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Programs cover:
Baking,
CAD,
Cleaning,
Component Insertion,
Curing,
Dispensing,
Feeders,
Handling,
Labeling,
Lasers,
Marking,
Modification,
Packaging,
Pick and Place,
Printing,
Repair,
Reflow,
Rework,
Soldering,
Stencil,
and more.
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A Robot's Place in SMT
SMT machines today are designed to pick and place from tape, tray, and sticks. Robots can handle these more efficiently than an operator.
Production Floor
Spray Plus Soak Improves Cleaning Under BTC
Innovative spray and soak methods for removing low residue flux residues and rinsing under bottom termination and leadless components is evaluated.
Production Floor
Acid Copper Electroplating Processes for Flash Etching
The focus of this study was to investigate the underlying mechanism of V-pitting and to develop a process to withstand or resist the pitting.
Production Floor
Minimizing Printed Circuit Board Warpage in Assembly Process
The purpose of this paper is to present a cleaning process for difficult no-clean, lead-free and high temperature flux residues on reflowed PCBs.
Production Floor
Miniaturization of Hearing Aid Electronics Using Embedded Die Packaging
This paper examines the use of second generation embedded die packaging to drive further size reduction in custom hearing instruments.
Production Floor
Latent Short Circuit Failure in High-rel PCBs
This paper describes inspections performed on base materials, manufacturing processes and final PCBs.
Production Floor
Automating the Rework Process
This paper describes Automated Optical Rework technology and its advantages for advanced circuit board production.
Production Floor
Duo-Solvent Cleaning for Removing Flux Residue from Class 3 Hardware
The research study evaluates the cleaning and electrical performance using the IPC B-52 Test Vehicle.
Production Floor
New Placement Technology for Rework
This paper introduces a rework technology using cameras to identify the target area for component installation and component pin structure.
Production Floor
Electroplated Copper Filling of Through Holes
This paper discusses a through hole copper filling process for applications of high density interconnects and IC substrates.
Production Floor
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