Electronics Assembly Knowledge, Vision & Wisdom
Jan 22, 2019
Causes of Blowholes
Causes of Blowholes
Are old components such as resistors and circuit breakers more likely to cause blowholes during wave soldering compared to newer components? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this question.
Board Talk
Cleanliness Testing
What are the latest techniques/methods for testing the cleanliness of an assembled PCB after going through our in-house cleaning process?
Ask the Experts
Characteristics of EPIG Deposits for Fine Line Applications
Next-Gen, High-Temp Capable Underfill
Extending MRS Sensor Technology to Address Challenging Applications
Solving Problems Before They Occur in PCB Design to Manufacture
Using Vias to Improve PCB Density
Improving Quality with Automatic Solder Nozzle Tinning
Enabling IPX Level 7/8 PCB Waterproof Protection
Important Ways of Approaching Heat Management
Solder Joint Reliability on Mixed Ball Grid Array Solder Joints
Solder Joint Reliability on Mixed Ball Grid Array Solder Joints
Due to the decreasing size of consumer electronics, ultrathin flip chip ball grid array packages are needed to with lower z-heights for slimmer form factors.
Production Floor
The Brave New World Comes to California
The Brave New World Comes to California
Technology has been a major force, but the current surge is unprecedented. The past five years, five technology companies grew in value by $2.7 trillion.
Technology Briefing
Analysis of Laminate Material Properties for Correlation to Pad Cratering
In this study, two Pb-free-compatible laminates were tested, with one dicy-cure non-Pb-free-compatible as control.
Analysis Lab
Optimizing Insulated Metal Substrate Application
Optimizing Insulated Metal Substrate Application
The growth in the use of insulated metal substrates (IMS) in power electronics requires a focus on material and mechanical configuration for each application.
Materials Tech
Double Print Stencils Systems
It is useful in Assemblies that require mixed technologies; including SMT / Through Hole, SMT / Glue attach components, Packages requiring die attach / SMT assembly.
Production Floor
Ask the Experts
Hand Soldering at Low Temperature
Is there any effect on hand soldered circuit boards during winter where the board and atmosphere are at 0 degrees C and humidity at 10%?
Ask the Experts
Influence of Plating Quality on Reliability of Microvias
This paper addresses the influence of voids on reliability of microvias, as well as the interface delamination issue.
Analysis Lab
How To Verify Cleanliness After Rework and Prior to Re-coating?
How To Verify Cleanliness After Rework and Prior to Re-coating?
Rework on a coated assembly happens often. How do you verify cleanliness of the rework site prior to re-coating?
Board Talk
Material Selection and Optimization for TMV PoP
Materials selection and parameter optimization to better understand the critical factors with successful TMV PoP assembly are investigated.
Materials Tech
21st Century Textiles Make Life Better
21st Century Textiles Make Life Better
As we continue into Golden Age of the Fifth Techno-Economic Revolution, digital technology is poised to transform textiles in ways that were unimaginable.
Technology Briefing
Fluxless Die Attach by Activated Forming Gas
As demonstrated in the study, the fluxless and oxide-free technology using EA has made it possible to achieve a high quality die attach with zero or near-zero voids.
Production Floor
Ask the Experts
Bottom Side Chip Bonding
When should we use adhesive to bond SMT components to the bottom side of a double sided PWA before going thru reflow soldering?
Ask the Experts
The Disappearing Ink
The Disappearing Ink
UV lamps were bleaching out the blue color so that a new ink looked like a clear coating. Why didn't this happen in the lab?
Mysteries of Science
Cartoon
"You're getting pretty good at this stress management thing."
Copyright © Randy Glasbergen