Electronics Assembly Knowledge, Vision & Wisdom
Apr 27, 2017
Best Method for Repairing Underfill Arrays?
What is the best method for removing an SMT array package that has been under-filled and cured. Is there an industry approved method? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this.
Hot or Cold DI Water Rinse?
How important is the use of hot water in our cleaning systems? Could we get equal results using a room temperature rinse?
Ask the Experts
Optimization of Stencil Apertures to Compensate for Scooping
This study investigates the scooping effect during solder paste printing as a function of aperture width, aperture length and squeegee pressure.
Automated Program Synthesis
Researchers are using a model of programming "automated program synthesis," computers generate pieces of code based on a user's intent.
pH Neutral vs. Alkaline Cleaning Agents
Study compares material compatibility and cleaning effectiveness of pH-neutral and alkaline technologies at low operating concentrations.
Reliability of ENEPIG by Sequential Thermal Cycling and Aging
Paper presents the reliability of LGA components assembled with tin-lead solder onto PCBs with an ENEPIG finish and subjected to thermal cycling and aging.
A Robust Fine Feature Printing Process
This paper evaluates many fine printing stencil factors that have an increased effect on the transfer efficiency of solder pastes.
Conformal Coating & Humidity
Can conformal coating protect a circuit board that will be operating in a humid environment? Is there a specific process?
Ask the Experts
Board, Package and Die Thickness Effects Under Thermal Cycling Conditions
A model that enables the scaling of solder joint failure cycles for board and die or substrate thickness effects under thermal cycling conditions is discussed.
Can We Rework Lead-Free Boards with Leaded Solder?
Can boards built with lead-free be reworked with leaded solder? I realize they may not comply with RoHS, but will they be reliable?
Comparison of SAC105 and SAC305 Solders
In this paper, the thermal fatigue performance under accelerated test conditions is compared for three common BGA ball alloys.
How Commercial Drones Will Optimize the Supply Chain
Drone vehicles are becomming cheaper, smarter, more powerful, and more reliable. How will this technology enter the commercial supply chain?
Lead-Free Flux and Influence on Cleaning
Lead-free flux technology is more difficult to clean. Cleaners with a better matching solvency for the residues are needed.
Problems Hand Soldering 24 Layer Boards
We are assembling a back plane board with 24 layers. We are finding that the solder does not flow through to the other side of the board.
Ask the Experts
Playing with Plasma
Playing around with high voltage, or plasma, is not for the shy or clumsy. Don't try this at home.
Mysteries of Science
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