Analysis Lab



Analysis Lab
Corrosion, Contamination, Data Acquisition, ESD, EOS, Inspection, Measurement, Profiling, Reliability, RFID, Solder Defects, Tombstoning, X-ray
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SIR Test Method for Developing Evidence for the Production Assembly
SIR Test Method for Developing Evidence for the Production Assembly
The purpose of this paper is research on the development of temperature-humidity-bias instrumentation and test board designs forproduct acceptance.
Analysis Lab

Effect of Assembly Pitch and Distance on Solder Joint Thermal Cycling Life
Effect of Assembly Pitch and Distance on Solder Joint Thermal Cycling Life
Cycles-to-failure versus Distance to Neutral Point (DNP) data for SnPb and lead-free assemblies under Accelerated Thermal Cycling (ATC) conditions are observed.
Analysis Lab

Pad Cratering Susceptibility Testing with Acoustic Emission
Pad Cratering Susceptibility Testing with Acoustic Emission
In this study, 6 laminates were subjected to four-point bend testing. Acoustic emission sensors were used to monitor pad cratering during the bend test.
Analysis Lab

Realization of a New Concept for Power Chip Embedding
Realization of a New Concept for Power Chip Embedding
This paper will focus on the behavior of the power module for operational conditions of a PedEleC (Pedal Electric Cycle) application.
Analysis Lab

Characterizing Thermal Fatigue Reliability of Third Generation PB-Free Alloys
Characterizing Thermal Fatigue Reliability of Third Generation PB-Free Alloys
The progress of an experimental program for evaluating thermal fatigue performance of third generation alternative Pbfree solder alloys is discussed.
Analysis Lab

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