PC Fab, Board Design, Laminates
These programs cover bare PC board fabrication, circuit board design, laminates and more.
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Via Filling: Challenges in the Plating Process
Via Filling: Challenges in the Plating Process
This paper describes the function and principles behind BMV filling processes together with methods for non destructive testing of the filled structures.
Production Floor

Plasma Polymerization
Plasma Polymerization
This paper will discuss the plasma coating process and the equipment used.
Production Floor

Reexamination of Thermal Cycling Reliablity of BGA Components with SNAGCU AND SnPb Solder Joints on Different Board Designs
Reexamination of Thermal Cycling Reliablity of BGA Components with SNAGCU AND SnPb Solder Joints on Different Board Designs
A direct comparison was conducted between SnPb and lead-free solder joints focused on long-term thermal cycling reliability after being exposed to high-temperature aging
Analysis Lab

CU Core Column Enables Fine Pitch & High-Density 3D Packaging
CU Core Column Enables Fine Pitch & High-Density 3D Packaging
The diameter, length, and aspect ratio of the Cu core columns and how to optimize the dimensions of the Cu core column is discussed.
Analysis Lab

Micro Trace Resistive Technology
Micro Trace Resistive Technology
Micro Trace Resistor Technology allows thin film resistors to be built within a printed circuit trace that is less than 100 microns wide.
Materials Tech

Reliability of ENEPIG by Sequential Thermal Cycling and Aging
Reliability of ENEPIG by Sequential Thermal Cycling and Aging
Paper presents the reliability of LGA components assembled with tin-lead solder onto PCBs with an ENEPIG finish and subjected to thermal cycling and aging.
Materials Tech

Nanomaterials Performance Advantages
Nanomaterials Performance Advantages
Low temperature reactivity, reaction speeds, flexibility and fine pitch considerations dictate that nanomaterials be given serious consideration.
Materials Tech

Optimizing Immersion Silver Chemistries For Copper
Optimizing Immersion Silver Chemistries For Copper
Study evaluated several types of additives. Data on thickness distribution, copper attack rate, and deposit porosity resulted in new theories on how to control immersion silver.
Production Floor

Room Temperature Fast Flow Reworkable Underfill for LGA
Room Temperature Fast Flow Reworkable Underfill for LGA
With the miniaturization of electronics, Land Grid Array has been widely used in consumer electronics, leaving only 20-30 microns gap left between LGA and the substrate.
Analysis Lab

Is HASL a Good Choice for Surface Finish?
Is HASL a Good Choice for Surface Finish?
We are using a lead-free hot air solder leveling board finish. Our boards have bottom-terminated components. Is this the best choice? The Assembly Brothers, Jim Hall and Phil Zarrow, discuss this scenario and share their own suggestions and recommendations.
Board Talk