Analysis Lab
Corrosion,
Contamination,
Data Acquisition,
ESD,
EOS,
Inspection,
Measurement,
Profiling,
Reliability,
RFID,
Solder Defects,
Tombstoning,
X-ray
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Comparing Past Board Assembly iNEMI Roadmaps to Technology Outcomes
This project compares past board assembly roadmaps with technological outcomes, drawing conclusions on the outline and readability of the board assembly roadmaps.
Analysis Lab
Process Control of Ionic Contamination in Assembly of Electronic Circuits
This paper reviews a testing protocol based on IPC-TM 650 2.3.25 to enable monitoring of ionic contamination within series production.
Analysis Lab
Immersion Gold Processes Used for Both ENIG and ENEPIG
This paper presents a comparative study for three types of immersion golds used for both ENIG and ENEPIG deposits in the same production line.
Analysis Lab
Design for Manufacture and Test Using Thermal Cycling Under Bia to Measure Electrochemical Reliablity on Bottom Terminated Components
There are many factors contributing to electrochemical failures on electronic devices including pitch, electrical field, ionic contamination and environmental conditions.
Analysis Lab
Method for Accurate PCB Impedance Simulation of Any Specific Stack-Ups
The reasons of inaccurate PCB impedance simulation of the traditional simulator and a novel and cost-effective method for accurate PCB impedance simulation are discussed.
Analysis Lab
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