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Knowledge, Vision & Wisdom Mar 3, 2015
Is Customer Approval Required for Class 3 Repair?
We have a case where a non-aerospace customer's board was repaired without prior authorization. It was for a class 3 assembly. Does it specify in an IPC document that customer approval is required for class 3 repairs?
Board Talk
Development of a Robust 03015 Process
This paper reviews major steps considered and taken for the development of a robust 03015 process. It focuses on the activities for the solder paste print process.
Production Floor
Conformal Coating & Connector Holes
Conformal Coating & Connector Holes
Is it possible to eliminate conformal coating from seeping into connector holes? How much coating residue is acceptable in the connector holes?
Ask the Experts
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Moisture Measurements in PCBs
Paper discusses use of capacitance measurements to follow the absorption and desorption behavior of moisture in PCBs.
Analysis Lab
The Intelligent and Secure Factory Floor
The Intelligent and Secure Factory Floor
In the near future, products moving along a production line will know where they are, which steps are completed, and what is needed for completion.
Technology Briefing
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Conformal Coating for Tin Whisker Management
The objective of this study is to evaluate conformal coatings for mitigation of tin whisker growth.
Materials Tech
Measuring Copper Surface Roughness for High Speed Applications
Measuring Copper Surface Roughness for High Speed Applications
This paper examines the use of light interferometry and the relevant parameters used to measure copper surface roughness before and after oxide alternative.
Analysis Lab
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Soldering Lead-free with Tin-lead Solder
Soldering Lead-free with Tin-lead Solder
Can we solder lead free, 1500 pin BGA with Leaded (SnPb) solder? This is for a non RoHS compliant application.
Ask the Experts
Effects of Dielectric Material, Aspect Ratio and Copper Plating on Microvia Reliability
Paper documents experiments to evaluate effects of dielectric material, aspect ratio, via morphology, surface prep, temperature and copper plating on microvia reliability.
Analysis Lab
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Top Side Reflow Causing Solder Balls
Top Side Reflow Causing Solder Balls
When selective soldering the secondary side, we are producing solder balls on the primary side. What can be done to prevent this from happening?
Board Talk
Thin, Flexible, Hyper-resolution Displays
A team has discovered a way to create pixels just a few hundred nanometers across. This could pave the way for thin, flexible, hyper-resolution, low-energy displays and foldable screens.
Technology Briefing
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Selecting Cleaning Processes for Defluxing
Selecting Cleaning Processes for Defluxing
This paper discusses the factors, advantages and disadvantages to consider for commonly used cleaning processes.
Production Floor
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Advanced Thermal Management for High Power Applications
Advanced Thermal Management for High Power Applications
The aim of this paper is to give a short overview about standard thermal solutions like thick copper, thermal vias, plugged vias or metal core based PCBs.
Materials Tech
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Suggested Limit for PCBA Heat Cycles
Suggested Limit for PCBA Heat Cycles
What is the suggested limit for the total number heating cycles that can be done on one PCB assembly? Our PCBs contain BGAs, leadless components and large fine pitch components.
Ask the Experts
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The Mysterious Pink Snow
The Mysterious Pink Snow
One morning after a snowstorm, the morning shift at Allied Chemical was greeted in the parking lot by pink snow. What caused this strange event?
Mysteries of Science
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