Electronics Assembly Knowledge, Vision & Wisdom
Aug 16, 2018
Incoming Circuit Boards - How Clean Is Clean?
Incoming Circuit Boards - How Clean Is Clean?
We're having cleanliness issues, our assembly processes are not introducing contaminants. Could it be the result of incoming PCB cleanliness? The Assembly Brothers, Jim Hall and Phil Zarrow, share their insight.
Board Talk
QFN Test Failures Caused by Flux
A test engineer claims that test failures are due to flux residue between terminations that affects the capacitance at the joints. Is this a valid claim?
Ask the Experts
Important Ways of Approaching Heat Management
PCB Prototyping for Smarties
Why Jobs Go On Hold
Case Studies Demonstrate Value-Added Services to Enable Client Success
Automated Visual Inspection and Correction (Demura) of OLED Displays
Implementing High-Volume, High-Performance Selective Soldering
RoHS: 10 Years Later -- IT Equipment Corrosion Issues Remain
When Machine Vision Inspection Comes Up Short: Is 'Almost' Defect-Free Enough?
Improved SMT and BLR of 0.35 mm Pitch Wafer Level Packages
Improved SMT and BLR of 0.35 mm Pitch Wafer Level Packages
This study shows optimized print process can be achieved using standard materials, while also considering board level reliability.
Production Floor
Quantum Computing Becomes a Real Technology
Quantum Computing Becomes a Real Technology
Researchers are close to building quantum computers powerful enough to do those things that conventional computers cannot dubbed "quantum supremacy."
Technology Briefing
Predicting the Lifetime of the PCB
This paper examines a concept to enable the prediction of the lifetime of the PCB using accelerated testing methods and finite element simulations.
Analysis Lab
HCFC-225 Phaseout, What Now?
HCFC-225 Phaseout, What Now?
The use restrictions on HCFC-225 are in effect throughout the US. This paper discusses the options for assemblers and component manufacturers.
Materials Tech
Gold Stud Bump Flip Chip Bonding on Interconnect Devices
This paper presents the studies on flip chip thermo-compression bonding (TCB) of gold stud bumps on MID substrate.
Production Floor
Ask the Experts
Test Probe Problems After Pin-In-Paste
We are having test probe contact issues with our Pin-In-Paste process. Should all the flux vaporize off in the reflow process? Any suggestions?
Ask the Experts
Wetting and Solidification of Pure Tin on Polycrystalline Intermetallic Substrates
This study analyzes the wetting and interface formation between polycrystalline CuxAly intermetallic substrates and the pure Beta-Sn phase.
Analysis Lab
Should We Modify Rework Procedures for Assemblies Fabricated Using OSP?
Should We Modify Rework Procedures for Assemblies Fabricated Using OSP?
Should we modify any rework or repair procedures for circuit board assemblies fabricated using OSP, organic solderability preservatives, bare boards?
Board Talk
Semi-Additive Process for High Frequency Signal Substrates
This paper covers a new SAP process for low loss build-up materials with low desmear roughness and excellent adhesion at various processing conditions.
Materials Tech
Wearable Cameras
Wearable Cameras
Wearable cameras promise to share videos instantaneously with the world. Engineers have developed HD video streaming that doesn't need to be plugged in.
Technology Briefing
Beyond 0402M Placement: Considerations for Microchip Mounting
This presentation explores board and component trends, and delves into three areas for successful 03015M adoption: equipment, materials, and controls.
Production Floor
Ask the Experts
Hot Air Solder 0201s and 01005s
We are struggling to solder and rework small parts - 0201s and 01005s. I have been using a small nozzle hot air solder rework station with adjustable air flow.
Ask the Experts
Cloudy Copper Plating Bath
Cloudy Copper Plating Bath
At a circuit shop near Los Angeles there was trouble with the copper plating line. Was an impurity getting in the tank and how?
Mysteries of Science
Cartoon
"Howl at an ambulance or fire siren every chance you get. Run around the room in circles with a sock in your mouth. Eat a messy meal without using your hands or utensils. Ask a friend to scratch your belly..."
Copyright © Randy Glasbergen