Technical Papers
Selective Solder Nozzle Technology for Reduced Dross and Solder Balls
Artificial Intelligence: How far can you go?
Thermal Control for Big Data
When to Request a Custom Reflow Profile
Integrating Automated Storage Systems to Facilitate Industry 4.0
Is Your Dry Storage J-Standard Compliant?
The Best Alternative to Dispensed Adhesives for SMT Assembly
Reliable void detection with fast inline X-Ray inspection
MORE TECHNICAL PAPERS
Ask the Experts
Soldering Components with Silver Pads
Environment Impact on Assembly, Printing and Reflow
Solder Balling Prediction Formula
Old Components and Blow Holes
Estimating Failure Rate During Rework
Coating to stop tin whisker growth?
Cleaning an assembled board with IPA
Remove and replace a 240 pin connector
MORE ASK THE EXPERTS
Latest Industry News
Soldiers could teach future robots how to outperform humans
The iPhone is still breaking sales records during the pandemic
Foxconn says China can no longer be "the world's factory"
The Counterintuitive Way Social Media Can Reduce Stress
Do Engineers Live Longer? A Look at Occupational Factors’ Effect on Longevity
How to Work from Home Successfully
Smartphone shipments in China plunge 35% in July: government data
China handset players launch 5G phones in Taiwan
MORE INDUSTRY NEWS
Aug 13, 2020
Cleaning Reballed BGA Components
Cleaning Reballed BGA Components
We currently clean reballed BGAs using an ultrasonic cleaner followed by baking to remove moisture. Is this an acceptable practice? Jim Hall and Phil Zarrow, the Assembly Brothers, offer their own suggestions and expertise.
Board Talk
Fill the Void II: An Investigation into Methods of Reducing Voiding
This paper is a continuation of previous work on voiding. The voiding results are summarized and recommendations made for reduction of voiding.
Production Floor
Revolutionized Energy Storrage in Electric Vehicles
Revolutionized Energy Storrage in Electric Vehicles
Researchers revealed a technology that has the potential to revolutionize energy storage in electric vehicles and reduce energy loss.
Technology Briefing
Final Finish Specifications Review
Specifications are consensus documents agreed upon by a panel of industry participants composed of suppliers, manufacturers, assembly houses and users.
Analysis Lab
DFX on High Density Assemblies
DFX on High Density Assemblies
This paper discusses selection of solder paste based on end product and the need to conduct proper root cause analyses before making any material changes.
Materials Tech
Challenges on ENEPIG Finished PCBs
Through extensive investigation, using 8D and Kepner-Tregoe problem solving methods, solutions were discovered in the majority of cases.
Production Floor
Testing PCBs for Creep Corrosion
This paper covers the iNEMI technical subcommittee test for creep corrosion using a flowers-of-sulfur based qualification test.
Analysis Lab
We Bake, But Still Have Delamination, Why?
We Bake, But Still Have Delamination, Why?
When our PCBs are wave soldered and then pass through reflow most had issues with delamination. Where should we look to solve this?
Board Talk
Screening of Lower Melting Point Pb-Free Alloys
Program explores the manufacturability and reliability for Pb-free Bi-containing alloys in comparison with conventional SAC305 and SnPb assemblies.
Materials Tech
New Stretchable Battery for Wearable Electronics
New Stretchable Battery for Wearable Electronics
Researchers have developed a soft and stretchable battery that stores power more safely than the flammable formulations used in conventional batteries today.
Technology Briefing
Hand Printing using Nanocoated and other High End Stencil Materials
This study details the effectiveness of nanocoating materials, high end stainless steel stencil materials, as they relate to the manual SMT printing.
Production Floor
Board Processes and Effects on Fine Copper Barrel Cracks
This research is to determine if there is a relationship between PCB fabrication processes and the prevalence of fine barrel cracks.
Analysis Lab
The Epoxy Mixing Mix-up
The Epoxy Mixing Mix-up
Epoxy resin batches were a little off target. Workers were rotated and the problem disappeared. Were employee causing this problem?
Mysteries of Science
Influence of Copper Conductor Surface Treatment for High Frequency PCB
Paper provides results of adhesion performance and electrical properties using certain types of dielectric material for high frequency PCBs.
Production Floor
Virtual Reality and Augmented Reality for Businesses
Virtual Reality and Augmented Reality for Businesses
A team developed moldable nanomaterials using metamaterials, allowing the commercialization of inexpensive and thin VR and AR devices.
Technology Briefing
TOF SIMS Analysis for SnO Determination
During the production of Lead-Free Hot Air Solder Leveling (LF HASL), non-wetting issues in several components were found including BGA pad.
Analysis Lab
Reliability of Copper, Gold, Silver and PCC Wirebonds Under Sustained Operation
Reliability of Copper, Gold, Silver and PCC Wirebonds Under Sustained Operation
In this paper, a detailed study of the electrical and mechanical degradation of wirebonds under high temperature exposure is presented.
Materials Tech
Effect of SMT Component Package Design on Cleaning Effectiveness
This paper will discuss the "physics" of liquid entrainment / entrapment / cleaning / rinsing and their effects on component materials.
Production Floor
Technology Corner
3D Visual Inspection
Vision Engineering Inc.
BERGQUIST Liqui-Form TLF 6000HG RRU
Henkel Corporation
Making Ovens Smarter
KIC
Real-time X-ray Inspection Systems
Glenbrook Technologies Inc.
A Full-Line of Programming Solutions
BPM Microsystems
MORE TECHNOLOGY CORNER
Board Talk
Cleaning Reballed BGA Components
We Bake, But Still Have Delamination, Why?
Reflow For Rigid Flex
Solder Paste Volume for BGA Rework
Problems With Starved "J" Lead Joints
Delay Before Cleaning Partial Assemblies
Can a CTE Mismatch Cause Reliability Problems?
Solder Paste Transfer Efficiency - What/Why
MORE BOARD TALK
Questions and Comments
Why Battery Powered Cars Are Not the Future
Like the sound of an engine not the whine of ...
Victor Healey
Reflow For Rigid Flex
Rigid-flex, actually all flex can heat up more than twice ...
Richard Stadem, Analog Technologies Corp.
Problems With Starved
If the quantity of J-lead components per CCA and the ...
Richard Stadem, Kongsberg Defence AS
Flux Residue Causing Test Issues
No-clean fluxes is a basically a general term. So long ...
KHChew, Quantum Chemicals
Variations in SAC 305 Solder
I agree with everything Phil and Jim say but there ...
Timothy ONeill, AIM
MORE COMMENTS
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