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Knowledge, Vision & Wisdom Apr 21, 2015
The Four Rs of  High-Stakes Decision Making
Decisiveness is often cited as a desirable trait in leaders. But being able to make a decision isn't the only thing that matters. Effectiveness depends on when and how the decision is made, not just that it was made.
Technology Briefing
When is it Time to Shift from Hand to Wave Soldering?
We assemble simple through-hole circuit boards. What are the main factors to consider when shifting from hand soldering to wave soldering?
Board Talk
Acceptance Testing Of Low-Ag Reflow Solder Alloys
Acceptance Testing Of Low-Ag Reflow Solder Alloys
This paper describes initial test results for low-silver alloys using solder paste alloy assessment protocols for BGAs and leaded components.
Analysis Lab
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Cause of Unusual Contamination?
Cause of Unusual Contamination?
We have 40 PCB assemblies with unusual contamination. Do you have any ideas what the contamination is, and what caused it?
Ask the Experts
Assembly of Fine Pitch PoP Components
Paper focuses different assembly variations for PoP components with .4 mm pitch on the lower package and .5mm pitch on the upper package.
Production Floor
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Reducing Defects with Embedded Sensing
Reducing Defects with Embedded Sensing
This paper covers sensing technologies to guarantee that only good PCBs pass the assembly process, reducing rework and improving efficiency.
Materials Tech
Re-Shoring or Near-Shoring Concepts Should be Strongly Considered
In this paper, there is an examination of what actual cost components should be included in a landed cost analysis.
Supply Chain
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What is Causing Solder Joint Cracking?
We are seeing field returns after a year in the field due to solder joint cracking on the pins of a 16 pin through-hole connector. The boards are used in an automotive dash board.
Ask the Experts
Solder Creep Fatigue for Lead-free Joints
Solder Creep Fatigue for Lead-free Joints
Paper covers parameters for the SAC405/305, SAC205, SAC105 and SnAg to replace eutectic SnPb in the Engelmaier-Wild solder creep-fatigue model.
Analysis Lab
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We Need Leaded BGAs, But They're Only Available Lead-Free
Today's topic of discussion is orientated to you poor, lost souls who are the exemptees for lead-free and have to cope with a lead-free world.
Board Talk
Storing Data 1000X Faster Than Fastest Hard Drives?
Storing Data 1000X Faster Than Fastest Hard Drives?
Dutch researchers are using the spin property of electrons to replace the conventional magnetic domains used in traditional disk drives.
Technology Briefing
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No-Clean Flux Residue and Underfill Compatibility
No-Clean Flux Residue and Underfill Compatibility
This paper covers an experiment designed to measure the electrical reliability of various combinations of underfill and no-clean flux residues.
Materials Tech
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Cleaning for Reliability After QFN Rework
Cleaning for Reliability After QFN Rework
Paper makes an argument for removing flux residue under QFNs post rework, and present cleaning process options for meeting this cleaning challenge.
Production Floor
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Idle Wave Solder Temperature
When our wave solder system is not in use, including after the workday and over the weekend, should we maintain the wave solder pot at a specific temperature?
Ask the Experts
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The Disappearing Ink
The Disappearing Ink
UV lamps were bleaching out the blue color so that a new ink looked like a clear coating. Why didn't this happen in the lab?
Mysteries of Science
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