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The new Heterogeneous Integration Roadmap provides a long-term vision for the electronics industry, identifying future challenges and potential solutions. Analysis Lab
CMOS image sensors continue to be used in an ever increasing variety of applications. Some of these applications are useful in every day life, some are for fun. Analysis Lab
The present work addresses the rework and reball challenges of a specific WLP case study, and suggests improvements for maintaining the true failure signature. Analysis Lab
In this paper FEA modeling was performed to observe stress-strain behavior of solder joints during thermal expansion for various potting materials. Analysis Lab
This paper evaluates the current state of inline SPI tools from multiple vendors for solder paste measurement accuracy and capability. Analysis Lab
This work aims to provide guidance for the potential trade-offs between thermal performances and second level interconnect reliability. Analysis Lab
The tendencies of commonly used RF connector polymeric materials to absorb and desorb moisture under various humidity and temperatures are characterized. Analysis Lab
In this study, degradation behavior of lead free solder joint was compared with mounted position and component density of vehicle engine control unit for excavator. Analysis Lab
As components reduce in size, the flux residue formation during the reflow soldering process is altered which can impact the reliability of the final assembly. Analysis Lab
Paper offers results of void experiments using an in-line convection reflow oven and three types of bottom terminated components. Analysis Lab |
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