Test, Inspection, X-RayThese programs cover manual and automated test, manual and automated optical inspection, x-ray and more. |
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The paper discusses the differences of the alloy, based stress in ceramic components due to passive cycle tests, real customer tests, and stress analyses. Analysis Lab
From component and fabrication to complete electronic assemblies, IC analysis has been the de facto method for evaluating ionic cleanliness of electronic hardware. Analysis Lab
We are correcting many solder defects. The search for defects is taking too long. Should we go with a 3D AOI system to save inspection time? Jim Hall and Phil Zarrow, The Assembly Brothers, address this question and share their own recommendations. Board Talk
Dye stain and cross section failure analysis techniques were used to identify pad crater damage and showed good agreement with the acoustic events. Analysis Lab
The paper reports the results of the iNEMI creep corrosion qualification test and compares them to the first round robin test and recent mixed-flowing gas test results. Analysis Lab |
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