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Knowledge, Vision & Wisdom Apr 2, 2015
Assembling  Boards with BGAs on Both Sides
What are the pros and cons of assembling circuit boards with BGA components on both sides? Should we first place BGAs on side one or side two? Does it make a difference?
Board Talk
Recommendations for PCB Surface Finish
We would like to order bare PCBs with a surface finish that would work with our current leaded process and lead-free solder process. What finish do you recommend?
Ask the Experts
Influence of Salt Residues on BGA Head in Pillow
Influence of Salt Residues on BGA Head in Pillow
In this paper, a series of experiments was carried over to know the influence of specifically NaCl on BGA wetting given Head in Pillow (HiP) as result.
Production Floor
IPC Course Calendar from Blackfox
BLACKFOX
Experience the Blackfox difference! Schedule your next IPC Training and Certification with Blackfox at one of our many certification sites, or have us come to you. Find the schedule and more here...
Blackfox Training Institute
 
Discover New Facts About Parylene Coating
Diamond MT
Learn about the parylene deposition process, the main benefits of parylene, and the most common applications of parylene in a new free fact sheet titled Parylene 101 from Diamond-MT.
Diamond MT
 
Preparation for Mitigating Tin Whiskers in Alternative Lead-Free Alloys
Preparation for Mitigating Tin Whiskers in Alternative Lead-Free Alloys
This work expands the understanding of the growth mechanism for tin whiskers and what mitigation strategies can be employed to reduce their propagation.
Analysis Lab
Networked Intelligence Reshapes Our World
Just as railroads, electricity, and automobiles reshaped the world in the 19th and 20th centuries, the 21st century is being reshaped by ubiquitous networks of cheap smart devices.
Technology Briefing
High Temperature Resistant Silicone System
Master Bond
With an extraordinarily fast non-corrosive cure, Master Bond MasterSil 711 is ideal for bonding, sealing, coating and formed-in-place gaskets applications, especially those involving electronics. It is extremely soft with superb flexibility and electrical insulation properties.
Master Bond
 
Stop Hand Assembling Your Prototypes
Advanced Assembly
We specialize in providing production quality on prototypes and low-volume orders. Save yourself time and have the experts handle it.
Advanced Assembly LLC
 
Stencil Printing Yield Improvements
Stencil Printing Yield Improvements
In this paper two methods were studied to improve solder paste release. A nano-scale hydrophobic, oleophobic and adhesion promoting coating.
Production Floor
Effect of Gold on Reliability of SnAgCu Joints
Little is known about the effect of gold content on the reliability of tin-silver-copper solder joints. This study determines the acceptable level of gold in SAC305 solder joints.
Analysis Lab
Juki
 
Advanced Assembly
 
Solder Balls During Rework
Solder Balls During Rework
During the rework of SMT components on conformal coated boards, we see solder balls appearing at neighboring components. How can this be eliminated?
Ask the Experts
Low Surface Energy Coatings Rewrite Area Ratio Rules
Paper focuses on the attributes that affect properties of solder paste release and introduces the effects of surface free energy that make up the stencil printing process.
Materials Tech
Static Prevention Products for Electronics
Ellsworth Adhesives
Ellsworth Adhesives provides Electronics Assembly, Rework, Repair, and Static Control products from ACL Staticide including cleaners, wipes, mats, and instrumentation.
Ellsworth Adhesives
 
Underfilling Using Continuous Path Motion
Asymtek
White paper for underfill applications and using continuous motion of the dispense head to avoid backtracking and improve units per hour by 27%. Download now.
Nordson ASYMTEK
 
Step Stencil Setup
When shifting from standard solder paste stencils to step stencils, should we change the pressure or attack angle? What about other settings?
Board Talk
The Challenges of LGA Server Socket Trends
The Challenges of LGA Server Socket Trends
This paper discusses the challenges and some potential solutions for sockets used in the high end server market.
Production Floor
Ultimate Solution for Placement Flexibility
JUKI
The Juki KE2080 flexible placement system successfully places the widest range of ICs, connectors, and unique shaped components on the market.
Juki Automation Systems, Inc.
 
Circuit Insight Deliver Results!
IPC
Introduce your technology in Circuit Insight’s bi-weekly newsletter & website to see how digital sponsorship advertising delivers results. Learn more...
Circuit Insight
 
         
Connecting a Trillion Battery-Free Devices
Connecting a Trillion Battery-Free Devices
Engineers have designed a new communication system that uses radio frequency signals as a power source to provide Internet connectivity to battery-free devices.
Technology Briefing
LPKF
Evaluation of New SMT Stencil Materials
Evaluation of New SMT Stencil Materials
This paper covers a study undertaken to quantify the effects of stencil materials on paste deposition in high volume production processes.
Analysis Lab
Next Generation of SMT Storage
Essemtec
Looking for a SMT storage system with user-adjustable shelves for up to 932 reels from 7 to 15"? Configure-Operate-Integrate! Click here to see Cubus in action...
Essemtec
Solder Mask Ghosting
Solder Mask Ghosting
Some here are convinced that we have solder mask ghosting on PCBs because our global suppliers are not curing the mask sufficiently.
Ask the Experts
Shadow Areas Cure with Ambient Moisture
Dymax Corporation
Conformal coatings for shadow areas on PCBs cure with light, then over time with secondary moisture. Guide explains benefits of light-cure technology!
DYMAX Corporation
The Frustrating Filter Fix
The Frustrating Filter Fix
A color film production facility was having a serious quality control problem and the building air filters were at the top of the suspect list.
Mysteries of Science
MicroLine 2000 Inline Laser Depaneling
LPKF Laser & Electronics
MicroLine 2000 is powered by UV lasers that make clean, burr-free cuts, to eliminate mechanical stress and limits thermal stress. Perfect for depaneling substrates from FR4 to ceramics.
LPKF Laser & Electronics
LPKF
Cartoon
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