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Test, Inspection, X-Ray
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Machine Vision-based Defect Inspection for Plated Through Hole Components
Machine Vision-based Defect Inspection for Plated Through Hole Components
This study delineates the conceptualization of a machine vision-based defect inspection model, meticulously engineered to confront the intricacies of high-throughput PCB assembly.
Production Floor

Accelerated Corrosion Testing of DRAM Modules for Data Centers
Accelerated Corrosion Testing of DRAM Modules for Data Centers
To investigate corrosion problems in electronic products for server applications, mixed flowing gas (MFG) is widely used as an accelerated testing method.
Analysis Lab

Machine Learning-based Server Testing for Large-Scale PCB Manufacturing
Machine Learning-based Server Testing for Large-Scale PCB Manufacturing
This paper presents a Decision Tree based Machine Learning to streamline server testing and debugging processes within large-scale PCB manufacturing.
Production Floor

DRAM damage due to X-Ray Inspections Post PCB Assembly
DRAM damage due to X-Ray Inspections Post PCB Assembly
This paper outlines several mitigation strategies for minimizing radiation dosage during X-ray inspections, particularly in the context of printed circuit boards (PCBs). One key observation is that the PCB itself acts as an effective shield, significantly reducing radiation exposure.
Analysis Lab

AI-Powered Real-Time Inspection for Electronic Component Assembly
AI-Powered Real-Time Inspection for Electronic Component Assembly
This paper introduces enhancing the quality of electronic component assembly through real-time, inline inspection utilizing AI-powered deep learning techniques.
Production Floor

Developments of the X-ray Inspection Technology for PCBAs
Developments of the X-ray Inspection Technology for PCBAs
This paper provides an overview of some of the latest technical developments in the X-ray inspection technology for the electronics industry.
Production Floor

Metallurgical and Mechanical Analysis of Castellated Via Rigid-Flex Connection
Metallurgical and Mechanical Analysis of Castellated Via Rigid-Flex Connection
The reliability of castellated vias as a rigid-flex interconnection method is evaluated. This is split into metallurgical aging of joints and investigating mechanical robustness/integrity.
Analysis Lab

A Close look at IPC X-Ray Inspection Guidelines for BGAs
A Close look at IPC X-Ray Inspection Guidelines for BGAs
The massive amount of measurements and qualitative information provided by CT-Xray systems can now enable more inspections to be easily automated, ultimately reducing the burden on engineers. With access to this impressive technology, tighter processing parameters can be maintained to ultimately ensure higher quality electronic products for a variety of markets.
Analysis Lab

Pre & Post Solder AOI for THT
Pre & Post Solder AOI for THT
By implementing and automated THT AOI solution, first pass yields improve due to standardized consistent inspection results, increased margins by reducing labor for inspection and rework, production optimization and traceability data is automatically generated for analysis in real time.
Analysis Lab

Tin Flakes/Splashes in SMT
Tin Flakes/Splashes in SMT
An increasing of electrical shorts reported in several testers was noticed. Initially, it was found than more of the 80% of the shorts corresponding to thin metal flakes/splashes.
Analysis Lab

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