Analysis Lab
Corrosion,
Contamination,
Data Acquisition,
ESD,
EOS,
Inspection,
Measurement,
Profiling,
Reliability,
RFID,
Solder Defects,
Tombstoning,
X-ray
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Influence of Manufacturing Quality on Thermomechanical Stress of Microvias
The advancement of area-array packages has driven the adoption of high density interconnects that allow for an increased I/Os.
Analysis Lab
Acoustic Micro Imaging Analysis for 3D Packages
This paper will present a review of AMI methods that are applicable to analyses of 3D devices and show example applications.
Analysis Lab
Compatibility and Aging for Flux and Cleaner Combinations
A materials study for high reliability electronics cleaning is presented in this paper.
Analysis Lab
Effects of Dielectric Material, Aspect Ratio and Copper Plating on Microvia Reliability
The effects of dielectric material, aspect ratio, via morphology, surface prep, temperature and copper plating on microvia reliability are evaluated.
Analysis Lab
Impact of Lead-Free Components for High Reliability
This paper has discussed some of the issues faced by organizations in the high reliability sector when adopting COTS and lead-free components.
Analysis Lab
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