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Tests performed in this study demonstrate that a conductive adhesive using spherical, polymer silver particles can be used for no-contact jet printing. Production Floor
The performance with one alloy under design conditions that make soldering difficult demonstrate the need to evaluate the performance differences. Production Floor
A robust board assembly recipe is demonstrated for thin FCCSP packages with reflow warpage values of up to 110μm or higher. Production Floor
This study compares uniform variable frequency microwave (VFM) field cure to standard oven curing at temperatures below Tg (transition temperature). Production Floor
In this paper the author reviews how Design for Testability techniques can be an effective way to reduce functional board test programming complexity. Production Floor
In this paper the authors present a new method of handling an assignment problem for hybrid manual and robotic assembly mixing lines. Production Floor
Locations closer to the insertion site experienced the highest level of strain, which progressively decreased further from the insertion location. Production Floor
The study elaborates the parameters with the solder separation failure per board design configuration, and also provides the potential solution to mitigate the failure. Production Floor
A model was developed to simulate the delamination behavior of multilayer PCBs assembled with BGA components reinforced with an underfill epoxy adhesive. Production Floor
This study presents a DOE method to pre-test materials to categorize ink and substrate rheology, compatibility and printed feature requirements. Production Floor |
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