Electronics Assembly Knowledge, Vision & Wisdom
Board Talk << Page 1 of 21 >>
Board Talk is presented by ITM Consulting

Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.


Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.

ITM Consulting
* EMS Qualification, Evaluation and Selection
* SMT Process Consulting and Troubleshooting
* SMT Process Development and Set-up
* SMT Process Audits
* Lead-free Process Readiness Audits
* SMT Process Optimization
* On-Site Workshops


Programs are sorted by published date, most recent first.
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Incoming Circuit Boards - How Clean Is Clean?
Incoming Circuit Boards - How Clean Is Clean?
We're having cleanliness issues, our assembly processes are not introducing contaminants. Could it be the result of incoming PCB cleanliness? The Assembly Brothers, Jim Hall and Phil Zarrow, share their insight.
Board Talk
Should We Modify Rework Procedures for Assemblies Fabricated Using OSP?
Should We Modify Rework Procedures for Assemblies Fabricated Using OSP?
Should we modify any rework or repair procedures for circuit board assemblies fabricated using OSP, organic solderability preservatives, bare boards?
Board Talk
What Is the Recommended Component Storage Environment?
What Is the Recommended Component Storage Environment?
What do you recommend for component storage to prohibit oxidation including relative humidity, nitrogen atmosphere, temperature? The Assembly Brothers, Jim Hall and Phil Zarrow, share their own experiences.
Board Talk
Review of Tin-Copper and Tin-Nickel Intermetallic Thickness
Review of Tin-Copper and Tin-Nickel Intermetallic Thickness
What is the desirable intermetallic layer thickness? I have read that 1 - 2.5 micron thickness of tin-copper and a .4 - .8 micron thickness on tin-nickel.
Board Talk
Solder Paste Printing First Pass
Solder Paste Printing First Pass
Is it recommended to print one cycle before printing the first production board? I could use a scrap board or blank plastic card for the first print. Phil Zarrow and Jim Hall, the Assembly Brothers, share their own experiences and insight.
Board Talk
Trouble With Skewed DPAK Components
Trouble With Skewed DPAK Components
We are having trouble with surface mount DPAC components skewing during reflow. We have checked our profile and tried a diagonal hatch aperture on our stencil.
Board Talk
What Causes Solder Icicles During Wave Soldering
What Causes Solder Icicles During Wave Soldering
Why are we getting solder icicles on some leads when we run boards in our wave solder machine? Where should be look first to change our process? The Assembly Brothers, Jim Hall and Phil Zarrow, share their insight and experience.
Board Talk
How to Reduce Voiding on QFN Components
How to Reduce Voiding on QFN Components
I'm concerned about voiding in the central ground planes of my QFN components. What can I do and how concerned should I be?
Board Talk
Do BGA Components Warp During Reflow?
Do BGA Components Warp During Reflow?
We recently reworked a BGA component and the corners all bridged. Can these components be removed and reused if we remove the warp? What causes the corners of the BGA component to warp and how do we prevent it? The Assembly Brothers, Jim Hall and Phil Zarrow, answer these questions.
Board Talk
Moisture Barrier Bag Issues
Moisture Barrier Bag Issues
Moisture sensitive chip components have been exposed to the atmosphere beyond specification. Can re-packageding and sealed with desiccant help?
Board Talk
Board Talk << Page 1 of 21 >>