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Cleaning, Washing, Solvents | ||||||||||
These programs cover manual and automated cleaning systems, water and other solvent based cleaning and cleaning solutions. | ||||||||||
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The purpose of this research is to measure what circuit cards and parts on those assemblies are exposed to during the wash and rinse process of inline cleaning. Analysis Lab Is there a move to no-clean for QFN components, or will certain technologies have to continue using a traditional cleaning process? The Assembly Brothers, Phil Zarrow and Jim Hall, address this question and share their own experiences and expertise. Board Talk This paper will discuss the "physics" of liquid entrainment / entrapment / cleaning / rinsing and their effects on component materials. Production Floor We clean R.F. assemblies by hand but want to switch to an automated process. Which process would be better vapor degreasing or aqueous? Board Talk This paper examines the role variables play in aerosol cleaning and offers guidelines to improve an aerosol cleaning process. Production Floor This study compares different SIR test vehicles to determine which test vehicle is tougher to clean and therefore a challenge the cleaning process. Analysis Lab Is there an effect on PCBA long-term reliability when cleaned with a sodium bicarbonate scrub followed by DI water rinse? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this secnario and share their own experiences. Board Talk The cleanliness of surfaces is critical for the quality of processes like bonding, coating and printing. That’s why manufacturers may want to consider using atmospheric pressure plasma. Production Floor A new low global warming potential fluorinated solvent for precision cleaning is discussed. The paper covers the properties and performance. Materials Tech The use restrictions on HCFC-225 are in effect throughout the US. This paper discusses the options for assemblers and component manufacturers. Materials Tech |
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