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Knowledge, Vision & Wisdom Apr 28, 2015
Larger Stencil Apertures and Type 4 Paste
What is your experience with larger size apertures and type four solder paste and how does it affect solder joints for non-collapsible BGA and CGA type solder joints?
Board Talk
Pros and Cons of Cleaning No-clean
With today's newer chemistries, what are the pros and cons of cleaning circuit boards assembled using a no-clean process?
Ask the Experts
Characterization of Solder Defects in Package on Package
Characterization of Solder Defects in Package on Package
This paper is part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls.
Analysis Lab
3-in-1 SMT Production Center
Essemtec
Looking for a SMT production center that is able to jet solder paste and/or glue and mount components in one machine? Click here to see Paraquda in action...
Essemtec
 
Discover New Facts About Parylene Coating
Diamond MT
Learn about the parylene deposition process, the main benefits of parylene, and the most common applications of parylene in a new free fact sheet titled Parylene 101 from Diamond-MT.
Diamond MT
 
Fracture Prediction in Lead-Free Joints
Fracture Prediction in Lead-Free Joints
Study examines applicability of solder joint fracture initiation criteria that would permit the prediction of solder joint strength.
Analysis Lab
Electroplated Copper Filling of Through Holes
This paper discusses a through hole copper filling process for applications of high density interconnects and IC substrates.
Production Floor
Circuit Insight Deliver Results!
IPC
Introduce your technology in Circuit Insight’s bi-weekly newsletter & website to see how digital sponsorship advertising delivers results. Learn more...
Circuit Insight
 
Europlacer's NEW Intelligent Feeders - ii-Feed
Europlacer
ii-Feed is a fully 'intelligent', fast-loading feeder; enabling accurate tape indexing and optimum productivity. ii-Feed Elements are compatible with all Europlacer machines. Learn more...
Europlacer North America
 
New Lithium Ion Battery - Outperforms by 300%
New Lithium Ion Battery - Outperforms by 300%
Researchers at the University of California Riverside have created a lithium ion battery that outperforms the current industry standard by 300 percent.
Technology Briefing
Rigid-Flex PCB Right the First Time - Without Paper Dolls
The biggest problem with designing rigid-flex hybrid PCBs is making sure everything will fold in the right way, while maintaining good flex-circuit stability and lifespan.
Production Floor
Master Bond
 
Printed Circuit Inc.
 
Most Important Factors for Screen Printing
Most Important Factors for Screen Printing
Which of these factors is more critical to the solder printing process, solder paste volume or solder print alignment?
Ask the Experts
Printed Circuit Structures, the Evolution of Printed Circuit Boards
The PCS concept will allow passives, actives and even antennas to move out of the XY plane and into the XZ and YZ planes.
Materials Tech
Quote in 24 Hours? No Problem
Advanced Assembly
We will return a quote to you in 24 hours or less. Simply upload your BOMs, Gerbers and XYRS files and see how we can be a great partner for you.
Advanced Assembly LLC
 
Got The BGA Blues?
ITM Consulting
ITM has extensive experience in resolving BGA soldering problems and other electronic assembly problems and defects. ITM Consulting solves problems! Learn more.
ITM Consulting
 
Does Copper Dissolution Impact Reliability?
Does Copper Dissolution Impact Reliability?
Results from this paper indicate concerns when severe copper dissolution occurs and shows signs of reduced reliability.
Analysis Lab
Component Moisture Question?
We mistakenly assembled circuit boards using BGA components that were not properly stored. Can we now rebake the assemblies?
Board Talk
See AdoptSMT at SMT 2015 Nuremberg
Adopt SMT
See AdoptSMT at SMT Nuremberg, Booth 7-100. Presenting Feeders, Spare Parts and Consumables for the European PCB Assembly industry. Learn more...
AdoptSMT
 
eSurface is the Game Changer for the PCB Industry
eSurface
eSurface enables you to: • Achieve Ultra-fine capability < 1/1 L/S; • Dramatically improve yields; • Reduce steps & cycle times; • Maximize efficiency
eSurface
 
         
Could Molybdenite Become a Replacement for Silicon in Electronics?
Could Molybdenite Become a Replacement for Silicon in Electronics?
While graphene is most often touted as a replacement for silicon in electronics due to its extremely high conductivity, it is not the only two-dimensional material that could play such a role.
Technology Briefing
Juki
Effect of Clamping Systems on Print Quality
Paper investigates the effect of top clamp and Y-snugger on a specially designed test stencil and production quality cell phone boards.
Production Floor
2015 IPC Certification Training Schedule
EPTAC
IPC Certification training schedule, new classes, new locations and all the expert training and support you need and expect. Learn more.
EPTAC
Problems with Blow Holes
We are having problems with what appear to be blow holes. Could the cause be due to an improper ratio of the lead to the hole?
Ask the Experts
Blackfox's Instructor's Courses
BLACKFOX
For companies developing in-house training programs, we provide Instructor Training, Certification, and Instructional Materials for all of the Blackfox Skill-Based Courses.
Blackfox Training Institute
Lead Poisoning - Was it from Wine?
Lead Poisoning - Was it from Wine?
A couple was found dead possibly from lead poisoning due to a pewter decanter containing wine. How could this happen?
Mysteries of Science
The first-ever temperature stable solder paste
Henkel
LOCTITE GC 10 is stable at 26.5°C for one year and up to 40°C for one month, while still offering unbeatable printability and reflow performance. Click to learn more.
Henkel Electronic Materials, LLC
Diamond MT
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