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Sponsor
Circuit-Technology-Center

Tough Engineering Changes? Where Can You Turn?
Engineering changes are a reality that need to be dealt with. Do you have qualified rework technicians to do the job efficiently and reliably?
Circuit Technology Center

Sponsorship Opportunities



Circuit Insight Media Guide 2025

Featured Sponsors
Featured Sponsors run text and banner ads weekly in the Circuit Insight email newsletter. Ads also appear on the website's home page and program pages. Text and banner ad clicks will direct readers to the advertiser's website or page as directed.

Featured Sponsor Rates
$900/month 12-month Contract
$1,000/month 6-month Contract

Mechanical Ad Specifications
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Sponsor
Master-Bond

Underfill Epoxy Offers Thermal Conductivity
Master Bond EP29LPTCHT is a low viscosity adhesive that can be used for underfill & encapsulation apps. It offers thermal conductivity & electrical insulation.
Master Bond