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Knowledge, Vision & Wisdom Feb 26, 2015
3D Printing Circuit Board Assemblies
One of the most promising commercial technologies of the decade is "additive manufacturing." Recently, printers have advanced to the point that they can even print sensors and electronic components on 2-D and 3-D substrates.
Technology Briefing
Flux Residue Causing Test Issues
Having issues with flux residues impacting in-circuit and functional test causing incomplete readings on connector pins.
Ask the Experts
Lead-free Solder Contamination Concern
Lead-free Solder Contamination Concern
Can thermocouples attached to a circuit board with high temperature solder contaminate a lead-free solder wave?
Board Talk
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Acoustic Micro Imaging Analysis for 3D Packages
This paper will present a review of AMI methods that are applicable to analyses of 3D devices and show example applications.
Analysis Lab
What's Going On With Nanomaterials?
What's Going On With Nanomaterials?
We're rapidly approaching critical mass for commercialization of nanomaterials. Where does this technology stand? What are the implications? We'll show you.
Technology Briefing
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Challenges of Package on Package Devices
Challenges of Package on Package Devices
Paper outlines processes associated with soldering stacked packages using dip flux and dip solder paste designed to overcome incidence of package warp.
Materials Tech
Impact of Low Silver Paste on Area Array Joint Quality
This paper provides test data and analysis to "fill in the gaps" concerning the implementation for a wide variety of lead-free solder alloys.
Production Floor
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Lifted Leads on QFP Components
Lifted Leads on QFP Components
After placement and reflow, we are having a random lifted lead problem on some QFP's. Is a 1% fall out rate normal? What might be the cause?
Ask the Experts
Comparison of Solder Paste Residues
Paper assesses the reliability of several lead-free, no clean paste residues after vapor phase reflow in comparison to convection reflow.
Analysis Lab
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Solder Pallets With Titanium Inserts - Yes/No?
Our pallet manufacturer recommends titanium inserts to allow larger apertures near closely spaced surface mount components. These inserts are expensive. Are they worth it?
Board Talk
Pad Cratering Evaluation of PCBs
Pad Cratering Evaluation of PCBs
This paper reviews major publications and research reports with regard to pad cratering on various PCB materials.
Materials Tech
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Alternative to Dead Bug Rework
Alternative to Dead Bug Rework
Dead bugging is when you add components to a circuit board upside-down and run jumper wires to complete the circuits. Here's an alternative.
Production Floor
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Design for Assembly of 01005 Components
Design for Assembly of 01005 Components
Paper covers stencil types, aperture designs, pad layouts and process settings to achieve high-yield assembly for 01005 components.
Materials Tech
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What Is the Ideal Humidity for PCB Assembly?
What Is the Ideal Humidity for PCB Assembly?
How would the temperature and humidity differing from the recommended affect the solderability of circuit board assemblies?
Ask the Experts
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Process Change Causes Spots
Process Change Causes Spots
After implementing line improvements, tiny bright spots appeared on the surface of newly made circuit boards. What was the cause?
Mysteries of Science
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"Please moan into the phone. A nurse will determine if you are too sick to work today or just faking it."
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