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| Test, Inspection, X-Ray | ||||||||||
| These programs cover manual and automated test, manual and automated optical inspection, x-ray and more. | ||||||||||
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In this paper, an effective method for predicting circuit failures in post-market circuit boards through simulation and deep learning is proposed and implemented. Analysis Lab
The iNEMI Connector Reliability Test Recommendations team recommends work to define test conditions to evaluate the expected degradation of connectors under the stress levels. Analysis Lab
We inspect PCBAs on a relatively hard ESD mat. Will moving the PCBs on the mat will scratch and stress the soldered components on the bottom side? Board Talk
This paper discusses individual process step validation methods with real examples of improvement that contribute to defect per million opportunities (DPMO) reduction. Analysis Lab
Paper describes how ICT advancements contribute to lowering overall manufacturing test costs by improving fault coverage, reliability, and throughput of production tests. Production Floor
This experiment considers the reliability of different electronic components and evaluates them on 0.200" power computing printed circuit boards with OSP. Analysis Lab
Recognizing the limitations of ROSE testing versus localized contamination, what can I use to validate the cleanliness of my finished product? Board Talk
This paper updates progress in the development of methods for investigating solder joint reliability in a combined environment of vibration and thermal cycle testing. Analysis Lab
Techniques in performing precision and analytical micro-sections, which fuse the techniques common in preparation of silicon wafers and bulk materials are discussed. Analysis Lab
The paper discusses the differences of the alloy, based stress in ceramic components due to passive cycle tests, real customer tests, and stress analyses. Analysis Lab |
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