Electronics Assembly Knowledge, Vision & Wisdom
Board Talk
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Board Talk is presented by ITM Consulting

Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.


Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.

ITM Consulting
* EMS Qualification, Evaluation and Selection
* SMT Process Consulting and Troubleshooting
* SMT Process Development and Set-up
* SMT Process Audits
* Lead-free Process Readiness Audits
* SMT Process Optimization
* On-Site Workshops
Programs are sorted by published date, most recent first.


What is the Best Way to Clean Solder Stencils?
What is the Best Way to Clean Solder Stencils?
Every 4 hours we remove each solder paste stencil and wipe both sides using IPA lint free wipes and then blow drying. Is this the proper procedure? The Assembly Brothers, Jim Hall and Phil Zarrow, share their experiences.
Board Talk

Help With Lead to Hole Ratio
Help With Lead to Hole Ratio
What is the proper minimum gap between a round conductor lead and the PCB hole that will allow proper solder fill? Where can I find the recommended guideline?
Board Talk

V-Score and Depanel in One Step
V-Score and Depanel in One Step
Can we score and de-panel assembled PCBs in one step to create a card edge connector on the PCB. Is there a precedence for doing this? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk

Questions About Humidity Indicator Cards and Baking Components?
Questions About Humidity Indicator Cards and Baking Components?
We run small jobs so a reel of MSD components could be opened a number of times. If the humidity cards are not pink, do we have to bake the components?
Board Talk

Tenting Via In Pad - Yes or No?
Tenting Via In Pad - Yes or No?
Should the thermal vias on the bottom terminated components be tented on both sides to prevent flux trapping or is it okay to tent the top side only? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this question.
Board Talk

A Review of Industry Terminology and Acronyms
A Review of Industry Terminology and Acronyms
What does the term BTC refer to? The Assembly Brothers talk about uniformity of terminology and the industry's acronyms.
Board Talk

Issues With Solder Paste Transfer Efficiency
Issues With Solder Paste Transfer Efficiency
With transfer efficiency and its relationship to solder paste volume, can you produce a transfer efficiency over 100% of the theoretical volume? Jim Hall and Phil Zarrow, the Assembly Brothers, discuss this question.
Board Talk

How Frequently Should  We Recheck Profiles?
How Frequently Should We Recheck Profiles?
Is it necessary to replicate thermal profiling during long-term mass production? Is it necessary to recheck accuracy of reflow oven profiles periodically?
Board Talk

Issues With Fillets on Via Holes?
Issues With Fillets on Via Holes?
During wave solder some of the vias have concave fillets giving them a dimple effect. What can we do to create flatter fillets on via holes? The Assembly Brothers, Phil Zarrow and Jim Hall, share their own experiences.
Board Talk

Solder Paste  Beyond The Shelf Life?
Solder Paste Beyond The Shelf Life?
We have some solder paste that has been in a sealed box at 4 degree Celsius for 8 months. The shelf life is 6 months. Can it be used?
Board Talk

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