Electronics Manufacturing and Electronics Assembly

After moving a reflow oven to a different site, what steps do you need to perform on the machine for the machine to be certified? Jim Hall and Phil Zarrow, The Assembly Brothers, address this question and share their own experiences.
Board Talk

Characterization, Prevention and Removal of Particulate Matter on PCBs
This paper describes a means of measuring the DRH of minute quantities of particulate matter (1 mg or less) found on PCBs.
Production Floor

Humanoid Robots are Finally on the Way
Over three years, there has been an explosion of companies racing to integrate the hardware and software that will constitute a viable humanoid robot.
Technology Briefing

Conformal Coating Prevention and Analysis of Resistor Silver Sulfide Corrosion
This paper covers all the long-term test results as a follow-up to an earlier publication reporting interim results and preliminary conclusions.
Analysis Lab

Pb-Free Water-Soluble Solder Paste Improves Reliability
This paper details a water-soluble lead-free solder paste that has improved voiding performance and washability over previous generations of solder paste.
Materials Tech

Engineered Tin-Copper Alloys in Selective Soldering
The performance with one alloy under design conditions that make soldering difficult demonstrate the need to evaluate the performance differences.
Production Floor

Collaboration to Combat Head on Pillowing Defects
This project was designed to evaluate AXI results from different machine platforms by analyzing results from similar platforms at different facilities.
Analysis Lab

Issues With SMT Component Alignment
During automatic optical inspection our chip components are shifting. This is not limited to single components and changes daily.
Board Talk

High Thermo-Mechanical Fatigue and Drop Shock Resistant Alloys
High-Ag, low-Ag: Which alloy fits best certain application? Here we present a report on the thermal and mechanical reliability of alloys.
Materials Tech

Unleash the Unexpected for Radical Innovation
The accelerometer chip is ubiquitous in today's digital devices. Its true impact didn't become apparent until many of today's most valued applications were developed.
Technology Briefing

Jetting Conductive Adhesives with Silver Coated Polymer Particles
Tests performed in this study demonstrate that a conductive adhesive using spherical, polymer silver particles can be used for no-contact jet printing.
Production Floor

Copper Foil Elements Affecting Transmission Loss with High Speed Circuits
This study examines possible factors for these inconsistencies such as etched signal trace shape, surface treatment, and grain size.
Analysis Lab

Cloudy Copper Plating Bath
At a circuit shop near Los Angeles there was trouble with the copper plating line. Was an impurity getting in the tank and how?
Mysteries of Science

A New Line Balancing Method
In this paper the authors present a new method of handling an assignment problem for hybrid manual and robotic assembly mixing lines.
Production Floor

Super-Capable Robots to Share Human Labor

Technology can do more jobs formerly performed by humans. This could result in AI automating tasks in the production of goods, services and ideas.
Technology Briefing

Electromigration in Tin-Bismuth Planar and Bottom Terminated Solder Joints
The electromigration rates and behavior of eutectic Sn-Bi alloy in planar and in BTC solder joints were compared and shown to be similar.
Analysis Lab

The Effect of Sb and Ag Addition on the Behavior of Sn-Bi LTS

This study focuses on the changes in melting and solidification behavior of near-eutectic Sn-Bi alloys with Sb (0.5-2wt%) and Ag (0-1wt%) additions.
Materials Tech

Design for Testability to Overcome Functional Board Test Complexities
In this paper the author reviews how Design for Testability techniques can be an effective way to reduce functional board test programming complexity.
Production Floor

Board Talk

Tips When Moving a Reflow Oven

Issues With SMT Component Alignment

No-Clean Residue Shorts

How To Strip Tin-Lead Solder From SMT Pads for RoHS

Larger Stencil Apertures and Type 4 Paste

What is the IPC Definition for Uncommonly Harsh?

Component Moisture Question?

Causes of Blowholes

MORE BOARD TALK

Questions and Comments

No-Clean Residue Shorts

One result of leaving the flux residue of no-clean solder ...
Jaye Waas, Renkus-Heinz

No-Clean Residue Shorts

You may want to inspect with a magnifier and verify ...
Ike Sedberry, ISEDS

Component Moisture Question?

Would it be worth doing V/I testing on the BGA ...
Alan Lowne, Saelig Co. Inc.

MORE COMMENTS

"Sometimes it's smooth sailing, sometimes it gets rough and stormy and sometimes you sink to the bottom with your crew. That's why it's called leadership."
Copyright © Randy Glasbergen