Electronics Assembly Knowledge, Vision & Wisdom
Nov 14, 2019
Suggested Stencil Wipe Frequency?
Suggested Stencil Wipe Frequency?
How do we determine what is the best under stencil wipe frequency? As always, the Assembly Brothers Phil Zarrow and Jim Hall, Pick and Place, give a review.
Board Talk
Characterization of SIP Assembly and Reliability Under Thermal Cycles
This paper presents assembly challenges and reliability evaluation of Three-Dimensional Through- Mold Via and System in Package in fine pitch ball grid arrays.
Production Floor
Reliable Novel Nickel-Free Surface Finish Solution for High-Frequency PCB Applications
Selective Soldering Solutions for High Thermal Mass & Fine-Pitch Components
A Novel ENIG Surface Finish for Robust Solder Joints
Improve Performance & Reliability of LED Systems With Protection Materials
Differences Between Through-Hole and Surface-Mount
Automating the Incoming Materials Process
Void-Free and Worry-Free
USB Connection Testing
Ask the Experts
Through Hole Connector Solder Joint Hole Fill
When looking at IPC610D in relation to through hole connectors and Class III level soldering. What is the recommended inspection method to ensure the 75% ...
Ask the Experts
The Sino-American War for 5G Dominance
The Sino-American War for 5G Dominance
Chinese telecom giants Huawei and ZTE dominate the 5G generation of wireless technology. Primacy in wireless is a key goal of Beijing’s.
Technology Briefing
Advance Board Level Modeling Wafer Level Packages
In this paper it is determined that the effective flexural modulus depends on the stackup and it often does not correlate with the effective tensile modulus.
Analysis Lab
Effects of Mixing Solder Sphere Alloys with Bismuth-Based Pastes
Effects of Mixing Solder Sphere Alloys with Bismuth-Based Pastes
In this paper, the effect of mixing solder sphere alloys with Bi-based solder pastes on the component reliability in accelerated thermal cycling is studied.
Materials Tech
Development of a Robust 03015 Process
This paper reviews major steps considered and taken for the development of a robust 03015 process. It focuses on the activities for the solder paste print process.
Production Floor
Ask the Experts
Challenging Cleaning Problem
We are designing an ECG monitor that uses an embedded phone-modem LGA module. This phone modem is shielded, however, it is not hermetically sealed. The manufacturer ...
Ask the Experts
Additive Manufacturing-Enabled Wireless Flexible Hybrid Electronics
This paper reports an ensemble of strategies for the successful miniaturization of EEG in a fully-flexible, wearable and wireless platform.
Analysis Lab
When To Use Adhesive To Bond SMT Components
When To Use Adhesive To Bond SMT Components
When should we use adhesive to bond SMT components to the bottom-side of a double-sided PWA before going through reflow soldering?
Board Talk
pH neutral Cleaning Agents - Market Expectation & Field Performance
Study reviews performance of pH neutral cleaning agents compared to alkaline cleaning alternatives and includes field data.
Materials Tech
Flying Cars Surge Forward
Flying Cars Surge Forward
After decades of failed projects, a new class of vehicles is finally emerging that could transform the way people and cargo are moved within and between cities.
Technology Briefing
Implementing Robust Bead Probe Test Processes
This paper defines a process window for the implementation of bead probe and similar bump technology that is compatible with standard Pb-free assembly.
Production Floor
Challenges for Bottom Termination Components
Complex components designed to keep up with the demand for electronics with expanding capabilities are challenging the performance of traditional solder pastes.
Analysis Lab
Corrupted Magnetic Tracking System
Corrupted Magnetic Tracking System
Magnetic traveler cards were being used to track information. Suddenly one section was unable to read the data. What was the cause?
Mysteries of Science
Cartoon
"We need to make some big changes around here. The kind of changes where many decisions are made but nothing actually happens."
Copyright © Randy Glasbergen