Questions and CommentsHave you got something to say? Visit any program page and use the Comment form at the bottom of the page to submit a comment or ask a question. Comments and questions are reviewed prior to posting. |
|
|
|
|
Nov 20, 2020 Trouble With Skewed DPAK Components I didn't see if they were all skewing the same direction. It is assumed that the oven/conveyer is level. I would double check the leveling just to eliminate that possibility. ... Steve Lee, IDA North America Nov 20, 2020 Trouble With Skewed DPAK Components I already corrected DPAK skewing by breaking the stencil aperture for the thermal pad of the DPAK in four smaller apertures, so breaking the big solder "lake" under the part in four smaller "lakes" during ... Helio Jose Cantarino, Heson Consultoria, Brazil Nov 18, 2020 How to Reduce Voiding on QFN Components Through our various studies on ground pad voiding, AIM discovered a no-cost, easily implemented stencil aperture design that can be consistently and repeatedly used to reduce void formation on QFN/BTC style packages. For AIM's detailed ... Logan Jelinske, AIM Solder Nov 18, 2020 How to Reduce Voiding on QFN Components Adjusting your reflow profile can be a tool to minimize voiding. The ultimate results have been found using a vacuum reflow oven. Another effective method is increasing the time above liquidous. Entrapped vapor displays brownian ... Mitch Holtzer, Alpha Assembly Solutions Nov 18, 2020 How to Reduce Voiding on QFN Components Voiding occurs because the gases generated by the flux and other reactions, can not escape. In addition to everything already discussed, increasing the standoff height of the part can help. The methods I use is ... Alan Woodford, NeoTech |
|
|
|
|
|