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Operations, Productivity, Supply
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Counterfeit Electronics Component Conundrum with Smart Labeling
Counterfeit Electronics Component Conundrum with Smart Labeling
Electronics manufacturers hurting from supply chain disruptions and component shortages are challenged by the rise in counterfeit components.
Production Floor

Essential Tools to Combat the Ingress of Counterfeit Materials
Essential Tools to Combat the Ingress of Counterfeit Materials
The tools to ensure that counterfeits are not polluting any given supply chain have not kept pace with the changing needs.
Materials Tech

Oxide Alternative Process for High Frequency Bonding Applications
Oxide Alternative Process for High Frequency Bonding Applications
This paper highlights the challenges made with conventional Sulphuric-Peroxide based Oxide Replacement bonding enhancement system.
Analysis Lab

Technology for Optical Co-Packaging
Technology for Optical Co-Packaging
A practical approach is to use optical transceiver submodules and to attach them onto the package substrate by soldering is discussed in this paper.
Production Floor

Copper Electrodeposition By Hydrogen Evolution Assisted Electroplacing
Copper Electrodeposition By Hydrogen Evolution Assisted Electroplacing
A technique called hydrogen evolution assisted electroplating, has shown enhancement to the deposition rate of copper compared to galvanostatic conventional electroplating methods.
Production Floor

Value-Driven CFX Case Studies Supporting Smart Manufacturing
Value-Driven CFX Case Studies Supporting Smart Manufacturing
In this paper, two diverse examples are discussed, illustrating how the adoption of the Connected Factory Exchange (CFX) standard is changing manufacturing.
Analysis Lab

Technologies and Standards to Realize Smart Manufacturing
Technologies and Standards to Realize Smart Manufacturing
The future of manufacturing in the Electronics Industry is dependent on the ability to develop and deploy technology platforms to realize Smart Manufacturing and Industry 4.0.
Production Floor

Developing a Low Palladium Activation System for Electroless Copper Deposition
Developing a Low Palladium Activation System for Electroless Copper Deposition
This paper summarizes experiences gained while developing a new cost effective Palladium containing ionic activation system.
Analysis Lab

Structural Electronics for Automotive Interiors
Structural Electronics for Automotive Interiors
This project evaluates structural electronics for automotive interior use. The car interior application is back-seat-control-panel and the structural electronics.
Analysis Lab

Materials Considerations for Automotive Radar Designs
Materials Considerations for Automotive Radar Designs
This paper will discuss the current areas of growth that support level 3 autonomy, specifically on radar modules that bring perspectives of distance and speed to surrounding objects.
Analysis Lab

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