Electronics Assembly Knowledge, Vision & Wisdom
Jan 16, 2020
How Do You Remove Oxidation from PCBs?
How Do You Remove Oxidation from PCBs?
What is the best method for cleaning bare PCBs with small amounts of oxidation? I know that proper storage and handling may help. Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question and share their own experiences.
Board Talk
A New Line Balancing Method
In this paper the authors present a new method of handling an assignment problem for hybrid manual and robotic assembly mixing lines.
Production Floor
Comparing Soldering Results of ENIG and EPIG Post Steam Exposure
Periodic Pulse Plating of Mid-Aspect Ratio PCB's for Enhanced Productivity
6 Common Mistakes of BGA Rework
How solder ball technology can facilitate QFP device transition
Overcoming Tombstones and Opens Due to Thermal Inequalities
BGA Site Modification - Is It Possible?
Economic Order Quantity (EOQ) in Electronics Contract Manufacturing
Reliable Novel Nickel-Free Surface Finish Solution for High-Frequency PCB Applications
Ask the Experts
Conformal Coating in Low Humidity Environments
Whereas conformal coating is excellent for high humidity protection - is there any performance impact when subjected to very low humidity environments?
Ask the Experts
The Great AI Boom Ahead
The Great AI Boom Ahead
Investment in artificial intelligence is rising rapidly. AI-related opportunities and threats are just becoming visible to most decision-makers.
Technology Briefing
Alloy Composition and Aging on the Survivability of Lead-Free Solders
A comparison of failure modes for different packaging architectures at elevated test temperatures and vibration has been presented in this study.
Analysis Lab
Reliability of ENEPIG by Sequential Thermal Cycling and Aging
Reliability of ENEPIG by Sequential Thermal Cycling and Aging
Paper presents the reliability of LGA components assembled with tin-lead solder onto PCBs with an ENEPIG finish and subjected to thermal cycling and aging.
Materials Tech
Engineered Tin-Copper Alloys in Selective Soldering
The performance with one alloy under design conditions that make soldering difficult demonstrate the need to evaluate the performance differences.
Production Floor
Ask the Experts
Mixing Different SAC305 Solders
We have been using SAC305 bar solder from one supplier. We now want to source it from a different supplier. Should we be concerned if we mix the new bar solder in with ...
Ask the Experts
Evaluation of the Use of ENEPIG in Small Solder Joints
In this study, the impact of industry standard Pd thicknesses on thin solder joints is evaluated through shear testing.
Analysis Lab
Consensus for Baking Prior to Rework?
Consensus for Baking Prior to Rework?
What is the consensus for baking out moisture in circuit board assemblies prior to convection rework, localized mini-wave rework, or hand soldering rework?
Board Talk
Micro Trace Resistive Technology
Micro Trace Resistor Technology allows thin film resistors to be built within a printed circuit trace that is less than 100 microns wide.
Materials Tech
Wirelessly Monitor Vital Signs
Wirelessly Monitor Vital Signs
A radar system developed can wirelessly monitor the vital signs of patients, eliminating the need to hook them up to any machines.
Technology Briefing
Assembly Process Feasibility of Low Silver Solder Paste
This paper presents performance/process capability of various low/no silver alloy solder pastes.
Production Floor
Effect of Area Shape and Area Ratio on Solder Paste Printing Performance
The effect of aperture shape and orientation on solder paste printing performance is analyzed using stencil thicknesses, solder paste types and manufacturers.
Analysis Lab
The Hot Chip Scale Package
The Hot Chip Scale Package
A team building the world's first high-density Chip Scale Package needed to get it out the door. It was still hot when it shipped.
Mysteries of Science
Cartoon
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