Electronics Assembly Knowledge, Vision & Wisdom
Oct 16, 2018
What is the Best Way to Clean Solder Stencils?
What is the Best Way to Clean Solder Stencils?
Every 4 hours we remove each solder paste stencil and wipe both sides using IPA lint free wipes and then blow drying. Is this the proper procedure? The Assembly Brothers, Jim Hall and Phil Zarrow, share their experiences.
Board Talk
Toe Fillet Requirements on Gull Wing Components
Is a toe fillet required on gull wing components? We have some gull wing components that have no toe fillet, but all other requirements are met.
Ask the Experts
Enabling IPX Level 7/8 PCB Waterproof Protection
Say Goodbye To Stencils
Conformal Coatings that don't crack under pressure
Important Ways of Approaching Heat Management
PCB Prototyping for Smarties
Why Jobs Go On Hold
Case Studies Demonstrate Value-Added Services to Enable Client Success
Automated Visual Inspection and Correction (Demura) of OLED Displays
Novel Pogo-Pin Socket Design for Automated Linearity Testing
Novel Pogo-Pin Socket Design for Automated Linearity Testing
A novel pogo-pin block array and corresponding motorized test socket has been designed to stimulate the MCM and acquire full functional test data.
Production Floor
Self-Driving Vehicles: From Prototypes to Commercial Success
Self-Driving Vehicles: From Prototypes to Commercial Success
From real estate and jobs to insurance and law enforcement, no digital application will have more far-reaching consequences than self-driving cars and trucks.
Technology Briefing
Method to Measure Intermetallic Layer Thickness
Lead Free has brought new materials and quality concerns to the industry. New methods to determine the quality of materials is needed.
Analysis Lab
RF Capacitor Material for Use in Printed Circuit Board
RF Capacitor Material for Use in Printed Circuit Board
A novel ceramic-functional-particle-filled polymer composite material has been developed for use either discrete elements on the PCBs.
Materials Tech
Jetting Solder Paste Opens Up New Possibilities
Today Jet Printing is no longer seen as a futuristic technology but it has proven itself and the technology is still gaining momentum.
Production Floor
Ask the Experts
What Causes Component Rotation During Reflow?
We are using a large 2 pin SMT inductor. During reflow soldering it rotates almost 30 degree. Why is this component rotating during reflow?
Ask the Experts
New Requirements for Sir Measurement
Flux residues can create interaction with solder resists and the component body. This paper discusses a new SIR measurement process.
Analysis Lab
A Review of Industry Terminology and Acronyms
A Review of Industry Terminology and Acronyms
What does the term BTC refer to? The Assembly Brothers talk about uniformity of terminology and the industry's acronyms.
Board Talk
Embedding Passive and Active Components: PCB Design and Fabrication
This paper focuses on six basic embedded component structure designs described in IPC-7092.
Materials Tech
Ultra-low Power Injectable Biosensors
Ultra-low Power Injectable Biosensors
Engineers have developed a miniature, ultra-low power injectable biosensor that could be used for continuous, long-term alcohol monitoring.
Technology Briefing
Stencil Printing Yield Improvements
Stencil Printing Yield Improvements
The wipe sequence, wipe frequency and wipe solvent and how these interact to provide solder paste printing yield improvement is studied.
Production Floor
Un-cleaned PCB Assemblies Potted
Our PCBs were soldered with a washable flux. The flux was not removed and the boards were potted with epoxy based resin. What can we expect?
Ask the Experts
Screen Print Mismatch
Screen Print Mismatch
At a printed circuit shop artwork on the finished sheets did not match up. What was causing this discrepancy.
Mysteries of Science
Cartoon
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