Electronics Assembly Knowledge, Vision & Wisdom
Board Talk
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Board Talk is presented by ITM Consulting

Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.


Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.

ITM Consulting
* EMS Qualification, Evaluation and Selection
* SMT Process Consulting and Troubleshooting
* SMT Process Development and Set-up
* SMT Process Audits
* Lead-free Process Readiness Audits
* SMT Process Optimization
* On-Site Workshops
Programs are sorted by published date, most recent first.


Reflow For Rigid Flex
Reflow For Rigid Flex
We have a new PCB assembly that includes a section of flex cable and FR4 circuit board. What are the reflow rules I need to consider? Jim Hall and Phil Zarrow, the Assembly Brothers, share their own insight and experience.
Board Talk

Solder Paste Transfer Efficiency - What/Why
Solder Paste Transfer Efficiency - What/Why
I've heard the term transfer efficiency relating to printing. What does this term refer to? What actions impact solder paste transfer efficiency?
Board Talk

Problems With Starved
Problems With Starved "J" Lead Joints
We have insufficient solder joint heel fillets with a PLCC J lead component. We cannot increase the stencil thickness. What do you advise? The Assembly Brothers, Phil Zarrow and Jim Hall, answer this question.
Board Talk

Going Beyond Your Solder Paste Work Life
Going Beyond Your Solder Paste Work Life
Solder paste used for a problem batch of board exceeded the 12 hour work life by one hour. Could this cause soldering problems for small chip components?
Board Talk

Can a CTE Mismatch Cause Reliability Problems?
Can a CTE Mismatch Cause Reliability Problems?
Does usage of BGAs, QFNs or SONs have an increased risk for reliability of solder joints due to the CTE mismatch with the base board material FR4? Jim Hall and Phil Zarrow, The Assembly Brothers, offer their own experiences.
Board Talk

Cause of Damage During Through-hole Component Insertion
Cause of Damage During Through-hole Component Insertion
During automatic insertion and clinching of two pin components we encounter small cracks in the lands or the walls of plated holes. How can we eliminate this?
Board Talk

Issues Mixing Silicone and Acrylic Conformal Coatings
Issues Mixing Silicone and Acrylic Conformal Coatings
Our repair PWA assemblies have a silicone based conformal coating. During repair some of the coating is removed. Is there be a compatibility problem with the coatings? The Assembly Brothers, Phil Zarrow and Jim Hall, answer these questions.
Board Talk

Help With Lead to Hole Ratio
Help With Lead to Hole Ratio
What is the proper minimum gap between a round conductor lead and the PCB hole that will allow proper solder fill? Where can I find the recommended guideline?
Board Talk

What is the Best Way to Clean Solder Stencils?
What is the Best Way to Clean Solder Stencils?
Every 4 hours we remove each solder paste stencil and wipe both sides using IPA lint free wipes and then blow drying. Is this the proper procedure? The Assembly Brothers, Jim Hall and Phil Zarrow, share their experiences.
Board Talk

Questions About Humidity Indicator Cards and Baking Components?
Questions About Humidity Indicator Cards and Baking Components?
We run small jobs so a reel of MSD components could be opened a number of times. If the humidity cards are not pink, do we have to bake the components?
Board Talk

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