Rework, Repair, Modification



These programs cover BGA rework, BGA reballing, tinning, damage repair, jumper wires, modifications and more.
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Rework and Reball Challenges for Wafer-Level Packages
Rework and Reball Challenges for Wafer-Level Packages
The present work addresses the rework and reball challenges of a specific WLP case study, and suggests improvements for maintaining the true failure signature.
Analysis Lab

Issues With BGA Rework Residue
Issues With BGA Rework Residue
After BGA rework there is an outline of residue on around the pads. Is it necessary to remove this residue to reinstall a new BGA?
Board Talk

Automating the Rework Process
Automating the Rework Process
This paper describes Automated Optical Rework technology and its advantages for advanced circuit board production.
Production Floor

New Placement Technology for Rework
New Placement Technology for Rework
This paper introduces a rework technology using cameras to identify the target area for component installation and component pin structure.
Production Floor

Modify Rework Procedures for Assemblies Fabricated Using OSP?
Modify Rework Procedures for Assemblies Fabricated Using OSP?
Should we modify any rework or repair procedures for circuit board assemblies fabricated using OSP, organic solderability preservatives, bare boards? Jim Hall and Phil Zarrow, the Assembly Brothers, share their own thoughts on this scenario.
Board Talk

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