Test, Inspection, X-Ray



These programs cover manual and automated test, manual and automated optical inspection, x-ray and more.
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Risk for Ceramic Component Cracking Dependent
Risk for Ceramic Component Cracking Dependent
The paper discusses the differences of the alloy, based stress in ceramic components due to passive cycle tests, real customer tests, and stress analyses.
Analysis Lab

Failure Analysis - Using Chromatography and Ion Chromatopgraphy/Mass Spec
Failure Analysis - Using Chromatography and Ion Chromatopgraphy/Mass Spec
From component and fabrication to complete electronic assemblies, IC analysis has been the de facto method for evaluating ionic cleanliness of electronic hardware.
Analysis Lab

Should We Invest in 3D Optical Inspection?
Should We Invest in 3D Optical Inspection?
We are correcting many solder defects. The search for defects is taking too long. Should we go with a 3D AOI system to save inspection time? Jim Hall and Phil Zarrow, The Assembly Brothers, address this question and share their own recommendations.
Board Talk

Pad Crater Initiation in Shock Using Acoustic Emission Detection
Pad Crater Initiation in Shock Using Acoustic Emission Detection
Dye stain and cross section failure analysis techniques were used to identify pad crater damage and showed good agreement with the acoustic events.
Analysis Lab

Second Round Robin Evaluation of iNEMI Creep Corrosion Qualification Test
Second Round Robin Evaluation of iNEMI Creep Corrosion Qualification Test
The paper reports the results of the iNEMI creep corrosion qualification test and compares them to the first round robin test and recent mixed-flowing gas test results.
Analysis Lab

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