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The effect of joint length on the fracture of copper-solder-copper joints is investigated using double cantilever-beam specimens of various joint lengths. Analysis Lab
This paper shows working demonstrations of printed circuit structures, the obstacles, and the potential future of 3D printed electronics. Analysis Lab
This paper evaluates the effect of particle size distribution and oxidation on the reflow performance of solder paste. Analysis Lab
This experiment provides insight into future design guidelines and process intellectual property for manufacturing printed electronic products. Analysis Lab
The primary objective of this study was to baseline the solder-joint thermal fatigue life for the POR (plan of record) package. Analysis Lab
This paper presents the effect of a priori thermal cycle on subsequent drop to failure behavior of CGAs with 1272 columns. Analysis Lab
In this study, the impact of industry standard Pd thicknesses on thin solder joints is evaluated through shear testing. Analysis Lab
A comparison of failure modes for different packaging architectures at elevated test temperatures and vibration has been presented in this study. Analysis Lab
Models for copper interconnect degradation are needed for life prediction modeling to ensure 10-year, 100,000 mile reliability for automotive applications. Analysis Lab
A study on the rubber standoffs and gaskets. The effectiveness of rubber standoffs and rubber gaskets as shock/vibration mitigation have been evaluated. Analysis Lab |
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