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Fluxless Reflow Technology for Combination Fine-Pitch and SMT-Level Component Attach
Fluxless Reflow Technology for Combination Fine-Pitch and SMT-Level Component Attach
The objective of this study to be discussed in this paper is to determine a solution for component attach in a formic acid environment with the appropriate combination of soldering material and equipment. A particular focus will be placed on a material and equipment combination which will provide acceptable soldering using a low-residue solder paste.
Analysis Lab

High Speed Transmission Characteristics on RDL Interposer
High Speed Transmission Characteristics on RDL Interposer
This paper presents the demonstration of RDL interposers with fine pitch firing and low loss dielectric layers.
Analysis Lab

Enhance the Shock Performance of Ultra-Large BGA Components
Enhance the Shock Performance of Ultra-Large BGA Components
A study on the rubber standoffs and gaskets. The effectiveness of rubber standoffs and rubber gaskets as shock/vibration mitigation have been evaluated.
Analysis Lab

Reliability in Low Temperature Soldering for BGA Components
Reliability in Low Temperature Soldering for BGA Components
The adoption of LTS presents compatibility challenges. This study explores the reliability of different ball-paste combinations for LTS soldering.
Analysis Lab

Solid-State Diffusion between Rolled Cu and Electroplated Matte-Sn System
Solid-State Diffusion between Rolled Cu and Electroplated Matte-Sn System
This study focusses on the IMC phase growth in rolled Cu- electroplated Sn system during the temperature range from 398K to 473K.
Analysis Lab

Impact of Lead-Free Components for High Reliability
Impact of Lead-Free Components for High Reliability
This paper has discussed some of the issues faced by organizations in the high reliability sector when adopting COTS and lead-free components.
Analysis Lab

Adhesive Bonding of Polymeric Substrates Through Plasma Treatment
Adhesive Bonding of Polymeric Substrates Through Plasma Treatment
This study assesses the effect of atmospheric plasma treatment used with compressed air. and te effect of plasma surface treatment on adhesive bond strength.
Analysis Lab

Evaluation of Reliability using Autocatalytic Silver Bath on ENEP Layer
Evaluation of Reliability using Autocatalytic Silver Bath on ENEP Layer
It was confirmed that ENEPES with a Ag thickness of 0.3 μm had good reliability both for the solder joint and Ag sintering joint.
Analysis Lab

Tin-Bismuth Low Temperature Solder Electromigration Behavior
Tin-Bismuth Low Temperature Solder Electromigration Behavior
This paper reviews results reported from accelerated testing compared with cross-sectional results from components on functional systems with known time in service.
Analysis Lab

Thermal Cycling Profile on Thermal Fatigue Performance of a 192-Pin Chip Array BGA
Thermal Cycling Profile on Thermal Fatigue Performance of a 192-Pin Chip Array BGA
This paper summarizes the findings from a thermal cycling test to evaluate the effect of thermal cycling profile on thermal fatigue performance of low temperature solders.
Analysis Lab

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