Electronics Assembly Knowledge, Vision & Wisdom
Feb 18, 2020
Acceptable Rate for Head in Pillow?
Acceptable Rate for Head in Pillow?
We have rejects in 2-3 per 15,000 PCBs that look like Head in Pillow. Should we tinker with the reflow process, or is this reject rate acceptable? Jim Hall and Phil Zarrow, The Assembly Brothers, share their experiences.
Board Talk
High Thermal, High Temperature Interconnects for Ultra High Power LEDs
For high performance applications, ultra-high power offers cost reduction through fewer LEDs, smaller PCBs, smaller heat sinks and lighter load bearing.
Production Floor
High-Density Micro-dispensing Solder and Adhesives
Automating Component Storage for Industry 4.0
Basics of MES
Eliminate Voids with Vacuum Reflow
Comparing Soldering Results of ENIG and EPIG Post Steam Exposure
Operation of a Vacuum Reflow Oven with Void Reduction Data
Periodic Pulse Plating of Mid-Aspect Ratio PCB's for Enhanced Productivity
6 Common Mistakes of BGA Rework
Ask the Experts
Cause of Cracking on SOT23 Components
We've recently encountered cracking with SOT-23 parts. The EMS contractor says the machines have been checked and there are no problems. The cracks occur only ...
Ask the Experts
Brain-Computer Interface
Brain-Computer Interface
Engineers recently reported that a brain-computer interface, using a form of artificial intelligence, can sense when its user is expecting a reward.
Technology Briefing
Effect of Encapsulation Materials on Tensile Stress
In this paper FEA modeling was performed to observe stress-strain behavior of solder joints during thermal expansion for various potting materials.
Analysis Lab
Surface Insulation Resistance of No-Clean Flux Residues
Surface Insulation Resistance of No-Clean Flux Residues
No-clean fluxes present great benefits, but the activity of the unwashed process residues must be tightly controlled in order to meet reliability standards.
Materials Tech
How to Set Up a Successful Blind Via Hole Fill DC Plating Process
Successful via fill plating requires a specific electrolyte; the copper concentration is as high 50 - 60 g/L copper with low sulfuric acid at 30 - 60 g/L.
Production Floor
Ask the Experts
Class 3 Cleaning Requirements
We recently received our first contract to assemble Class 3 circuit board assemblies. Are there any changes we need to make in our cleaning operations to switch ...
Ask the Experts
Reactivity of No-Clean Flux Trapped Under Bottom Terminated Components
As components reduce in size, the flux residue formation during the reflow soldering process is altered which can impact the reliability of the final assembly.
Analysis Lab
What is Ideal Humidity for Final Assembly?
What is Ideal Humidity for Final Assembly?
What is ideal humidity within a final assembly facility? No soldering involved. The facility is used for final box build.
Board Talk
Solder Paste Selection for Bottom Termination Components Attach
Two solder paste chemistries and several printing parameters were evaluated in order to achieve consistent solder paste deposition across the assembly.
Materials Tech
Four Challenges to Overcome For AI-Driven Customer Experience
Four Challenges to Overcome For AI-Driven Customer Experience
From improving customer experience, or cutting costs, virtual agents offer many benefits. Like any new technology, making the switch isn’t trivial.
Technology Briefing
Selecting Stencil Technologies to Optimize Print Performance
Research has been done to identify individual factors in stencil performance; this paper discusses the real-world application of numerous findings.
Production Floor
Component Density on Solder Joint Reliability Under Harsh Environment
In this study, degradation behavior of lead free solder joint was compared with mounted position and component density of vehicle engine control unit for excavator.
Analysis Lab
Cloudy Copper Plating Bath
Cloudy Copper Plating Bath
At a circuit shop near Los Angeles there was trouble with the copper plating line. Was an impurity getting in the tank and how?
Mysteries of Science
Cartoon
"We had a scheduling conflict, so tomorrow's meeting has been moved to yesterday."
Copyright © Randy Glasbergen