Adhesives, Coating, DispensingThese programs cover adhesives, epoxies, bonding, coatings, tapes, jetting, dispensing and more. |
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In this study, concerns involving the reliability of probing different solder/flux compounds, the land configurations, the contact pressures and probe styles will be discussed in detail. Analysis Lab
The paper compares the best flux and underfill combination in reliability performance was selected and applied to the production process. Production Floor
The strength of solder joints is enhanced by several times, and thermal cycling performance is significantly improved. Materials Tech
Study illustrates the complexity of achieving optimum thermal and electrical performance with any circuit, especially at higher frequencies. Materials Tech
Research on a prototype paste is being completed to improve reliability and survivability of PCB and SMT solder joints under extreme temperatures (< 500° Celsius). Production Floor |
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