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May 21, 2025 iNEMI Board Assembly –Press-Fit Technology Roadmap A very interesting article. UIBEL CONSULTING is participating in the working group “IPC 9797 Press-Fit Standard for Automotive Requirements and Other High Reliability Applications.” In my opinion, it could be beneficial for both sides to ... Frank Alexander Uibel, Uibel Consulting Apr 16, 2025 A Comparison of Thermal Cycling and Thermal Shock for Evaluating Solder Joint Reliability In re-reading this study, the results, of course are well substantiated, but it would be particularly nice to know the conversion factors as relates to the real-world product lifetime expectations. Quite few applications have the ... Jaye Waas, Renkus-Heinz Apr 9, 2025 Electronic Assembly Rework Best Practices: No-Clean and Cleaning Conditions There really, at present, no such thing as "selective cleaning". As my friends at Foresite say " if there is no rinse you are not really cleaning - you're just relocating the contaminant". ... Phil Zarrow, ITM Consulting Mar 10, 2025 Palm Size Portable 3 Printer Impressive start. I look forward to further reports on the progress. Thank you for the clear explanation of the 3D device. ... Jaye Waas, Renkus-Heinz Mar 10, 2025 Impact of PCB Manufacturing, Design, and Material to PCB Warpage Symmetrical stack ups and copper distribution is key to maintaining flatness. See IPC-2221 section 5.2.4 and IPC-2222 4.2.2 ... Gerry Partida, Summit Interconnect |
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