Analysis Lab
Corrosion,
Contamination,
Data Acquisition,
ESD,
EOS,
Inspection,
Measurement,
Profiling,
Reliability,
RFID,
Solder Defects,
Tombstoning,
X-ray
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Wettable-Flanks On Bottom-Termination Components in Mass Production
Paper investigates the influence of wetting height of lead-frame based bottom-termination components on the performance of AO joint inspection.
Analysis Lab
Effects of Composition and Isothermal Aging on Microstructure Performance
Investigations of alloy composition and isothermal aging on solder microstructure and shear fatigue were performed on Pb-free alloy solder joints.
Analysis Lab
Evaluation of Molded Flip-chip BGA Packages
The results of this study demonstrate that the molded flip-chip BGA package is a cost effective and high reliability solution for 28nm FPGA devices.
Analysis Lab
Controlling Voiding Mechanisms in the Reflow Soldering Process
This paper reviews the factors that influence the incidence of voids in small and large area solder joints in LED modules.
Analysis Lab
Optimization of Robotic Soldering Process: Solder Spread and Spattering
Robotic soldering is a growing market. We will present how cored wires with different flux percentages will affect robotic soldering performance.
Analysis Lab
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