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Conformal Coatings in Preventing Resistor Silver Sulfide Corrosion
Conformal Coatings in Preventing Resistor Silver Sulfide Corrosion
The evaluation of conformal coatings to mitigate silver sulfide corrosion of thick film resistors is discussed.
Materials Tech

Signal Transmission Loss Due to Surface Roughness
Signal Transmission Loss Due to Surface Roughness
In this research, parameters of various types of transmission line structures on an evaluation board were measured and analyzed in detail.
Materials Tech

Advanced Interconnect Process Enables Very High-Density PCB Structures
Advanced Interconnect Process Enables Very High-Density PCB Structures
Liquid Metal Ink technology allows a very dense thin catalytic seed layer that can then be used as a base for a much thicker electrolytic copper layer.
Materials Tech

High and Matched Refractive Index Liquid Adhesives for Optical Device
High and Matched Refractive Index Liquid Adhesives for Optical Device
High and matched refractive index liquid adhesives are required in several electronics devices, where the liquid adhesives are in the optical pathway.
Materials Tech

Embedded Fibers Enhance Nano-Scale Interconnections
Embedded Fibers Enhance Nano-Scale Interconnections
This paper introduces the use of embedded fibers in the interconnections of chip-to-chip and chip-to-package components.
Materials Tech

Challenges for Selecting Appropriate TIM2 Material for CPU
Challenges for Selecting Appropriate TIM2 Material for CPU
This paper provides a methodology for a potential TIM2 material for applications including automotive, personal computers and internet of things.
Materials Tech

Liquid Dispensed Thermal Materials for High Volume Manufacturing
Liquid Dispensed Thermal Materials for High Volume Manufacturing
This paper presents the science behind liquid TIMs identifies key TIM characteristics needed to design and manufacture reliably and efficiently.
Materials Tech

Improving properties of a Lead-free Solder Alloy with Doping of Copper
Improving properties of a Lead-free Solder Alloy with Doping of Copper
This paper reviews 3 lead-free solder alloys to assess the mechanical and thermal cycle properties by implementing drop tests and thermal cycle tests.
Materials Tech

Effect of Bi Content on Properties of Low Silver SAC Solders
Effect of Bi Content on Properties of Low Silver SAC Solders
A systematic study is presented to address the effect of Bi content on soldering and mechanical performance of low silver SAC alloys.
Materials Tech

Low-Cost & High Performance Silicon Interposers
Low-Cost & High Performance Silicon Interposers
The Low-Cost Silicon Interposer industry consortium addresses limitations of organic packages as well as wafer-based silicon interposers.
Materials Tech