Optimizing Cleaning Strategies for Advanced Packaging Technologies
The study will utilize various test vehicles with low standoff components, using both No-clean and Water-soluble solder formulations. Two aqueous-based cleaning agents will be evaluated, and cleanliness assessed through visual inspection, SIR, and IC testing following IPC standards.
Technical Paper
|
|
|
|
|
|
Reduction of Condensate Residues in the Reflow Process
Increased electronics manufacturing results in an increased amount of condensate residue. The problem is not only to meet the increased cleaning requirements with increasing production, it is much more the absence of knowledge about the condensate residue formation process and how this residue can be minimized and inhibited in its formation.
Technical Paper
|
|
Solder Performance and Reliability Assurance (SPRA) Project
The performance specification of solder requires that any solder being considered meet assembly requirements as well as the interconnects formed with the solder survive specified mechanical shock, thermal cycle, and vibrations environment conditions.
Technical Paper
|
|
|
|
| Sponsor |
|
Boost Reballing with EZReball Preforms
EZReball reballing preforms provide fast, clean, and accurate reballing of complex BGA packages while eliminating traditional complexities and the need for operator dexterity.
BEST Inc
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Risks Using Flux Only for Soldering BGAs
What are the risks using flux only versus solder paste for placing BGAs in a hybrid lead-free environment? Why would you only use flux, why not solder paste?
Board Talk
|
|
| Sponsor |
|
Contaminant Removal with Plasma
Plasma provides organics removal and other benefits to increase bond strength! Many chamber sizes available, all with a low environmental impact. Learn more.
Plasma Etch
|
|
Gooey Flux Residue Left Behind
After selective soldering connectors there is a small amount of no-clean flux residue left behind. How can I judge how much flux residue can be left behind?
Board Talk
|
|
