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| PC Fab, Board Design, Laminates | ||||||||||
| These programs cover bare PC board fabrication, circuit board design, laminates and more. | ||||||||||
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Achieving optimum high-frequency PCB performance is not only the best possible PCB material, but can be impacted by PCB fabrication practices. Materials Tech
This investigation measures the leakage within internal PCB layers during exposure of various specimens to a controlled ground-based test environment. Materials Tech
The study elaborates the parameters with the solder separation failure per board design configuration, and also provides the potential solution to mitigate the failure. Production Floor
This paper describes the purpose, methodology, and results to date of thermal endurance testing performed at the company. Materials Tech
Paper presents work performed to achieve LCP-based high density multilayer structures, describing the breadboards manufactured and tested. Analysis Lab
Lead Free has brought new materials and quality concerns to the industry. New methods to determine the quality of materials is needed. Analysis Lab
How long will the industry continue to use through hole components? I can envision connectors being used for some time, what about component types? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this question. Board Talk
We have a PCB with a HASL surface finish, the assembly includes a 256 ball BGA. The component balls are .6 mm pitch. Is coplanarity a concern? Board Talk
Paper covers a series of comparative analyses, testing the reliability of standard SMT components vs their embedded counterparts. Materials Tech
A non-halogen flame retardant has been developed for high performance applications. Resin performance data are presented. Materials Tech |
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