Electronics Assembly Knowledge, Vision & Wisdom
Jun 25, 2019
Trends for Printing Ultra Miniature Chips
What are the current trends and practices for printing ultra-miniature chips, a la 01005? The Assembly Brothers, Phil and Jim, take a look and share their opinions.
Impractical Stencil Aperture Designs to Enable M0201 Assembly
Implementation of metric 0201 or M0201 size surface mount passives will help enable the next generation form factor electronic packaging.
How To Get The Best Thermal Profile
Meter-Mix Dispensing Basics
Cleaning Process Compatibility with PCB Surface Finishes
High Reliability Alloy for Auto Apps
Dispelling Dry Storage Myths
Strategies For Ensuring a Smooth Assembly Process
New Generation of Conformal Coatings for Challenging Operating Environments
US Army & nScrypt Direct Digitally Manufacture 3D Printed Circuit Structure
QFN Test Failures Caused by Flux
We have a PCBA with a QFN44. We use a no-clean flux. We have encountered many test failures during testing. A test engineer claims that the failures are due to flux residue ...
Ask the Experts
China's Narrow Path to 21st Century Dominance
China is working to dominate the global system. Yet, contrary to what we are led to believe, China is poorly positioned to achieve global dominance.
Void Reduction Method for BTC Using Exposed Via in Pad
The method explored in this paper regards the use of exposed via in pad. A dedicated test vehicle was designed for two types of QFN components.
Three Dimensional Integration Focusing on Device Embedded Substrate
In this paper, EDA tools, TEG chips, and several evaluation equipment developed in Fukuoka are explained.
Selecting Stencil Technologies to Optimize Print Performance
Research has been done to identify individual factors in stencil performance; this paper discusses the real-world application of numerous findings.
Selective Soldering Frame Causing Cold Solder Joints
We have continual problems with our wave soldering system, especially cold solder joints. Could the cold solder joints be caused by using a selective soldering frame?
Ask the Experts
Process Control of Ionic Contamination in Assembly of Electronic Circuits
This paper reviews a testing protocol based on IPC-TM 650 2.3.25 to enable monitoring of ionic contamination within series production.
Cure for the Grape Effect
We are processing lead-free boards with large components. Our smaller parts are showing the grape effect. What is the best solution for this?
Multilayer Ceramic Capacitors: Mitigating Rising Failure Rates
The multilayer ceramic capacitor (MLCC) has become a widely used electronics component both for surface mount and embedded PCB applications.
Securing the Supply Chain of Strategic Minerals
A study focuses on 23 "mineral commodity groups" classified as critical based on the likelihood of supply interruption and the cost of such an interruption.
How to Set Up a Successful Blind Via Hole Fill DC Plating Process
Successful via fill plating requires a specific electrolyte; the copper concentration is as high 50 - 60 g/L copper with low sulfuric acid at 30 - 60 g/L.
Immersion Gold Processes Used for Both ENIG and ENEPIG
This paper presents a comparative study for three types of immersion golds used for both ENIG and ENEPIG deposits in the same production line.
Pennies Converted To Dimes
A vendor was sorting a vending machine's change when he came across some strange looking dimes that looked like silver pennies.
Mysteries of Science
"Let's compromise - I'll agree to raise your salary if you'll agree to talk me out of it."
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