Electronics Assembly Knowledge, Vision & Wisdom
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Jan 24, 2017
Why Do Our Boards Warp During Reflow?
Why Do Our Boards Warp During Reflow?
Board flexing has recently started to occur on one of our circuit board assemblies, yet our process has remained the same. We are using a three-zone reflow oven. The Assembly Brothers, Jim Hall and Phil Zarrow, take on this issue.
Board Talk
Cleaning Conformal Coating After Rework
We need to rework conformal coated assemblies. After the rework is completed, can we send the board through our aqueous DI wash system?
Ask the Experts
Solder Column Attachment for Absorbing Large CTE Mismatch
Solder Column Attachment for Absorbing Large CTE Mismatch
Paper reviews commercially off-the-shelf solder columns available, including plain columns, copper wrapped columns and more.
Production Floor
Smart Buildings Will Transform Our Lives
Smart Buildings Will Transform Our Lives
Homes, offices, retail stores, schools, hospitals, and factories are shaped by the needs of the occupants as well as the materials and construction methods available to build them.
Technology Briefing
Preparation for Mitigating Tin Whiskers in Alternative Lead-Free Alloys
The understanding of the growth mechanism for tin whiskers and what mitigation strategies can be employed to reduce their propagation.
Analysis Lab
Emerging Substrate Technologies
Emerging Substrate Technologies
This paper outlines the market dynamics driving the development of advanced substrates in today's industry landscape.
Materials Tech
Electronics Manufacturing by Inkjet Printing
Inkjet printing is of great interest in the field of electronics manufacture because its digital nature negates the need for physical tooling.
Production Floor
Ask the Experts
Reflow Causing Warp
We have a 20 layer PWB that bows during reflow. What can be done prior to reflow, during reflow, or post reflow, to prevent warping?
Ask the Experts
Effect of Gold on Reliability of SnAgCu Joints
This study addresses the effect of gold content on the reliability of tin-silver-copper solder joints, determining the acceptable level of gold in SAC305 solder joints.
Analysis Lab
What Causes Chip Blow Off During Reflow?
What Causes Chip Blow Off During Reflow?
What can cause a 0603 passive component to blow off the circuit board during reflow as if a firecracker was put underneath?
Board Talk
Stencil Design Improves Drop Test Performance
Paper evaluates the influence of stencil printed solder volume on electronic component lifetime in mechanical stress testing.
Materials Tech
         
Advances In Electrocaloric Materials
Advances In Electrocaloric Materials
Firefighters and athletes competing in the hot sun may be able to carry their own, lightweight cooling units with them, thanks to nanowire technology.
Technology Briefing
Problems to Look for with Crimp Terminations
Problems to Look for with Crimp Terminations
Bob Willis troubleshoots the challenges of using crimp terminations using the National Physical Laboratory's Process Defect Database.
Production Floor
Ask the Experts
Cleaning No-clean Flux with Tap Water
What happens when using tap water to clean boards assembled with no-clean flux, that had components hand soldered with water soluable flux?
Ask the Experts
Mysterious Drop In Production Yield
Mysterious Drop In Production Yield
A factory manufactured membrane switches. After installing exhaust fans the yield dropped. What was causing this decrease in production?
Mysteries of Science
Cartoon
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