Electronics Assembly Knowledge, Vision & Wisdom
Dec 11, 2018
Solder Pallets With Titanium Inserts - Yes/No?
Solder Pallets With Titanium Inserts - Yes/No?
Our pallet manufacturer recommends titanium inserts to allow larger apertures near closely spaced surface mount components. Are they worth it? The Assembly Brothers, Jim Hall and Phil Zarrow, share their insights.
Board Talk
Reusing recovered solder paste
We are wasting a lot of solder paste. Can we recover the solder paste, since disposition of used solder paste is tedious task?
Ask the Experts
Solving Problems Before They Occur in PCB Design to Manufacture
Using Vias to Improve PCB Density
Improving Quality with Automatic Solder Nozzle Tinning
Enabling IPX Level 7/8 PCB Waterproof Protection
Important Ways of Approaching Heat Management
PCB Prototyping for Smarties
Why Jobs Go On Hold
Case Studies Demonstrate Value-Added Services to Enable Client Success
Early Design Review of Boundary Scan To Enhancing Testability
Early Design Review of Boundary Scan To Enhancing Testability
Paper reviews what portions of a design can be covered structurally and what are covered functionally, to provide the best diagnostics to discover faults?
Production Floor
21st Century Textiles Make Life Better
21st Century Textiles Make Life Better
As we continue into Golden Age of the Fifth Techno-Economic Revolution, digital technology is poised to transform textiles in ways that were unimaginable
Technology Briefing
Mitigating Tin Whiskers in Alternative Lead-Free Alloys
As lead-free alloys shift into high reliability electronics, the issue of tin whisker growth remains a primary concern among those in the industry.
Analysis Lab
Status and Outlooks of Flip Chip Technology
Status and Outlooks of Flip Chip Technology
Status of flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill is presented in this study.
Materials Tech
Electroplated Copper Filling of Through Holes
This paper discusses a through hole copper filling process for applications of high density interconnects and IC substrates.
Production Floor
Ask the Experts
Soldering Components with Silver Pads
We use a low temp profile, did not obtain proper wetting and got solder balls. If the reflow temperature is too high, the silver dissolves.
Ask the Experts
Predicting Fatigue of Solder Joints
Chip resistors were subjected to a high number of short duration power cycles. Environmental conditions and material properties were documented.
Analysis Lab
Why Should We Consider Smart Feeders?
Why Should We Consider Smart Feeders?
In selecting a new pick and place line, why should we consider smart feeders? How can we justify the added cost?
Board Talk
Thermally, Electrically Conductive Adhesive to Control Heat in PCBs
Study illustrates the complexity of achieving optimum thermal and electrical performance with any circuit, especially at higher frequencies.
Materials Tech
Wearable Cameras
Wearable Cameras
Wearable cameras promise to share videos instantaneously with the world. Engineers have developed HD video streaming that doesn't need to be plugged in.
Technology Briefing
New Placement Technology for Rework
This paper introduces a rework technology using cameras to identify the target area for component installation and component pin structure.
Production Floor
Ask the Experts
Viscosity of Solder Paste Before Printing
What is the general recommended viscosity of solder paste before printing?
Ask the Experts
Dead Phone and the Mysterious Dialer
Dead Phone and the Mysterious Dialer
A home had cable telephone but the phone line started going completely dead, mysteriously fixing itself just before the repairman arrived.
Mysteries of Science
Cartoon
"We're installing a USB port so it's easier to recharge you after lunch."
Copyright © Randy Glasbergen