Board Talk



Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
Phil Zarrow
Phil Zarrow - With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.
Jim Hall
Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
Previous
 Page 1 of 47 
Next
Cleaning Reballed BGA Components
Cleaning Reballed BGA Components
We currently clean reballed BGAs using an ultrasonic cleaner followed by baking to remove moisture. Is this an acceptable practice? Jim Hall and Phil Zarrow, the Assembly Brothers, offer their own suggestions and expertise.
Board Talk

We Bake, But Still Have Delamination, Why?
We Bake, But Still Have Delamination, Why?
When our PCBs are wave soldered and then pass through reflow most had issues with delamination. Where should we look to solve this?
Board Talk

Reflow For Rigid Flex
Reflow For Rigid Flex
We have a new PCB assembly that includes a section of flex cable and FR4 circuit board. What are the reflow rules I need to consider? Jim Hall and Phil Zarrow, the Assembly Brothers, share their own insight and experience.
Board Talk

Solder Paste Volume for BGA Rework
Solder Paste Volume for BGA Rework
Rework can never be as controlled or consistent as original assembly, should we use more paste during BGA rework to compensate for irregularities or flatness?
Board Talk

Problems With Starved
Problems With Starved "J" Lead Joints
We have insufficient solder joint heel fillets with a PLCC J lead component. We cannot increase the stencil thickness. What do you advise? The Assembly Brothers, Phil Zarrow and Jim Hall, answer this question.
Board Talk

Previous
 Page 1 of 47 
Next