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Additive Manufacturing for Next Generation Microwave Electronics
Additive Manufacturing for Next Generation Microwave Electronics
The paper will discuss the integration of 3D printing and inkjet printing fabrication technologies for microwave and millimeter-wave applications. With the recent advancements in 3D and inkjet printing technology, achieving resolution down to 50 um, it is feasible to fabricate electronic components and antennas operating in the millimeter-wave regime.
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Calibration of Tweezer Meters Enabling Sub 1 pF and Sub 10 nH
Calibration of Tweezer Meters Enabling Sub 1 pF and Sub 10 nH
The importance of calibration for two-wire measurement setups is reaffirmed. For tweezer meters, this issue is critical due to the higher offset values, which can be as large as 19 nH.
Production Floor

Reducing Dust Deposition on Electronic Equipment
Reducing Dust Deposition on Electronic Equipment
This work focuses on one aspect of reducing dust accumulation on electronic equipment, specifically by optimizing the cooling air flow.
Production Floor

Adiabatic & Isothermal Humidification for Electronics Manufacturing
Adiabatic & Isothermal Humidification for Electronics Manufacturing
The need for including humidification into a well-rounded electronics manufacturing facilities’ ESD program is discussed.
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The Convergence of Technologies and Standards
The Convergence of Technologies and Standards
The Vertical Segments of the Electronic Products Manufacturing Industry are converging and service offerings are consolidating due to advanced technology adoption and market dynamics. The convergence will cause shifts in the flow of materials across the supply chain as well as the introduction of equipment and processes across the segments.
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Board Level Reliability Testing of RF Packages
Board Level Reliability Testing of RF Packages
The paper presents a summary of board level reliability test performed on RF packages, the assembly process, mechanical and environmental tests, and understanding failures.
Production Floor

Ultrasonics as an Option for Electronics Assembly Cleaning
Ultrasonics as an Option for Electronics Assembly Cleaning
Ultrasonic cleaning parameters including frequency, power, time, temperature and chemistries results demonstrate developments in technology.
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Printed Electronics for Medical Devices
Printed Electronics for Medical Devices
This paper will share details about multiple medical sensing applications and the advanced materials and processes used to assemble them for optimal functionality.
Production Floor

Low Temperature SMT Solder Evaluation
Low Temperature SMT Solder Evaluation
Recent advances in alloy "doping" have opened the door to revisit Sn/Bi alloys as a possible alternative to SAC-305 for many applications.
Production Floor

Enhanced Cleanability Using Fluxes with Decreased Viscosity after Reflow
Enhanced Cleanability Using Fluxes with Decreased Viscosity after Reflow
A series of flux systems have been developed which would result in a reduced viscosity after reflow. This enables a high viscosity, high tack flux to be used.
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