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Knowledge, Vision & Wisdom Jan 22, 2015
Major Game-changer for the Lighting Industry
Many researchers have attempted to construct light sources with carbon nanotubes. But nobody has developed an equivalent and simpler lighting device. But that could soon change.
Technology Briefing
Tin-lead Reflowed at Lead-free Temps
We reflowed a batch of tin-lead circuit boards with a lead-free profile at higher temperatures than specified. Would you scrap these board assemblies?
Board Talk
Frequency of Checking Solder Paste Viscosity
Frequency of Checking Solder Paste Viscosity
Is it necessary to check viscosity of solder paste before each use? How often should we check and verify solder paste viscosity?
Ask the Experts
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Voiding/Drop Test for Mixed Alloy BGA Assembly
Voiding/Drop Test for Mixed Alloy BGA Assembly
BGAs with various alloy balls were assembled with various solder pastes. Joint strength, drop test performance and voiding performance were evaluated.
Analysis Lab
Is Cleaning Critical to POP Assemblies?
Paper addresses the cleanliness level of package-on-package assemblies including underneath package-on-package components.
Production Floor
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Conformal Coating In Harsh Environments
Paper studies a test protocol designed to environmentally stress conformal coatings for their ability to withstand moisture and protect from moisture-related failures.
Materials Tech
Testing PCBs for Creep Corrosion
Testing PCBs for Creep Corrosion
This paper covers the iNEMI technical subcommittee test for creep corrosion using a flowers-of-sulfur based qualification test.
Analysis Lab
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Twisting Multi-strand Wires
Twisting Multi-strand Wires
Should multi-strand wires be twisted before they are tinned with solder? What are the benefits of twisting prior to tinning?
Ask the Experts
Jetting Fine Lines onto 2D and 3D Electronic Packages
The increasing demand for smaller dispense doses including fine lines, small dots and more accurate dispensing requires examination of available products and technologies.
Production Floor
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Board Deflection During Pick & Place
Board Deflection During Pick & Place
We notice deflection in panels being populated. Will this deflection cause components to sit higher on the paste and have a higher solder joint height?
Board Talk
How Computing Is Unleashing a Materials Revolution
The Digital Techno-Economic Revolution has opened up a dramatically faster, more efficient way to handle the task of developing new materials, and the implications will be profound.
Technology Briefing
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 Mitigating Tin Whiskers in Alternative Lead-Free Alloys
Mitigating Tin Whiskers in Alternative Lead-Free Alloys
As lead-free alloys shift into high reliability electronics, the issue of tin whisker growth remains a primary concern among those in the industry.
Analysis Lab
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Design for Flip-Chip and Chip-Size Technology
This paper provides a comparison of flip-chip and wafer level array package methodologies detailed in IPC-7094.
Materials Tech
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Embedded Fibers Enhance Nano-Scale Interconnections
Embedded Fibers Enhance Nano-Scale Interconnections
This paper introduces the use of embedded fibers in the interconnections of chip-to-chip and chip-to-package components.
Materials Tech
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Jet Engine Bicycle Blasts Off
Jet Engine Bicycle Blasts Off
Definitely don't try this at home: putting a propane-powered engine onto a bicycle.
Mysteries of Science
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Cartoon
"I'm tired of arguing with auto-correct. We're having your name legally changed to Sandcastle Watermelon."
Copyright © Randy Glasbergen