Electronics Manufacturing and Electronics Assembly

Sponsor

TIM1 for EV Battery Thermal Management
AIT's thermal adhesives, grease-gels, & gum-pads offer proven thermal dissipation for a balance of strength, rework ability, & recyclability of EV battery packs.
AI Technology, Inc.

Technical Papers

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

MORE TECHNICAL PAPERS

Ask the Experts

Cleanliness Testing

Hand Sanitizer Contamination

Epoxy Wicking up Wire Insulation

Out-gassing and Cleaning

Contamination From Anti-static Foam

Organic Flux Residue Concerns

Lifted Lead on SOT Component

Ultrasonic Cleaning and Surfactants

MORE ASK THE EXPERTS

Cu Conductive Paste as Via Filling Materials for Various Substrates
In this study, we developed a Cu paste that can be used as a filling material for through silicon via (TSV), through glass via (TGV), and organic substrates.
Technical Paper

The Effect of Sb and Ag Addition on the Behavior of Sn-Bi LTS
This study focuses on the changes in melting and solidification behavior of near-eutectic Sn-Bi alloys with Sb (0.5-2wt%) and Ag (0-1wt%) additions.
Technical Paper

Sponsor

Depaneling machine for separating circuit boards
SCHUNK offers solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling.
SCHUNK

Opens With Assembled QFN Components
We are experiencing opens on assembled QFN components at a rate of 9%. The failure only appears in rows near the component center. What is happening?
Board Talk

Miniaturization of Hearing Aid Electronics Using Embedded Die Packaging
This paper examines the use of second generation embedded die packaging to drive further size reduction in custom hearing instruments.
Technical Paper

AI to Predict Compatibility Between Solder Paste Residues and Coatings
This paper shows how AI is used to predict compatibility results between solder paste residues and coatings. A physical compatibility study is carried out to benchmark some combinations of solder pastes and coatings of the market. Results between AI prediction and the physical tests are compared to choose the right AI model for a good prediction of the compatibilities.
Technical Paper

Sponsor

Scoring Big With Glenbrook's Real-Time X-Ray Inspection
Jewel Box 70T helps East/West Manufacturing ensure accurate assembly of complex boards, for a system delivering statistics in seconds. Read more
Glenbrook Technologies

Metallurgical and Mechanical Analysis of Castellated Via Rigid-Flex Connection
The reliability of castellated vias as a rigid-flex interconnection method is evaluated. This is split into metallurgical aging of joints and investigating mechanical robustness/integrity.
Technical Paper

Design for Manufacturability - Perspectives from a Manufacturing Engineer
This paper will examine a few key areas of PCB design and manufacturing that can have a substantial impact on product reliability and how to mitigate reliability risks by deploying design for manufacturability (DFM) best practices. It will also explore the dependencies between the design and manufacturing processes.
Technical Paper

Sponsor

Latest 3D AOI System from Viscom
iS6059 PCB Inspection Plus. Its new and faster sensor technology, data processing and analysis functions all stand for the best 3D AOI performance that meets the highest requirements.
Viscom

No-Clean Residue Shorts
We have a PCBA with a QFN 44 using no-clean flux. We have many test failures during testing. Are the failures due to flux reside between terminations? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk

Issues With SMT Component Alignment
During automatic optical inspection our chip components are shifting. This is not limited to single components and changes daily.
Board Talk

01005 Rework – barricades and technological processes
Touch up and repair processes need to fulfil the high-quality demands of today’s highly integrated and complex electronic products.
Technical Paper

Sponsor

AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS

Microstructure Modification for SnBi Low Temperature Solder Alloy
This paper introduces a novel structure for the SnBi-based solder joint at the board level. A layer of SAC alloy is applied over the OSP surface finish.
Technical Paper

Materials Considerations for Automotive Radar Designs
This paper will discuss the current areas of growth that support level 3 autonomy, specifically on radar modules that bring perspectives of distance and speed to surrounding objects.
Technical Paper

Sponsor

Outsourcing Costs More Than You Think
Delays, tariffs, and uncertainty come with overseas PCB assembly. In-house production with Manncorp delivers faster builds, tighter control, and long-term stability.
Manncorp Inc.

Expandable Bio-based Polymers: Future for Electronics Ruggedization
This paper presents a bio-based, expandable, thermoset solution, a low density, light weight method to effectively encapsulate and protect electronic components.
Technical Paper

Latest Industry News

Why China Cannot Quit 'Open' AI

New Apple iPhone Fold Decision Changes Smartphones Forever

How Engineers Kick-Started the Scientific Method

SiIicon Valley's AI agent hiccups: Wasted tokens and 'chaotic' systems

The Mac Mini is no longer a niche product, it's local AI infrastructure

MORE INDUSTRY NEWS

Sponsor

Trailblazing Process News for Conformal Coating
Say goodbye to clogged nozzles and hello to flawless conformal coating with the ASYMTEK Select Coat SL-1040 Ultrasonic Cleaning Station.
Nordson Electronics Solutions

Sponsor

High-Reliability for Low-Temp Processes
Durafuse® LT low-temp, high-rel solder paste is bismuth-free, reduces warpage in large BGAs, enhances thermal cycling, drop shock reliability and reduces energy use up to 15%.
Indium Corporation