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Programs cover:
Baking,
CAD,
Cleaning,
Component Insertion,
Curing,
Dispensing,
Feeders,
Handling,
Labeling,
Lasers,
Marking,
Modification,
Packaging,
Pick and Place,
Printing,
Repair,
Reflow,
Rework,
Soldering,
Stencil,
and more.
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Ultrasonics as an Option for Electronics Assembly Cleaning
Ultrasonic cleaning parameters including frequency, power, time, temperature and chemistries results demonstrate developments in technology.
Production Floor
Cleaning High Reliability Assemblies with Tights Gaps
The purpose of this designed experiment was to evaluate the effectiveness of a variety of cleaning agents under an array of process conditions.
Production Floor
Enhanced Cleanability Using Fluxes with Decreased Viscosity after Reflow
A series of flux systems have been developed which would result in a reduced viscosity after reflow. This enables a high viscosity, high tack flux to be used.
Production Floor
Additive Manufacturing for Next Generation Microwave Electronics
The paper will discuss the integration of 3D printing and inkjet printing fabrication technologies for microwave and millimeter-wave applications.
Production Floor
Electrostatic Discharge Factory Issues
The paper offers an overview of causes for ESD, where electrostatic charges are increasingly generated.
Production Floor
Jetting Strategies for mBGAs
This study attempts to understand the dependencies on piezo actuation pulse profile on jetting deposit quality, especially focused on positioning, satellites and shape.
Production Floor
Solder Column Attachment for Absorbing Large CTE Mismatch
Paper reviews commercially off-the-shelf solder columns available, including plain columns, copper wrapped columns and more.
Production Floor
Stereo Vision Based Automated Solder Ball Height Detection
An automatic, stereo vision based, in-line ball height inspection method is presented. This includes an imaging setup with a computer vision algorithm.
Production Floor
Backward Compatible Solder Joint Reliability Under Accelerated Conditions
Accelerated temperature cycling was used to assess the thermal fatigue reliability of a Pb free grid array package assembled.
Production Floor
Counterfeit Electronics Component Conundrum with Smart Labeling
Electronics manufacturers hurting from supply chain disruptions, component shortages, and a trade war are further challenged by the rise in counterfeit components.
Production Floor
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