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| Rework, Repair, Modification | ||||||||||
| These programs cover BGA rework, BGA reballing, tinning, damage repair, jumper wires, modifications and more. | ||||||||||
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This paper reviews the challenges and process steps needed for successful repair of surface mount devices on very densely packaged circuit boards. Production Floor
What is the best method for removing an SMT array package that has been under-filled and cured. Is there an industry approved method? Board Talk
This paper describes Automated Optical Rework technology and its advantages for advanced circuit board production. Production Floor
The present work addresses the rework and reball challenges of a specific WLP case study, and suggests improvements for maintaining the true failure signature. Analysis Lab
This paper introduces a rework technology using cameras to identify the target area for component installation and component pin structure. Production Floor
We are soldering and reworking 0201s and 01005s using hot air solder rework station with adjustable air flow. The minimum air flow will blow parts. Board Talk
Touch up and repair processes need to fulfil the high-quality demands of today’s highly integrated and complex electronic products. Production Floor
The lead-free solder does not wet metal surfaces as well as tin-lead metallurgy. This narrows down the process window for lead-free solder. Production Floor
After BGA rework there is an outline of residue on around the pads. Is it necessary to remove this residue to reinstall a new BGA? Board Talk
This paper outlines rework processes for many challenging components including BGA, QFN/BTC, and LED packages. Production Floor |
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