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Program explores the manufacturability and reliability for Pb-free Bi-containing alloys in comparison with conventional SAC305 and SnPb assemblies. Materials Tech
Paper presents the reliability of LGA components assembled with tin-lead solder onto PCBs with an ENEPIG finish and subjected to thermal cycling and aging. Materials Tech
In this work, a new halogen-free no-clean flux solder paste been developed. It exhibited ultra-low voiding and virtually zero solder beading performance. Materials Tech
Low temperature reactivity, reaction speeds, flexibility and fine pitch considerations dictate that nanomaterials be given serious consideration. Materials Tech
This paper presents harsh environment reliability test results for lead-free solder pastes with and without the presence of a variety of dopant elements. Materials Tech
In high-reliability applications ball grid array versions are used because of technology availability, lower cost, and lower CTE mismatches. Materials Tech
Under pressure-less sintering conditions silver sintering pastes for different sized die attachment to form robust silver joints have been developed. Materials Tech
This paper discusses selection of solder paste based on end product and the need to conduct proper root cause analyses before making any material changes. Materials Tech
As a result of the continuous industrial trend towards high density packaging there is a growing demand for highly thermally-stable laminate materials. Materials Tech
In this paper, a detailed study of the electrical and mechanical degradation of wirebonds under high temperature exposure is presented. Materials Tech |
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