Electronics Assembly Knowledge, Vision & Wisdom
Jul 19, 2018
Issues With SMT Component Alignment
Issues With SMT Component Alignment
During automatic optical inspection our chip components are shifting. This is not limited to single components and changes daily, sometimes at one location and sometimes at the other location. The Assembly Brothers investigate and explore the causes.
Board Talk
Solder Splashing During Wave Soldering
We are experiencing solder splash while using both adjustable and dedicated pallets. What is the likely reason for this?
Ask the Experts
Why Jobs Go On Hold
Case Studies Demonstrate Value-Added Services to Enable Client Success
Automated Visual Inspection and Correction (Demura) of OLED Displays
Implementing High-Volume, High-Performance Selective Soldering
RoHS: 10 Years Later -- IT Equipment Corrosion Issues Remain
When Machine Vision Inspection Comes Up Short: Is 'Almost' Defect-Free Enough?
Enhancing the Quality of Your Selective Soldering Process
An Electroless Nickel/Immersion Gold (ENIG) Surface Finish for Better Reliability of Assemblies
Backward Compatible Solder Joint Reliability Under Accelerated Conditions
Backward Compatible Solder Joint Reliability Under Accelerated Conditions
Accelerated temperature cycling was used to assess the thermal fatigue reliability of a Pb free grid array package assembled.
Production Floor
Greater Storage on Smaller Chips
Greater Storage on Smaller Chips
A team has developed the thinnest memory storage device with dense memory capacity, paving the way for faster, smaller and smarter computer chips.
Technology Briefing
Low Temperature SnBi Containing Solder Pastes with Lead-Free Solder Balls
A detailed study has been carried out on low temperature lead-free solder paste that utilizes Bi bearing alloys.
Analysis Lab
NanoCopper Based Solder-free Electronic Assembly
NanoCopper Based Solder-free Electronic Assembly
This paper explores a nanotechnology enabled copper-based electrical interconnect material that can be processed around 200 degrees.
Materials Tech
Electrostatic Discharge Factory Issues
The paper offers an overview of causes for ESD, where electrostatic charges are increasingly generated.
Production Floor
Ask the Experts
Partially Visible or Hidden Solder Connections
Being a CM, it is not feasible to add an X-Ray inspection to the process due to added cost. How do others in the industry handle this?
Ask the Experts
On-Board Package Decapsulation Techniques for Failure Analysis
Various on-board decapsulation techniques to remove package overmold while preserving wire bonds either gold (Au) or Copper (Cu) were evaluated.
Analysis Lab
Why Do Our Boards Warp During Reflow?
Why Do Our Boards Warp During Reflow?
Board flexing has recently started to occur on one of our circuit board assemblies, yet our process has remained the same. We are using a three-zone reflow oven.
Board Talk
Embedded Passive Technology
This paper summarizes the selection of resistor embedded materials, evaluations of resistive material and duplication of a complex digital design.
Materials Tech
Quantum Computers Break Encryption
Quantum Computers Break Encryption
When quantum computers are fully developed, they will break much of today's encryption whose security is only based on mathematical assumptions.
Technology Briefing
Jetting Strategies for mBGAs
This study attempts to understand the dependencies on piezo actuation pulse profile on jetting deposit quality, especially focused on positioning, satellites and shape.
Production Floor
Ask the Experts
Problems With Large Voids
We had large voids on a 30mm x 30mm QFN Module. Every board failed. What can prevent huge voiding in the future on larger modules that are similar?
Ask the Experts
The Puzzling Z-Axis Adhesive
The Puzzling Z-Axis Adhesive
A new type of z-axis conductive adhesive was mysteriously switching on and off. The cycle was endlessly repeated. What was the cause?
Mysteries of Science
Cartoon
"My presentation lacks power and it has no point. I assumed the software would take care of that!"
Copyright © Randy Glasbergen