Electronics Assembly Knowledge, Vision & Wisdom
Board Talk << Page 1 of 21 >>
Board Talk is presented by ITM Consulting

Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.


Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.

ITM Consulting
* EMS Qualification, Evaluation and Selection
* SMT Process Consulting and Troubleshooting
* SMT Process Development and Set-up
* SMT Process Audits
* Lead-free Process Readiness Audits
* SMT Process Optimization
* On-Site Workshops


Programs are sorted by published date, most recent first.
Directory Search        


Program Search        
Should We Modify Rework Procedures for Assemblies Fabricated Using OSP?
Should We Modify Rework Procedures for Assemblies Fabricated Using OSP?
Should we modify any rework or repair procedures for circuit board assemblies fabricated using OSP, organic solderability preservatives, bare boards? Phil Zarrow and Jim Hall, the Assembly Brothers, offer their insight.
Board Talk
Incoming Circuit Boards - How Clean Is Clean?
Incoming Circuit Boards - How Clean Is Clean?
We're having cleanliness issues, our assembly processes are not introducing contaminants. Could it be the result of incoming PCB cleanliness?
Board Talk
Review of Tin-Copper and Tin-Nickel Intermetallic Thickness
Review of Tin-Copper and Tin-Nickel Intermetallic Thickness
What is the desirable intermetallic layer thickness? I have read that 1 - 2.5 micron thickness of tin-copper is desirable and a .4 - .8 micron thickness on tin-nickel is desirable. The Assembly Brothers, Jim Hall and Phil Zarrow, address this.
Board Talk
What Is the Recommended Component Storage Environment?
What Is the Recommended Component Storage Environment?
What do you recommend for component storage to prohibit oxidation including relative humidity, nitrogen atmosphere, temperature?
Board Talk
What is the Proper Storage Condition For PCBs
What is the Proper Storage Condition For PCBs
Is there a defined specification for the storage of PCBs? What are some storage concerns? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this issue.
Board Talk
Should We Invest in 3D Optical Inspection?
Should We Invest in 3D Optical Inspection?
We are correcting many solder defects. The search for defects is taking too long. Should we go with a 3D AOI system to save inspection time?
Board Talk
Trouble With Skewed DPAK Components
Trouble With Skewed DPAK Components
We are having trouble with surface mount DPAC components skewing during reflow. We have checked our profile and have tried a diagonal hatch aperture on our stencil. The Assembly Brothers, Jim Hall and Phil Zarrow, address this issue.
Board Talk
Can We Skip Cleaning After Rework?
Can We Skip Cleaning After Rework?
What short-term and long-term concerns should we have with product reliability if we skip cleaning after rework?
Board Talk
How To Determine Stencil Thickness
How To Determine Stencil Thickness
On what basis is stencil thickness decided in the case of BGA's or fine pitch components? The Assembly Brothers, Jim Hall and Phil Zarrow, address this question.
Board Talk
Solder Paste Printing First Pass
Solder Paste Printing First Pass
Is it recommended to print one cycle before printing the first production board? I could use a scrap board or blank plastic card for the first print.
Board Talk
Board Talk << Page 1 of 21 >>