Defect of the Month



Bob Willis
Defect of the month is presented by Bob Willis. For decades Bob has been providing solutions for process and product failure trouble shooting, in-house training, process engineering support and product failure analysis.
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Bob Willis
SMT Adhesive Inspection
Industry expert Bob Willis uses the NPL Defect Database to explain SMT adhesive inspection.
Defect of the Month

Bob Willis
Head in Pillow Explained
Industry expert Bob Willis explains the causes of HiPHoP (head-in-pillow/head-on-pillow) and how to address it.
Defect of the Month

Bob Willis
Causes and Tests for Pin Holes, Blow Holes and Outgassing
Bob Willis explains the causes, solutions and tests for outgassing, caused by moisture in the printed board board.
Defect of the Month

Bob Willis
Causes of Popcorn Defects in Plastic Packages
Industry expert Bob Willis explains the causes of popcorning (distortion) on plastic packages like QFPs, SOICs and BGAs.
Defect of the Month

Bob Willis
Causes of PCB Delamination
Industry expert Bob Willis explains the causes of PCB lamination defects.
Defect of the Month

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