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Knowledge, Vision & Wisdom Mar 2, 2015
Is Customer Approval Required for Class 3 Repair?
We have a case where a non-aerospace customer's board was repaired without prior authorization. It was for a class 3 assembly. Does it specify in an IPC document that customer approval is required for class 3 repairs?
Board Talk
Development of a Robust 03015 Process
This paper reviews major steps considered and taken for the development of a robust 03015 process. It focuses on the activities for the solder paste print process.
Production Floor
Conformal Coating & Connector Holes
Conformal Coating & Connector Holes
Is it possible to eliminate conformal coating from seeping into connector holes? How much coating residue is acceptable in the connector holes?
Ask the Experts
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3D Printing Circuit Board Assemblies
One of the most promising commercial technologies of the decade is "additive manufacturing." Recently, printers have advanced to the point that they can even print sensors and electronic components on 2-D and 3-D substrates.
Technology Briefing
Flux Residue Causing Test Issues
Having issues with flux residues impacting in-circuit and functional test causing incomplete readings on connector pins.
Ask the Experts
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Lead-free Solder Contamination Concern
Lead-free Solder Contamination Concern
Can thermocouples attached to a circuit board with high temperature solder contaminate a lead-free solder wave?
Board Talk
Acoustic Micro Imaging Analysis for 3D Packages
This paper will present a review of AMI methods that are applicable to analyses of 3D devices and show example applications.
Analysis Lab
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What's Going On With Nanomaterials?
What's Going On With Nanomaterials?
We're rapidly approaching critical mass for commercialization of nanomaterials. Where does this technology stand? What are the implications? We'll show you.
Technology Briefing
Challenges of Package on Package Devices
Challenges of Package on Package Devices
Paper outlines processes associated with soldering stacked packages using dip flux and dip solder paste designed to overcome incidence of package warp.
Materials Tech
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Impact of Low Silver Paste on Area Array Joint Quality
This paper provides test data and analysis to "fill in the gaps" concerning the implementation for a wide variety of lead-free solder alloys.
Production Floor
Lifted Leads on QFP Components
Lifted Leads on QFP Components
After placement and reflow, we are having a random lifted lead problem on some QFP's. Is a 1% fall out rate normal? What might be the cause?
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Comparison of Solder Paste Residues
Paper assesses the reliability of several lead-free, no clean paste residues after vapor phase reflow in comparison to convection reflow.
Analysis Lab
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Solder Pallets With Titanium Inserts - Yes/No?
Our pallet manufacturer recommends titanium inserts to allow larger apertures near closely spaced surface mount components. These inserts are expensive. Are they worth it?
Board Talk
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Pad Cratering Evaluation of PCBs
Pad Cratering Evaluation of PCBs
This paper reviews major publications and research reports with regard to pad cratering on various PCB materials.
Materials Tech
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Alternative to Dead Bug Rework
Alternative to Dead Bug Rework
Dead bugging is when you add components to a circuit board upside-down and run jumper wires to complete the circuits. Here's an alternative.
Production Floor
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