Electronics Assembly Knowledge, Vision & Wisdom
Oct 15, 2019
Is There a Spacing Spec for SMD Components?
Is There a Spacing Spec for SMD Components?
Is there a minimum spacing requirement or should we apply SMT components to comply with SMT pick and place systems on the market? The Assembly Brothers, Jim Hall and Phil Zarrow, answer this question.
Board Talk
Ultrasonics as an Option for Electronics Assembly Cleaning
Ultrasonic cleaning parameters including frequency, power, time, temperature and chemistries results demonstrate developments in technology.
Production Floor
A Novel ENIG Surface Finish for Robust Solder Joints
Improve Performance & Reliability of LED Systems With Protection Materials
Differences Between Through-Hole and Surface-Mount
Automating the Incoming Materials Process
Void-Free and Worry-Free
USB Connection Testing
Turning Printed Circuit Boards Into Printed Circuit Structures Using 3D Printing
Assessing the Impact of Lean on PCB Manufacturing
Ask the Experts
Solution for Warped PCBAs
From a large lot we have 20 populated boards with components on both sides that are warped. Components vary in height. What method can we use to flatten them?
Ask the Experts
Flying Cars Surge Forward
Flying Cars Surge Forward
After decades of failed projects, a new class of vehicles is finally emerging that could transform the way people and cargo are moved within and between cities.
Technology Briefing
The Quest for Reliability Standards
Many methods simulate end-use characteristics of equipment, but a clear understanding is required to differentiate between the methods.
Analysis Lab
Insulation Resistance of Dielectric Materials
Insulation Resistance of Dielectric Materials
This investigation measures the leakage within internal PCB layers during exposure of various specimens to a controlled ground-based test environment.
Materials Tech
Cleaning High Reliability Assemblies with Tights Gaps
The purpose of this designed experiment was to evaluate the effectiveness of a variety of cleaning agents under an array of process conditions.
Production Floor
Ask the Experts
Problems With Large Voids
I work at a very fast paced quick turn prototype house. Recently we had large voids on a 30mm x 30mm QFN Module. The voids were 50%-75%. Every single board failed. ...
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Impact of Lead-Free Components for High Reliability
This paper has discussed some of the issues faced by organizations in the high reliability sector when adopting COTS and lead-free components.
Analysis Lab
Is HASL a Good Choice for Surface Finish?
Is HASL a Good Choice for Surface Finish?
We are using a lead-free hot air solder leveling board finish. Our boards have bottom-terminated components. Is this the best choice?
Board Talk
Investigation of Copper Sinter Material for Die Attach
3 different copper powders were tested for their feasibility to use as die attach material for pressure sintering process without prior treatment with reducing agents.
Materials Tech
The Sino-American War for 5G Dominance
The Sino-American War for 5G Dominance
Chinese telecom giants Huawei and ZTE dominate the 5G generation of wireless technology. Primacy in wireless is a key goal of Beijing’s.
Technology Briefing
Stereo Vision Based Automated Solder Ball Height Detection
An automatic, stereo vision based, in-line ball height inspection method is presented. This includes an imaging setup with a computer vision algorithm.
Production Floor
Board Processes and Effects on Fine Copper Barrel Cracks
This research is to determine if there is a relationship between PCB fabrication processes and the prevalence of fine barrel cracks.
Analysis Lab
Odd Measurements On Fridays
Odd Measurements On Fridays
A research group tested prehistoric fish for mercury. They noticed that test measurements on Fridays were much higher. What was causing this?
Mysteries of Science
Cartoon
"Are you part of the problem, part of the solution, part of the problem with the solution or part of the solution to the problem with the solution?"
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