Materials Tech



Materials Tech
Adhesives, Cleaning, Coatings, Design, Embedded Technology, Finishes, Flex Circuits, Flip Chip, Flux, Solder, Solder Mask, Solder Paste
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Solder Paste Selection for Bottom Termination Components Attach
Solder Paste Selection for Bottom Termination Components Attach
Two solder paste chemistries and several printing parameters were evaluated in order to achieve consistent solder paste deposition across the assembly.
Materials Tech

Surface Insulation Resistance of No-Clean Flux Residues
Surface Insulation Resistance of No-Clean Flux Residues
No-clean fluxes present great benefits, but the activity of the unwashed process residues must be tightly controlled in order to meet reliability standards.
Materials Tech

Rheology of Solder Paste: Shelf Life Study
Rheology of Solder Paste: Shelf Life Study
This study offers a better understanding of the correlation between rheological properties and shelf life of solder paste exposed to extreme conditions.
Materials Tech

Solder Paste: Fundamental Material Property / SMT Performance Correlation
Solder Paste: Fundamental Material Property / SMT Performance Correlation
Aggressive form factors, reducing pitch, thinner packages, and larger die to package ratios are leading to higher package warpage during SMT reflow.
Materials Tech

Implementation of Assembly Processes for Low-Melting Point Solder Pastes
Implementation of Assembly Processes for Low-Melting Point Solder Pastes
This paper discusses the need for low-temperature solders and process-ability of solder pastes with three novel alloys against the industry standard.
Materials Tech

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