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A new generation of indium TIM is introduced. This class of indium TIM has a protective layer to suppress surface oxidation. This work examines the performance of indium as TIM for BGA packaging. Materials Tech
The study compares a paste that barely passes SIR at 85C/85RH with polymeric material, Silicone conformal, and acrylic conformal coating. Materials Tech
The advantage of engineered flux for low temperature solders in achieving critical properties of the solder paste is summarized in this paper. Materials Tech
The purpose of this study was to evaluate the impact of the gold layer thickness on the ENIG layer performance in different perspectives. Materials Tech
In this paper, the effect of mixing solder sphere alloys with Bi-based solder pastes on the component reliability in accelerated thermal cycling is studied. Materials Tech
This paper describes the approach for measuring the solder dissolution that can be used to optimize soldering process profiles for electronic assemblies. Materials Tech
This study is broken into two parts, first a review of the solubility of some critical ions in different ratios of IPA/DI and at different temperatures. Materials Tech
Several methods of minimizing voids are presented. Printing solder paste with gas escape routes is an excellent way to reduce voiding. Materials Tech
This research studies rinsing effects as a function of loading and cleaning agent design. A type of sensor for non-ionic organic compounds will be used. Materials Tech
This paper focuses on the effects of sustained high temperatures on the high strain rate of doped lead-free solders operating between -65°C to 200°C. Materials Tech |
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