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Testing PCBs for Creep Corrosion
Testing PCBs for Creep Corrosion
This paper covers the iNEMI technical subcommittee test for creep corrosion using a flowers-of-sulfur based qualification test.
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The Quest for Reliability Standards
The Quest for Reliability Standards
Many methods simulate end-use characteristics of equipment, but a clear understanding is required to differentiate between the methods.
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Final Finish Specifications Review
Final Finish Specifications Review
Specifications are consensus documents agreed upon by a panel of industry participants composed of suppliers, manufacturers, assembly houses and users.
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Voiding/Drop Test for Mixed Alloy BGA Assembly
Voiding/Drop Test for Mixed Alloy BGA Assembly
BGAs with various alloy balls were assembled with various solder pastes. Joint strength, drop test performance and voiding performance were evaluated.
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TOF SIMS Analysis for SnO Determination
TOF SIMS Analysis for SnO Determination
During the production of Lead-Free Hot Air Solder Leveling (LF HASL), non-wetting issues in several components were found including BGA pad.
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Board  Processes and Effects on Fine Copper Barrel Cracks
Board Processes and Effects on Fine Copper Barrel Cracks
This research is to determine if there is a relationship between PCB fabrication processes and the prevalence of fine barrel cracks.
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Predicting Fatigue of Solder Joints
Predicting Fatigue of Solder Joints
Chip resistors were subjected to a high number of short duration power cycles. Environmental conditions and material properties were documented.
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 Mitigating Tin Whiskers in Alternative Lead-Free Alloys
Mitigating Tin Whiskers in Alternative Lead-Free Alloys
As lead-free alloys shift into high reliability electronics, the issue of tin whisker growth remains a primary concern among those in the industry.
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Effectiveness of Conformal Coat to Prevent Corrosion of Terminals
Effectiveness of Conformal Coat to Prevent Corrosion of Terminals
In this study many coatings were examined for their effectiveness at preventing corrosion of nickel-palladium-gold-finished terminals.
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Study of Various PCBA Surface Finishes
Study of Various PCBA Surface Finishes
In this study various printed circuit board surface finishes were evaluated. A total of nine groups of PCB were evaluated.
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