Board Talk



Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
Phil Zarrow
Phil Zarrow - With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.
Jim Hall
Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
Previous
 Page 1 of 23 
Next
How Effective Is Nano Coating On Stencils?
How Effective Is Nano Coating On Stencils?
With nano coatings on stencils evolving, what is the best method to measure the thickness? How do you know if the coating degrades over time? The Assembly Brothers, Jim Hall and Phil Zarrow, answer these questions.
Board Talk

What Causes Board Delamination?
What Causes Board Delamination?
We are experiencing delamination on printed circuit boards, is there a way to determine that this is caused by moisture or some other defect?
Board Talk

01005 Component Challenges and Bugs
01005 Component Challenges and Bugs
We are going forward with assemblies that use 01005 components. We're wondering if you have some input as to the challenges we will face. The Assembly Brothers, Phil Zarrow and Jim Hall, share their own experience and insight.
Board Talk

Sticky Residue Under Low Clearance Parts
Sticky Residue Under Low Clearance Parts
We are finding a tacky substance under a large SMT component. Is this common when no-clean leaded solder paste is used with no clearance parts?
Board Talk

Soldering Relays Intrusively in Lead Free Process
Soldering Relays Intrusively in Lead Free Process
We use intrusive reflow soldering on relays using a lead process. We are now challenged to also solder relays intrusively in a lead-free process. Our design has relays, bunched very close with gaps of only 4 mm. Phil Zarrow and Jim Hall, The Assembly Brothers, share their experiences.
Board Talk

Printing vs. Dispensing
Printing vs. Dispensing
Do people size their stencil for the larger components, then use a needle dispenser for the smaller components? It seems more flexible than step stencils.
Board Talk

Maximum Board Temperature During Tin-Lead
Maximum Board Temperature During Tin-Lead
IPC 709SC 6.4.2 discusses the maximum top-side board temperature for BGAs to be 150 degrees C during a tin-lead wave solder. Does anyone know how this temperature was determined? The Assembly Brothers, Jim Hall and Phil Zarrow, offer insight.
Board Talk

Is There a Spacing Spec for SMD Components?
Is There a Spacing Spec for SMD Components?
Is there a minimum spacing requirement or should we apply SMT components to comply with SMT pick and place systems on the market?
Board Talk

Connector Bowing During Reflow Process
Connector Bowing During Reflow Process
I have a connector that is bowing during the lead-free soldering process. When the connector is put through an oven on its own no bowing takes place. What is causing the connector to bow? Phil Zarrow and Jim Hall, The Assembly Brothers, address this question.
Board Talk

Is HASL a Good Choice for Surface Finish?
Is HASL a Good Choice for Surface Finish?
We are using a lead-free hot air solder leveling board finish. Our boards have bottom-terminated components. Is this the best choice?
Board Talk

Previous
 Page 1 of 23 
Next