Adhesives, Coating, Dispensing



These programs cover adhesives, epoxies, bonding, coatings, tapes, jetting, dispensing and more.
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Residues on Probing PCBAS-Consistent Connections Across No-Clean Fluxes
Residues on Probing PCBAS-Consistent Connections Across No-Clean Fluxes
In this study, concerns involving the reliability of probing different solder/flux compounds, the land configurations, the contact pressures and probe styles will be discussed in detail.
Analysis Lab

Fine Pitch Flip Chip Assembly Process Underfill, Evaluation and Reliability
Fine Pitch Flip Chip Assembly Process Underfill, Evaluation and Reliability
The paper compares the best flux and underfill combination in reliability performance was selected and applied to the production process.
Production Floor

Lower Temperature Solder Joint Encapsulant
Lower Temperature Solder Joint Encapsulant
The strength of solder joints is enhanced by several times, and thermal cycling performance is significantly improved.
Materials Tech

Thermally, Electrically Conductive Adhesive to Control Heat in PCBs
Thermally, Electrically Conductive Adhesive to Control Heat in PCBs
Study illustrates the complexity of achieving optimum thermal and electrical performance with any circuit, especially at higher frequencies.
Materials Tech

SN-CU-NI Composite Solder Paste High Temperature Use
SN-CU-NI Composite Solder Paste High Temperature Use
Research on a prototype paste is being completed to improve reliability and survivability of PCB and SMT solder joints under extreme temperatures (< 500° Celsius).
Production Floor

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