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Rheology and Wetting Characterizations of Flux and Solder Paste
Rheology and Wetting Characterizations of Flux and Solder Paste
In this paper, we will discuss a solder paste wetting method. A high resolution solder wetting balance was used for the solder paste wettability analysis.
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Durable Conductive Inks for Robust Printed Electronics
Durable Conductive Inks for Robust Printed Electronics
Polymer Thick Film based printed electronics has improved in durability and is now a proven alternative to copper circuitry in many applications.
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Impact of Low Silver Paste on Area Array Joint Quality
Impact of Low Silver Paste on Area Array Joint Quality
This paper provides analysis to "fill in the gaps" concerning the implementation for a wide variety of lead-free solder alloys.
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Unlocking The Mystery of Aperture Architecture for Fine Line Printing
Unlocking The Mystery of Aperture Architecture for Fine Line Printing
This paper covers issues of printing for challenging area ratio components and their associated aspect ratio will be investigated.
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Characterization of SIP Assembly and Reliability Under Thermal Cycles
Characterization of SIP Assembly and Reliability Under Thermal Cycles
This paper presents assembly challenges and reliability evaluation of Three-Dimensional Through- Mold Via and System in Package in fine pitch ball grid arrays.
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Void-Free Soldering With Vapor-Phase Vacuum Tech
Void-Free Soldering With Vapor-Phase Vacuum Tech
This paper explores equipment that has been developed to achieve void-free joints using modern condensation reflow technology.
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Adiabatic & Isothermal Humidification for Electronics Manufacturing
Adiabatic & Isothermal Humidification for Electronics Manufacturing
The need for including humidification into a well-rounded electronics manufacturing facilities’ ESD program is discussed.
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Condensation Testing - A New Approach
Condensation Testing - A New Approach
The data for a range of conformal coatings are correlated back to the material type, and coverage and thickness by cross-sectioning.
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Cleaning Industrial Parts with Plasma
Cleaning Industrial Parts with Plasma
The cleanliness of surfaces is critical for the quality of processes like bonding, coating and printing. That’s why manufacturers may want to consider using atmospheric pressure plasma.
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Choosing the Right Stencil Options
Choosing the Right Stencil Options
Quality and yield are directly linked to the solder printing process. A constant paste depot is critical to a stable soldering process.
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