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The paper describes four case studies of solder joint embrittlement, three with Sn63Pb37 and one with SnAg3.7 solder alloy. Materials Tech
In this paper, the effect of mixing solder sphere alloys with Bi-based solder pastes on the component reliability in accelerated thermal cycling is studied. Materials Tech
Study reviews performance of pH neutral cleaning agents compared to alkaline cleaning alternatives and includes field data. Materials Tech
This paper focuses on six basic embedded component structure designs described in IPC-7092. Materials Tech
This study is broken into two parts, first a review of the solubility of some critical ions in different ratios of IPA/DI and at different temperatures. Materials Tech
This paper focuses on the surface insulation resistance (SIR) differences between rosin-containing and rosin-free flux formulations. Materials Tech
This paper describes the approach for measuring the solder dissolution that can be used to optimize soldering process profiles for electronic assemblies. Materials Tech
A novel ceramic-functional-particle-filled polymer composite material has been developed for use either discrete elements on the PCBs. Materials Tech
This paper gives a short overview about standard thermal solutions like thick copper, thermal vias, plugged vias or metal core based PCBs. Materials Tech
Several methods of minimizing voids are presented. Printing solder paste with gas escape routes is an excellent way to reduce voiding. Materials Tech |
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