Electronics Assembly Knowledge, Vision & Wisdom
Board Talk << Page 1 of 21 >>
Board Talk is presented by ITM Consulting
Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.


Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.

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Test for Spray Fluxer Uniformity
Test for Spray Fluxer Uniformity
How can we verify that our spray fluxer is uniformly spraying flux over the entire surface of our circuit board? What's new in the world of spray fluxing? The Assembly Brothers, Jim Hall and Phil Zarrow, answer these questions.
Board Talk
How Do You Remove Oxidation from PCBs?
How Do You Remove Oxidation from PCBs?
What is the best method for cleaning bare PCBs with small amounts of oxidation? I know that proper storage and handling may help.
Board Talk
Problems with Pin-In-Paste
Problems with Pin-In-Paste
We are using pin-in-paste and notice that solder paste is dripping out of holes at a connector location and accumulating inside our reflow oven. Is this normal? The Assembly Brothers, Phil Zarrow and Jim Hall, address this question.
Board Talk
Proper Exhaust Pressure for Reflow Ovens?
Proper Exhaust Pressure for Reflow Ovens?
What is the proper exhaust pressure for a reflow over? Where should we measure the pressure? How should we measure pressure?
Board Talk
Max Interval Between Reflow for OSP Boards
Max Interval Between Reflow for OSP Boards
With OSP coated circuit boards, what is the maximum allowable and recommend time interval between reflow of the first and second sides to insure proper wetting. The Assembly Brothers, Jim Hall and Phil Zarrow, discuss this.
Board Talk
We Bake, But Still Have Delamination, Why?
We Bake, But Still Have Delamination, Why?
When our PCBs are wave soldered and then pass through reflow most had issues with delamination. Where should we look to solve this?
Board Talk
How Do You Inspect QFN Components?
How Do You Inspect QFN Components?
How can you inspect QFN components? What guidelines can you suggest for qualifying an assembly house for QFN assembly? The Assembly Brothers, Jim Hall and Phil Zarrow, answer these questions.
Board Talk
QFN Rework: No-Clean or Water Soluble Flux?
QFN Rework: No-Clean or Water Soluble Flux?
We are replacing 32 lead QFN and 14 lead DFN components. We can use either a no-clean or a water soluble process. Which do you suggest?
Board Talk
What is Causing Intermittent BGA Failures?
What is Causing Intermittent BGA Failures?
We're having problems with BGA devices after SMT assembly. During testing, the BGA devices are failing, if we press lightly on top of the BGA device during testing, the board passes. The Assembly Brothers, Jim Hall and Phil Zarrow, offer their advice.
Board Talk
How To Eliminate Pesky Solder Balls?
How To Eliminate Pesky Solder Balls?
Frequently after reflow we have solder balls on the sides of chip capacitors and resistors. What is causing these to form? How can we eliminate them?
Board Talk
Board Talk << Page 1 of 21 >>
 
 
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