Electronics Assembly Knowledge, Vision & Wisdom
Board Talk
Previous   Page 1 of 23   Next


Board Talk is presented by ITM Consulting

Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.


Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.

ITM Consulting
* EMS Qualification, Evaluation and Selection
* SMT Process Consulting and Troubleshooting
* SMT Process Development and Set-up
* SMT Process Audits
* Lead-free Process Readiness Audits
* SMT Process Optimization
* On-Site Workshops
Programs are sorted by published date, most recent first.


Why Do Our Boards Warp During Reflow?
Why Do Our Boards Warp During Reflow?
Board flexing has recently started to occur on one of our circuit board assemblies, yet our process has remained the same. We are using a three-zone reflow oven. Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this.
Board Talk

What is the Suggested Humidity Level for Electronics Assembly?
What is the Suggested Humidity Level for Electronics Assembly?
I am aware of the suggested humidity level for an electronics assembly facility. Do the same limits apply within a 100,000 class clean room?
Board Talk

Hand Soldering Reliability
Hand Soldering Reliability
Can you comment on potential differences in reliability for SMT machine placement followed by reflow soldering vs. hand placement followed by hand soldering in surface mount? The Assembly Brothers, Jim Hall and Phil Zarrow, address this question.
Board Talk

Selective Solder Paste Printing for BGA Components
Selective Solder Paste Printing for BGA Components
Could we print paste only on the pads that have functional requirements? Could we skip printing on 50 or more of the interior pads since they serve no function?
Board Talk

Opens With Assembled QFN Components
Opens With Assembled QFN Components
We are experiencing opens on assembled QFN components at a rate of approximately 9%. The component has two rows of pads and the failure only appears in rows near the component center. Our boards are double-side reflow and this component is mounted on the first side. What is happening?
Board Talk

Issues With SMT Component Alignment
Issues With SMT Component Alignment
During automatic optical inspection our chip components are shifting. This is not limited to single components and changes daily.
Board Talk

How To Strip Tin-Lead Solder From SMT Pads for RoHS
How To Strip Tin-Lead Solder From SMT Pads for RoHS
Is it possible to scrub the pads of a PCB to bring it back into compliance? 63-37 solder was mistakenly used to hand solder parts. Somebody put out the wrong material for the manual soldering operation. The Assembly Brothers review this challenge.
Board Talk

No-Clean Residue Shorts
No-Clean Residue Shorts
We have a PCBA with a QFN 44 using no-clean flux. We have many test failures during testing. Are the failures due to flux reside between terminations?
Board Talk

What is the IPC Definition for Uncommonly Harsh?
What is the IPC Definition for Uncommonly Harsh?
IPC 610 and other documents define class three to include products where the end use environment may be uncommonly harsh. Does anyone have guidelines for how uncommonly harsh may be defined? The Assembly Brothers, Jim Hall and Phil Zarrow, address this question.
Board Talk

Tips When Moving a Reflow Oven
Tips When Moving a Reflow Oven
After moving a reflow oven to a different site, what steps do you need to perform on the machine for the machine to be certified?
Board Talk

Free Newsletter Subscription
Every issue of the Circuit Insight email newsletter will bring you the latest information on the issues affecting you and your company.

Insert Your Email Address

Directory Search


Program Search