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Cu Conductive Paste as Via Filling Materials for Various Substrates
In this study, we developed a Cu paste that can be used as a filling material for through silicon via (TSV), through glass via (TGV), and organic substrates.
Materials Tech
Insulation Resistance of Dielectric Materials
This investigation measures the leakage within internal PCB layers during exposure of various specimens to a controlled ground-based test environment.
Materials Tech
Long Term Thermal Reliability of Printed Circuit Board Materials
This paper describes the purpose, methodology, and results to date of thermal endurance testing performed at the company.
Materials Tech
Investigation of Copper Sinter Material for Die Attach
3 copper powders were tested for their feasibility to use as die attach material for pressure sintering process without prior treatment with reducing agents.
Materials Tech
Nanocopper Based Paste for Solid Copper Via Fill
This paper discusses a nano copper based paste for use in via filling.
Materials Tech
Reliability of New SAC-Bi Solder Alloys in Thermal Cycling with Aging
The effect of micro-alloying to SAC based solder materials on component reliability was studied, considering various factors of solder paste and surface finish.
Materials Tech
Expandable Bio-based Polymers: Future for Electronics Ruggedization
This paper presents a bio-based, expandable, thermoset solution, a low density, light weight method to effectively encapsulate and protect electronic components.
Materials Tech
Reliability Improvements by the Creation of Intermetallic Connections
The possibilities to combine small and large passive components, and new devices for active components with an increase in reliability is discussed.
Materials Tech
Discrete Carbon Nanotube Implementation for use in ESD Tooling
This research illustrates the improvement in volume and surface resistivity for trays and tooling fixtures manufactured usin functionalized carbon nanotubes.
Materials Tech
New-Generation, Low-Temperature Lead-Free Solder
In this paper, the roles of additive and bismuth content will be discussed. Eutectic SnBi and three newly designed SnBi-based alloys were experimented upon.
Materials Tech
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