Electronics Assembly Knowledge, Vision & Wisdom
Board Talk
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Board Talk is presented by ITM Consulting

Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.


Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.

ITM Consulting
* EMS Qualification, Evaluation and Selection
* SMT Process Consulting and Troubleshooting
* SMT Process Development and Set-up
* SMT Process Audits
* Lead-free Process Readiness Audits
* SMT Process Optimization
* On-Site Workshops
Programs are sorted by published date, most recent first.


Should We Invest in 3D Optical Inspection?
Should We Invest in 3D Optical Inspection?
We are correcting many solder defects. The search for defects is taking too long. Should we go with a 3D AOI system to save inspection time? The Assembly Brothers, Jim Hall and Phil Zarrow, share their experiences and insight.
Board Talk

Issues With BGA Rework Residue
Issues With BGA Rework Residue
After BGA rework there is an outline of residue on around the pads. Is it necessary to remove this residue to reinstall a new BGA?
Board Talk

Incoming Circuit Boards - How Clean Is Clean?
Incoming Circuit Boards - How Clean Is Clean?
We're having cleanliness issues, our assembly processes are not introducing contaminants. Could it be the result of incoming PCB cleanliness? The Assembly Brothers, Jim Hall and Phil Zarrow, share their insight.
Board Talk

Reliability of Tin Lead Solder vs. Lead Free Solder
Reliability of Tin Lead Solder vs. Lead Free Solder
The issue of tin-lead solder versus lead-free solder reliability and whether lead in solders used for circuit board assembly impacts the reliability.
Board Talk

What Is the Recommended Component Storage Environment?
What Is the Recommended Component Storage Environment?
What do you recommend for component storage to prohibit oxidation including relative humidity, nitrogen atmosphere, temperature? The Assembly Brothers, Jim Hall and Phil Zarrow, share their own experiences.
Board Talk

Should We Modify Rework Procedures for Assemblies Fabricated Using OSP?
Should We Modify Rework Procedures for Assemblies Fabricated Using OSP?
Should we modify any rework or repair procedures for circuit board assemblies fabricated using OSP, organic solderability preservatives, bare boards?
Board Talk

Solder Paste Printing First Pass
Solder Paste Printing First Pass
Is it recommended to print one cycle before printing the first production board? I could use a scrap board or blank plastic card for the first print. Phil Zarrow and Jim Hall, the Assembly Brothers, share their own experiences and insight.
Board Talk

Review of Tin-Copper and Tin-Nickel Intermetallic Thickness
Review of Tin-Copper and Tin-Nickel Intermetallic Thickness
What is the desirable intermetallic layer thickness? I have read that 1 - 2.5 micron thickness of tin-copper and a .4 - .8 micron thickness on tin-nickel.
Board Talk

What Causes Solder Icicles During Wave Soldering
What Causes Solder Icicles During Wave Soldering
Why are we getting solder icicles on some leads when we run boards in our wave solder machine? Where should be look first to change our process? The Assembly Brothers, Jim Hall and Phil Zarrow, share their insight and experience.
Board Talk

Trouble With Skewed DPAK Components
Trouble With Skewed DPAK Components
We are having trouble with surface mount DPAC components skewing during reflow. We have checked our profile and tried a diagonal hatch aperture on our stencil.
Board Talk

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