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Cross-Sectioning of SMT and PCB Related Architectures
Techniques in performing precision and analytical micro-sections, which fuse the techniques common in preparation of silicon wafers and bulk materials are discussed.
Analysis Lab
Electrochemical Reliability as a Function of Component Standoff
The purpose of this paper is to research the activity of flux residues as a function of the standoff height using insulation resistance.
Analysis Lab
Risk for Ceramic Component Cracking Dependent
The paper discusses the differences of the alloy, based stress in ceramic components due to passive cycle tests, real customer tests, and stress analyses.
Analysis Lab
Embracing a New Paradigm: Electronic Work Instructions (EWI)
To stay competitive in today's evolving global marketplace, manufacturing must recognize and embrace the new EWI paradigm.
Analysis Lab
Board, Package and Die Thickness Effects Under Thermal Cycling Conditions
A model that enables the scaling of solder joint failure cycles for board and die or substrate thickness effects under thermal cycling conditions is discussed.
Analysis Lab
Failure Analysis - Using Chromatography and Ion Chromatopgraphy/Mass Spec
From component and fabrication to complete electronic assemblies, IC analysis has been the de facto method for evaluating ionic cleanliness of electronic hardware.
Analysis Lab
Low Temperature Solder Interconnect Reliabiilty in Enterprise Computer and Automotive Electronics
This article studies a new low melting temperature solder interconnect application and reliability on various product categories.
Analysis Lab
Extended-Time Process Consistency and Process-Property Relationships for Flexible Additive-Printed Electronics
In this paper, a detailed study of the effect of aerosol-jet process parameters on the resistance, shear strength, and elastic modulus has been presented.
Analysis Lab
Assessment of 2nd Level Interconnect Quality in Flip Chip Ball Grid Array Package
Wire bonding is extensively used in the electronic packaging industry. One of the difficulties with flip chip technology is testing its reliability.
Analysis Lab
Reworkable Edgebond Applied Wafer-Level Chip-Scale Package
This paper presents data showing that localized distribution of recrystallized grains is an accurate indicator of solder joint life-cycle degradation and enhancement.
Analysis Lab
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