Electronics Assembly Knowledge, Vision & Wisdom
Aug 22, 2019
Why Do Our Boards Warp During Reflow?
Why Do Our Boards Warp During Reflow?
Board flexing has recently started to occur on one of our circuit board assemblies, yet our process has remained the same. We are using a three-zone reflow oven. Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this.
Board Talk
In Situ Recycling of Cleaning and Rinsing Fluids
The purpose of this paper is to provide an understanding of how to achieve these targets at the lowest possible cost.
Production Floor
USB Connection Testing
Turning Printed Circuit Boards Into Printed Circuit Structures Using 3D Printing
Assessing the Impact of Lean on PCB Manufacturing
How To Get The Best Thermal Profile
Meter-Mix Dispensing Basics
Cleaning Process Compatibility with PCB Surface Finishes
High Reliability Alloy for Auto Apps
Dispelling Dry Storage Myths
Ask the Experts
Is Component Lead Damage Reparable?
Our lead forming process left gashes in the component leads. Some more than 10% of the lead thickness, some not quite. Basis material was exposed on all leads ...
Ask the Experts
Breakthrough in Recyclable Plastics
Breakthrough in Recyclable Plastics
A breakthrough from scientists at Lawrence Berkeley Lab could finally provide the solution we’ve been waiting for: truly recyclable plastics.
Technology Briefing
Dielectrics for Embedding Active and Passive Components
This paper presents a composite type material that can be used as dielectric for the embedding of actives and passives.
Materials Tech
Reservior Printing in Deep Cavities
Reservior Printing in Deep Cavities
Guidelines for stencil designs and aperture placement in cavities are presented, including stencil design, paste material, experimentation, and results.
Production Floor
OEM and EMS to Combat Head on Pillowing Defects
This paper evaluates AXI results from different machine platforms and results from similar platforms operating at different facilities.
Analysis Lab
Ask the Experts
Requirement for Toe Fillets
I am a junior inspector at an electronics manufacturing service. I ran into a little bit of confusion regarding what is the requirement for a toe fillet. Figure 8-89 of the IPC ...
Ask the Experts
Selective Solder Paste Printing for BGA Components
Could we print paste only on the pads that have functional requirements? Could we skip printing on 50 or more of the interior pads since they serve no function?
Board Talk
Alternatives to Solder in Packaging and Assembly
Alternatives to Solder in Packaging and Assembly
This presentation surveys the landscape of alternatives to solder in interconnect, packaging, and assembly.
Materials Tech
Get Ready for the Great 5G Business Boom
5G telecom will make such a huge difference. 5G represents the fifth generation of wireless Internet connectivity and it will provide the infrastructure needed.
Technology Briefing
Novel Approaches for Minimizing Pad Cratering
Novel Approaches for Minimizing Pad Cratering
Pad cratering is laminate fracturing under the copper pads of a surface mount component. Two novel approaches to minimize pad cratering are presented.
Production Floor
Advanced Second Level Assembly Analysis Techniques
This analysis method provides new capabilities when planning and monitoring the assembly interface to help predict and compensate for defects.
Analysis Lab
Radioactivity Warning Surprise
Radioactivity Warning Surprise
A chemist had a hunch that radioactive contamination might have come from a window. How could a window be the cause?
Mysteries of Science
Hand Soldering Reliability
Hand Soldering Reliability
Can you comment on potential differences in reliability for SMT machine placement followed by reflow soldering vs. hand placement followed by hand soldering in surface mount? The Assembly Brothers, Jim Hall and Phil Zarrow, address this question.
Board Talk
Cartoon
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