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Board Talk << Page 1 of 21 >>
Board Talk is presented by ITM Consulting
Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.


Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.

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Best Method for Repairing Underfill Arrays?
Best Method for Repairing Underfill Arrays?
What is the best method for removing an SMT array package that has been under-filled and cured. Is there an industry approved method? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this.
Board Talk
Can We Rework Lead-Free Boards with Leaded Solder?
Can We Rework Lead-Free Boards with Leaded Solder?
Can boards built with lead-free be reworked with leaded solder? I realize they may not comply with RoHS, but will they be reliable?
Board Talk
Screen Print Stepped Stencil Review
Screen Print Stepped Stencil Review
Should you use a metal or rubber squeegee when using stepped solder paste stencils? What is the proper depth for a step? The Assembly Brothers, Jim Hall and Phil Zarrow, offer their take.
Board Talk
Eliminate Tin Whiskers on Component Leads
Eliminate Tin Whiskers on Component Leads
Is there a process that can be used to re-plate component leads to add lead to eliminate the problem of tin whisker formation?
Board Talk
Sticky Residue Under Low Clearance Parts
Sticky Residue Under Low Clearance Parts
We are finding a tacky substance under a large SMT component. Is this common when no-clean leaded solder paste is used with no clearance parts? The Assembly Brothers, Phil Zarrow and Jim Hall, offer their experience.
Board Talk
Is There a Limit to the Step in a Step Stencil?
Is There a Limit to the Step in a Step Stencil?
I've seen a problem with the 3-mil step. Is there a rule of thumb regarding the amount of step that can used in a step stencil?
Board Talk
Is Alloy Mixing During Rework Acceptable?
Is Alloy Mixing During Rework Acceptable?
A board may bear a RoHS label, but the lead-free solder alloy is not known. What is the best rework procedure to follow? Jim Hall and Phil Zarrow, The Assembly Brothers, share their insight.
Board Talk
Is De-paneling PCBs by Hand Acceptable?
Is De-paneling PCBs by Hand Acceptable?
Is it acceptable to hand break when de-panelizing circuit boards that contain QFN and SMD components? Are there specs for hand breaking?
Board Talk
Printing vs. Dispensing
Printing vs. Dispensing
Do people size their stencil for the larger components, then use a needle dispenser for the smaller components? It seems more flexible than step stencils. The Assembly Brothers, Jim Hall and Phil Zarrow, answer this question.
Board Talk
How Effective Is Nano Coating On Stencils?
How Effective Is Nano Coating On Stencils?
With nano coatings on stencils evolving, what is the best method to measure the thickness? How do you know if the coating degrades over time?
Board Talk
Board Talk << Page 1 of 21 >>