PC Fab, Board Design, Laminates



These programs cover bare PC board fabrication, circuit board design, laminates and more.
Previous
 Page 1 of 28 
Next
Board Level Failure Analysis Demount Challenges Package Package
Board Level Failure Analysis Demount Challenges Package Package
Board level FA and component demount experiments for PoP mounted on PCB is discussed. The FA methods includes 2D and 3D X-ray imaging, cross section and DnP test.
Analysis Lab

Overcome Nodules and Scratches on Wire Bondable Plating on  PCBs
Overcome Nodules and Scratches on Wire Bondable Plating on PCBs
Manufacturing was improved to minimize nodules and scratches. Wire bonds were evaluated to determine the allowable size of nodules and scratches.
Analysis Lab

Hi Pot Dielectic Breakdown
Hi Pot Dielectic Breakdown
How the Electrical Test industry combats requirements and provides solutions to adhere to ever changing requirements is discussed.
Materials Tech

Electroplating of Cu in TSV
Electroplating of Cu in TSV
The research objective is to estimate metallurgical and mechanical properties of low alpha solder. Cu-filling property to TSV was also investigated.
Production Floor

Characterization of PCB Material & Manufacturing for High Frequency
Characterization of PCB Material & Manufacturing for High Frequency
This paper investigates the impact of different PCB manufacturing technologies and their relation to their high frequency behavior.
Analysis Lab

Previous
 Page 1 of 28 
Next