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| PC Fab, Board Design, Laminates | ||||||||||
| These programs cover bare PC board fabrication, circuit board design, laminates and more. | ||||||||||
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This paper describes the function and principles behind BMV filling processes together with methods for non destructive testing of the filled structures. Production Floor
This paper will discuss the plasma coating process and the equipment used. Production Floor
A direct comparison was conducted between SnPb and lead-free solder joints focused on long-term thermal cycling reliability after being exposed to high-temperature aging Analysis Lab
The diameter, length, and aspect ratio of the Cu core columns and how to optimize the dimensions of the Cu core column is discussed. Analysis Lab
Micro Trace Resistor Technology allows thin film resistors to be built within a printed circuit trace that is less than 100 microns wide. Materials Tech
Paper presents the reliability of LGA components assembled with tin-lead solder onto PCBs with an ENEPIG finish and subjected to thermal cycling and aging. Materials Tech
Low temperature reactivity, reaction speeds, flexibility and fine pitch considerations dictate that nanomaterials be given serious consideration. Materials Tech
Study evaluated several types of additives. Data on thickness distribution, copper attack rate, and deposit porosity resulted in new theories on how to control immersion silver. Production Floor
With the miniaturization of electronics, Land Grid Array has been widely used in consumer electronics, leaving only 20-30 microns gap left between LGA and the substrate. Analysis Lab
We are using a lead-free hot air solder leveling board finish. Our boards have bottom-terminated components. Is this the best choice? The Assembly Brothers, Jim Hall and Phil Zarrow, discuss this scenario and share their own suggestions and recommendations. Board Talk |
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