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In this paper, we evaluate and compare the print performance of four different step technologies: Chemically etched, Laser weld, Milled, and Electroform. Analysis Lab
This paper proposes a test method and vehicle to characterize soldering materials, assembly process steps, and conformal coating to determine reliability. Analysis Lab
This study analyzes the impact of electroplating parameters of matte-Sn terminal layer on the thermo-mechanical reliability of solder joints. Analysis Lab
In this paper, a comprehensive study is presented to demonstrate the impact of different BGA escaping trace design cases on solder joint reliability. Analysis Lab
This paper is based on the planar solder joint approach which affords non-destructive real-time monitoring of the solder joint microstructure in a scanning electron microscope. Analysis Lab
With high frequency and high-speed transmission in information industry, PCB customers demand stricter signal transmission integrity of PCB. Analysis Lab
In this paper we examine the influence of three factors on thermal-mechanical solder joint reliability of LEDs mounted on an IMS PCB using FEA. Analysis Lab
The industry standard for accelerated temperature cycling, IPC-9701B, defines test conditions for characterizing solder interconnect fatigue. The document specifies a maximum cycling ramp rate of 20 °C/minute to avoid thermal shock conditions that can accelerate failure modes other than low cycle fatigue in the bulk solder. Analysis Lab
This paper covers all the long-term test results as a follow-up to an earlier publication reporting interim results and preliminary conclusions. Physical analyses were completed to investigate possible differences in the failure mode at the various FoS test temperatures. Analysis Lab
This study examines possible factors for these inconsistencies such as etched signal trace shape, surface treatment, and grain size. Analysis Lab |
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