Investigation of Overprinting BGA Pads
The added benefit of using overprinting stencil design strategy is that this should compel further improvement in paste transfer efficiency and uniformity by raising its area ratio. In this study the circle shape overprint apertures were designed for 0.5mm pitch BGA land patterns that measured to an area ratio value of 0.70.
Technical Paper
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Blow Holes After Switching from Lead-Free HASL to ENIG
After switching our PCB finish from lead-free HASL to ENIG blow holes started occurring in the solder joints of the through-hole LEDs. The PCBs and LEDs are from the same suppliers as before, only the finish changed.
Board Talk
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Precision Control for BGA Rework
Vacuum sensing electronics provide control for gentle, automatic component removal while a non-contact site cleaning tip's height is accurately monitored and maintained.
Air-Vac Engineering
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From Slave to Master: flexible ISM integrations
ESSEGI AUTOMATION's ISM software integrates with 250+ brands, connecting ERP, MES, WMS, Pick & Place and X-Ray systems. Flexible logic allows it to operate as master or slave in any production flow.
Essegi Automation
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X-ray Rentals & Rent-to-Own
Rent any of our machine models, with up to 3 months of rental costs applied toward purchasing X-ray equipment. Our flexible plan lets you test the system before committing to purchase.
Glenbrook Technologies
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Cavity Board SMT Assembly Challenges
This study is to identifies the challenges related to assembly of a package into a cavity on the board, and establish the best known method for SMT assembly success.
Technical Paper
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Latest 3D AOI System from Viscom
iS6059 PCB Inspection Plus. Its new and faster sensor technology, data processing and analysis functions all stand for the best 3D AOI performance that meets the highest requirements.
Viscom
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