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The objective of this study to be discussed in this paper is to determine a solution for component attach in a formic acid environment with the appropriate combination of soldering material and equipment. A particular focus will be placed on a material and equipment combination which will provide acceptable soldering using a low-residue solder paste. Analysis Lab
This paper presents the demonstration of RDL interposers with fine pitch firing and low loss dielectric layers. Analysis Lab
A study on the rubber standoffs and gaskets. The effectiveness of rubber standoffs and rubber gaskets as shock/vibration mitigation have been evaluated. Analysis Lab
The adoption of LTS presents compatibility challenges. This study explores the reliability of different ball-paste combinations for LTS soldering. Analysis Lab
This study focusses on the IMC phase growth in rolled Cu- electroplated Sn system during the temperature range from 398K to 473K. Analysis Lab
This paper has discussed some of the issues faced by organizations in the high reliability sector when adopting COTS and lead-free components. Analysis Lab
This study assesses the effect of atmospheric plasma treatment used with compressed air. and te effect of plasma surface treatment on adhesive bond strength. Analysis Lab
It was confirmed that ENEPES with a Ag thickness of 0.3 μm had good reliability both for the solder joint and Ag sintering joint. Analysis Lab
This paper reviews results reported from accelerated testing compared with cross-sectional results from components on functional systems with known time in service. Analysis Lab
This paper summarizes the findings from a thermal cycling test to evaluate the effect of thermal cycling profile on thermal fatigue performance of low temperature solders. Analysis Lab |
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