Technical Papers
Openair-Plasma for Display and HMI Manufacturing
ISO Standards and the Case for Cost-Effective Delivery of Quality
Solder Bridging and Other Common Soldering Problems
Improve SMT Yield and Reduce Defects
High Power Density Aerospace Solution
Eliminating Ni Corrosion in ENIG/ENEPIG Using RAIG
A Novel Method to Improve the Adhesion of Conformal Coatings
Conformal Coating on PCBs
MORE TECHNICAL PAPERS
Ask the Experts
EMI Shield Reflow Soldering Techniques
Can a Few Contaminated Joints Cause an Assembly to Fail RoHS Compliance?
Copper Dissolution Rate
Excess Flux Residue After Hand Soldering
Solder Paste Viscosity
How To Rework SMT Connector with Center Ground Strip
Solder Paste Mixing
Shelf Life Limit for Soldering Old Components
MORE ASK THE EXPERTS
Latest Industry News
How Many Qubits Needed For Quantum Supremacy?
Entering the Era of Real-Time AI
Pandemic Delays Electronic Product Launches
How South Korea turned an urban planning system into a virus tracking database
Verizon Partners with Movandi, NXP, Qualcomm for 5G
Top safety official at Waymo self-driving unit stepping down
Facebook says half of its employees might be remote
How Leaders Nurture Emotional Well-Being During Times Of Crisis
MORE INDUSTRY NEWS
May 26, 2020
Maximum Board Temperature During Tin-Lead
Maximum Board Temperature During Tin-Lead
IPC 709SC 6.4.2 discusses the maximum top-side board temperature for BGAs to be 150 degrees C during a tin-lead wave solder. Does anyone know how this temperature was determined? The Assembly Brothers, Jim Hall and Phil Zarrow, offer insight.
Board Talk
Pick-and-Place Feeder density within SMT and Electronics Assembly
To keep up, P&P machine suppliers must increase feeder density in traditional ways or new creative innovations to better serve the end user.
Production Floor
Upcycling Waste Plastic Into High-quality Liquid Products
Upcycling Waste Plastic Into High-quality Liquid Products
While plastics can be melted and reprocessed, this type of recycling yields low-value materials that are not as structurally strong as the original material.
Technology Briefing
Optimization of Robotic Soldering Process: Solder Spread and Spattering
Robotic soldering is a growing market. We will present how cored wires with different flux percentages will affect robotic soldering performance.
Analysis Lab
Reliability Improvements by the Creation of Intermetallic Connections
Reliability Improvements by the Creation of Intermetallic Connections
The possibilities to combine small and large passive components, and new devices for active components with an increase in reliability is discussed.
Materials Tech
Reliability of Stacked Microvia
Study was designed to understand the reliability of Type 1, 2, and 3 Microvias. The reliability test coupons included four stacks of microvias and a buried via.
Production Floor
Controlling Voiding Mechanisms in the Reflow Soldering Process
This paper reviews the factors that influence the incidence of voids in small and large area solder joints in LED modules.
Analysis Lab
Is There a Spacing Spec for SMD Components?
Is There a Spacing Spec for SMD Components?
Is there a minimum spacing requirement or should we apply SMT components to comply with SMT pick and place systems on the market?
Board Talk
Nanocopper Based Paste for Solid Copper Via Fill
This paper discusses a nano copper based paste for use in via filling.
Materials Tech
Radiative Cooling Without Power
Radiative Cooling Without Power
Imagine a device that can sit outside under sunlight on a clear day, and without using any electric power cool things down.
Technology Briefing
Advanced Printing for Microelectronic Packaging
Using micro-dispensing it is possible to print in 3D space a wide variety of materials including solders, epoxies, conductive adhesives and ceramic filled polymers.
Production Floor
SIR Test Vehicles - Comparison from a Cleaning Perspective
This study compares different SIR test vehicles to determine which test vehicle is tougher to clean and therefore a challenge the cleaning process.
Analysis Lab
Dead Phone and the Mysterious Dialer
Dead Phone and the Mysterious Dialer
A home had cable telephone but the phone line started going completely dead, mysteriously fixing itself just before the repairman arrived.
Mysteries of Science
Through-Hole Rework for Challenging Components
The successful transition of low and mid-range servers to lead-free has come largely through wave solder process optimization and the use of alternate lead-free alloys.
Production Floor
New Stretchable Battery for Wearable Electronics
New Stretchable Battery for Wearable Electronics
Researchers have developed a soft and stretchable battery that stores power more safely than the flammable formulations used in conventional batteries today.
Technology Briefing
PCB Manufacturability and Reliability for Fine Pitch PCB Server Boards
This paper assesss PCB vendor drill registration capability and will also evaluate PCB reliability using electrochemical migration and via reliability testing.
Analysis Lab
Reliable Nickel-Free Surface Finish for High-Frequency-HDI PCB
Reliable Nickel-Free Surface Finish for High-Frequency-HDI PCB
In this paper, assemblies involving this nickel-less novel surface finish have been subjected to extended thermal exposure, then intermetallics analyses.
Materials Tech
Cost Effective 3D Glass Microfabrication
In this extended abstract we present 3D Glass Solutions' efforts in using our proprietary APEX Glass ceramic to create various interposer technologies.
Production Floor
Technology Corner
Making Ovens Smarter
KIC
A Full-Line of Programming Solutions
BPM Microsystems
Using the Dam & Fill Method to Protect Components
Master Bond Inc.
3D Manufacturing Platforms
nScrypt, Inc.
Thermaltronics TMT R9900S Inline Soldering Robot V1
Thermaltronics
MORE TECHNOLOGY CORNER
Board Talk
Maximum Board Temperature During Tin-Lead
Is There a Spacing Spec for SMD Components?
Connector Bowing During Reflow Process
Is HASL a Good Choice for Surface Finish?
Long Term Component Storage
Has My Flux Expired?
What Causes Solder Balls During Hand Soldering?
Processing Circuit Boards with BGAs On Both Sides
MORE BOARD TALK
Comments
Connector Bowing During Reflow Process
I would guess as the board and the connector go ...
Alan Woodford, NeoTech
Connector Bowing During Reflow Process
Is it possible your PCB is guilty, and the connector ...
Alan Couchman, Process Sciences, Inc.
Long Term Component Storage
As Jim mentioned above moisture bags and baking components are ...
Neşe Gençtürk, X-Treme Series Auto Dry Cabinets
What Causes Solder Balls During Hand Soldering?
Personally, I've never seen solder balls with hand soldering. I ...
Dave Kearns, TinyCircuits
Dross Contamination After Selective Soldering
We've run into this exact same issue on our selective ...
Chris Denney, Worthington Assembly
MORE COMMENTS
Cartoon
"It's not just you. We're all insecure in one way or another."
Copyright © Randy Glasbergen