Electronics Assembly Knowledge, Vision & Wisdom
Mar 14, 2019
Should We Invest in 3D Optical Inspection?
Should We Invest in 3D Optical Inspection?
We are correcting many solder defects. The search for defects is taking too long. Should we go with a 3D AOI system to save inspection time? The Assembly Brothers, Jim Hall and Phil Zarrow, share their experiences and insight.
Board Talk
Testing of Soldering Materials vs. Soldering Processes
This paper discusses Surface Insulation Resistance (SIR) data of solder pastes and other soldering materials on IPCB-52 coupons.
Production Floor
Oven vs Product Profiling
Keeping Counterfeit Components Out of Supply Chain
3 Ways to Increase Plasma Uniformity
Polyurethane Encapsulants - Enhanced Protection For LEDs in Challenging Environments
Assembling High Current Heavy Copper PCBs
Heat Flow in Reflow
Characteristics of EPIG Deposits for Fine Line Applications
Next-Gen, High-Temp Capable Underfill
Ask the Experts
SMT Target Component Placement
I'm having trouble obtaining accurate placement for an IR SMT LED on a PCB during the SMT soldering process. Despite ...
Ask the Experts
The 5G Future Is Almost Here
The 5G Future Is Almost Here
Investments in 5G-compatible spectrum show economic promise of 5G wireless technology, slated to be rolled out in developed economies in 2019.
Technology Briefing
The Effects of Solder Powder Size on Solder Paste Performance
Testing was conducted to measure each of these solders paste performance attributes for solder powders in both water-soluble and no clean solder pastes.
Analysis Lab
New-Generation, Low-Temperature Lead-Free Solder
New-Generation, Low-Temperature Lead-Free Solder
In this paper, the roles of additive and bismuth content will be discussed. Eutectic SnBi and three newly designed SnBi-based alloys were experimented upon.
Materials Tech
The Development of a 0.3 mm Pitch CSP Assembly Process
A major study looks at different aspects of the stencil printing process and their impact upon the assembly and reliability of CSP components.
Production Floor
Ask the Experts
Manual or Automated Assembly?
We are a new start-up assembling wireless sensors. All assembly is now manual, we have no automation. We are at a point where we are experiencing large reject rates due to hand ...
Ask the Experts
Pad Cratering Susceptibility Testing with Acoustic Emission
In this study, 6 laminates were subjected to four-point bend testing. Acoustic emission sensors were used to monitor pad cratering during the bend test.
Analysis Lab
Issues With BGA Rework Residue
Issues With BGA Rework Residue
After BGA rework there is an outline of residue on around the pads. Is it necessary to remove this residue to reinstall a new BGA?
Board Talk
Reliability Improvements by the Creation of Intermetallic Connections
The possibilities to combine small and large passive components, and new devices for active components with an increase in reliability is discussed.
Materials Tech
3D Stretchable Circuits
3D Stretchable Circuits
A team has built a stretchable "electronic patch," which can be worn on the skin and used to wirelessly monitor physical and electrical signals.
Technology Briefing
Computed Tomography on Electronic Components
The combination of improved computers, detectors, and new software has allowed the addition of a fourth dimension to a computed tomography data set.
Production Floor
Effect of Assembly Pitch and Distance on Solder Joint Thermal Cycling Life
Cycles-to-failure versus Distance to Neutral Point (DNP) data for SnPb and lead-free assemblies under Accelerated Thermal Cycling (ATC) conditions are observed.
Analysis Lab
The Epoxy Mixing Mix-up
The Epoxy Mixing Mix-up
Epoxy resin batches were a little off target. Workers were rotated and the problem disappeared. Were employee causing this problem?
Mysteries of Science
Cartoon
"I have plenty of management experience. I spent 18 years telling my parents what to do."
Copyright © Randy Glasbergen