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This paper covers the iNEMI technical subcommittee test for creep corrosion using a flowers-of-sulfur based qualification test. Analysis Lab
Many methods simulate end-use characteristics of equipment, but a clear understanding is required to differentiate between the methods. Analysis Lab
Specifications are consensus documents agreed upon by a panel of industry participants composed of suppliers, manufacturers, assembly houses and users. Analysis Lab
BGAs with various alloy balls were assembled with various solder pastes. Joint strength, drop test performance and voiding performance were evaluated. Analysis Lab
During the production of Lead-Free Hot Air Solder Leveling (LF HASL), non-wetting issues in several components were found including BGA pad. Analysis Lab
This research is to determine if there is a relationship between PCB fabrication processes and the prevalence of fine barrel cracks. Analysis Lab
Chip resistors were subjected to a high number of short duration power cycles. Environmental conditions and material properties were documented. Analysis Lab
As lead-free alloys shift into high reliability electronics, the issue of tin whisker growth remains a primary concern among those in the industry. Analysis Lab
In this study many coatings were examined for their effectiveness at preventing corrosion of nickel-palladium-gold-finished terminals. Analysis Lab
In this study various printed circuit board surface finishes were evaluated. A total of nine groups of PCB were evaluated. Analysis Lab |
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