Electronics Assembly Knowledge, Vision & Wisdom
Feb 21, 2019
Moisture Barrier Bag Issues
Moisture Barrier Bag Issues
Moisture sensitive chip components have been exposed to the atmosphere beyond specification. Can re-packageding and sealed with desiccant help? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk
Backward Compatible Solder Joint Reliability Under Accelerated Conditions
Accelerated temperature cycling was used to assess the thermal fatigue reliability of a Pb free grid array package assembled.
Production Floor
Polyurethane Encapsulants - Enhanced Protection For LEDs in Challenging Environments
Assembling High Current Heavy Copper PCBs
Heat Flow in Reflow
Characteristics of EPIG Deposits for Fine Line Applications
Next-Gen, High-Temp Capable Underfill
3D MRS Sensor Technology for Challenging Measurement & Inspection
Solving Problems Before They Occur in PCB Design to Manufacture
Using Vias to Improve PCB Density
Ask the Experts
Exposed Copper Risk
We received many PCB's where a modification have been completed. The modification involved soldering a chip cap to an existing pad and adjacent surface ground layer. The modification is correct ...
Ask the Experts
The 5G Future Is Almost Here
The 5G Future Is Almost Here
Investments in 5G-compatible spectrum show economic promise of 5G wireless technology, slated to be rolled out in developed economies in 2019.
Technology Briefing
Overcome Nodules and Scratches on Wire Bondable Plating on PCBs
Manufacturing was improved to minimize nodules and scratches. Wire bonds were evaluated to determine the allowable size of nodules and scratches.
Analysis Lab
High and Matched Refractive Index Liquid Adhesives for Optical Device
High and Matched Refractive Index Liquid Adhesives for Optical Device
High and matched refractive index liquid adhesives are required in several electronics devices, where the liquid adhesives are in the optical pathway.
Materials Tech
Concentration Monitoring & Closed Loop Control
In this study, the Flowsensor or acoustic concentration measurement system was evaluated at the original beta site detailing 20 days of concentration monitoring data.
Production Floor
Ask the Experts
Components Falling Off During Reflow
Can excessive solder paste volume contribute to components falling off the bottom of the board during topside reflow?
Ask the Experts
Advances Autonomous Driving V2X Technologies
This paper looks at the state of development of V2X and provides a perspective on this and other technologies required to make autonomous driving a reality.
Analysis Lab
Do BGA Components Warp During Reflow?
Do BGA Components Warp During Reflow?
We recently reworked a BGA component and the corners all bridged. Can these components be removed and reused if we remove the warp?
Board Talk
Embedded Fibers Enhance Nano-Scale Interconnections
This paper introduces the use of embedded fibers in the interconnections of chip-to-chip and chip-to-package components.
Materials Tech
21st Century Textiles Make Life Better
21st Century Textiles Make Life Better
As we continue into Golden Age of the Fifth Techno-Economic Revolution, digital technology is poised to transform textiles in ways that were unimaginable.
Technology Briefing
Solder Column Attachment for Absorbing Large CTE Mismatch
Solder Column Attachment for Absorbing Large CTE Mismatch
Paper reviews commercially off-the-shelf solder columns available, including plain columns, copper wrapped columns and more.
Production Floor
Challenges for Bottom Termination Components
Complex components designed to keep up with the demand for electronics with expanding capabilities are challenging the performance of traditional solder pastes.
Analysis Lab
The Olympics Balloon Fiasco
The Olympics Balloon Fiasco
As the opening ceremonies for the 1984 Olympics were being broadcast reports of "lost signal" started coming into the control center.
Mysteries of Science
Cartoon
"Every man has his price. Let me scan your barcode."
Copyright © Randy Glasbergen