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Knowledge, Vision & Wisdom Jan 27, 2015
Will Typical No Clean Paste Pass an SIR Test?
Will a typical no clean paste pass an SIR test? Is it really clean enough for a conformal coating and 20 years of service? Phil Zarrow and Jim Hall provide some answers.
Board Talk
A New Computing Paradigm
Even as silicon-germanium and carbon nanotubes exceed limits for conventional computing, researchers are creating a new computing paradigm.
Technology Briefing
Long Term Component Storage
Long Term Component Storage
We need to store a variety of SMD components for at least 10 years. What do you recommend for humidity and temperature settings?
Ask the Experts
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HALT Testing of Backward Soldered BGAs on a Military Product
This study continues evaluation of reliability in a production design. Functional assemblies were built using Pb-free BGAs in a SnPb solder process and subjected to life testing.
Analysis Lab
Removing Flux from Low Standoff Heights
Removing Flux from Low Standoff Heights
Paper covers evaluation of cleaning effectiveness of chemistries in removing flux residues from beneath low standoff height components.
Production Floor
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How to Measure Thermal Zones with Blind Vias
How to Measure Thermal Zones with Blind Vias
IPC Technical Project Manager John Perry explains how to measure the thermal zone for boards with blind or buried vias.
Analysis Lab
Advances in Monitoring of Stencil Printing
Paper presents a print verification technology that captures the full board image, analyzes the data and accepts or rejects the print.
Production Floor
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Tacky Flux Residue Problem
Tacky Flux Residue Problem
We're having problems with tacky flux residues under BGA components after rework. What is this residue and how can we remove it?
Ask the Experts
Thin Immersion Tin Using Organic Metals
Paper reviews ability of a thin immersion tin to achieve comparable performance to thick immersion tin with improvements in process costs and yields.
Materials Tech
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Circuit Board Moisture Sensitivity and Baking
Circuit Board Moisture Sensitivity and Baking
The dicussion focuses on concerns regarding IPC's guideline for handling and storage of circuit boards specifically covering moisture sensitivity and baking.
Board Talk
Connecting a Trillion Battery-Free Devices
Engineers have designed a new communication system that uses radio frequency signals as a power source to provide Internet connectivity to battery-free devices.
Technology Briefing
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Predicting Fatigue of Solder Joints
Predicting Fatigue of Solder Joints
In this paper, chip resistors were subjected to a high number of short duration power cycles. Environmental conditions and relevant material properties were documented.
Analysis Lab
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Computed Tomography on Electronic Components
Computed Tomography on Electronic Components
The combination of improved computers, detectors, and new software has allowed the addition of a fourth dimension to a computed tomography data set.
Production Floor
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Issues with BGA Components Near PCB Edges
What issues are we likely to see when we place BGA components very close to PCB edges?
Ask the Experts
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Screen Print Mismatch
Screen Print Mismatch
At a printed circuit shop artwork on the finished sheets did not match up. What was causing this discrepancy.
Mysteries of Science
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