Electronics Assembly Knowledge, Vision & Wisdom
Dec 5, 2019
What is the Best Way to Clean Solder Stencils?
What is the Best Way to Clean Solder Stencils?
Every 4 hours we remove each solder paste stencil and wipe both sides using IPA lint free wipes and then blow drying. Is this the proper procedure? The Assembly Brothers, Jim Hall and Phil Zarrow, share their experiences.
Board Talk
Surface Treatment Enabling Low Temperature Soldering to Aluminum
An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on Polyester (Al-PET) substrates.
Production Floor
Economic Order Quantity (EOQ) in Electronics Contract Manufacturing
Reliable Novel Nickel-Free Surface Finish Solution for High-Frequency PCB Applications
Selective Soldering Solutions for High Thermal Mass & Fine-Pitch Components
A Novel ENIG Surface Finish for Robust Solder Joints
Improve Performance & Reliability of LED Systems With Protection Materials
Differences Between Through-Hole and Surface-Mount
Automating the Incoming Materials Process
Void-Free and Worry-Free
Ask the Experts
Bromine Free PWBs
What are the pros and cons of bromine in PWBs? Several of our customers require bromine free PWBs, but some of our suppliers do not think that is a good way to go. ...
Ask the Experts
The Great AI Boom Ahead
The Great AI Boom Ahead
Investment in artificial intelligence is rising rapidly. AI-related opportunities and threats are just becoming visible to most decision-makers.
Technology Briefing
Realization of a New Concept for Power Chip Embedding
This paper will focus on the behavior of the power module for operational conditions of a PedEleC (Pedal Electric Cycle) application.
Analysis Lab
Behavior of Materials in the Manufacturing Environment
Behavior of Materials in the Manufacturing Environment
This document shows the effect of Dk and Df values from 10GHz to 20GHz and also shows their performance for lead-free assembly.
Materials Tech
Effect of SMT Component Package Design on Cleaning Effectiveness
This paper will discuss the "physics" of liquid entrainment / entrapment / cleaning / rinsing and their effects on component materials.
Production Floor
Ask the Experts
Glued SMT Components Falling Off
We are having issues with glued SMD capacitors falling off after going through the oven curing process. We are using well known adhesive from a quality supplier. ...
Ask the Experts
Characterizing Thermal Fatigue Reliability of Third Generation PB-Free Alloys
The progress of an experimental program for evaluating thermal fatigue performance of third generation alternative Pbfree solder alloys is discussed.
Analysis Lab
Help With Lead to Hole Ratio
Help With Lead to Hole Ratio
What is the proper minimum gap between a round conductor lead and the PCB hole that will allow proper solder fill? Where can I find the recommended guideline?
Board Talk
The Role of Organic Amines in Soldering Materials
Paper shows that tests can be developed to characterize fundamental properties of activator packages that directly impact performance.
Materials Tech
Breakthrough in Recyclable Plastics
Breakthrough in Recyclable Plastics
A breakthrough from scientists at Lawrence Berkeley Lab could finally provide the solution we’ve been waiting for: truly recyclable plastics.
Technology Briefing
Influence of Copper Conductor Surface Treatment for High Frequency PCB
Paper provides results of adhesion performance and electrical properties using certain types of dielectric material for high frequency PCBs.
Production Floor
Characterization of Solder Defects in Package on Package
This paper is part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls.
Analysis Lab
Flying Saucer Over The Factory
Flying Saucer Over The Factory
At a new circuit factory an employee heard a thud and saw a bright metal dome-shaped object falling from the sky. Where did it come from?
Mysteries of Science
Cartoon
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