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BTC-QFN Test Board Design for Qualifying Soldering Materials
BTC-QFN Test Board Design for Qualifying Soldering Materials
This research uses a non-standard test board with sensors placed at the bottom termination to study cleanliness and contamination effects under QFN components.
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Reliability Study of Bottom Terminated Components
Reliability Study of Bottom Terminated Components
This paper covers the impact of voiding on solder joint reliability and the impact of voiding on the heat transfer characteristics for BTC components.
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Evaluating Accuracy of Thermocouple Attach Methods
Evaluating Accuracy of Thermocouple Attach Methods
The goal of this study was to identify a non-destructive method for thermocouple attachment that provides a small offset to the "actual temperature under a BGA."
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The Maximum Allowable Compression Load Per Solder Interconnect
The Maximum Allowable Compression Load Per Solder Interconnect
An attempt to identify the maximum quantitative allowable compression load per solder ball in a large component configuration with 600μm in solder ball diameter is investigated.
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Tin Whisker Risk Management by Conformal Coating
Tin Whisker Risk Management by Conformal Coating
This study evaluates conformal coatings for mitigation of tin whisker growth. The coatings chosen for the experiment are acrylic, polyurethane and parylene.
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Head in Pillow X-ray Inspection at Flextronics
Head in Pillow X-ray Inspection at Flextronics
For the study we used two boards exhibiting HIP defects with four types of AXI machines at four sites in Flextronics manufacturing, or vendor laboratory.
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Finite Element Analysis of Tin-Bismuth Electromigration of Solder Joints
Finite Element Analysis of Tin-Bismuth Electromigration of Solder Joints
This paper is based on the planar solder joint approach which affords non-destructive real-time monitoring of the solder joint microstructure in a scanning electron microscope.
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Human-Induced Contamination on PCB Assembly
Human-Induced Contamination on PCB Assembly
This paper will discuss an experiment that was performed to investigate the effects of "contaminants" that could be measured with SIR testing.
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Dielectric Material Damage vs, Conductive Anodic Filament Formation
Dielectric Material Damage vs, Conductive Anodic Filament Formation
Our objective is to establish correlation between the various types of material damage and the propensity to CAF failure.
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Electrical Plus Functional Testing in Designing Electronics for Harsh Conditions
Electrical Plus Functional Testing in Designing Electronics for Harsh Conditions
This paper proposes a test method and vehicle to characterize soldering materials, assembly process steps, and conformal coating to determine reliability.
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