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The roles of additive and bismuth content will be discussed. Eutectic SnBi and three newly designed SnBi-based alloys were experimented upon. Materials Tech
Researchers discovered the first two-dimensional material, graphene, which consists of only a single layer of atoms13. Materials Tech
This paper shows alloy and flux properties as well as temperature cycle test results comparing SAC305 and Innolot® solder pastes. Materials Tech
In this paper, the reliability of lead-free SAC solder alloys at high temperature and vibration for pristine and thermally aged assemblies is analyzed. Materials Tech
The main objective of this paper was to identify a solder (specifically Sn-based and high reliability) and thick film combination to improve overall reliability of thick film hybrids. This was done by conducting rigorous thermal testing. The work conducted for this paper served as an initial exploration into this area of study. Materials Tech
A novel epoxy SAC solder paste TIM system has been developed with the use of non-volatile epoxy flux. Cu filler was added to the solder paste. Materials Tech
In this study, flexible Chip-In-Fabric (CIF) assemblies using anisotropic conductive films (ACFs) and cover layer structure were demonstrated. Materials Tech
We are still searching for alternative lead-free alloys. Selective soldering requires relatively high solder temperatures to get proper hole filling. Materials Tech
This paper discusses the use of jet-dispensed SMT adhesives for increased durability, lower component cost, and new form factor printed electronics. Materials Tech
The novel Alloy 10 solder alloy presented here exhibits exemplary thermomechanical and mechanical reliability in extreme operating conditions, ideal for the future needs of high-reliability electronics, such as in the automotive industry. Materials Tech |
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