Electronics Assembly Knowledge, Vision & Wisdom
May 21, 2019
Problems With Starved "J" Lead Joints
Problems With Starved
We have insufficient solder joint heel fillets with a PLCC J lead component. We cannot increase the stencil thickness. What do you advise? The Assembly Brothers, Phil Zarrow and Jim Hall, answer this question.
Board Talk
A New Line Balancing Method
In this paper the authors present a new method of handling an assignment problem for hybrid manual and robotic assembly mixing lines.
Production Floor
High Reliability Alloy for Auto Apps
Dispelling Dry Storage Myths
Strategies For Ensuring a Smooth Assembly Process
New Generation of Conformal Coatings for Challenging Operating Environments
US Army & nScrypt Direct Digitally Manufacture 3D Printed Circuit Structure
Handling Risk Mitigation in Hand Soldering
Oven vs Product Profiling
Keeping Counterfeit Components Out of Supply Chain
Ask the Experts
Baking Concerns for Stacked Trays of Components
When we are baking multiple trays of parts stacked on top of each other in our oven, will this lessen the effect of baking on the components in the middle trays. Do ...
Ask the Experts
3D Stretchable Circuits
3D Stretchable Circuits
A team has built a stretchable "electronic patch," which can be worn on the skin and used to wirelessly monitor physical and electrical signals.
Technology Briefing
Assessment of 2nd Level Interconnect Quality in Flip Chip Ball Grid Array Package Using Laser Ultrasonic Inspection Technique
Wire bonding is extensively used in the electronic packaging industry. One of the difficulties with flip chip technology is testing its reliability.
Analysis Lab
Low Temperature Soldering: Reflow Enhanced Mechanical Reliability
Low Temperature Soldering: Reflow Enhanced Mechanical Reliability
In this work, we further discuss solderability and mechanical reliability of a novel low temperature proprietary alloy (generically called as X46).
Materials Tech
Design for Testability to Overcome Functional Board Test Complexities
In this paper the author reviews how Design for Testability techniques can be an effective way to reduce functional board test programming complexity.
Production Floor
Ask the Experts
Tough Hand Soldering Problem
I work in an auto glass factory and we're having problems soldering the defrost cable wire to the windshield grid pattern. I think it has to do with factory temperature ...
Ask the Experts
Reworkable Edgebond Applied Wafer-Level Chip-Scale Package
This paper presents data showing that localized distribution of recrystallized grains is an accurate indicator of solder joint life-cycle degradation and enhancement.
Analysis Lab
Going Beyond Your Solder Paste Work Life
Going Beyond Your Solder Paste Work Life
Solder paste used for a problem batch of board exceeded the 12 hour work life by one hour. Could this cause soldering problems for small chip components?
Board Talk
Evaluation and Qualification of Reworkable Underfill Materials
Study investigates, evaluates and qualifies reworkable underfill materials for BGAs, Leadless devices, QFNs, and other devices to improve reliability.
Materials Tech
Why AI Isn't the Death of Jobs
Why AI Isn't the Death of Jobs
A probable outcome for companies that use AI only to increase efficiency. Companies using AI to drive innovation are likely to increase head count than reduce it.
Technology Briefing
Fine Pitch Flip Chip Assembly Process Underfill, Evaluation and Reliability
The paper compares the best flux and underfill combination in reliability performance was selected and applied to the production process.
Production Floor
Board, Package and Die Thickness Effects Under Thermal Cycling Conditions
A model that enables the scaling of solder joint failure cycles for board and die or substrate thickness effects under thermal cycling conditions is discussed.
Analysis Lab
Danger on the Adhesive Coating Line
Danger on the Adhesive Coating Line
A plant worker adjusting rollers on an adhesive line suddenly began to act strangely. What caused the worker's spaced out appearance?
Mysteries of Science
Cartoon
"Just the same, it's nice to get an award."
Copyright © Randy Glasbergen