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The electromigration rates and behavior of eutectic Sn-Bi alloy in planar and in BTC solder joints were compared and shown to be similar. Analysis Lab
The flatness of boards and components is an important topic. This study deals only with components. Analysis Lab
This paper discusses a recent joint industry project to evaluate the retermination process on a range of electronic package styles. Analysis Lab
This study focuses on determining the effects of palladium and gold thicknesses to ensure dependable solder joints and wire bonds. Analysis Lab
There has been an increasing number of reports concluding that stacked micro vias are failing preferentially when compared to an alternative staggered via design. Analysis Lab
This study qualifies an aqueous cleaning process capable of removing combinations of no-clean flux residues for Class III electronic assemblies. Analysis Lab
This paper will review the status of the ongoing interposer development program and provide details on the process capabilities that have been established. Analysis Lab
Paper presents work performed to achieve LCP-based high density multilayer structures, describing the breadboards manufactured and tested. Analysis Lab
Lead Free has brought new materials and quality concerns to the industry. New methods to determine the quality of materials is needed. Analysis Lab
This article presents workflows that combine 3D X-ray microscopy, nanoscale tomography, and electron microscopy for visualization of the interior of electronic devices. Analysis Lab |
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