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Accelerated Corrosion Testing of DRAM Modules for Data Centers
Accelerated Corrosion Testing of DRAM Modules for Data Centers
To investigate corrosion problems in electronic products for server applications, mixed flowing gas (MFG) is widely used as an accelerated testing method.
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Tin Whisker Testing and Modeling
Tin Whisker Testing and Modeling
The elimination of lead from consumer electronics has resulted in an increase in tin whisker risk mitigation using dual-use commercial/aerospace components.
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Fracture of Lead-Free Joints
Fracture of Lead-Free Joints
The current study extended the quasi-static approach of [6,7] to treat solder joint fracture under higher strain-rate loading conditions.
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Addressing Low-Temperature Rework Concerns
Addressing Low-Temperature Rework Concerns
This paper will detail the material properties and rework considerations of using a eutectic tin/bismuth solid wire and SAC305 flux cored wire in a rework setting.
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SIR Test Vehicles - Comparison from a Cleaning Perspective
SIR Test Vehicles - Comparison from a Cleaning Perspective
This study compares different SIR test vehicles to determine which test vehicle is tougher to clean and therefore a challenge the cleaning process.
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PCB Manufacturability and Reliability for Fine Pitch PCB Server Boards
PCB Manufacturability and Reliability for Fine Pitch PCB Server Boards
This paper assesss PCB vendor drill registration capability and will also evaluate PCB reliability using electrochemical migration and via reliability testing.
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Developing a Low Palladium Activation System for Electroless Copper Deposition
Developing a Low Palladium Activation System for Electroless Copper Deposition
This paper summarizes experiences gained while developing a new cost effective Palladium containing ionic activation system.
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Process Characterization for Acceptable Levels of Flux
Process Characterization for Acceptable Levels of Flux
Analysis of residues and their effects has shifted from a global examination of ionic residues to a more site-specific examination of spot or local contamination.
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Examination of Glass-fiber and Epoxy Interface Degradation in Circuit Boards
Examination of Glass-fiber and Epoxy Interface Degradation in Circuit Boards
Failures in PCBs account for a significant percentage of field returns. Studies have found that path formation is often along the glass fiber to epoxy matrix interface.
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Mechanical Behavior of Bi-Containing Pb-Frees
Mechanical Behavior of Bi-Containing Pb-Frees
The objective of this research was to characterize the mechanical metallurgy of alternative solder alloys for high-reliability applications.
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