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Board Talk << Page 1 of 21 >>
Board Talk is presented by ITM Consulting
Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.


Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.

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Maximum Time Between Printing and Reflow
Maximum Time Between Printing and Reflow
What is the maximum allowable time for a PCB after it leaves the screen printer but before reflow? We're using water soluble lead-free paste. The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this.
Board Talk
Dross Contamination After Selective Soldering
Dross Contamination After Selective Soldering
We have discovered a fine low density dross on PCBs after selective soldering. The dross is difficult to see. Is there an effective way to clean this?
Board Talk
Has My Flux Expired?
Has My Flux Expired?
What specific attributes occur in an expired flux? How do you know if a flux is bad and shouldn't be used? Are there any simple tests? The Assembly Brothers, Jim Hall and Phil Zarrow, share there expertise and shed some light on these questions.
Board Talk
Issues With BGA Rework Residue
Issues With BGA Rework Residue
After BGA rework there is an outline of residue on around the pads. Is it necessary to remove this residue to reinstall a new BGA?
Board Talk
Processing Circuit Boards with BGAs On Both Sides
Processing Circuit Boards with BGAs On Both Sides
What is the best way to process a 30 mil circuit board assembly that has micro BGAs that need to be soldered to both sides? The Assembly Brothers, Jim Hall and Phil Zarrow, answer this question.
Board Talk
Reliability of Tin Lead Solder vs. Lead Free Solder
Reliability of Tin Lead Solder vs. Lead Free Solder
The issue of tin-lead solder versus lead-free solder reliability and whether lead in solders used for circuit board assembly impacts the reliability.
Board Talk
Seeking Alternatives to Solvent Cleaning
Seeking Alternatives to Solvent Cleaning
We are currently using a mix of trichloroethylene and IPA for cleaning in the ratio of 10 to 90. We are looking to eliminate the use of trichloroethylene and request your input.
Board Talk
Incoming Circuit Boards - How Clean Is Clean?
Incoming Circuit Boards - How Clean Is Clean?
We're having cleanliness issues, our assembly processes are not introducing contaminants. Could it be the result of incoming PCB cleanliness?
Board Talk
Should We Modify Rework Procedures for Assemblies Fabricated Using OSP?
Should We Modify Rework Procedures for Assemblies Fabricated Using OSP?
Should we modify any rework or repair procedures for circuit board assemblies fabricated using OSP, organic solderability preservatives, bare boards? Phil Zarrow and Jim Hall, the Assembly Brothers, offer their insight.
Board Talk
What Is the Recommended Component Storage Environment?
What Is the Recommended Component Storage Environment?
What do you recommend for component storage to prohibit oxidation including relative humidity, nitrogen atmosphere, temperature?
Board Talk
Board Talk << Page 1 of 21 >>