Analysis Lab
Corrosion,
Contamination,
Data Acquisition,
ESD,
EOS,
Inspection,
Measurement,
Profiling,
Reliability,
RFID,
Solder Defects,
Tombstoning,
X-ray
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Effect of Encapsulation Materials on Tensile Stress
In this paper FEA modeling was performed to observe stress-strain behavior of solder joints during thermal expansion for various potting materials.
Analysis Lab
The Invention of CMOS Image Sensors: A Camera in Every Pocket
CMOS image sensors continue to be used in an ever increasing variety of applications. Some of these applications are useful in every day life, some are for fun.
Analysis Lab
Microstructure and Reliability of Low AG/Bi Solder Alloys
The goal of this study was to provide a screening experiment for three alloys Bi-containing, Low (or no) Ag as alternatives to SAC305.
Analysis Lab
Component Density on Solder Joint Reliability Under Harsh Environment
In this study, degradation behavior of lead free solder joint was compared with mounted position and component density of vehicle engine control unit for excavator.
Analysis Lab
Heterogeneous Integration Roadmap: Technology for Systems of the Future
The new Heterogeneous Integration Roadmap provides a long-term vision for the electronics industry, identifying future challenges and potential solutions.
Analysis Lab
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