5 vs 8-Zone Ovens
We are setting up an assembly line for small line production. We prefer a 5-zone oven. Will five zones be enough to ensure a reliable reflow process?
Board Talk
|
|
Aerosol Jet Printing SIR Patterns on Real World Components
In this study, aerosol jet printing, an additive manufacturing technology for electronics, was used to manufacture surface insulation resistance (SIR) test structures that were tested in the ability to detect cleanliness defects and provide stable results when none are present, as well as their survivability to standard electronics wash processes.
Technical Paper
|
|
| Sponsor |
|
Thermally Conductive, Low Outgassing Epoxy
Master Bond EP21AOLV-2LO is an electrically insulating adhesive that meets NASA low outgassing requirements for sealing, coating and encapsulation applications. Ask an expert.
Master Bond
|
|
Tin Flakes/Splashes in SMT
An increasing of electrical shorts reported in several testers was noticed. Initially, it was found than more of the 80% of the shorts corresponding to thin metal flakes/splashes.
Technical Paper
|
|
Top 5 BGA Rework Challenges to Overcome
As BGA component package dimensions continue to get thinner more are being used in handheld device applications. The challenges of BGA rework is discussed.
Technical Paper
|
|
|
|
| Sponsor |
|
Discover the power of vAI ProVision from Viscom
Create and optimize 3D AOI and AXI programs in minutes. vAI ProVision boosts inspection depth, quality, and speed. Viscom develops & produces premium inspection systems.
Viscom SE
|
|
What Causes Solder Balls During Hand Soldering?
To many operators believe the old myth that flux is your friend and you can never have to much flux. That is not true as to much flux will outgas at the end of the hand soldering process creating solder balls around the connection. This is one possible explanation as others have stated other causes as well.
Board Talk
|
|
|
|
| Sponsor |
|
Future-Ready Bonding Technology
ZTACH® ACE Anisotropic Conductive Epoxy – Cures under reflow or UV and can be a replacement for solder, ACF, ACA, and wire bonding. No underfilling required. Find out more.
Action Integrated Resources
|
|
|
|
|
|
|
|
| Sponsor |
|
Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.
|
|
Case Studies of Harsh Application Environments
This paper will present scenarios where environmental factors played a role in inducing various degradation mechanisms to Rockwell products. The paper will attempt to concentrate on the unusual scenarios, or where assumptions were made too early in the analytical process that likely hindered efficient determination of root cause.
Technical Paper
|
|
Intrusive Soldering Through-Hole Connector
We are SMT soldering a through-hole PC 104 connector. We have tried preforms and are unable to get all of the pins soldered. Phil Zarrow and Jim Hall, The Assembly Brothers, share their own suggestions in this scenario.
Board Talk
|
|
| Sponsor |
|
Beat Rising Silver Prices with AIM REL61
With silver at historic highs, there’s never been a better time to switch. Reduce material costs significantly while maintaining the reliability your applications demand.
AIM Solder
|
|
How to Cost a Board
My boss has asked me to provide a cost matrix so we can quickly quote labor machine time component for the SMT board assembly.
Board Talk
|
|
