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Electronics manufacturers hurting from supply chain disruptions and component shortages are challenged by the rise in counterfeit components. Production Floor
The tools to ensure that counterfeits are not polluting any given supply chain have not kept pace with the changing needs. Materials Tech
This paper highlights the challenges made with conventional Sulphuric-Peroxide based Oxide Replacement bonding enhancement system. Analysis Lab
A practical approach is to use optical transceiver submodules and to attach them onto the package substrate by soldering is discussed in this paper. Production Floor
A technique called hydrogen evolution assisted electroplating, has shown enhancement to the deposition rate of copper compared to galvanostatic conventional electroplating methods. Production Floor
In this paper, two diverse examples are discussed, illustrating how the adoption of the Connected Factory Exchange (CFX) standard is changing manufacturing. Analysis Lab
The future of manufacturing in the Electronics Industry is dependent on the ability to develop and deploy technology platforms to realize Smart Manufacturing and Industry 4.0. Production Floor
This paper summarizes experiences gained while developing a new cost effective Palladium containing ionic activation system. Analysis Lab
This project evaluates structural electronics for automotive interior use. The car interior application is back-seat-control-panel and the structural electronics. Analysis Lab
This paper will discuss the current areas of growth that support level 3 autonomy, specifically on radar modules that bring perspectives of distance and speed to surrounding objects. Analysis Lab |
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