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Knowledge, Vision & Wisdom May 5, 2015
What Causes Chip Blow Off During Reflow?
What can cause a 0603 passive component to blow off the circuit board during reflow as if a firecracker was put underneath? That's a pretty graphic description.
Board Talk
Dewetting of Acrylic Conformal Coating
We are using a no clean, alcohol based flux for wave. We are coating the assemblies with an acrylic conformal coating, but are experiencing dewetting of the coating. Any suggestions?
Ask the Experts
Stencil Design for Ultra Fine Pitch Printing
Stencil Design for Ultra Fine Pitch Printing
Miniaturization is pushing the stencil printing process. As features become smaller, solder paste transfer efficiency is becoming more critical.
Production Floor
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3D Printing Circuit Board Assemblies
3D Printing Circuit Board Assemblies
Recently, printers have advanced to the point that they can even print sensors and electronic components on 2-D and 3-D substrates.
Technology Briefing
Reliability Impact of Partial Pad Craters
PCB pad craters are generally associated with single overstress events that cause immediate failure. This investigation examines the effects of partial pad craters on reliability.
Analysis Lab
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How to Protect Internal Circuitry from a Harsh Environment
How to Protect Internal Circuitry from a Harsh Environment
Paper discusses recent developments in conformal coating to meet criteria for increased reliability at a lower cost for high production volume devices.
Materials Tech
Collaborative Cleaning Innovations
We'll cover how collaboration from equipment and cleaning material companies has led to innovations for improving throughput and residue removal under low standoff components.
Production Floor
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Questions About Soldering to Flex Circuits
Questions About Soldering to Flex Circuits
What is the best way to solder fine pitch surface mount connectors to a thin flexible circuit?
Ask the Experts
Test Optimization to Improve Rework
Paper reviews how to use test machines to diagnose defects and how to reduce defects from a SMT line.
Analysis Lab
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Can Water Harm Electronic Components?
Can Water Harm Electronic Components?
A new quality assurance engineer insists electronic components should not be cleaned with water. Can you enlighten us?
Board Talk
Nanomaterials Performance Advantages
Low temperature reactivity, reaction speeds, flexibility and fine pitch considerations dictate that nanomaterials should be given serious consideration in printed electronics.
Materials Tech
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The Robotic Explosion
The Robotic Explosion
Today for better or worse we're witnessing an explosion in robots. What will these robots look like and what will they do? What impact will they have on productivity, employment and personal satisfaction? What are the opportunities and threats? We'll show you.
Technology Briefing
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Cleaning Assemblies in Batch Systems
This study compares the relative performance of batch spray-in-air, batch immersion and batch vapor degreasing processes for cleaning underneath low stand-off components.
Production Floor
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Uncontrolled Environment Causing Problems
We are seeing a high fallout due to insufficient paste application on TSOP components. Is there such a thing as low humidity, low temp lead free - no clean paste?
Ask the Experts
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Polymer Thick Film That Was Thinned Out
Polymer Thick Film That Was Thinned Out
A factory is making circuits using polymer thick film. One day the ink was too thin, making it print poorly. What was causing this?
Mysteries of Science
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