Technical Papers
Solder Paste Printing: Cleaning Compatibility Assessment of Jettable and Screen-Printable Pastes
An Essential Guide to Optimize Selective Soldering Processing
Is My Printed Circuit Board Wash Concentration in Check?
Ultraminiature Soldering: Techniques, Technologies, and Standards
X-Ray Inspection Verifies Quality of Complex PCBs
Cold Underfill Component Removal
Cleaning Performance Evaluations for Jettable Pastes for Advanced SMT Assembly Processes
Dispensing 2-Part Adhesives
MORE TECHNICAL PAPERS
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
MORE ASK THE EXPERTS
Latest Industry News
This is the Phone that Might Pave the Way to a Foldable iPhone
Have Geopolitics 'Weaponized' the Supply Chain?
AI companies sign new voluntary commitments pledging AI safety
We're Ending Our Samsung Collaboration
What Makes a Great Leader vs. a Great Manager? Here's Why You Need to Understand the Difference.
MORE INDUSTRY NEWS
May 23, 2024
Minimum Lead to Lead Spacing for Wave Soldered Through-Hole Components
Minimum Lead to Lead Spacing for Wave Soldered Through-Hole Components
What is the recommended minimum lead-to-lead spacing for through-hole components run through a wave soldering system? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their own suggestions.
Board Talk
Continuous Improvement: The Task That Never Ends in the Cleaning World
This paper investigates new processes that achieve cleaning effectiveness while balancing the environmental, human, and machine impacts for longevity.
Production Floor
Unleash the Unexpected for Radical Innovation
Unleash the Unexpected for Radical Innovation
The accelerometer chip is ubiquitous in digital devices. Its true impact didn't become apparent until many of today's most valued applications were developed.
Technology Briefing
BTC-QFN Test Board Design for Qualifying Soldering Materials
This research uses a non-standard test board with sensors placed at the bottom termination to study cleanliness and contamination effects under QFN components.
Analysis Lab
Dissolution Rate of Specific Elements in SAC305 Solder
Dissolution Rate of Specific Elements in SAC305 Solder
This paper describes the approach for measuring the solder dissolution that can be used to optimize soldering process profiles for electronic assemblies.
Materials Tech
High Thermal, High Temperature Interconnects for Ultra High Power LEDs
For high performance applications, ultra-high power offers cost reduction through fewer LEDs, smaller PCBs, smaller heat sinks and lighter load bearing.
Production Floor
Reliability Study of Bottom Terminated Components
This paper covers the impact of voiding on solder joint reliability and the impact of voiding on the heat transfer characteristics for BTC components.
Analysis Lab
Moisture Barrier Bag Issues
Moisture Barrier Bag Issues
Moisture sensitive chip components have been exposed to the atmosphere beyond specification. Can they be packaged and sealed with desiccant?
Board Talk
Rosin vs. Non-Rosin Wave Flux? - More Reliable Electronic Assemblies
This paper focuses on the surface insulation resistance (SIR) differences between rosin-containing and rosin-free flux formulations.
Materials Tech
Humanoid Robots are Finally on the Way
Humanoid Robots are Finally on the Way
Over three years, there has been an explosion of companies racing to integrate the hardware and software that will constitute a viable humanoid robot.
Technology Briefing
Flip Chip LED Solder Assembly
A pin transfer process was adapted to assemble flip-chip CSP LEDs with fine pitch solder paste to assemble lateral and vertical LEDs on flat substrates.
Production Floor
Evaluating Accuracy of Thermocouple Attach Methods
The goal of this study was to identify a non-destructive method for thermocouple attachment that provides a small offset to the "actual temperature under a BGA."
Analysis Lab
The Invisible Roof Stacks
The Invisible Roof Stacks
The EPA had photos showing a new stack on the roof of a plant. Upon examination, they found nothing. What happened to the stack?
Mysteries of Science
Cleaning and No-Clean Process Control Using the SIR Test Method
This research is to design electrical twin test boards in the waste area of a panel of production boards, which are representative of production hardware.
Production Floor
AI, Digitalization, & the Outlook for the U.S. Economy
AI, Digitalization, & the Outlook for the U.S. Economy
Trends in U.S. demography are poised to complement the deployment of maturing AI and digitalization. This will transform industries and create new ones.
Technology Briefing
The Maximum Allowable Compression Load Per Solder Interconnect
An attempt to identify the maximum quantitative allowable compression load per solder ball in a large component configuration with 600μm in solder ball diameter is investigated.
Analysis Lab
Advanced Thermal Management for High Power Applications
Advanced Thermal Management for High Power Applications
This paper gives a short overview about standard thermal solutions like thick copper, thermal vias, plugged vias or metal core based PCBs.
Materials Tech
3D IC Integration Technology Development in China
China's semiconductor foundry and microelectronic packaging industries are embracing the move to join 3D IC integration.
Production Floor
Board Talk
Minimum Lead to Lead Spacing for Wave Soldered Through-Hole Components
Moisture Barrier Bag Issues
Calculating Failure Rate During Rework
Can Mixing Wave Solder Pallets Cause Contamination?
Can Silver Cause Solder Embrittlement?
How to Reduce Voiding on QFN Components
Can Water Contamination Cause Failure?
Do BGA Components Warp During Reflow?
MORE BOARD TALK
Questions and Comments
Can Silver Cause Solder Embrittlement?
I worked with boards and cabling for over 30 years. ...
Dave Good
Cause of Long-Term Soldering Joint Cracking in Automotive Application
Consider also the solder alloy. These failures occurred within the ...
Ike Sedberry, ISEDS
Cause of Long-Term Soldering Joint Cracking in Automotive Application
Is the failing pin at the same location, such as ...
Wallace Huson Ables, Dell Technologies
MORE COMMENTS
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