Electronics Assembly Knowledge, Vision & Wisdom
Mar 21, 2019
Processing Circuit Boards with BGAs On Both Sides
Processing Circuit Boards with BGAs On Both Sides
What is the best way to process a 30 mil circuit board assembly that has micro BGAs that need to be soldered to both sides? The Assembly Brothers, Jim Hall and Phil Zarrow, answer this question.
Board Talk
Choosing the Right Stencil Options
Quality and yield are directly linked to the solder printing process. A constant paste depot is critical to a stable soldering process.
Production Floor
Oven vs Product Profiling
Keeping Counterfeit Components Out of Supply Chain
3 Ways to Increase Plasma Uniformity
Polyurethane Encapsulants - Enhanced Protection For LEDs in Challenging Environments
Assembling High Current Heavy Copper PCBs
Heat Flow in Reflow
Characteristics of EPIG Deposits for Fine Line Applications
Next-Gen, High-Temp Capable Underfill
Ask the Experts
MELF Component Misalignment
We have glued SMD MELF components that are misaligned after reflow. But all the chip components are correctly aligned. In testing if we eliminate the gluing of the MELF components ...
Ask the Experts
Ultra-low Power Injectable Biosensors
Ultra-low Power Injectable Biosensors
Engineers have developed a miniature, ultra-low power injectable biosensor that could be used for continuous, long-term alcohol monitoring.
Technology Briefing
Effect of Package Warpage and Composite CTE on Failure Modes
This paper gives examples of the BLR TC failure modes and locations of package test vehicles designed to correlate failure modes.
Analysis Lab
Investigation of Copper Sinter Material for Die Attach
Investigation of Copper Sinter Material for Die Attach
3 different copper powders were tested for their feasibility to use as die attach material for pressure sintering process without prior treatment with reducing agents such as hydrogen or formic acid.
Materials Tech
Investigation into Printing Miniaturized Devices
Paper investigates a solution to ensure a high yield process where fine pitch devices can be printed alongside traditional larger footprint devices.
Production Floor
Ask the Experts
BGA BAll Sheer Testing
We soldered a lead-free 548-ball BGA. After reflow, we mechanically pulled the BGA component off the circuit board surface. See the areas of separation. In some areas the pad was ripped ...
Ask the Experts
Evaluation of 13 Solder Pastes for High Rel
The authors undertook this project to choose the most robust solder paste to support the manufacture of complex high reliability products assembled at a of locations.
Analysis Lab
What is the Life Span of a Profile Board?
What is the Life Span of a Profile Board?
What is the life span of a profile board? How many times can I use one test board to profile a reflow oven before throwing it away and why?
Board Talk
Insulation Resistance of Dielectric Materials
This investigation measures the leakage within internal PCB layers during exposure of various specimens to a controlled ground-based test environment.
Materials Tech
3D Printed Food
3D Printed Food
Researchers have built a platform that uses 3D printing to create food microstructures that allow food texture and body absorption to be customized.
Technology Briefing
Solder Paste Stencil Design for Optimal QFN Reliability
In this study, the volume of solder used in assembly of QFNs was varied to investigate the relationship between standoff height and thermal cycle life.
Production Floor
3D Digital Stitching Imagery is Revolutionizing Failure Analysis and Product Analysis
This presentation will outline the different types of 3D imagery and how they have found uses in various applications.
Analysis Lab
Flying Saucer Over The Factory
Flying Saucer Over The Factory
At a new circuit factory an employee heard a thud and saw a bright metal dome-shaped object falling from the sky. Where did it come from?
Mysteries of Science
Cartoon
"We're looking for someone who isn't afraid to fire people. You may be overqualified."
Copyright © Randy Glasbergen