Electronics Assembly Knowledge, Vision & Wisdom
Sep 18, 2018
Best Method for Repairing Underfill Arrays?
Best Method for Repairing Underfill Arrays?
What is the best method for removing an SMT array package that has been under-filled and cured. Is there an industry approved method? The Assembly Brothers, Phil Zarrow and Jim Hall, answer this question.
Board Talk
Exposed Copper Risk
This PCB is used in an outside environment exposed to high humidity and temperatures extremes. Should we be concerned with corrosion? What should we do?
Ask the Experts
Say Goodbye To Stencils
Conformal Coatings that don't crack under pressure
Important Ways of Approaching Heat Management
PCB Prototyping for Smarties
Why Jobs Go On Hold
Case Studies Demonstrate Value-Added Services to Enable Client Success
Automated Visual Inspection and Correction (Demura) of OLED Displays
Implementing High-Volume, High-Performance Selective Soldering
Flowers of Sulfur Creep Corrosion Testing of Populated PCBs
Flowers of Sulfur Creep Corrosion Testing of Populated PCBs
Creep corrosion testing of printed circuit boards using a specially designed flowers of sulfur chamber has been pioneered by an iNEMI technical committee.
Production Floor
Zero-Emission Vehicles
Zero-Emission Vehicles
Zero-emission vehicles have taken two forks, toward battery electric cars like the Tesla and the toward fuel-cell-powered automobiles like the Toyota Mirai.
Technology Briefing
Fracture of Lead-Free Joints
The current study extended the quasi-static approach of [6,7] to treat solder joint fracture under higher strain-rate loading conditions.
Analysis Lab
Embedded Components: A Comparative Analysis of Reliability
Embedded Components: A Comparative Analysis of Reliability
Paper covers a series of comparative analyses, testing the reliability of standard SMT components vs their embedded counterparts.
Materials Tech
SN-CU-NI Composite Solder Paste High Temperature Use
Research on a prototype paste is being completed to improve reliability and survivability of PCB and SMT solder joints under extreme temperatures (< 500 Celsius).
Production Floor
Ask the Experts
Blow Holes and Disturbed Joints
We are finding many blow holes and disturbed joints after reflow. The process is non RoHS. What could be going wrong?
Ask the Experts
Microstructure and Reliability of Low Ag, Bi-Containing Solder Alloys
This paper investigates a number of low (or no) Silver (Ag), Bi-containing Pb-free alloys for performance in accelerated thermal cycling (ATC).
Analysis Lab
Sticky Residue Under Low Clearance Parts
Sticky Residue Under Low Clearance Parts
We are finding a tacky substance under a large SMT component. Is this common when no-clean leaded solder paste is used with no clearance parts?
Board Talk
Digitally Printed Battery Design
Battery operated devices have grown smaller while energy demands have increased. This paper provides a review of battery construction.
Materials Tech
Latest in Public-Key Encryption Chip
Latest in Public-Key Encryption Chip
Researchers have built a new chip, hardwired to perform public-key encryption, that consumes less power, uses less memory and executes faster.
Technology Briefing
6 Common Mistakes of BGA Rework
6 Common Mistakes of BGA Rework
Discover the 6 most common mistakes in BGA rework and how you can avoid them.
Production Floor
Ask the Experts
Components Jumping Around During Reflow
We reflowed boards using a lead-free solder process and had components jumping around from their initial position. What could be causing this?
Ask the Experts
Was Sodium Causing Factory Fires?
Was Sodium Causing Factory Fires?
One summer a factory producing coloring dyes was experiencing many alarms signaling a fire. What was causing these fires?
Mysteries of Science
Cartoon
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