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Nov 20, 2020
Trouble With Skewed DPAK Components
I didn't see if they were all skewing the same direction. It is assumed that the oven/conveyer is level. I would double check the leveling just to eliminate that possibility. ...
Steve Lee, IDA North America

Nov 20, 2020
Trouble With Skewed DPAK Components
I already corrected DPAK skewing by breaking the stencil aperture for the thermal pad of the DPAK in four smaller apertures, so breaking the big solder "lake" under the part in four smaller "lakes" during ...
Helio Jose Cantarino, Heson Consultoria, Brazil

Nov 18, 2020
How to Reduce Voiding on QFN Components
Through our various studies on ground pad voiding, AIM discovered a no-cost, easily implemented stencil aperture design that can be consistently and repeatedly used to reduce void formation on QFN/BTC style packages. For AIM's detailed ...
Logan Jelinske, AIM Solder

Nov 18, 2020
How to Reduce Voiding on QFN Components
Adjusting your reflow profile can be a tool to minimize voiding. The ultimate results have been found using a vacuum reflow oven. Another effective method is increasing the time above liquidous. Entrapped vapor displays brownian ...
Mitch Holtzer, Alpha Assembly Solutions

Nov 18, 2020
How to Reduce Voiding on QFN Components
Voiding occurs because the gases generated by the flux and other reactions, can not escape. In addition to everything already discussed, increasing the standoff height of the part can help. The methods I use is ...
Alan Woodford, NeoTech

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