Analysis Lab
Corrosion,
Contamination,
Data Acquisition,
ESD,
EOS,
Inspection,
Measurement,
Profiling,
Reliability,
RFID,
Solder Defects,
Tombstoning,
X-ray
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Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction
Many center pad voiding studies have focused on center pad footprint/stencil aperture designs. This study focuses on I/O pad stencil modifications.
Analysis Lab
Impact of Thermal Loading on the Structural Intergrity of 3D TSV Package
In this paper, the different types of crack that can happen along the TSV/Si interface has been determined with the study of behaviors of crack.
Analysis Lab
Last Will and Testament of the BGA Void
This paper investigates the impact of voids in BGA and CSP components using thermal cycle testing per the IPC specification for tin-lead solder alloys.
Analysis Lab
Impact of Substrate on Materials Reliability of High Power LED Assemblies
What role does the substrate type play in the LED package-to-board assembly reliability? This paper presents a study to help answer this question.
Analysis Lab
NASA DOD SAC305/SN100C Copper Dissolution Testing
In lead-free solder alloys, the reaction of the tin/copper is faster than of tin-lead solders/copper, which increases the degradation of the plated copper connections.
Analysis Lab
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