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This research is to design electrical twin test boards in the waste area of a panel of production boards, which are representative of production hardware. Production Floor
This paper investigates how the connected at-line x-ray system can improve production yield and lower costs when connected to the production line. Production Floor
A technology featuring Copper Pillar Bond-On-Lead (BOL) with Enhanced processes delivers cost effective, high performance packaging solution. Production Floor
In this paper we will discuss a newly developed conformal coating system that meets the high performance, reliability and cycle time demand based on the hybrid polymer approach (Urethane Acrylates). Results from a structured Design of Experiment (DOE) using a standard test vehicle will be presented. Production Floor
The paper focuses on all aspects of SMT assembly of the MaxQFP. The robustness of the assembly in automotive type board-level thermal cycling will be demonstrated. Production Floor
The level of importance of a clean circuit assembly has been demoted. How did the cleanliness of circuit assemblies, once required, get shoved aside? Production Floor
This presentation will explore Industry 4.0, and then explore how Advanced Process Control (APC) can increase production yields and reduce defects. Production Floor
AI has been deployed in the verification tool with studies conducted to compare the effectiveness and efficiency of the tool versus human operation. Production Floor
The study elaborates the parameters with the solder separation failure per board design configuration, and also provides the potential solution to mitigate the failure. Production Floor
A robust board assembly recipe is demonstrated for thin FCCSP packages with reflow warpage values of up to 110μm or higher. Production Floor |
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