Production Floor
Programs cover:
Baking,
CAD,
Cleaning,
Component Insertion,
Curing,
Dispensing,
Feeders,
Handling,
Labeling,
Lasers,
Marking,
Modification,
Packaging,
Pick and Place,
Printing,
Repair,
Reflow,
Rework,
Soldering,
Stencil,
and more.
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Risk and Solution for No-Clean Flux Not Dried Under Components
In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed.
Production Floor
Embedded Components from Concept-To-Manufacturing
Use of embedded components has grown significantly in the defense, aerospace, telecommunications, medical and consumer markets.
Production Floor
Reducing Dust Deposition on Electronic Equipment
This work focuses on one aspect of reducing dust accumulation on electronic equipment, specifically by optimizing the cooling air flow.
Production Floor
Miniaturization with Help of Reduced Component to Component Spacing
This paper covers layout, assembly and material selections to reduce component to component spacing down to 4-5mil from today's mainstream of 6-8mil.
Production Floor
Jetting Fine Lines onto 2D and 3D Electronic Packages
The demand for smaller dispense doses including fine lines, small dots and accurate dispensing requires examination of available products and technologies.
Production Floor
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