Electronics Manufacturing and Electronics Assembly

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Take the Complexity Out of Advanced BGA Rework
High-reliability BGA repairs require proven processes, precision, and deep technical expertise. See why manufacturers rely on trusted rework solutions.
Circuit Technology Center

Technical Papers

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

MORE TECHNICAL PAPERS

Ask the Experts

Inspection for Hidden Solder Joints

Solution for Warped PCBAs

BGA Component Cleaning Spec

Tin Whiskers and Vapor Phase Reflow

Soldering Station Calibration

Solder Paste Stencil Inactivity

Solder Mask Thickness Tolerance

Question About ESD Ionizer Guns

MORE ASK THE EXPERTS

Supercooled Solder Pastes in Low-Temperature Attach Applications
This paper presents progress-to-date using supercooled solder pastes of core-shell bismuth-tin (BiSn) particles to accomplish solder interconnects below the melting point of the alloy. Comparisons between supercooled BiSn solder pastes and traditional BiSn pastes are discussed.
Technical Paper

QFN I/O Pad Solder Paste Overprint on Thermal Pad Void Reduction
QFN SMT components continue to be increasingly used and also becoming smaller for applications further requiring a high level of thermal performance and reliability.
Technical Paper

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What are your economic depaneling needs?
Our depaneling machines are high-performance machines for single circuit boards with electronic components. The cutting principles are fast, the best quality.
SCHUNK

How To Rework Warped PCBAs?
From a large lot, 20 populated boards with components of varied heights on both sides are warped. What methods can they use to flatten them?
Board Talk

Optimizing Throughput and Cost with Manufacturing Simulation
This paper describes the design and implementation of several manufacturing simulation use-cases at an electronics assembly factory in Nanjing, China.
Technical Paper

Technology for Optical Co-Packaging
A practical approach is to use optical transceiver submodules and to attach them onto the package substrate by soldering is discussed in this paper.
Technical Paper

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Probe Card Manufacturer 'Sees the Unseen' With X-ray
Probe card manufacturer relies on mobile real-time x-ray inspection to verify the quality of its aligned probes at different stages along the assembly line.
Glenbrook Technologies

Process-Reliability Relationships of Low-Temperature Solders and ECAs
This paper studies the process-performance-reliability relationships for Sn-Bi-Ag and Sn-In solders on additively printed copper metallization.
Technical Paper

Dissolution Rate of Specific Elements in SAC305 Solder
This paper describes the approach for measuring the solder dissolution that can be used to optimize soldering process profiles for electronic assemblies.
Technical Paper

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Silver Filled Electrically Conductive Epoxy
Master Bond EP3HTSDA-2Med is a silver filled adhesive system with high electrical and thermal conductivity that passes ISO 10993-5 for cytotoxicity.
Master Bond

How Long Solder Paste Can Be Left On a Stencil Without Activity
How long can we leave solder paste on a stencil without any activity? If activity means not printing, then we are talking about a pause or abandoned time.
Board Talk

Intrusive Soldering vs. Wave Solder
We are wave soldering with top and bottom side preheat. Would a pin in paste, or intrusive soldering, be a better option than wave soldering? The Assembly Brothers, Phil Zarrow and Jim Hall, address this question.
Board Talk

Improved Process Yield with Dynamic "real-time" Dual Head Dispensing
This paper examines proven methods to determine the dot/line positional accuracy along with mass flow rate for both heads during synchronous dispensing.
Technical Paper

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ASYMTEK Select Coat SL-1040
The SL-1040 Conformal Coating System upgrades the SL-940 and added significant system-level advancements to elevate automation, control, precision & preventative maintenance for better yield.
Nordson Electronics Solutions

Thermal Cycling Dwell Time on Reliability of Pb-free Solder Alloys
This paper presents the initial results from an experimental program designed to compare thermal cycling results for high-performance solder alloys.
Technical Paper

75% IPA/25% DI Extraction Solution on No-Clean Flux Residues
This study is broken into two parts, first a review of the solubility of some critical ions in different ratios of IPA/DI and at different temperatures.
Technical Paper

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SEHO makes production lines smarter
Improve your work flow and reduce manufacturing costs with creative ideas and innovative solutions for automation, board handling and material management.
SEHO Systems GmbH

Component Pressure Exposure Validation in An Inline Wash System
The purpose of this research is to measure what circuit cards and parts on those assemblies are exposed to during the wash and rinse process of inline cleaning.
Technical Paper

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Let our contract cleaning services help
If you have a technical cleaning question, or if you are facing process challenges or performance challenges, use this technical hotlist form to get help from a KYZEN Technical Care Expert.
KYZEN

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Plasma as a Key Technology
Plasma technology improves electronics manufacturing, reduces oxide layers, prevents delamination & enables environmentally friendly products by using Openair-Plasma ® & PlasmaPlus®.
Plasmatreat GmbH