Electronics Assembly Knowledge, Vision & Wisdom
Board Talk << Page 1 of 21 >>
Board Talk is presented by ITM Consulting
Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.


Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.

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Is Customer Approval Required for Class 3 Repair?
Is Customer Approval Required for Class 3 Repair?
We have a case where a non-aerospace customer's board was repaired without prior authorization. It was for a class 3 assembly. Does it specify in an IPC document that customer approval is required for class 3 repairs?
Board Talk
What Are the Benefits and Drawbacks of OSP Finish?
What Are the Benefits and Drawbacks of OSP Finish?
What are the advantages of using an OSP surface finish? What precautions should be taken when using circuit boards supplied with OSP finish?
Board Talk
Lead-free Solder Contamination Concern
Lead-free Solder Contamination Concern
Can thermocouples attached to a circuit board with high temperature solder contaminate a lead-free solder wave? The Assembly Brothers, Phil Zarrow and Jim Hall, answer this question.
Board Talk
Is There a Passive Component Solder Void Limit?
Is There a Passive Component Solder Void Limit?
Is there a quality criteria for solder voids in passive components. Phil Zarrow and Jim Hall point to the answers.
Board Talk
SMT Components Popping Off During Reflow
SMT Components Popping Off During Reflow
One particular SMT component is popping off during the reflow process leaving indentations in the solder. Could the fans in our convection reflow oven be blowing the part of the PCB? The Assembly Brothers, Phil Zarrow and Jim Hall, answer these questions.
Board Talk
Are There Standards Governing Polarity Marks?
Are There Standards Governing Polarity Marks?
Is there a standard that governs how polarity marks are used to denote orientation of components on circuit boards?
Board Talk
Round or Square Stencil Apertures?
Round or Square Stencil Apertures?
What is your opinion about using round versus square apertures for BGA patterns in solder paste stencils? Which wins, square or round? The Assembly Brothers, Jim Hall and Phil Zarrow, answer these questions.
Board Talk
Top Side Reflow Causing Solder Balls
Top Side Reflow Causing Solder Balls
When selective soldering the secondary side, we are producing solder balls on the primary side. What can be done to prevent this from happening?
Board Talk
What is the Best Way to Reduce Dross?
What is the Best Way to Reduce Dross?
What is the best way to reduce dross? What are all the possible options to cut down on solder dross? The Assembly Brothers, Phil Zarrow and Jim Hall, offer some options.
Board Talk
Solder Pallets With Titanium Inserts - Yes/No?
Solder Pallets With Titanium Inserts - Yes/No?
Our pallet manufacturer recommends titanium inserts to allow larger apertures near closely spaced surface mount components. Are they worth it?
Board Talk
Board Talk << Page 1 of 21 >>
 
 
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