Electronics Assembly Knowledge, Vision & Wisdom
Jun 22, 2017
Is There a Test for Black Pad?
Is There a Test for Black Pad?
We have identified black-pad and are concerned it may extend to assembled PCBs. Is there a nondestructive test that can be performed on assemblies? The Assembly Brothers, Jim Hall and Phil Zarrow, use their expertise in the industry to answer this question.
Board Talk
Reworked BGA Bridging at the Corners
Recently reworked BGA components are bridged at the corners. What caused the corners of the BGA component to bridge and how can we prevent it?
Ask the Experts
Returning to Basics in the SMT Screen Printing Process
Returning to Basics in the SMT Screen Printing Process
This paper showcases a new stencil process that was discovered by reverting to the basics.
Production Floor
Harnessing AI-Driven Growth
Harnessing AI-Driven Growth
As AI transforms one industry after another, it will spur economic growth throughout the world, but particularly in the United States.
Technology Briefing
BGA Reballing and Influence on Ball Shear Strength
This paper focuses on the effect of various parameters that are used to reball a BGA component and their effect on the overall shear strength.
Analysis Lab
Alternative Solvent with Low Global Warming Potential
Alternative Solvent with Low Global Warming Potential
A new low global warming potential fluorinated solvent for precision cleaning is discussed. The paper covers the properties and performance.
Materials Tech
Minimizing Voiding in QFN Packages
This paper quantifies the preform requirements and process adjustments needed to minimize voiding in QFN packages.
Production Floor
Ask the Experts
Estimating Failure Rate During Rework
Is there a way to estimate the potential failure rate introduced by hand rework of one SMT part that involves de-soldering and soldering a new part?
Ask the Experts
Reliability of Lead Free Solder Joints in Ball Grid Array Packages
This paper investigates the impact of isothermal aging on the long-term reliability of lead-free solder joints.
Analysis Lab
Can a CTE Mismatch Cause Reliability Problems?
Can a CTE Mismatch Cause Reliability Problems?
Does usage of BGAs, QFNs or SONs have an increased risk for reliability of solder joints due to the CTE mismatch with the base board material FR4?
Board Talk
Lead-free Development in Server Applications
Paper examines the effects of varying surface finishes, process parameters and interactions that affect solder attach attributes.
Materials Tech
The Declining Cost of Distance
The Declining Cost of Distance
The forces that propelled the growth of cities and discouraged businesses from locating far from urban centers is now being reversed by the digital technologies.
Technology Briefing
Press Fit  Roadmap for High Performance Process
Press Fit Roadmap for High Performance Process
Paper investigates the roadmap for press fit technology, with attention to placement and insertion, inspection, repair, pin design, challenges and solutions.
Production Floor
Ask the Experts
LED Component Shift During Reflow
What can be the root cause of SMT LED Component Shift during reflow?
Ask the Experts
The Day They Shut Down Intel
The Day They Shut Down Intel
Chipmaker Intel had just started up a new chip factory when something odd caused a shut down. What lead to this development?
Mysteries of Science
Cartoon
"There's going to be a lot of finger pointing around here and I'd like to put you in charge. You have exquisite hands."
Copyright © Randy Glasbergen
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