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We found that BGAs exhibit minimum warpage at a reflow temperature of 200-220°C, not MAPSP 210oC the lower temperature of about 180°C that tin-bismuth solders require. The best process production window can be obtained by using a solder alloy with a melting point of 200°C Production Floor
We are showing what could be done when using a 2D X-ray system to collect high resolution images and process them with Deep Learning using AI. Analysis Lab
The journey toward zero defects in dispensing is challenging but achievable. True 3D inspection technology has have emerged as a powerful ally in this quest to ensure the highest quality levels. Production Floor
How can two different test methods provide Dk measurement that are different? When the methods measure the same circuit material in two different directions. Analysis Lab
This article presents workflows that combine 3D X-ray microscopy, nanoscale tomography, and electron microscopy for visualization of the interior of electronic devices. Analysis Lab
We inspect PCBAs on a relatively hard ESD mat. Will moving the PCBs on the mat will scratch and stress the soldered components on the bottom side? Board Talk
This paper investigates PCB supplier rework processes, including identifying rework procedures that have potential implications to PCB functionality. Analysis Lab
After reviewing the four AI use cases presented in this paper, it is very apparent the overwhelming benefit AI can have with our AOI process and programs. Production Floor
This paper will outline the board-level assembly development and reliability that was undertaken to demonstrate this WLCSP could meet the demands of automotive. Analysis Lab
This study delineates the conceptualization of a machine vision-based defect inspection model, meticulously engineered to confront the intricacies of high-throughput PCB assembly. Production Floor |
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