Electronics Assembly Knowledge, Vision & Wisdom
Apr 23, 2019
Suggested Stencil Wipe Frequency?
Suggested Stencil Wipe Frequency?
How do we determine what is the best under stencil wipe frequency? As always, the Assembly Brothers Phil Zarrow and Jim Hall, Pick and Place, give a review.
Board Talk
Investigation into Lead-Free Low Silver Solder Wire for Electronics
This paper show results using a lead-free solder rework wire alloy in terms of wetting, reduced solder iron tip erosion, reduced IMC growth and reliability.
Production Floor
Dispelling Dry Storage Myths
Strategies For Ensuring a Smooth Assembly Process
New Generation of Conformal Coatings for Challenging Operating Environments
US Army & nScrypt Direct Digitally Manufacture 3D Printed Circuit Structure
Handling Risk Mitigation in Hand Soldering
Oven vs Product Profiling
Keeping Counterfeit Components Out of Supply Chain
3 Ways to Increase Plasma Uniformity
Ask the Experts
How Many Fiducials Per Solder Paste Stencil?
We manufacture solder paste stencils for a variety of customers. We have seen as many as 180 fiducials per stencil with a step and repeat. Is this excessive? How many fiducials are recommended for a typical solder paste stencil?
Ask the Experts
Securing the Supply Chain of Strategic Minerals
Securing the Supply Chain of Strategic Minerals
A study focuses on 23 "mineral commodity groups" classified as critical based on the likelihood of supply interruption and the cost of such an interruption.
Technology Briefing
Fatigue and Shear Properties of High Reliable Solder Joints
In this study, individual high-reliability SnAgCu based solder joints (Innolot, MaxRel, Ecolloy) were tested to investigate their shear and fatigue properties.
Analysis Lab
Effects of Mixing Solder Sphere Alloys with Bismuth-Based Pastes
Effects of Mixing Solder Sphere Alloys with Bismuth-Based Pastes
In this paper, the effect of mixing solder sphere alloys with Bi-based solder pastes on the component reliability in accelerated thermal cycling is studied.
Materials Tech
Fill the Void II: An Investigation into Methods of Reducing Voiding
This paper is a continuation of previous work on voiding. The voiding results are summarized and recommendations made for reduction of voiding.
Production Floor
Ask the Experts
QFN Open Solder Joints
We are experiencing opens on assembled QFN components at a rate of approx 9%. This component has 2 rows of pads and the failure only appears in rows near the component center. See the yellow area ...
Ask the Experts
Effect of Fine Lead-Free Solder Powder on the Reflow Property Pastes
This paper evaluates the effect of particle size distribution and oxidation on the reflow performance of solder paste.
Analysis Lab
PCBA Inspection Concerns
PCBA Inspection Concerns
We inspect PCBAs on a relatively hard ESD mat. Will moving the PCBs on the mat will scratch and stress the soldered components on the bottom side?
Board Talk
Rosin vs. Non-Rosin Wave Flux? - More Reliable Electronic Assemblies
This paper focuses on the surface insulation resistance (SIR) differences between rosin-containing and rosin-free flux formulations.
Materials Tech
Ultra-Thin Artificial Retina
Ultra-Thin Artificial Retina
Researchers have developed the world's first ultrathin artificial retina that could improve on existing implantable visualization technology for the blind.
Technology Briefing
Challenges on ENEPIG Finished PCBs
Challenges on ENEPIG Finished PCBs
Through extensive investigation, using 8D and Kepner-Tregoe problem solving methods, solutions were discovered in the majority of cases.
Production Floor
3D Printed Electronics for Printed Circuit Structures
This paper shows working demonstrations of printed circuit structures, the obstacles, and the potential future of 3D printed electronics.
Analysis Lab
Resistor Values off the Mark
Resistor Values off the Mark
Suddenly values for screened resistors on ceramic circuits were way too high. What caused the sudden high values?
Mysteries of Science
Cartoon
"We rarely back up our data. We prefer not to keep a permanent record of everything that goes wrong around here."
Copyright © Randy Glasbergen