Analysis Lab
Corrosion,
Contamination,
Data Acquisition,
ESD,
EOS,
Inspection,
Measurement,
Profiling,
Reliability,
RFID,
Solder Defects,
Tombstoning,
X-ray
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SIR Test Method for Developing Evidence for the Production Assembly
The purpose of this paper is research on the development of temperature-humidity-bias instrumentation and test board designs forproduct acceptance.
Analysis Lab
Effect of Assembly Pitch and Distance on Solder Joint Thermal Cycling Life
Cycles-to-failure versus Distance to Neutral Point (DNP) data for SnPb and lead-free assemblies under Accelerated Thermal Cycling (ATC) conditions are observed.
Analysis Lab
Pad Cratering Susceptibility Testing with Acoustic Emission
In this study, 6 laminates were subjected to four-point bend testing. Acoustic emission sensors were used to monitor pad cratering during the bend test.
Analysis Lab
Realization of a New Concept for Power Chip Embedding
This paper will focus on the behavior of the power module for operational conditions of a PedEleC (Pedal Electric Cycle) application.
Analysis Lab
Characterizing Thermal Fatigue Reliability of Third Generation PB-Free Alloys
The progress of an experimental program for evaluating thermal fatigue performance of third generation alternative Pbfree solder alloys is discussed.
Analysis Lab
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