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Knowledge, Vision & Wisdom Apr 28, 2015
Larger Stencil Apertures and Type 4 Paste
What is your experience with larger size apertures and type four solder paste and how does it affect solder joints for non-collapsible BGA and CGA type solder joints?
Board Talk
Pros and Cons of Cleaning No-clean
With today's newer chemistries, what are the pros and cons of cleaning circuit boards assembled using a no-clean process?
Ask the Experts
Characterization of Solder Defects in Package on Package
Characterization of Solder Defects in Package on Package
This paper is part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls.
Analysis Lab
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Fracture Prediction in Lead-Free Joints
Fracture Prediction in Lead-Free Joints
Study examines applicability of solder joint fracture initiation criteria that would permit the prediction of solder joint strength.
Analysis Lab
Electroplated Copper Filling of Through Holes
This paper discusses a through hole copper filling process for applications of high density interconnects and IC substrates.
Production Floor
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New Lithium Ion Battery - Outperforms by 300%
New Lithium Ion Battery - Outperforms by 300%
Researchers at the University of California Riverside have created a lithium ion battery that outperforms the current industry standard by 300 percent.
Technology Briefing
Rigid-Flex PCB Right the First Time - Without Paper Dolls
The biggest problem with designing rigid-flex hybrid PCBs is making sure everything will fold in the right way, while maintaining good flex-circuit stability and lifespan.
Production Floor
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Most Important Factors for Screen Printing
Most Important Factors for Screen Printing
Which of these factors is more critical to the solder printing process, solder paste volume or solder print alignment?
Ask the Experts
Printed Circuit Structures, the Evolution of Printed Circuit Boards
The PCS concept will allow passives, actives and even antennas to move out of the XY plane and into the XZ and YZ planes.
Materials Tech
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Does Copper Dissolution Impact Reliability?
Does Copper Dissolution Impact Reliability?
Results from this paper indicate concerns when severe copper dissolution occurs and shows signs of reduced reliability.
Analysis Lab
Component Moisture Question?
We mistakenly assembled circuit boards using BGA components that were not properly stored. Can we now rebake the assemblies?
Board Talk
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Could Molybdenite Become a Replacement for Silicon in Electronics?
Could Molybdenite Become a Replacement for Silicon in Electronics?
While graphene is most often touted as a replacement for silicon in electronics due to its extremely high conductivity, it is not the only two-dimensional material that could play such a role.
Technology Briefing
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Effect of Clamping Systems on Print Quality
Paper investigates the effect of top clamp and Y-snugger on a specially designed test stencil and production quality cell phone boards.
Production Floor
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Problems with Blow Holes
We are having problems with what appear to be blow holes. Could the cause be due to an improper ratio of the lead to the hole?
Ask the Experts
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Lead Poisoning - Was it from Wine?
Lead Poisoning - Was it from Wine?
A couple was found dead possibly from lead poisoning due to a pewter decanter containing wine. How could this happen?
Mysteries of Science
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