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Bending Strength of Solder Joints as a Function of Joint Length
Bending Strength of Solder Joints as a Function of Joint Length
The effect of joint length on the fracture of copper-solder-copper joints is investigated using double cantilever-beam specimens of various joint lengths.
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3D Printed Electronics for Printed Circuit Structures
3D Printed Electronics for Printed Circuit Structures
This paper shows working demonstrations of printed circuit structures, the obstacles, and the potential future of 3D printed electronics.
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Effect of Fine Lead-Free Solder Powder on the Reflow Property Pastes
Effect of Fine Lead-Free Solder Powder on the Reflow Property Pastes
This paper evaluates the effect of particle size distribution and oxidation on the reflow performance of solder paste.
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Design Variables of Thermoforming Process on Printed Electronic Traces
Design Variables of Thermoforming Process on Printed Electronic Traces
This experiment provides insight into future design guidelines and process intellectual property for manufacturing printed electronic products.
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Solder-Joint Reliability of a 0.65 mm Pitch Molded Array Package for Automotive
Solder-Joint Reliability of a 0.65 mm Pitch Molded Array Package for Automotive
The primary objective of this study was to baseline the solder-joint thermal fatigue life for the POR (plan of record) package.
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Effect of Thermal Cycling on Subsequent Drop Behavior of Assemblies
Effect of Thermal Cycling on Subsequent Drop Behavior of Assemblies
This paper presents the effect of a priori thermal cycle on subsequent drop to failure behavior of CGAs with 1272 columns.
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Evaluation of the Use of ENEPIG in Small Solder Joints
Evaluation of the Use of ENEPIG in Small Solder Joints
In this study, the impact of industry standard Pd thicknesses on thin solder joints is evaluated through shear testing.
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Alloy Composition and Aging on the Survivability of Lead-Free Solders
Alloy Composition and Aging on the Survivability of Lead-Free Solders
A comparison of failure modes for different packaging architectures at elevated test temperatures and vibration has been presented in this study.
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Corrosion and Contaminant Diffusion Multi-Physics Model
Corrosion and Contaminant Diffusion Multi-Physics Model
Models for copper interconnect degradation are needed for life prediction modeling to ensure 10-year, 100,000 mile reliability for automotive applications.
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Enhance the Shock Performance of Ultra-Large BGA Components
Enhance the Shock Performance of Ultra-Large BGA Components
A study on the rubber standoffs and gaskets. The effectiveness of rubber standoffs and rubber gaskets as shock/vibration mitigation have been evaluated.
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