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Electronics Assembly Knowledge, Vision & Wisdom
Apr 24, 2018
Help With Lead to Hole Ratio
Help With Lead to Hole Ratio
What is the proper minimum gap between a round conductor lead and the PCB hole that will allow proper solder fill? Can you point us to a guideline with the recommended through hole component to hole diameter ratio? What can be do to improve barrel fill?
Board Talk
Gold Plating and Embrittlement
What is your opinion regarding gold plating removal to improve soldering? In the past gold plating was thick enough to cause gold embrittlement in solder joints.
Ask the Experts
Best Practices for Optimizing Your Selective Soldering Process
Reducing the Cost of Applying Package-Level EMI Shield Coatings
Method for Repeatable Measurement of Sparkle in Anti-Glare Displays
Selective Soldering is Playing an Increasing Role in PCB Assembly
Why vapor phase soldering?
Why Experience Matters in PCB Assembly
How Flex Circuits and Wearable Tech are Changing the World of Medicine
Conformal Coatings that don't crack under pressure
Rework of High I/O Column Grid Arrays
Rework of High I/O Column Grid Arrays
Off-the-shelf column grid arrays are now being considered for use in a number of NASA systems. This paper presents rework and re-column attachment data.
Production Floor
Realizing the Potential of 4D Printing
Realizing the Potential of 4D Printing
4D printing promises a library of smart materials that are conducive to efficient manufacturing with the ability to manufacture complex geometries.
Technology Briefing
Conformal Coating - Performance Comparison Environmental Testing
The experiment compares the behavior of acrylic coating used on large scale in various applications and a specific super-hydrophobic nano conformal coating.
Analysis Lab
High Thermo-Mechanical Fatigue and Drop Shock Resistant Alloys for Ball-Grid Array
High Thermo-Mechanical Fatigue and Drop Shock Resistant Alloys for Ball-Grid Array
High-Ag, low-Ag: Which alloy fits best certain application? Here we present a report on the thermal and mechanical reliability of alloys.
Materials Tech
New Approaches to Develop a Scalable 3D IC Assembly Method
In this paper, we will discuss various assembly options and the challenges posed by each.
Production Floor
Ask the Experts
Customer Approval for Repairs
We have a case where a customer's board was repaired without authorization. Does IPC specify that customer approval is required for class 3 repairs?
Ask the Experts
Ball Pull Test Efficiency for the PCB Pad Cratering Validation
In the study cold ball pull testing is used to validate the resistance of PCB pad cratering for different ultra-low loss dielectrics materials.
Analysis Lab
Can a CTE Mismatch Cause Reliability Problems?
Can a CTE Mismatch Cause Reliability Problems?
Does usage of BGAs, QFNs or SONs have an increased risk for reliability of solder joints due to the CTE mismatch with the base board material FR4?
Board Talk
Long Term Thermal Reliability of Printed Circuit Board Materials
This paper describes the purpose, methodology, and results to date of thermal endurance testing performed at the company.
Materials Tech
Addressing the Counterfeit Goods Crisis
Addressing the Counterfeit Goods Crisis
A new report titled The Economic Impacts of Counterfeiting, estimates that by 2022, the global economic value of counterfeiting could reach US$2.8 trillion.
Technology Briefing
Selective Reflow Rework Process
This paper discusses some aspects of the process optimization and changes made to improve the quality of the rework process.
Production Floor
QFN Open Solder Joints
We are experiencing opens on assembled QFN components at a rate of approx 9%. Usually only 1 or 2 pads have opens. What is happening?
Ask the Experts
Lead Poisoning - Was it from Wine?
Lead Poisoning - Was it from Wine?
A couple was found dead possibly from lead poisoning due to a pewter decanter containing wine. How could this happen?
Mysteries of Science
Cartoon
"The weather report is predicting 3 to 6 inches of paperwork."
Copyright © Randy Glasbergen