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Knowledge, Vision & Wisdom May 7, 2015
Is There a Standard Usage Rate for Stencils?
Is there a recommended usage rate for stencils? Is there a way to determine when it's time to replace a squeege?
Board Talk
What Causes Oxidation on SMT Pads?
What causes oxidation on surface mount pads? We believe oxidation on BGA pads is resulting in poor solder joints.
Ask the Experts
Effect of Process Changes and Flux on Mid-Chip Solder Balling
Effect of Process Changes and Flux on Mid-Chip Solder Balling
Paper documents experimental work performed to understand the impact on mid-chip solder balling from the manufacturing process and flux chemistry.
Production Floor
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Early Detection of PCB Pad Cratering Failures
In this study, a new monitoring approach based on acoustic emission has been introduced for early detection of pad cratering failure.
Analysis Lab
The Discipline of Business Experimentation
The Discipline of Business Experimentation
We'll tell you how you can determine in advance whether a new product or business program will succeed by subjecting it to a rigorous test.
Technology Briefing
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Automating the Rework Process
This paper describes Automated Optical Rework technology and its advantages for advanced circuit board production including examples of actual before and after results.
Production Floor
Thermally, Electrically Conductive Adhesive to Control Heat in PCBs
Thermally, Electrically Conductive Adhesive to Control Heat in PCBs
Study illustrates the complexity of achieving optimum thermal and electrical performance with any circuit, especially at higher frequencies.
Materials Tech
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HASL Surface Finish and Coplanarity
HASL Surface Finish and Coplanarity
We have a customer that has requested HASL surface finish. This assembly includes a 256 ball BGA component. Should we be concerned with coplanarity?
Ask the Experts
Effects of Whiskers on Nanocrystalline Copper
This paper compares the formation of tin whiskers on nanocrystalline and conventional polycrystalline copper deposits.
Analysis Lab
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Components Near PCB Edges
Components Near PCB Edges
What issues are we likely to see whan we place BGA components very close to PCB edges? What impact might it have on reliability?
Board Talk
iNEMI Lead-free Wave Soldering Project
Paper provides an understanding of how wave soldering parameters correlate to performance and provides information in selecting process parameters.
Production Floor
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Faster Computers, Better Sensors Using Graphene
Faster Computers, Better Sensors Using Graphene
With properties that promise faster computers, better sensors and much more, graphene has been dubbed the "miracle material." However, producing it on an industrial scale has proved elusive.
Technology Briefing
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Solder Fortification with Preforms
PIP has been used for several decades, but it's not always possible to print enough paste to obtain an acceptable joint. This paper covers design and assembly techniques using solder performs.
Materials Tech
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Reusing Solder Paste Samples
Is it permissible to return a sample of paste to the original solder paste container after the sample has been used to measure viscosity?
Ask the Experts
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The Suspicious Bicycle
The Suspicious Bicycle
An employee left the plant on his bicycle looking unsteady. His bike seemed to weigh more than 100 pounds. Why was the bike so heavy?
Mysteries of Science
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Cartoon
"I found you a donor for an attitude transplant."
Copyright © Randy Glasbergen