Production Floor
Programs cover:
Baking,
CAD,
Cleaning,
Component Insertion,
Curing,
Dispensing,
Feeders,
Handling,
Labeling,
Lasers,
Marking,
Modification,
Packaging,
Pick and Place,
Printing,
Repair,
Reflow,
Rework,
Soldering,
Stencil,
and more.
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Impractical Stencil Aperture Designs to Enable M0201 Assembly
Implementation of metric 0201 or M0201 size surface mount passives will help enable the next generation form factor electronic packaging.
Production Floor
Selective Reflow Rework Process
This paper discusses some aspects of the process optimization and changes made to improve the quality of the rework process.
Production Floor
Influence of PCB Surface Features on BGA Assembly Yield
This paper provides insight into the impact of irregularities on BGA package surface mount yield, and guidance on design and to limit their impact.
Production Floor
Selecting Stencil Technologies to Optimize Print Performance
Research has been done to identify individual factors in stencil performance; this paper discusses the real-world application of numerous findings.
Production Floor
The Challenges of LGA Server Socket Trends
This paper discusses the challenges and some potential solutions for sockets used in the high end server market.
Production Floor
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