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Knowledge, Vision & Wisdom Mar 30, 2015
Problem Meeting Minimum Hole Fill During Wave Soldering
We are having problems achieving the minimum hole fill of 75% on electrolytic capacitors using our wave soldering. What do you suggest?
Board Talk
How Many Zones Needed for Lead-free Profile?
How many zones are required to run a lead-free profile? Does the number of zones dictate capability or do they only matter for throughput?
Ask the Experts
Meeting Future Stencil Printing Challenges with Ultrafine Powder Pastes
Meeting Future Stencil Printing Challenges with Ultrafine Powder Pastes
Paper provides a comparison of the transfer efficiency of different solder powder particle sizes with post reflow results in optimal and harsh conditions.
Materials Tech
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How Super Capacitors May Super Charge Electric Car Use
How Super Capacitors May Super Charge Electric Car Use
The charging duration of electric car batteries may be dramatically shortened with the use of super-capacitors based on innovative nano-materials.
Technology Briefing
Ideas for Identifying Counterfeit Components
Expert Bob Willis explains some nondestructive methods for identifying counterfeit components - before they go on your boards.
Analysis Lab
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3D Assembly Processes a Look at Today and Tomorrow
3D Assembly Processes a Look at Today and Tomorrow
This paper explores various technologies available today and some that are starting to appear and illustrates some key items for each technology.
Production Floor
3 Steps To Solder Paste Selection
This paper covers the most significant issues in solder paste selection to meet the goals of manufacturing.
Materials Tech
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Conformal Coating Over No-Clean Flux
We need to apply conformal coating to one circuit board assembly. Is it normally acceptable to apply conformal coating directly over circuit board assembled using no-clean flux?
Ask the Experts
Optimization to Prevent the Graping Effect
Optimization to Prevent the Graping Effect
This paper will discuss the specific challenge of the Graping Effect and the work that has been performed to mitigate this phenomenon.
Production Floor
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Side Wall Wetting Induced Void Formation
Side Wall Wetting Induced Void Formation
In this study the authors examine the mechanism of void formation in the processing of microbumps.
Analysis Lab
Printable Materials for Electronic Packaging
This paper reports on novel printable materials that have the potential to surpass conventional materials.
Materials Tech
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I Hate to Disappoint
I Hate to Disappoint
Individuals who are highly prone to feel guilty for disappointing their co-workers are among the most ethical and hard-working team personnel.
Technology Briefing
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3D IC Integration Technology Development in China
3D IC Integration Technology Development in China
China's semiconductor foundry and microelectronic packaging industries are embracing the move to join 3D IC integration. This paper provides an overview of the recent progress.
Production Floor
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Is Baking Required After Aqueous Cleaning?
Is Baking Required After Aqueous Cleaning?
Do assembled circuit board assemblies need to be baked after routine aqueous cleaning?
Ask the Experts
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The Case of the Falling Floor
The Case of the Falling Floor
The line was running when suddenly there was a loud thud. The floor, supporting a vertical beam had given way. What happened?
Mysteries of Science
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