Electronics Assembly Knowledge, Vision & Wisdom
Jul 18, 2019
Step Stencil Setup
Step Stencil Setup
When shifting from standard solder paste stencils to step stencils, should we change the pressure or attack angle? Phil Zarrow and Jim Hall, The Assembly Brothers, answer this question and share their own experiences.
Board Talk
Warpage of Flexible-Board Assemblies with BGAs During Reflow and Post-Assembly
Failure in solder interconnects is a leading cause of reliability failure. Complexity of electronic assembly requires these lead-free interconnects to be reliable.
Production Floor
Assessing the Impact of Lean on PCB Manufacturing
How To Get The Best Thermal Profile
Meter-Mix Dispensing Basics
Cleaning Process Compatibility with PCB Surface Finishes
High Reliability Alloy for Auto Apps
Dispelling Dry Storage Myths
Strategies For Ensuring a Smooth Assembly Process
New Generation of Conformal Coatings for Challenging Operating Environments
Ask the Experts
Suggested Limit for PCBA Heat Cycles
What is the suggested limit for the total number heating cycles that can be done on one PCB assembly? Our PCBs contain BGAs, leadless components and large fine 
Ask the Experts
Laser Sensors Detect 3D Objects
Laser Sensors Detect 3D Objects
A method, using two inexpensive cameras on either side of a car windshield, can detect objects with more accuracy and a fraction of the cost is discussed.
Technology Briefing
Via-In Pad Plated Over (VIPPO) Design Considerations
This work has evaluates BGA packaging and PCB design parameters to characterize their influence on double-reflow solder separation failure mode for mixed VIPPO BGA pad footprints.
Analysis Lab
Solder Paste Selection for Bottom Termination Components Attach
Solder Paste Selection for Bottom Termination Components Attach
Two solder paste chemistries and several printing parameters were evaluated in order to achieve consistent solder paste deposition across the assembly.
Materials Tech
An Introduction to the Process of Printed Electronics
While following best practices, researchers aim to create processes that ramp up the scale of production for simple circuits and integrated conductive structures.
Production Floor
Ask the Experts
Test Probe Problems After Pin-In-Paste
We are having test probe contact issues with our Pin-In-Paste process. The root cause being the flux residue on the surface of the solder joint. Test probes can't penetrate ...
Ask the Experts
Innovative BGA Defect Detection Method for Transient Discontinuity
This paper summarized the development of this innovative in-situ, real time methodology, which is capable of detecting BGA transient discontinuity.
Analysis Lab
What is Ideal Humidity for Final Assembly?
What is Ideal Humidity for Final Assembly?
What is ideal humidity within a final assembly facility? No soldering involved. The facility is used for final box build.
Board Talk
Surface Insulation Resistance of No-Clean Flux Residues
No-clean fluxes present great benefits, but the activity of the unwashed process residues must be tightly controlled in order to meet reliability standards.
Materials Tech
Securing the Supply Chain of Strategic Minerals
Securing the Supply Chain of Strategic Minerals
A study focuses on 23 "mineral commodity groups" classified as critical based on the likelihood of supply interruption and the cost of such an interruption.
Technology Briefing
Rework Challenges for Leading Edge Components BGA, QFN and LED
Rework Challenges for Leading Edge Components BGA, QFN and LED
This paper outlines rework processes for many challenging components including BGA, QFN/BTC, and LED packages.
Production Floor
Void Reduction in Reflow Soldering Processes by Sweep Stimulation
The insights of the feasibility study were the basis for the integration of the voidless technique into an industrial production process.
Analysis Lab
Screen Print Mismatch
Screen Print Mismatch
At a printed circuit shop artwork on the finished sheets did not match up. What was causing this discrepancy.
Mysteries of Science
Cartoon
"It's your attitude, not your aptitude that determines your altitude. That's the philosophy that got me kicked out of pilot school."
Copyright © Randy Glasbergen