Sponsor
Smart-Sonic

Eliminate Worry of Cross Contamination
While Models 529 and 1550 are similar semi-automatic cleaners with single wash and rinse tanks, the Model 2003 includes 2 wash tanks for cleaning multiple applications in one machine.
Smart Sonic
Smart-Sonic
Materials Tech
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2nd Generation of indium TIM
2nd Generation of indium TIM
A new generation of indium TIM is introduced. This class of indium TIM has a protective layer to suppress surface oxidation. This work examines the performance of indium as TIM for BGA packaging.
Materials Tech

Improved Reliability of Jet Dispensable Polymeric Coating Material
Improved Reliability of Jet Dispensable Polymeric Coating Material
The study compares a paste that barely passes SIR at 85C/85RH with polymeric material, Silicone conformal, and acrylic conformal coating.
Materials Tech

Engineered Flux for Low Temperature Solders
Engineered Flux for Low Temperature Solders
The advantage of engineered flux for low temperature solders in achieving critical properties of the solder paste is summarized in this paper.
Materials Tech

The Impact of the Gold Layer Thickness on Layer Properties
The Impact of the Gold Layer Thickness on Layer Properties
The purpose of this study was to evaluate the impact of the gold layer thickness on the ENIG layer performance in different perspectives.
Materials Tech

Effects of Mixing Solder Sphere Alloys with Bismuth-Based Pastes
Effects of Mixing Solder Sphere Alloys with Bismuth-Based Pastes
In this paper, the effect of mixing solder sphere alloys with Bi-based solder pastes on the component reliability in accelerated thermal cycling is studied.
Materials Tech

Dissolution Rate of Specific Elements in SAC305 Solder
Dissolution Rate of Specific Elements in SAC305 Solder
This paper describes the approach for measuring the solder dissolution that can be used to optimize soldering process profiles for electronic assemblies.
Materials Tech

75% IPA/25% DI Extraction Solution on No-Clean Flux Residues
75% IPA/25% DI Extraction Solution on No-Clean Flux Residues
This study is broken into two parts, first a review of the solubility of some critical ions in different ratios of IPA/DI and at different temperatures.
Materials Tech

Fill the Void
Fill the Void
Several methods of minimizing voids are presented. Printing solder paste with gas escape routes is an excellent way to reduce voiding.
Materials Tech

Engineered Cleaning Agent Study Rinsing under Low Profile Components
Engineered Cleaning Agent Study Rinsing under Low Profile Components
This research studies rinsing effects as a function of loading and cleaning agent design. A type of sensor for non-ionic organic compounds will be used.
Materials Tech

Effect of Bi-Addition on the High Strain Rate Properties of SnAgCu Solders
Effect of Bi-Addition on the High Strain Rate Properties of SnAgCu Solders
This paper focuses on the effects of sustained high temperatures on the high strain rate of doped lead-free solders operating between -65°C to 200°C.
Materials Tech

Sponsor
Advanced-Interconnections

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Advanced-Interconnections