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Knowledge, Vision & Wisdom Apr 2, 2015
Assembling  Boards with BGAs on Both Sides
What are the pros and cons of assembling circuit boards with BGA components on both sides? Should we first place BGAs on side one or side two? Does it make a difference?
Board Talk
Recommendations for PCB Surface Finish
We would like to order bare PCBs with a surface finish that would work with our current leaded process and lead-free solder process. What finish do you recommend?
Ask the Experts
Influence of Salt Residues on BGA Head in Pillow
Influence of Salt Residues on BGA Head in Pillow
In this paper, a series of experiments was carried over to know the influence of specifically NaCl on BGA wetting given Head in Pillow (HiP) as result.
Production Floor
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Preparation for Mitigating Tin Whiskers in Alternative Lead-Free Alloys
Preparation for Mitigating Tin Whiskers in Alternative Lead-Free Alloys
This work expands the understanding of the growth mechanism for tin whiskers and what mitigation strategies can be employed to reduce their propagation.
Analysis Lab
Networked Intelligence Reshapes Our World
Just as railroads, electricity, and automobiles reshaped the world in the 19th and 20th centuries, the 21st century is being reshaped by ubiquitous networks of cheap smart devices.
Technology Briefing
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Stencil Printing Yield Improvements
Stencil Printing Yield Improvements
In this paper two methods were studied to improve solder paste release. A nano-scale hydrophobic, oleophobic and adhesion promoting coating.
Production Floor
Effect of Gold on Reliability of SnAgCu Joints
Little is known about the effect of gold content on the reliability of tin-silver-copper solder joints. This study determines the acceptable level of gold in SAC305 solder joints.
Analysis Lab
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Solder Balls During Rework
Solder Balls During Rework
During the rework of SMT components on conformal coated boards, we see solder balls appearing at neighboring components. How can this be eliminated?
Ask the Experts
Low Surface Energy Coatings Rewrite Area Ratio Rules
Paper focuses on the attributes that affect properties of solder paste release and introduces the effects of surface free energy that make up the stencil printing process.
Materials Tech
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Step Stencil Setup
When shifting from standard solder paste stencils to step stencils, should we change the pressure or attack angle? What about other settings?
Board Talk
The Challenges of LGA Server Socket Trends
The Challenges of LGA Server Socket Trends
This paper discusses the challenges and some potential solutions for sockets used in the high end server market.
Production Floor
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Connecting a Trillion Battery-Free Devices
Connecting a Trillion Battery-Free Devices
Engineers have designed a new communication system that uses radio frequency signals as a power source to provide Internet connectivity to battery-free devices.
Technology Briefing
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Evaluation of New SMT Stencil Materials
Evaluation of New SMT Stencil Materials
This paper covers a study undertaken to quantify the effects of stencil materials on paste deposition in high volume production processes.
Analysis Lab
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Solder Mask Ghosting
Solder Mask Ghosting
Some here are convinced that we have solder mask ghosting on PCBs because our global suppliers are not curing the mask sufficiently.
Ask the Experts
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The Frustrating Filter Fix
The Frustrating Filter Fix
A color film production facility was having a serious quality control problem and the building air filters were at the top of the suspect list.
Mysteries of Science
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