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Knowledge, Vision & Wisdom Apr 30, 2015
Why Do Our Boards Warp During Reflow?
Board flexing has recently started to occur on one of our circuit board assemblies, yet our process has remained the same. We are using a three-zone reflow oven.
Board Talk
Is Pre-Bake Standard for Rework?
On occasion we need to perform rework. Is there a rule or standard that can be applied for pre-bake requirements prior to rework?
Ask the Experts
Evaluating Manual and Automated Heat Sink Assembly
Evaluating Manual and Automated Heat Sink Assembly
This paper illustrates the use of strain gauge testing and Finite Element Analysis as a simulation tool to optimize the heat sink assembly process.
Production Floor
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Where PCBs and Printed Electronics Meet
Where PCBs and Printed Electronics Meet
As electronics devices are applied to more and more parts of our lives, we need to continually push for better solutions.
Supply Chain
Solder Joint Reliability of QFN Packages
This study focused on the board level solder joint reliability of a 28 lead dual row QFN package.
Analysis Lab
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Flexible, Ultra-Energy-Efficient, Transparent Electronics
Flexible, Ultra-Energy-Efficient, Transparent Electronics
A new integrated circuit patterned onto a sheet of graphene offers the possibility for flexible, ultra-energy-efficient, and transparent electronics.
Technology Briefing
Comparison of SAC105 and SAC305 Solders
In this paper, the thermal fatigue performance under accelerated test conditions is compared for three common BGA ball alloys.
Materials Tech
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Zip-lock Bags vs. Heat Sealed Bags
Zip-lock Bags vs. Heat Sealed Bags
Are zip-lock bags vs. heat sealed bags an acceptable option for storage of moisture sensitive components?
Ask the Experts
Limitations of DI-Water Cleaning Processes
Recent studies suggest that water is beginning to reach its cleaning limitation. The findings presented shed much needed light on this emerging industry challenge.
Production Floor
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Tips When Moving a Reflow Oven
After moving a reflow oven to a different site, what steps do you need to perform on the machine and the heat exhaust in order for the machine to be certified?
Board Talk
Where to Look for Insight
Where to Look for Insight
Where can you discover the insights you need to fuel innovation? We'll explore the seven "insight-channels" that can be used by would-be innovators.
Technology Briefing
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LGA/QFN Packages Floating During Reflow
LGA/QFN Packages Floating During Reflow
Industry expert Bob Willis explains why LGA/QFN packages may float during reflow and how this defect may be associated with excess voids and open solder joints.
Analysis Lab
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Improve Etching Performance
This paper discusses a new technology to improve etching performance using shiny side surface treatment on copper foil.
Materials Tech
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Stencil Tension
Is it advisable to have a tension meter in our SMT assembly area? What is the acceptable stencil mesh tension in order to maintain good solder paste prints?
Ask the Experts
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Odd Measurements On Fridays
Odd Measurements On Fridays
A research group tested prehistoric fish for mercury. They noticed that test measurements on Fridays were much higher. What was causing this?
Mysteries of Science
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