Technical Papers
Conformal Coating on PCBAs
Openair-Plasma for Display and HMI Manufacturing
ISO Standards and the Case for Cost-Effective Delivery of Quality
Solder Bridging and Other Common Soldering Problems
Improve SMT Yield and Reduce Defects
High Power Density Aerospace Solution
Eliminating Ni Corrosion in ENIG/ENEPIG Using RAIG
A Novel Method to Improve the Adhesion of Conformal Coatings
MORE TECHNICAL PAPERS
Ask the Experts
HASL vs. Immersion Gold
Very Low Temp PCBs
Looking for Long-term Component Storage Options
Baking After Cleaning Hand Placed Parts
Conformal Coating Recommendation
Burned Chip Repair
BGA Component Grounding Problem
What is the IPC Definition of Uncommonly Harsh?
MORE ASK THE EXPERTS
Latest Industry News
Smartphone Shipments to Plummet 11.9% in 2020
PC market to dip 7% this year
Alternate Roads to Flexible Electronics
Huawei hid business operation in Iran after Reuters reported links to CFO
Global Distributor Group Tackles Tariff Inefficiencies
How to Set Boundaries While Working Remotely
Apple must face U.S. shareholder lawsuit over CEO's iPhone, China comments
The AI-Based Competitive Revolution
MORE INDUSTRY NEWS
Jun 4, 2020
How Effective Is Nano Coating On Stencils?
How Effective Is Nano Coating On Stencils?
With nano coatings on stencils evolving, what is the best method to measure the thickness? How do you know if the coating degrades over time? The Assembly Brothers, Jim Hall and Phil Zarrow, answer these questions.
Board Talk
Innovative Panel Plating for Heterogeneous Integration
This paper will show that improvements in feature density, deposition uniformity and void free via filling can be achieved in large panel processing.
Production Floor
Lag-Free Wireless Connections
Lag-Free Wireless Connections
Researchers are proposing a system that would use underutilized resources in a wireless channel to create opportunities for lag-free connections.
Technology Briefing
A Method to Investigate PCB Supplier Rework Processes and Best Practices
This paper investigates PCB supplier rework processes, including identifying rework procedures that have potential implications to PCB functionality.
Analysis Lab
The Effects of PCB Fabrication on High-Frequency Electrical Performance
The Effects of PCB Fabrication on High-Frequency Electrical Performance
Achieving optimum high-frequency PCB performance is not only the best possible PCB material, but can be impacted by PCB fabrication practices.
Materials Tech
Aerosol Jet Printing of Conductive Epoxy for 3D
The authors describe efforts to improve both the dispensability of small volume dots and correspondingly improve the consistency and conductivity of the dots.
Production Floor
EOS Exposure of Components in the Soldering Process
Examines the consequences of electrical overstress caused by electromagnetic interference on power lines and ground in the manufacturing environment.
Analysis Lab
What Causes Board Delamination?
What Causes Board Delamination?
We are experiencing delamination on printed circuit boards, is there a way to determine that this is caused by moisture or some other defect?
Board Talk
High Thermo-Mechanical Fatigue and Drop Shock Resistant Alloys
High-Ag, low-Ag: Which alloy fits best certain application? Here we present a report on the thermal and mechanical reliability of alloys.
Materials Tech
The Coming Battle for Arctic Resources
The Coming Battle for Arctic Resources
Secretary of State Pompeo set forth his “Northern Doctrine”, putting Russia and China on notice regarding militarizing the region and chastened Canada.
Technology Briefing
Filling of Microvias and Through Holes by Electrolytic Copper Plating
This paper describes the reasons for development and a roadmap of dimensions for copper filled through holes, microvias and other copper plated structures on PCBs.
Production Floor
NASA DOD Phase 2: Copper Dissolution Testing
This paper describes copper dissolution measurements of two lead-free solder alloys to better define allowable rework process windows.
Analysis Lab
The Day They Shut Down Intel
The Day They Shut Down Intel
Chipmaker Intel had just started up a new chip factory when something odd caused a shut down. What lead to this development?
Mysteries of Science
Hot Air BGA Rework Process Improvement with a Touchless Temperature- Dependent Live-Feedback Process
The goal of this paper is to share complex rework process improvements to review and consider how incorporating into their practice can provide benefit.
Production Floor
The AI-Based Competitive Revolution
The AI-Based Competitive Revolution
The Golden Age of the Techno-economic Revolution has been characterized by the rise of AI-based firms like Google, Facebook, Amazon.
Technology Briefing
Single Device Traceability in Assembly without ECID
The recent evolution of data analytics allows correlation analysis from wafer fab to wafer test to assembly and packaging to product level test and field performance.
Analysis Lab
Investigation of Copper Sinter Material for Die Attach
Investigation of Copper Sinter Material for Die Attach
3 copper powders were tested for their feasibility to use as die attach material for pressure sintering process without prior treatment with reducing agents.
Materials Tech
CGA Trends and Capabilities
The Column Grid Array (CGA) module is a high reliability JEDEC format package, with several options adaptable to end user needs.
Production Floor
Technology Corner
AOI Delivers Mission Critical Quality
Koh Young Technology Inc.
Peel-A-Way Removal Terminal Carriers
Advanced Interconnections Corp.
World-class Surface Modification Technologies
Aculon, Inc.
Selective Soldering Overview
Nordson SELECT
Atmospheric Plasma in Electronics Manufacturing
Plasmatreat GmbH
MORE TECHNOLOGY CORNER
Board Talk
How Effective Is Nano Coating On Stencils?
What Causes Board Delamination?
01005 Component Challenges and Bugs
Sticky Residue Under Low Clearance Parts
Soldering Relays Intrusively in Lead Free Process
Printing vs. Dispensing
Maximum Board Temperature During Tin-Lead
Is There a Spacing Spec for SMD Components?
MORE BOARD TALK
Comments
Soldering Relays Intrusively in Lead Free Process
PK does not mention how many zones his oven has. ...
Alan Woodford, NeoTech
Maximum Board Temperature During Tin-Lead
Disclaimer: I'm a design EE, not a manufacturing guy but ...
Alan Ritter, MtRitter.com, LLC
Connector Bowing During Reflow Process
I would guess as the board and the connector go ...
Alan Woodford, NeoTech
Connector Bowing During Reflow Process
Is it possible your PCB is guilty, and the connector ...
Alan Couchman, Process Sciences, Inc.
Long Term Component Storage
As Jim mentioned above moisture bags and baking components are ...
Neşe Gençtürk, X-Treme Series Auto Dry Cabinets
MORE COMMENTS
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