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Questions and CommentsHave you got something to say? Visit any program page and use the Comment form at the bottom of the page to submit a comment or ask a question. Comments and questions are reviewed prior to posting. |
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Apr 24, 2024 No-Clean Residue Shorts One result of leaving the flux residue of no-clean solder paste is the onset of 'Wisker growth (Dendrite). Once it starts, no subsequent cleaning is effective in halting the growth. A known fact, from a ... Jaye Waas, Renkus-Heinz Apr 24, 2024 No-Clean Residue Shorts You may want to inspect with a magnifier and verify the pin points are clean and not fouled with the flux residue. ... Ike Sedberry, ISEDS Apr 19, 2024 Component Moisture Question? Would it be worth doing V/I testing on the BGA part to detect potential failures? ABI's BoardMaster does "3-D V/I Testing" which compares each pin with a "gold standard part" and many frequencies, detecting even ... Alan Lowne, Saelig Co. Inc. Apr 5, 2024 Problem Meeting Minimum Hole Fill During Wave Soldering Everything that has been described is correct. If it is a thermodynamic problem, preheating is essential because it’s part of the demand on soldering heat. The higher the heat capacity of the PCB, the longer ... Juergen Friedrich, Ersa GmbH Apr 3, 2024 Problem Meeting Minimum Hole Fill During Wave Soldering Our past experience is that the use of an inert atmosphere, Nitrogen, significantly improves through wetting performance. The nitrogen will allow for the flux to stay active longer and promote improved wetting. N2 inerting retrofit ... Gregory K Arslanian, Air Products and Chemicals, Inc. |
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