Electronics Assembly Knowledge, Vision & Wisdom
Aug 17, 2017
Problems with Pin-In-Paste
Problems with Pin-In-Paste
We are using pin-in-paste and notice that solder paste is dripping out of holes at a connector location and accumulating inside our reflow oven. Is this normal? The Assembly Brothers, Phil Zarrow and Jim Hall, address this question.
Board Talk
Component Damage From IR Reflow
We have an SMT package with J formed leads that crack at the shoulder after IR reflow. What could be causing these defects?
Ask the Experts
BGA Site Modification - Is It Possible?
BGA Site Modification - Is It Possible?
Here we cover a type of BGA site modification that uses a section of circuit track and a jumper wire to complete the modification.
Production Floor
Breakthrough Printing 3D Carbon Fiber Composites
Breakthrough Printing 3D Carbon Fiber Composites
Researchers recently printed 3D carbon fiber composites offering greater control and optimization of the lighter-weight, yet stronger-than-steel material.
Technology Briefing
Electrical Test Conditions & Considerations
When an OEM is deciding requirements for a particular part regarding Electrical Test, some over precautions and disconnects may occur.
Analysis Lab
Reliability of Multiple Pb-free Solder Ball Alloys
Reliability of Multiple Pb-free Solder Ball Alloys
Paper covers a screening experiment to obtain data comparing thermal fatigue reliability of the various solder ball alloys.
Materials Tech
Problem Areas for Selective Conformal Coating
This paper covers how to deal with problem areas for selective conformal coating for use in environments that are not friendly to electronic circuits.
Production Floor
Ask the Experts
Hard Water Contamination
I have a cleanliness problem with a batch of printed circuit assemblies. One batch appears polluted by ionic residues visible as a thin film.
Ask the Experts
OEM and EMS to Combat Head on Pillowing Defects
This paper evaluates AXI results from different machine platforms and results from similar platforms operating at different facilities.
Analysis Lab
Proper Exhaust Pressure for Reflow Ovens?
Proper Exhaust Pressure for Reflow Ovens?
What is the proper exhaust pressure for a reflow over? Where should we measure the pressure? How should we measure pressure?
Board Talk
Low-Cost & High Performance Silicon Interposers
The Low-Cost Silicon Interposer industry consortium addresses limitations of organic packages as well as wafer-based silicon interposers.
Materials Tech
What to Expect from Artificial Intelligence
What to Expect from Artificial Intelligence
The interest in AI is triggering a variety of reactions from excitement about how it will augment human labor to trepidation about how it will eliminate jobs.
Technology Briefing
Challenges for Step Stencil Printing
Challenges for Step Stencil Printing
This paper focuses on the printing performance of step-up/step-down stencils and the paper ends up with a short outlook on 3D cavity printing.
Production Floor
Recommended Lead to Hole Ratio
What is the proper minimum gap between a round conductor lead and a PCB hole that will allow for a proper solder fill?
Ask the Experts
Corrupted Magnetic Tracking System
Corrupted Magnetic Tracking System
Magnetic traveler cards were being used to track information. Suddenly one section was unable to read the data. What was the cause?
Mysteries of Science
Cartoon
"If it's really important, write URGENT in the subject line and I'll be sure to ignore it immediately."
Copyright © Randy Glasbergen
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