Electronics Manufacturing and Electronics Assembly

Sponsor

Probe Card Manufacturer 'Sees the Unseen' With X-ray
Probe card manufacturer relies on mobile real-time x-ray inspection to verify the quality of its aligned probes at different stages along the assembly line.
Glenbrook Technologies

Technical Papers

Flux-Free, Reliable, Efficient: Soldering with Formic Acid

Redesigning Material Logistics for High-Mix EMS Production

Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education

Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

MORE TECHNICAL PAPERS

Ask the Experts

Polyurethane Conformal and Acrylic Coating on the Same PCB

Conformal Coating in Nitrogen Environment

Double Sided Reflow for Micro BGA Components

Baking After Cleaning Hand Placed Parts

Question About IPC-6013 Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

Coils Rotated After Reflow

Stencil Pattern for Thermal Pads on QFNs

Component Shifting

MORE ASK THE EXPERTS

Continuous Improvement: The Task That Never Ends in the Cleaning World
The job of a cleaning agent is to remove an unwanted contaminant, or simply some kind of “dirt”. How can you efficiently remove that soil while minimizing total waste and improving worker safety? While that answer evolves based on updated impact studies and new regulations, the goal of removing those undesired contaminants remains fixed.
Technical Paper

Microalloying Effects of Sb and Ag on the Microstructural of Eutectic Sn-Bi Alloys
In this paper, we will compare the bulk microstructure of eutectic Sn-Bi with Sb and Ag additions to solder joints on Cu substrates and ENIG surface finishes.
Technical Paper

Sponsor

What are your economic depaneling needs?
Our depaneling machines are high-performance machines for single circuit boards with electronic components. The cutting principles are fast, the best quality.
SCHUNK

Ductile Low Temperature Solders for Mass Production of Assemblies
This paper reports results of the behaviour of Sb in a Sn-Bi alloy and consider the implications of the findings for the reliability of LTS solder joints.
Technical Paper

Cause of Long-Term Soldering Joint Cracking in Automotive Application
We are seeing field returns due to solder joint cracking on the pin of a 16-pin through-hole connector. What might be the cause of the joint cracking?
Board Talk

Hand Soldering Reliability
What are the differences in reliability for SMT machine placement followed by reflow vs. hand placement followed by hand soldering in surface mount?
Board Talk

Sponsor

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura

Flip Chip LED Solder Assembly
A pin transfer process was adapted to assemble flip-chip CSP LEDs with fine pitch solder paste to assemble lateral and vertical LEDs on flat substrates.
Technical Paper

Modern Methods of PCB Depanelization with a Focus on Low Impact Depanelization
It is easier and more economical to manufacture multiple assemblies simultaneously on a larger panel and then singularize them once they’ve been populated.
Technical Paper

Sponsor

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD

How Does Printed Solder Paste Volume Affect Solder Joint Reliability?
Solder paste and stencil technology has been well studied. It is the aim of this work to correlate printed solder paste volume to solder joint reliability.
Technical Paper

High Thermal, High Temperature Interconnects for Ultra High Power LEDs
For high performance applications, ultra-high power offers cost reduction through fewer LEDs, smaller PCBs, smaller heat sinks and lighter load bearing.
Technical Paper

Does HASL or ENIG Reduce Creep Corrosion in Corrosive Environments?
We make electronics equipment used in corrosive environments. Do you recommend the use of HASL versus immersion gold for our application? The Assembly Brothers, Phil Zarrow and Jim Hall, answer this question.
Board Talk

Sponsor

Improve PCB Repair Quality with 100+ Proven Rework Procedures
Access a collection of repair and rework procedures covering damage assessment, troubleshooting, conductor repair, pad replacement, BGA rework, and more.
Circuit Technology Center

Molecular Fingerprint of Condensate Residues in the Soldering Process
A range of condensate samples were taken from different process zones of reflow soldering systems and were analyzed using FT-IR spectrometry.
Technical Paper

Implementation of Assembly Processes for Low-Melting Point Solder Pastes
This paper discusses the need for low-temperature solders and process-ability of solder pastes with three novel alloys against the industry standard.
Technical Paper

Sponsor

"Ask the Experts" Program by Circuitnet
Do you have a question or process issue in PCB assembly? The Circuitnet "Ask the Expert's" program has over 100 panel members waiting to answer your question. Submit question now.
Circuitnet Media LLC

Low-Voiding High-Reliability Lead-Free Solder Paste for Automotive
A novel lead-free solder paste, Durafuse® HR (DFHR), has been developed using Durafuse® technology. This technology demonstrates the combined merits of each constituent solder powder in the paste. DFHR is based on Sn-Ag-Cu alloy system and contains bismuth (Bi), indium (In), and antimony (Sb).
Technical Paper

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Sponsor

Viscom at SMTA Michigan & Ohio
Join Viscom at SMTA Michigan (8/18/26) and Ohio (8/20/26) to discover the latest advancements in AOI and AXI inspection technology, including our powerful AI solutions.
Viscom SE

Sponsor

Thermally Conductive, Low Outgassing Epoxy
Master Bond EP21AOLV-2LO is an electrically insulating adhesive that meets NASA low outgassing requirements for sealing, coating and encapsulation applications. Ask an expert.
Master Bond

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