Electronics Manufacturing and Electronics Assembly

Sponsor

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura

Technical Papers

Flux-Free, Reliable, Efficient: Soldering with Formic Acid

Redesigning Material Logistics for High-Mix EMS Production

Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education

Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

MORE TECHNICAL PAPERS

Ask the Experts

Solder Alloy Investigation

Reliability Concerns When Converting to Lead-free

Contamination Using Solvent Dispensers

Mixed Process Solder Joint Appearance, Smooth or Grainy?

What Caused SMT Pads to Oxidize After Reflow

Viscosity of Solder Paste Before Printing

Solder Splashing During Wave Soldering

ENIG Solderability Issues

MORE ASK THE EXPERTS

Surface Finish Can Achieve Robustness Against Copper Creep Corrosion
We evaluate conventional surface finishes i.e., ENIG, ImmSn, HASL, OSP, and novel Ni-free surface finish for their robustness against creep corrosion.
Technical Paper

Requirements for Depaneling and Rescoring Boards with BGA Components
Are there any special requirements for depaneling and rescoring separate panel circuit boards if they contain BGA components?
Board Talk

Sponsor

Viscom at SMTA Michigan & Ohio
Join Viscom at SMTA Michigan (8/18/26) and Ohio (8/20/26) to discover the latest advancements in AOI and AXI inspection technology, including our powerful AI solutions.
Viscom SE

Homogeneous Low Temperature Soldering Technology
This paper presents key findings of enabling LTS technology on AMD’s Client BGA Packages using surface mount technology (SMT).
Technical Paper

The Basics of Metal Thermal Interface Materials (TIMS)
Advancements in metal patterning have improved the effectiveness of metal TIMs by improving their compressibility.
Technical Paper

Safeguarding Electrical Components with Nano-coating Technology
This study validates the use of plasma-deposited nano-coating layers in protecting against environments that pose significant challenges to electronics.
Technical Paper

Sponsor

The Battle for Space Superiority Has Begun
The next conflict may begin in orbit. Learn why resilient space systems and advanced manufacturing matter more than ever.
Summit Interconnect

ENEPIG - How the Process Characteristics Influence the Layer Performance
This paper will focus on the comparison of pure Pd and PdP deposits and the interaction with the gold electrolyte type in use.
Technical Paper

Can High Particle Concentrations Impact PCB Assembly?
At our SMT facility we currently control ambient temperature, relative humidity and particle count. Is particle count a good parameter to control? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this question.
Board Talk

Sponsor

Training for Certified IPC Specialists
BEST's 7711 Training Rework Kit is designed for certification/re-certification of Certified IPC Specialists (CIS) so employees can be tested for speed, accuracy and quality.
BEST Inc

Utilizing an Alternative Solder Paste to Improve the PCB Assembly Process
Results from an investigation that studied and characterized a novel lead-free solder paste as compared to traditional solder materials will be presented.
Technical Paper

Effect of Temperature and Stressing on Low Temperature Solder BGA Drop Performance
Simultaneous temperature and current stressing affect the performance of LTS BGA solder joints in drop testing, with increased temperature and current level showing larger impacts.
Technical Paper

Atmospheric Plasma Surface Engineering of Printed Circuit Boards
Plasma treatment increases the adhesion strength of the conformal coatings through the removal of organic contaminants and surface activation.
Technical Paper

Sponsor

Automation in Transition
The world of automation is changing. What does this mean for customers? And what impact is the transformation having on providers? Find out more from a panel of experts.
SCHUNK

Overcome Nodules and Scratches on Wire Bondable Plating on PCBs
Manufacturing was improved to minimize nodules and scratches. Wire bonds were evaluated to determine the allowable size of nodules and scratches.
Technical Paper

Trouble With Skewed DPAK Components
We are having trouble with surface mount DPAC components skewing during reflow. We checked our profile and tried a diagonal hatch aperture.
Board Talk

Sponsor

Discover the power of vAI ProVision from Viscom
Create and optimize 3D AOI and AXI programs in minutes. vAI ProVision boosts inspection depth, quality, and speed. Viscom develops & produces premium inspection systems.
Viscom

Minimum Lead to Lead Spacing for Wave Soldered Through-Hole Components
What is the recommended minimum lead-to-lead spacing for through-hole components run through a wave soldering system? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their own suggestions.
Board Talk

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MORE INDUSTRY NEWS

Sponsor

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp

Sponsor

Eliminate Lead Tinning Issues Before They Become Reliability Failures
Learn lead tinning methods, causes of tinning defects, and solutions from the experts at Circuit Technology Center to help ensure dependable solder connections.
Circuit Technology Center