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The evaluation of conformal coatings to mitigate silver sulfide corrosion of thick film resistors is discussed. Materials Tech
It was the goal of this paper to overcome myths and misunderstandings within the PCB manufacturing environment regarding the HP ENIG finish. Materials Tech
High and matched refractive index liquid adhesives are required in several electronics devices, where the liquid adhesives are in the optical pathway. Materials Tech
Liquid Metal Ink technology allows a very dense thin catalytic seed layer that can then be used as a base for a much thicker electrolytic copper layer. Materials Tech
This paper presents the science behind liquid TIMs identifies key TIM characteristics needed to design and manufacture reliably and efficiently. Materials Tech
This paper provides a methodology for a potential TIM2 material for applications including automotive, personal computers and internet of things. Materials Tech
A systematic study is presented to address the effect of Bi content on soldering and mechanical performance of low silver SAC alloys. Materials Tech
This paper reviews 3 lead-free solder alloys to assess the mechanical and thermal cycle properties by implementing drop tests and thermal cycle tests. Materials Tech
This paper presents the results of a study aimed at developing high-power density devices for aerospace applications. Materials Tech
The Low-Cost Silicon Interposer industry consortium addresses limitations of organic packages as well as wafer-based silicon interposers. Materials Tech |
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