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This paper describes the use of embedded die technologies and the development of work in the on power electronic applications. Production Floor
With the introduction of lead-free soldering operating temperatures increased, and the chemistry of solder paste has been modified. Production Floor
Paper reviews what portions of a design can be covered structurally and what are covered functionally, to provide the best diagnostics to discover faults? Production Floor
This paper focuses on establishing package warpage boundary conditions and identifying key process parameters for a successful LTS assembly. Production Floor
Touch up and repair processes need to fulfil the high-quality demands of today’s highly integrated and complex electronic products. Production Floor
This paper illustrates the use of strain gauge testing and Finite Element Analysis as a simulation tool to optimize the heat sink assembly process. Production Floor
Failure in solder interconnects is a leading cause of reliability failure. Complexity of electronic assembly requires these lead-free interconnects to be reliable. Production Floor
The through hole fill technology and factors that affect performance such as substrate thickness and through hole diameter will be presented. Production Floor
In this paper a wide variety of technologies are described that allow the generation of maximum miniaturized microsystems or SiPs. Production Floor
This paper will review a model to illustrate the source of “ball drift” and will report empirical results from testing designed to confirm the mechanism. Production Floor |
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