Electronics Assembly Knowledge, Vision & Wisdom
Board Talk << Page 1 of 21 >>
Board Talk is presented by ITM Consulting
Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.


Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.

Programs are sorted by published date, most recent first.
Directory Search        


Program Search        
Will High Humidity Affect Reflow Soldering?
Will High Humidity Affect Reflow Soldering?
Will higher than normal humidity in our facility affect reflow soldering? What impact might it have? The Assembly Brothers, Jim Hall and Phil Zarrow, address these questions and more.
Board Talk
Max Time Between Soldering and Cleaning
Max Time Between Soldering and Cleaning
What is the maximum staging time permissible for PCBA's between wave soldering and cleaning? Is there an industry standard?
Board Talk
Is There a Test for Black Pad?
Is There a Test for Black Pad?
We have identified black-pad and are concerned it may extend to assembled PCBs. Is there a nondestructive test that can be performed on assemblies? The Assembly Brothers, Jim Hall and Phil Zarrow, use their expertise in the industry to answer this question.
Board Talk
Can a CTE Mismatch Cause Reliability Problems?
Can a CTE Mismatch Cause Reliability Problems?
Does usage of BGAs, QFNs or SONs have an increased risk for reliability of solder joints due to the CTE mismatch with the base board material FR4?
Board Talk
Help With Lead to Hole Ratio
Help With Lead to Hole Ratio
What is the proper minimum gap between a round conductor lead and the PCB hole that will allow proper solder fill? Can you point us to a guideline with the recommended through hole component to hole diameter ratio? What can be do to improve barrel fill?
Board Talk
Cleaning Solder Paste Misprint
Cleaning Solder Paste Misprint
What should we do when we find defects in the solder paste print on the second side. We currently scrap the boards when these defects.
Board Talk
Issues Mixing Silicone and Acrylic Conformal Coatings
Issues Mixing Silicone and Acrylic Conformal Coatings
We do a lot of repair PWAs. These assemblies have a silicone based conformal coating. During repair some of the coating is removed. After repair our tech uses an acrylic conformal coat to touch up the area. Could there be a compatibility problem, particularly with adhesion, when we mix these two coatings?
Board Talk
Conformal Coating Over No-clean Flux
Conformal Coating Over No-clean Flux
Is it normally acceptable to apply conformal coating directly over circuit boards assembled with no clean flux?
Board Talk
Questions About Humidity Indicator Cards and Baking Components?
Questions About Humidity Indicator Cards and Baking Components?
We run small jobs so a reel of MSD components could be open and closed a number of times. Each time we put a new desiccant pack and humidity card in the MSD bag. If we total the times we open the bag it exceeds 168 hours. If the humidity cards are not pink, do we still have to bake the components?
Board Talk
What is the Best Way to Clean Solder Stencils?
What is the Best Way to Clean Solder Stencils?
Every 4 hours we remove each solder paste stencil and wipe both sides using IPA lint free wipes and then blow drying. Is this the proper procedure?
Board Talk
Board Talk << Page 1 of 21 >>
 
 
About | Advertising | Contact | Directory | Directory Search | Directory Submit | Privacy | Programs | Program Search | Sponsorship | Subscribe | Terms

Circuit Insight
6 Liberty Square #2040, Boston MA 02109 USA

Jeff Ferry, Publisher | Ken Cavallaro, Editor/Business Manager

Copyright © Circuitnet LLC. All rights reserved.
A Circuitnet Media Publication