Materials Tech
Materials Tech
Adhesives, Cleaning, Coatings, Design, Embedded Technology, Finishes, Flex Circuits, Flip Chip, Flux, Solder, Solder Mask, Solder Paste
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Multilayer Ceramic Capacitors: Mitigating Rising Failure Rates
Multilayer Ceramic Capacitors: Mitigating Rising Failure Rates
The multilayer ceramic capacitor (MLCC) has become a widely used electronics component both for surface mount and embedded PCB applications.
Materials Tech

Three Dimensional Integration Focusing on Device Embedded Substrate
Three Dimensional Integration Focusing on Device Embedded Substrate
In this paper, EDA tools, TEG chips, and several evaluation equipment developed in Fukuoka are explained.
Materials Tech

How to Protect Internal Circuitry from a Harsh Environment
How to Protect Internal Circuitry from a Harsh Environment
Paper discusses developments in conformal coating for increased reliability at a lower cost for high production volume devices.
Materials Tech

The Effect of Fine Mesh Solder Powder on Flux Residue Removal
The Effect of Fine Mesh Solder Powder on Flux Residue Removal
There is a drive to miniaturize solder paste deposits. A key element to success is the incorporation of smaller solder particles in the solder paste.
Materials Tech

Micro Trace Resistive Technology
Micro Trace Resistive Technology
Micro Trace Resistor Technology allows thin film resistors to be built within a printed circuit trace that is less than 100 microns wide.
Materials Tech

Evaluating Rinsing Effectiveness in Spray-In-Air Cleaners
Evaluating Rinsing Effectiveness in Spray-In-Air Cleaners
This study was designed to investigate the efficiency of the rinse cycle using both a spray-in-air batch and inline cleaner.
Materials Tech

The Importance of Conformal Coating Thickness and Edge Coverage
The Importance of Conformal Coating Thickness and Edge Coverage
The performance of new silicone and urethane materials, designed for coverage and thickness, is compared with an acrylic and ultra-thin material.
Materials Tech

Reliability of ENEPIG by Sequential Thermal Cycling and Aging
Reliability of ENEPIG by Sequential Thermal Cycling and Aging
Paper presents the reliability of LGA components assembled with tin-lead solder onto PCBs with an ENEPIG finish and subjected to thermal cycling and aging.
Materials Tech

Screening of Lower Melting Point Pb-Free Alloys
Screening of Lower Melting Point Pb-Free Alloys
Program explores the manufacturability and reliability for Pb-free Bi-containing alloys in comparison with conventional SAC305 and SnPb assemblies.
Materials Tech

Nanomaterials Performance Advantages
Nanomaterials Performance Advantages
Low temperature reactivity, reaction speeds, flexibility and fine pitch considerations dictate that nanomaterials be given serious consideration.
Materials Tech