|
![]() |
Analysis Lab | ||||||||||
|
||||||||||
|
||||||||||
There are many factors contributing to electrochemical failures on electronic devices including pitch, electrical field, ionic contamination and environmental conditions. Analysis Lab
A detailed study has been carried out on low temperature lead-free solder paste that utilizes Bi bearing alloys. Analysis Lab
This project compares past board assembly roadmaps with technological outcomes, drawing conclusions on the outline and readability of the board assembly roadmaps. Analysis Lab
Large size commercially available plastic ball grid array chip packaging was tested and analyzed under random vibration to assess its application feasibility on satellite electronics. Analysis Lab
This paper reviews a testing protocol based on IPC-TM 650 2.3.25 to enable monitoring of ionic contamination within series production. Analysis Lab
This paper presents a comparative study for three types of immersion golds used for both ENIG and ENEPIG deposits in the same production line. Analysis Lab
This paper evaluates SMT production and inspection machines and attempts to define their potential to act as ‘smart sensors’, the first building blocks towards i4.0. Analysis Lab
The reasons of inaccurate PCB impedance simulation of the traditional simulator and a novel and cost-effective method for accurate PCB impedance simulation are discussed. Analysis Lab
The method explored in this paper regards the use of exposed via in pad. A dedicated test vehicle was designed for two types of QFN components. Analysis Lab
The stencil aperture design has more influence on overcoming CTE mismatch between the ceramic LGA and the FR4 PCB than the reflow oven temperature profile cool down slope. Analysis Lab |
|
![]() |