Electronics Assembly Knowledge, Vision & Wisdom
May 23, 2019
Reflow For Rigid Flex
Reflow For Rigid Flex
We have a new PCB assembly that includes a section of flex cable and FR4 circuit board. What are the reflow rules I need to consider? Jim Hall and Phil Zarrow, the Assembly Brothers, share their own insight and experience.
Board Talk
Stencil Printing Yield Improvements
In this paper two methods were studied to improve solder paste release. A nano-scale hydrophobic, oleophobic and adhesion promoting coating.
Production Floor
High Reliability Alloy for Auto Apps
Dispelling Dry Storage Myths
Strategies For Ensuring a Smooth Assembly Process
New Generation of Conformal Coatings for Challenging Operating Environments
US Army & nScrypt Direct Digitally Manufacture 3D Printed Circuit Structure
Handling Risk Mitigation in Hand Soldering
Oven vs Product Profiling
Keeping Counterfeit Components Out of Supply Chain
Ask the Experts
How to Detect Counterfeit Components?
I'm exploring issues with counterfeit components and would like to know the best technologies available to detect counterfeit devices. Can X-ray or other inspection ...
Ask the Experts
Ice and Frost Can Damage Machines
Ice and Frost Can Damage Machines
Research describes unique properties of materials known as phase-switching liquids, or PSLs, that hold promise as next-generation anti-icing materials
Technology Briefing
Low Temperature Solder Interconnect Reliabiilty in Enterprise Computer and Automotive Electronics
This article studies a new low melting temperature solder interconnect application and reliability on various product categories.
Analysis Lab
Effect of Aging on SAC305 Solder Joints Reliabiity in Accelerated Fatigue Shear Test
Effect of Aging on SAC305 Solder Joints Reliabiity in Accelerated Fatigue Shear Test
This study aims to assess the reliability of the most common solder material under different cyclic stress levels and aging times at an elevated temperature.
Materials Tech
Assembly Process Feasibility of Low Silver Solder Paste
This paper presents performance/process capability of various low/no silver alloy solder pastes.
Production Floor
Ask the Experts
Baking Concerns for Stacked Trays of Components
When we are baking multiple trays of parts stacked on top of each other in our oven, will this lessen the effect of baking on the components in the middle trays. Do ...
Ask the Experts
Risk for Ceramic Component Cracking Dependent
The paper discusses the differences of the alloy, based stress in ceramic components due to passive cycle tests, real customer tests, and stress analyses.
Analysis Lab
Solder Paste Transfer Efficiency - What/Why
Solder Paste Transfer Efficiency - What/Why
I've heard the term transfer efficiency relating to printing. What does this term refer to? What actions impact solder paste transfer efficiency?
Board Talk
Printed Circuit Structures, the Evolution of Printed Circuit Boards
The PCS concept will allow passives, actives and even antennas to move out of the XY plane and into the XZ and YZ planes.
Materials Tech
The Brave New World Comes to California
The Brave New World Comes to California
Technology has been a major force, but the current surge is unprecedented. The past five years, five technology companies grew in value by $2.7 trillion.
Technology Briefing
Engineered Tin-Copper Alloys in Selective Soldering
The performance with one alloy under design conditions that make soldering difficult demonstrate the need to evaluate the performance differences.
Production Floor
Embracing a New Paradigm: Electronic Work Instructions (EWI)
To stay competitive in today's evolving global marketplace, manufacturing must recognize and embrace the new EWI paradigm.
Analysis Lab
Pay Clerk Production Woes
Pay Clerk Production Woes
A company was having quality control problems. Friday morning was when the problems happened, but why just on Fridays?
Mysteries of Science
Cartoon
"There is always room for improvement. It's a small room with no windows or distractions. We already moved your things."
Copyright © Randy Glasbergen