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This paper describes the IMCs that occur typically in eutectic, Sn63Pb37, near-eutectic SAC305, and high-performance tin-based Pb-free solder alloys. Materials Tech
This paper examines process changes and the material properties or performance of polymer composites used in semiconductor packaging and board assembly. Materials Tech
In this paper, a detailed study of the electrical and mechanical degradation of wirebonds under high temperature exposure is presented. Materials Tech
This study aims to assess the reliability of the most common solder material under different cyclic stress levels and aging times at an elevated temperature. Materials Tech
The re-classification and regulation of EDCs and bioaccumulative substances is expected to multiply the materials that require control or replacement. Materials Tech
In this work, we further discuss solderability and mechanical reliability of a novel low temperature proprietary alloy (generically called as X46). Materials Tech
This paper presents an examination of three low temperature solders and provides a comparison with tin-silver-copper solder. Materials Tech
Ideally, we would have a solder ball dispensing solution that had the throughput of analog solutions with the accuracy of traditional digital solutions. Materials Tech
This paper describes the development and testing procedure of a new lead-free low melting point alloy. Materials Tech
This study focuses on two major bonding techniques: Cu nanoparticle (Cu NP) sintering and Cu-Sn3.0Ag0.5Cu (Cu-SAC305) hybrid paste bonding. Both methods aim to address the limitations of conventional soldering processes, especially in high-temperature, high-power applications. Materials Tech |
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