Production Floor
Programs cover:
Baking,
CAD,
Cleaning,
Component Insertion,
Curing,
Dispensing,
Feeders,
Handling,
Labeling,
Lasers,
Marking,
Modification,
Packaging,
Pick and Place,
Printing,
Repair,
Reflow,
Rework,
Soldering,
Stencil,
and more.
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Evaluating Manual and Automated Heat Sink Assembly
This paper illustrates the use of strain gauge testing and Finite Element Analysis as a simulation tool to optimize the heat sink assembly process.
Production Floor
Rigid-Flex PCB Right the First Time - Without Paper Dolls
The biggest problem with designing rigid-flex hybrid PCBs is making sure everything will fold in the right way, while maintaining good flex-circuit stability and lifespan.
Production Floor
Stencil Design for Ultra Fine Pitch Printing
Miniaturization is pushing the stencil printing process. As features become smaller, solder paste transfer efficiency is becoming more critical.
Production Floor
Electroplated Copper Filling of Through Hole Influence of Hole Geometry
The through hole fill technology and factors that affect performance such as substrate thickness and through hole diameter will be presented.
Production Floor
Evaluation of Stencil Technology for Miniaturization
The objective of this study is to assess the impact of various stencil materials and fabrication methods on the repeatability of solder paste deposition.
Production Floor
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