Electronics Assembly Knowledge, Vision & Wisdom
Oct 19, 2017
Is Customer Approval Required for Class 3 Repair?
Is Customer Approval Required for Class 3 Repair?
We have a case where a non-aerospace customer's board was repaired without prior authorization. It was for a class 3 assembly. Does it specify in an IPC document that customer approval is required for class 3 repairs?
Board Talk
Most Important Factors for Screen Printing
Which of these factors is more critical to the solder printing process, solder paste volume or solder print alignment?
Ask the Experts
4 Techniques for Removing Solder Mask
4 Techniques for Removing Solder Mask
This program explains four techniques for removing solder mask including grinding, milling, chemical stripping, and micro-blasting.
Production Floor
The Declining Cost of Distance
The Declining Cost of Distance
The forces that propelled the growth of cities and discouraged businesses from locating far from urban centers is being reversed by digital technologies.
Technology Briefing
Quantitative Analysis of Corrosion Resistance
An electrochemical method via sequential electrochemical reduction analysis instrument to quantify the corrosion resistance of the EN deposit is proposed.
Analysis Lab
Reliability Improvements by the Creation of Intermetallic Connections
Reliability Improvements by the Creation of Intermetallic Connections
The possibilities to combine small and large passive components, and new devices for active components with an increase in reliability is discussed.
Materials Tech
Reliability of Stacked Microvia
Study was designed to understand the reliability of Type 1, 2, and 3 Microvias. The reliability test coupons included four stacks of microvias and a buried via.
Production Floor
Ask the Experts
Cause of Unusual Contamination?
We have 40 PCB assemblies with unusual contamination. Do you have any ideas what the contamination is, and what caused it?
Ask the Experts
Evaluating Accuracy of Thermocouple Attach Methods
The goal of this study was to identify a non-destructive method for thermocouple attachment that provides a small offset to the "actual temperature under a BGA."
Analysis Lab
What Are the Benefits and Drawbacks of OSP Finish?
What Are the Benefits and Drawbacks of OSP Finish?
What are the advantages of using an OSP surface finish? What precautions should be taken when using circuit boards supplied with OSP finish?
Board Talk
Insulation Resistance of Dielectric Materials
This investigation measures the leakage current within internal PCB layers during exposure of various specimens to a controlled ground-based test environment.
Materials Tech
Breakthrough Printing 3D Carbon Fiber Composites
Breakthrough Printing 3D Carbon Fiber Composites
Researchers recently printed 3D carbon fiber composites offering greater control and optimization of the lighter-weight, yet stronger-than-steel material.
Technology Briefing
Electrical Testing of Passive Components
Substrates have become more critical with regard to pitch and density leading to increased use of buried components. This paper reviews testing for buried capacitors.
Production Floor
Zip-lock Bags vs. Heat Sealed Bags
Are zip-lock bags vs. heat sealed bags an acceptable option for storage of moisture sensitive components?
Ask the Experts
Mysterious Drop In Production Yield
Mysterious Drop In Production Yield
A factory manufactured membrane switches. After installing exhaust fans the yield dropped. What was causing this decrease in production?
Mysteries of Science
Cartoon
"There is always room for improvement. It's a small room with no windows or distractions. We already moved your things."
Copyright © Randy Glasbergen
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