Electronics Manufacturing and Electronics Assembly

Sponsor

AEC Grade-0 and MSL Level-1 Conductive Paste & Film Adhesives
240° Tg and ultra-high thermal stability for AEC Grade-0 applications. Proven rapid and snap curing die-attach paste for ultimate productivity.
AI Technology, Inc.

Technical Papers

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

MORE TECHNICAL PAPERS

Ask the Experts

Is Solder Mask Considered an Insulator

Solder Balls During Selective Soldering

Concerns Replacing High Speed Components with No-Clean Solder

How to Remove Oxidization from SMT Component Leads?

Solder Ball Wrinkles

Assembly Question for Soldering USB Connectors

BGA Die and Pry Testing

Rise of Bismuth Levels in our Solder Pots

MORE ASK THE EXPERTS

Essential Tools to Combat the Ingress of Counterfeit Materials
The tools to ensure that counterfeits are not polluting any given supply chain have not kept pace with the changing needs.
Technical Paper

Investigating the Metric 0201 Assembly Process
This paper will look at the challenges of assembling the M0201 component in a high-volume manufacturing environment.
Technical Paper

Sponsor

Need Improved Solder Joint Visibility?
Solder Peel-A-Wayš Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.

Wet-Based vs. Dry-Based Cleaning
For automatic under-stencil cleaning there are many cleaning methods. What factors should we consider to select wet based cleaning versus dry based cleaning?
Board Talk

Lessons Learned While Investigating Microvia Reliability Failures
There has been an increasing number of reports concluding that stacked micro vias are failing preferentially when compared to an alternative staggered via design.
Technical Paper

Thermal Cycle Fatigue Life of Low-Temperature Solders
Thermal cycling fatigue is one of the main reliability concerns for solder. For the introduction of low temperature solders with reflow peak temperatures below 200℃, their thermal cycle fatigue life must be characterized. This paper presents a multiple component type test and time to failure data for solder interconnects formed with low temperature solders for BGAs, QFNs, and SMR component types.
Technical Paper

Sponsor

iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE

Optimize the Dispensing Process with True 3D Inspection
The journey toward zero defects in dispensing is challenging but achievable. True 3D inspection technology has have emerged as a powerful ally in this quest to ensure the highest quality levels.
Technical Paper

Voids in SMT Solder Joints – Trends in Automotive Electronics
There is a need for a more extensive coverage of voiding in standards where customer specifications often contain requirements for voiding in SMT solder joints.
Technical Paper

Sponsor

Salvaging Electronic Components: Ensuring Economic Reuse
Component salvaging provides a reliable and consistent method of harvesting electronic components, reducing electronic waste, minimizing fabrication of new components, and ensuring economic reuse for automated assembly.
BEST Inc.

Connector Bowing During Reflow Process
I have a connector that is bowing during lead-free soldering. When the connector is put through an oven on its own no bowing takes place. What is causing this?
Board Talk

Seeking Alternatives to Solvent Cleaning
We are using a mix of trichloroethylene and IPA for cleaning in the ratio of 10 to 90. We are looking to eliminate the use of trichloroethylene.
Board Talk

Conformal Coatings - New Solutions to Existing Problems
This paper describes work carried out by Humiseal to investigate root causes of these problems, and to introduce materials with improved performance.
Technical Paper

Sponsor

Digital Warehouse Automation in High-Mix PCB Assembly
High mix SMT production demands full material visibility. This white paper shows how ASTER improved traceability, inventory accuracy and FIFO control through integrated automation and reel-level tracking across warehouse operations.
Essegi Automation

Effects of Mixing Solder Sphere Alloys with Bismuth-Based Pastes
In this paper, the effect of mixing solder sphere alloys with Bi-based solder pastes on the component reliability in accelerated thermal cycling is studied.
Technical Paper

Hot Air BGA Rework with a Touchless Temperature-Dependent Process
The goal of this paper is to share complex rework process improvements to review and consider how incorporating into their practice can provide benefit.
Technical Paper

Sponsor

Micro Dispensing Technology White Paper
The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size.
DL Technology

Solder Joint Performance Under Shock for ENIG and ENEPIG Surface Plated Tester
This paper discusses the results of a comparative study for solder joint performance - under shock - for ENIG and ENEPIG surface plated tester PCBs.
Technical Paper

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Sponsor

Discover Real Operational Strategies from Proven Global Leaders
In this 4-part series we asked three experienced global leaders for their insights on the biggest challenges faced by manufacturing operations today. No Registration required.
Intraratio

Sponsor

Electronic Assembly Cleaning Basics
Monitoring & effectively controlling chemistry concentration when cleaning electronic assemblies is crucial for maintaining optimal cleanliness results & preventing costly consequences.
KYZEN