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Current work seeks to better understand how the indium (In) bump size affects the respective interface kinetics and subsequent mechanical properties. Analysis Lab
This paper presents the demonstration of RDL interposers with fine pitch firing and low loss dielectric layers. Analysis Lab
The study elaborates the parameters with the solder separation failure per board design configuration, and also provides the potential solution to mitigate the failure. Production Floor
This paper presents an in-depth analysis of potential influences of the cutting quality variation on the characteristics of the printed circuit board. Therefore, examinations such as a sidewall resistance and breakdown voltage test have been carried out for the two cutting strategies FastCut and CleanCut. Production Floor
This paper will focus on the behavior of the power module for operational conditions of a PedEleC (Pedal Electric Cycle) application. Analysis Lab
In this paper we examine the influence of three factors on thermal-mechanical solder joint reliability of LEDs mounted on an IMS PCB using FEA. Analysis Lab
This paper aimed to investigate the impacts of printed circuit board (PCB) design, including the PCB thickness and solder mask opening, on the fatigue performance of lead-free solders. Each test vehicle includes one of two component types: CABGA192 and MLF32, assembled using SnAgCu solder paste with an Organic Solderability Preservative (OSP) surface finish. Analysis Lab
This paper will examine a few key areas of PCB design and manufacturing that can have a substantial impact on product reliability and how to mitigate reliability risks by deploying design for manufacturability (DFM) best practices. It will also explore the dependencies between the design and manufacturing processes. Analysis Lab
The focus of this study was to investigate the underlying mechanism of V-pitting and to develop a process to withstand or resist the pitting. Production Floor
This work has evaluates BGA packaging and PCB design parameters to characterize their influence on double-reflow solder separation failure mode for mixed VIPPO BGA pad footprints. Analysis Lab |
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