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| Rework, Repair, Modification | ||||||||||
| These programs cover BGA rework, BGA reballing, tinning, damage repair, jumper wires, modifications and more. | ||||||||||
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A non-aerospace customer's board was repaired without authorization. Does an IPC document state that customer approval is required for class 3 repairs? Board Talk
We have populated boards with components on both sides that are warped. Components are varied height. What methods can we use to flatten them? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss their recommendations. Board Talk
Paper reviews study on underfill/flux compatibility issues and investigates flux compatibility between four popular commercial solder pastes and six underfills. Production Floor
This paper will detail the material properties and rework considerations of using a eutectic tin/bismuth solid wire and SAC305 flux cored wire in a rework setting. Analysis Lab
What is the consensus for baking out moisture in circuit board assemblies prior to convection rework, localized mini-wave rework, or hand soldering rework? Board Talk
We currently clean reballed BGAs using an ultrasonic cleaner followed by baking to remove moisture. Is this an acceptable practice? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss the best practices given this scenario. Board Talk
This paper focuses on the effect of various parameters that are used to reball a BGA component and their effect on the overall shear strength. Analysis Lab
Rework can never be as controlled or consistent as original assembly, should we use more paste during BGA rework to compensate for irregularities or flatness? Board Talk
Reworkable edge bond materials designed to improve the reliability of large area BGAs and ceramic BGAs assemblies are presented. Production Floor
The goal of this paper is to share complex rework process improvements to review and consider how incorporating into their practice can provide benefit. Production Floor |
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