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| Adhesives, Coating, Dispensing | ||||||||||
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This paper discusses the use of jet-dispensed SMT adhesives for increased durability, lower component cost, and new form factor printed electronics. Materials Tech
This paper presents the science behind liquid TIMs identifies key TIM characteristics needed to design and manufacture reliably and efficiently. Materials Tech
This study is focused on liquid glop top encapsulants that are placed over the PCB components and wire bonds as a protective layer. Materials Tech
This paper presents the results of a study aimed at developing high-power density devices for aerospace applications. Materials Tech
This paper will focus on the comparison of pure Pd and PdP deposits and the interaction with the gold electrolyte type in use. Materials Tech
Plasma treatment increases the adhesion strength of the conformal coatings through the removal of organic contaminants and surface activation. Materials Tech
This paper covers all the long-term test results as a follow-up to an earlier publication reporting interim results and preliminary conclusions. Analysis Lab
The development of a spray coating process to apply EMI shielding materials to the exterior surfaces of components on strips and larger SiP packages. Production Floor
This paper describes work carried out by Humiseal to investigate root causes of these problems, and to introduce materials with improved performance. Analysis Lab
This paper examines proven methods to determine the dot/line positional accuracy along with mass flow rate for both heads during synchronous dispensing. Production Floor |
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