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Knowledge, Vision & Wisdom Mar 30, 2015
Problem Meeting Minimum Hole Fill During Wave Soldering
We are having problems achieving the minimum hole fill of 75% on electrolytic capacitors using our wave soldering. What do you suggest?
Board Talk
How Many Zones Needed for Lead-free Profile?
How many zones are required to run a lead-free profile? Does the number of zones dictate capability or do they only matter for throughput?
Ask the Experts
Meeting Future Stencil Printing Challenges with Ultrafine Powder Pastes
Meeting Future Stencil Printing Challenges with Ultrafine Powder Pastes
Paper provides a comparison of the transfer efficiency of different solder powder particle sizes with post reflow results in optimal and harsh conditions.
Materials Tech
A World of Reflow Soldering Solutions
Vitronics Soltec
Vitronics Soltec's reflow ovens provide unmatched ease of use. Esterline Technologies says their XPM3i reflow "is an engineer's dream come true!"

Vitronics Soltec
 
Why Rigid Flex? The reliability of your circuitry
Printed Circuits, Inc.
Rigid Flex are designed for aerospace, medical and military reliability. Flex assemblies reduce connector and reliability issues. Learn more...
Printed Circuits, Inc.
 
How Super Capacitors May Super Charge Electric Car Use
How Super Capacitors May Super Charge Electric Car Use
The charging duration of electric car batteries may be dramatically shortened with the use of super-capacitors based on innovative nano-materials.
Technology Briefing
Ideas for Identifying Counterfeit Components
Expert Bob Willis explains some nondestructive methods for identifying counterfeit components - before they go on your boards.
Analysis Lab
Circuit Insight Deliver Results!
IPC
Introduce your technology in Circuit Insight’s bi-weekly newsletter & website to see how digital sponsorship advertising delivers results. Learn more...
Circuit Insight
 
Employment opportunities at Hallmark Circuits
HallmarkCircuits
Hallmark Circuits, manufacturer of high technology circuit boards in San Diego area is expanding. Opportunities for Process Engineer, Planner, Cam Technician & Data Receipt Trainee. Click to learn more learn more.
Hallmark Circuits, a SOMACIS Company
 
3D Assembly Processes a Look at Today and Tomorrow
3D Assembly Processes a Look at Today and Tomorrow
This paper explores various technologies available today and some that are starting to appear and illustrates some key items for each technology.
Production Floor
3 Steps To Solder Paste Selection
This paper covers the most significant issues in solder paste selection to meet the goals of manufacturing.
Materials Tech
EPTAC
 
LPKF
 
Conformal Coating Over No-Clean Flux
We need to apply conformal coating to one circuit board assembly. Is it normally acceptable to apply conformal coating directly over circuit board assembled using no-clean flux?
Ask the Experts
Optimization to Prevent the Graping Effect
Optimization to Prevent the Graping Effect
This paper will discuss the specific challenge of the Graping Effect and the work that has been performed to mitigate this phenomenon.
Production Floor
Flux and Under-fill in a Single Material
Henkel
This breakthrough epoxy flux material combines flux function and under-fill protection in a single material.
Henkel Corporation
 
Discover New Facts About Parylene Coating
Diamond MT
Learn about the parylene deposition process, the main benefits of parylene, and the most common applications of parylene in a new free fact sheet titled Parylene 101 from Diamond-MT.
Diamond MT
 
Side Wall Wetting Induced Void Formation
Side Wall Wetting Induced Void Formation
In this study the authors examine the mechanism of void formation in the processing of microbumps.
Analysis Lab
Printable Materials for Electronic Packaging
This paper reports on novel printable materials that have the potential to surpass conventional materials.
Materials Tech
eSurface is the Game Changer for the PCB Industry
eSurface
eSurface enables you to: • Achieve Ultra-fine capability < 1/1 L/S; • Dramatically improve yields; • Reduce steps & cycle times; • Maximize efficiency
eSurface
 
2015 IPC Certification Training Schedule
EPTAC
IPC Certification training schedule, new classes, new locations and all the expert training and support you need and expect. Learn more.
EPTAC
 
         
I Hate to Disappoint
I Hate to Disappoint
Individuals who are highly prone to feel guilty for disappointing their co-workers are among the most ethical and hard-working team personnel.
Technology Briefing
Circuit Technology Center
3D IC Integration Technology Development in China
3D IC Integration Technology Development in China
China's semiconductor foundry and microelectronic packaging industries are embracing the move to join 3D IC integration. This paper provides an overview of the recent progress.
Production Floor
Surface Mount Pad Repair - Fast and Reliable
CTC
Surface mount and BGA pad repair are routine operations at Circuit Technology Center. Learn how we can do it reliably.
Circuit Technology Center
Is Baking Required After Aqueous Cleaning?
Is Baking Required After Aqueous Cleaning?
Do assembled circuit board assemblies need to be baked after routine aqueous cleaning?
Ask the Experts
Thermally Conductive, B-Staged Epoxy Film
Master Bond
Master Bond FLM36 is a flexibilized epoxy that delivers high temperature resistance, thermal conductivity, electrical insulation and withstands rigorous thermal cycling. As a film it offers uniform bond line thickness and limited squeeze out.
Master Bond
The Case of the Falling Floor
The Case of the Falling Floor
The line was running when suddenly there was a loud thud. The floor, supporting a vertical beam had given way. What happened?
Mysteries of Science
MicroLine 2000 Inline Laser Depaneling
LPKF Laser & Electronics
MicroLine 2000 is powered by UV lasers that make clean, burr-free cuts, to eliminate mechanical stress and limits thermal stress. Perfect for depaneling substrates from FR4 to ceramics.
LPKF Laser & Electronics
Printed Circuit Inc.
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