Rework, Repair, Modification



These programs cover BGA rework, BGA reballing, tinning, damage repair, jumper wires, modifications and more.
Previous
 Page 1 of 12 
Next
Additive Manufacturing-Enabled Wireless Flexible Hybrid Electronics
Additive Manufacturing-Enabled Wireless Flexible Hybrid Electronics
This paper reports an ensemble of strategies for the successful miniaturization of EEG in a fully-flexible, wearable and wireless platform.
Analysis Lab

Removing Warpage from PCBAs
Removing Warpage from PCBAs
We have 20 populated boards with components on both sides that are warped. Components are varied height. What methods can we use to flatten them? Jim Hall and Phil Zarrow, The Assembly Brothers, share their thoughts and experiences.
Board Talk

Consensus for Baking Prior to Rework?
Consensus for Baking Prior to Rework?
What is the consensus for baking out moisture in circuit board assemblies prior to convection rework, localized mini-wave rework, or hand soldering rework?
Board Talk

Cleaning Reballed BGA Components
Cleaning Reballed BGA Components
We currently clean reballed BGAs using an ultrasonic cleaner followed by baking to remove moisture. Is this an acceptable practice? Jim Hall and Phil Zarrow, the Assembly Brothers, offer their own suggestions and expertise.
Board Talk

Solder Paste Volume for BGA Rework
Solder Paste Volume for BGA Rework
Rework can never be as controlled or consistent as original assembly, should we use more paste during BGA rework to compensate for irregularities or flatness?
Board Talk

Previous
 Page 1 of 12 
Next