Electronics Assembly Knowledge, Vision & Wisdom
Board Talk
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Board Talk is presented by ITM Consulting

Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.


Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.

ITM Consulting
* EMS Qualification, Evaluation and Selection
* SMT Process Consulting and Troubleshooting
* SMT Process Development and Set-up
* SMT Process Audits
* Lead-free Process Readiness Audits
* SMT Process Optimization
* On-Site Workshops
Programs are sorted by published date, most recent first.


What Causes Solder Icicles During Wave Soldering
What Causes Solder Icicles During Wave Soldering
Why are we getting solder icicles on some leads when we run boards in our wave solder machine? Where should be look first to change our process? The Assembly Brothers, Jim Hall and Phil Zarrow, share their insight and experience.
Board Talk

Review of Tin-Copper and Tin-Nickel Intermetallic Thickness
Review of Tin-Copper and Tin-Nickel Intermetallic Thickness
What is the desirable intermetallic layer thickness? I have read that 1 - 2.5 micron thickness of tin-copper and a .4 - .8 micron thickness on tin-nickel.
Board Talk

Can High Particle Concentrations Impact PCB Assembly?
Can High Particle Concentrations Impact PCB Assembly?
At our SMT facility we currently control ambient temperature, relative humidity and particle count. Is particle count a good parameter to control? How can having high particle concentration affect our PCB assembly process, printing process, reflow, etc.?
Board Talk

Trouble With Skewed DPAK Components
Trouble With Skewed DPAK Components
We are having trouble with surface mount DPAC components skewing during reflow. We checked our profile and tried a diagonal hatch aperture.
Board Talk

Moisture Barrier Bag Issues
Moisture Barrier Bag Issues
Moisture sensitive chip components have been exposed to the atmosphere beyond specification. Can re-packageding and sealed with desiccant help? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk

How to Reduce Voiding on QFN Components
How to Reduce Voiding on QFN Components
I'm concerned about voiding in the central ground planes of my QFN components. What can I do and how concerned should I be?
Board Talk

Can Mixing Wave Solder Pallets Cause Contamination?
Can Mixing Wave Solder Pallets Cause Contamination?
Our wave solder pallets are made from Durastone. Can we use the same wave solder pallets for leaded and lead-free? Jim Hall and Phil Zarrow, the Assembly Brothers, share their own experiences.
Board Talk

Do BGA Components Warp During Reflow?
Do BGA Components Warp During Reflow?
We recently reworked a BGA component and the corners all bridged. Can these components be removed and reused if we remove the warp?
Board Talk

Calculating Failure Rate During Rework
Calculating Failure Rate During Rework
Is there a way to estimate the potential failure rate introduced by hand rework on one SMT part? Phil Zarrow and Jim Hall, The Assembly Brothers, share their own insights to answer this question.
Board Talk

Why Uneven Conformal Coating?
Why Uneven Conformal Coating?
We are experiencing an issue with our conformal coating . On matte finish boards the coating is vibrating away from some others and building up in others.
Board Talk

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