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Knowledge, Vision & Wisdom Jul 2, 2015
01005 Component Challenges and Bugs
We are going forward with assemblies that use 01005 components. We're wondering if you have some input as to the most important challenges we are going to face.
Board Talk
Fastening SMT Connectors - Before or After Refow?
Is there an IPC guideline for attachment of SMT or PTH connectors that are hardware mounted? Do you tighten / torque hardware before soldering?
Ask the Experts
Taking the LED Pick and Place Challenge
Taking the LED Pick and Place Challenge
There has been a shift in the lighting industry that has carried over to surface mount technology. What is this shift? Is it the LED revolution?
Production Floor
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What Drives Consumer Loyalty and Passion?
What Drives Consumer Loyalty and Passion?
When designing a new car, manufacturers might try to attract consumers with more horsepower, increased fuel efficiency, or a lower price point.
Technology Briefing
Predicting the Lifetime of the PCB
This paper examines a concept to enable the prediction of the lifetime of the PCB using accelerated testing methods and finite element simulations.
Analysis Lab
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Lead-free Development in Server Applications
Paper examines the effects of varying surface finishes, process parameters and interactions that affect solder attach attributes.
Materials Tech
Printing and Assembly Challenges for QFN Devices
Printing and Assembly Challenges for QFN Devices
QFN (quad flatpack, no leads) and DFN (dual flatpack, no lead) are becoming more popular in new component releases.
Production Floor
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Ultrasonic Cleaning Considerations
Ultrasonic Cleaning Considerations
I need to clean using an ultrasonic cleaner. What considerations do we need to know about?
Ask the Experts
Drop Test Performance of BGA Assemblies
In this work, BGA solder spheres using SAC105 with 0.02% addition of Titanium were evaluated for BGA assembly drop test performance.
Analysis Lab
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Long Term Component Storage
Long Term Component Storage
We need to store SMD components for at least 10 years. What do you recommend for a humidity and temperature settings?
Board Talk
Gold Stud Bump Flip Chip Attachment
Flip chip bonding is a desirable attachment approach for minimizing size. This paper compares immersion and auto catalytic gold plating processes for flip chip bonding.
Materials Tech
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Major Game-changer for the Lighting Industry
Major Game-changer for the Lighting Industry
Many researchers have attempted to construct light sources with carbon nanotubes, but with little success. That could soon change.
Technology Briefing
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Double Print Stencils Systems
It is useful in Assemblies that require mixed technologies; including SMT / Through Hole, SMT / Glue attach components, Packages requiring die attach / SMT assembly.
Production Floor
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Package-on-Package Rework
We need to perform some Package-on-Package rework. The only package we need to rework is the top package. Can we rework the top package only, or should we remove both packages and then replace them both?
Ask the Experts
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Cyanide Leak and Sleepy Chemists
Cyanide Leak and Sleepy Chemists
Chemists were found on the floor of a boxcar while unloading drums of sodium cyanide. What happened to the chemists, were they poisoned?
Mysteries of Science
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