and expertise. Board Talk
We run small jobs so a reel of MSD components could be opened a number of times. If the humidity cards are not pink, do we have to bake the components? Board Talk
We attach travelers to every group of MSD components taken out of the moisture barrier bag. Is this enough documents on our MSD program? Board Talk
Failure to have completely flat components and circuit boards can lead to opens, shorts, head on pillow, weakened solder joints and stressed solder joints. Analysis Lab
Paper discusses use of capacitance measurements to follow the absorption and desorption behavior of moisture in PCBs. Analysis Lab
The dicussion focuses on concerns regarding IPC's guideline for handling and storage of circuit boards covering moisture sensitivity and baking. Board Talk
Do we need to bake PCBs that are vacuum packed? Can additional baking cause other problems? Board Talk
Industry expert Bob Willis discusses the process of baking printed circuit boards. Defect of the Month |
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