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Knowledge, Vision & Wisdom Mar 26, 2015
Is No-Clean the Trend for QFN Components?
Is there a continuing trend to move to no-clean for QFN components, or is industry in agreement that certain technologies will have to continue using a traditional cleaning process?
Board Talk
Proper DI Water Resistivity for PCB Cleaning?
What the proper resistivity reading for DI water when cleaning electronic assemblies and why? Is there a specification?
Ask the Experts
Selecting Stencil Technologies to Optimize Print Performance
Selecting Stencil Technologies to Optimize Print Performance
Research has been done to identify individual factors in stencil performance; this paper discusses the real-world application of numerous findings.
Production Floor
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Embedding Passive and Active Components: PCB Design and Fabrication
Embedding Passive and Active Components: PCB Design and Fabrication
This paper focuses on six basic embedded component structure designs described in IPC-7092.
Materials Tech
Semiconductor Spray Paint
Researchers at Wake Forest University have developed a high-performance semiconductor "spray paint" that can be applied to large areas without losing electrical conductivity.
Technology Briefing
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Head-On-Pillow Defect - A Pain in the Neck
The head on pillow defect is becoming more common. This paper describes an occurrence for an OEM and explains how it was dealt with.
Analysis Lab
Jetting Solder Paste Opens Up New Possibilities
Jetting Solder Paste Opens Up New Possibilities
Today Jet Printing is no longer seen as a futuristic technology but it has proven itself and the technology is still gaining momentum.
Production Floor
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Solder Paste Transfer Greater Than 100%
Solder Paste Transfer Greater Than 100%
I understand the concept of transfer efficiency and the relationship to solder paste volume, is it possible to produce transfer efficiency greater than 100% of the theoretical volume?
Ask the Experts
The Digital Solder Paste
This paper discusses a process for creating a digital solder paste using quantitative benchmarking techniques.
Materials Tech
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Intermetallic Crystals and Role in Microbridges
This paper documents several short circuit failures caused by copper tin intermetallic crystals, the root cause, and rework techniques that can be used to prevent its occurrence.
Analysis Lab
Corrosion Resistant Servers for Free-Air Cooling Data Centers
Corrosion Resistant Servers for Free-Air Cooling Data Centers
This paper describes a corrosion resistant server design suitable for reliable operation in a free-air cooling data center.
Production Floor
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The Stresses of Commuting
The Stresses of Commuting
The more time you spend getting to and from work, the less likely you are to be satisfied with life, says a new study published in World Leisure ...
Technology Briefing
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Electroplating of Cu in TSV and Characteristics of Low Alpha Solder Bump
Electroplating of Cu in TSV and Characteristics of Low Alpha Solder Bump
The research objective is to estimate metallurgical and mechanical properties of low alpha solder. Cu-filling property to TSV was also investigated.
Materials Tech
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Urethane Conformal Coating Problem
Urethane Conformal Coating Problem
We use urethane conformal coating and have difficulty with the coating adhering to the board despite washing and efforts to avoid any silicon contamination.
Ask the Experts
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Wasp Vs. Spider
Wasp Vs. Spider
A battle for the ages as a spider and wasp face-off. Let's get ready to bumbleeeee.
Mysteries of Science
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"I'm afraid I have to let you go. You test positive for decaf."
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