Electronics Assembly Knowledge, Vision & Wisdom
Jul 25, 2017
Delay Before Cleaning Partial Assemblies
Delay Before Cleaning Partial Assemblies
We're assembling circuit boards with a water soluble flux, but have run out of some parts. Is it acceptable to leave these partially assembled boards for 3 to 4 days, then put on the rest of the parts and then finally clean them?
Board Talk
Solution for Grape Effect
Our smaller parts are showing the 'grape' effect. What is the best solution for this since we cannot increase the conveyor speed or lower temperatures?
Ask the Experts
Cleanliness of Stencils and Misprinted Boards
Cleanliness of Stencils and Misprinted Boards
This paper covers how control of a stencil cleaner's cleaning ability is possible, but requires a preventative maintenance program.
Production Floor
Wireless Infrared Networks
Wireless Infrared Networks
Researchers have developed a wireless network based on harmless infrared rays. The capacity is more than 40 Gbit/s per ray and every device gets its own ray.
Technology Briefing
Evaluation of Molded Flip-chip BGA Packages
The results of this study demonstrate that the molded flip-chip BGA package is a cost effective and high reliability solution for 28nm FPGA devices.
Analysis Lab
Solderability of Vapor vs. Convection Reflow
Solderability of Vapor vs. Convection Reflow
This paper compares the solder wetting between vapor phase reflow and convection reflow using a specific Pb Free SAC solder paste.
Materials Tech
Electroplated Copper Filling of Through Holes
This paper discusses a through hole copper filling process for applications of high density interconnects and IC substrates.
Production Floor
Ask the Experts
Delamination Dilemma
Can you point to any other potential causes of delamination or any other steps we should take to prevent it?
Ask the Experts
Performance and Reliability Requirements of Soldering Fluxes
Paper outlines the evolution of flux chemistry and details the challenges in developing flux chemistries for current and future application.
Analysis Lab
Screen Printing and Humidity
Screen Printing and Humidity
Solder paste is drying out inside our screen printer. How can we increase humidity to slow drying of our solder paste?
Board Talk
From the Single Chip to Wafer Integration
The objective of this paper is to identify the various technological concepts and to give a focus on Chip in Wafer in Silicon technology.
Materials Tech
Countries Most (and Least) Likely to be Affected by Automation
Countries Most (and Least) Likely to be Affected by Automation
Around the world, automation is transforming work, business, and the economy. But, the impact of robotics, AI and the Internet of Things, will vary widely from country to country.
Technology Briefing
iNEMI Lead-free Wave Soldering Project
iNEMI Lead-free Wave Soldering Project
Paper provides an understanding of how wave soldering parameters correlate to performance and in selecting process parameters.
Production Floor
Ask the Experts
MELF Component Misalignment
We have glued SMD MELF components that are misaligned after reflow. If we eliminate the gluing of the MELF components there is no misalignment.
Ask the Experts
Polymer Thick Film That Was Thinned Out
Polymer Thick Film That Was Thinned Out
A factory is making circuits using polymer thick film. One day the ink was too thin, making it print poorly. What was causing this?
Mysteries of Science
Cartoon
"When I said it's time to step up to the plate, I didn't mean go to lunch early!"
Copyright © Randy Glasbergen
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