Technical Papers
Using True3D Inspection Data as a Process Control Tool in a Smart Factory
Selective Soldering Fine Pitch Components on High Thermal Mass Assembly
An Engineer's Guide to Testing and Evaluating The Performance of Desiccant Bags
High-Performance, Light and Moisture Dual-Curable Encapsulant
Smaller Components and Increasing Placement Density
The Value of Accurate Inspection
First Principles of Solder Reflow
Stencil Printing 008004/0201 Aperture Components
MORE TECHNICAL PAPERS
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
MORE ASK THE EXPERTS
Latest Industry News
Global Chip Shortage Is Impacting Carmakers
VIEWPOINT 2021: Raymond M. LaFleur, General Manager of Overseas Sales and Marketing, DEN-ON
VIEWPOINT 2021: Mark Cottom, Vice President of Sales & Marketing, National Circuit Assembly
Geely and Foxconn form partnership to build cars for other automakers
Samsung Debuts World's First Wi-Fi 6E Mobile Phone
IBM tops US patent list for 28th year in a row with more than 9,100 patents granted
5G Makes Waves At CES 2021
4 Reasons a Retreat Into Nature Will Increase Productivity
MORE INDUSTRY NEWS
January 14, 2021
Is There a Spacing Spec for SMD Components?
Is There a Spacing Spec for SMD Components?
Is there a minimum spacing requirement or should we apply SMT components to comply with SMT pick and place systems on the market? The Assembly Brothers, Jim Hall and Phil Zarrow, discuss this question.
Board Talk
In-Line Testing of Highly Panelized PCBAs with Parallel Functional Test
The manufacturing process challenges faced by electronics manufactures producing large panels of small boards is discussed.
Production Floor
6G Mobile Communications to Utilize AI to Control Devices
6G Mobile Communications to Utilize AI to Control Devices
The 6th generation of mobile communications promises higher data rates, shorter latency, and increased densities of terminal devices..
Technology Briefing
Electrochemical Reliability as a Function of Component Standoff
The purpose of this paper is to research the activity of flux residues as a function of the standoff height using insulation resistance.
Analysis Lab
Reliable Nickel-Free Surface Finish for High-Frequency-HDI PCB
Reliable Nickel-Free Surface Finish for High-Frequency-HDI PCB
In this paper, assemblies involving this nickel-less novel surface finish have been subjected to extended thermal exposure, then intermetallics analyses.
Materials Tech
Enclosed Media Printing as an Alternative to Metal Blades
This paper explores the latest developments in enclosed media print head technology and how it can impact the bottom line.
Production Floor
Risk for Ceramic Component Cracking Dependent
The paper discusses the differences of the alloy, based stress in ceramic components due to passive cycle tests, real customer tests, and stress analyses.
Analysis Lab
Maximum Board Temperature During Tin-Lead
Maximum Board Temperature During Tin-Lead
IPC discusses the maximum top-side board temperature for BGAs to be 150 degrees C during a tin-lead wave solder. How is this temperature was determined?
Board Talk
Nanocopper Based Paste for Solid Copper Via Fill
This paper discusses a nano copper based paste for use in via filling.
Materials Tech
Smart Algorithm Improves Material Search Efficiency 100x
Smart Algorithm Improves Material Search Efficiency 100x
Researchers have developed a deep learning-based smart algorithm that uses a technique to improve the material search efficiency by roughly 100 times.
Technology Briefing
Fluxless Die Attach by Activated Forming Gas
As demonstrated in the study, the fluxless and oxide-free technology using EA has made it possible to achieve a high quality die attach with zero or near-zero voids.
Production Floor
Embracing a New Paradigm: Electronic Work Instructions (EWI)
To stay competitive in today's evolving global marketplace, manufacturing must recognize and embrace the new EWI paradigm.
Analysis Lab
Was the Contamination From Silicone?
Was the Contamination From Silicone?
Black enamel was sprayed onto metal followed by a clear coating when a contamination problems surfaced. What was causing the contamination?
Mysteries of Science
Soft Intelligence Epidermal Communication Platform A Path to A Wearable Future
Wearable electronics will need to be stretchable to a considerable degree which in turn will require an adjusted production strategy for the commercial manufacturing of the products.
Production Floor
Reduce Energy Loss in Electric Vehicles
Reduce Energy Loss in Electric Vehicles
A new technology has the potential to revolutionize energy storage in electric vehicles and reduce energy loss in the national grid.
Technology Briefing
Failure Analysis - Using Chromatography and Ion Chromatopgraphy/Mass Spec
From component and fabrication to complete electronic assemblies, IC analysis has been the de facto method for evaluating ionic cleanliness of electronic hardware.
Analysis Lab
Managing blooming in an adhesives process
Managing blooming in an adhesives process
If you have ever used a cyanoacrylate adhesive, you may have seen blooming — a chalky, white residue on the surface of your part.
Materials Tech
Assembly of POP with Novel Epoxy Flux on Solder Paste
In this paper, a newly developed epoxy flux, that is compatible with solder paste, was evaluated for assembly and reliability.
Production Floor
✷ ✷ Supplier Spotlight ✷ ✷
SCHUNK Electronics Solutions
SCHUNK Electronics Solutions
More than 3,500 employees in nine plants ...
Permabond
Permabond
Permabond is a global manufacturer of engineering ...
IBL Technologies, LLC
IBL Technologies, LLC
IBL was founded in 1987 and has ...
Electronic Interconnect
Electronic Interconnect
Electronic Interconnect (EI) is your one stop ...
Technology Corner
Lund robot - with 2 test stations
Ironwood Electronics
About XIMEA company video
XIMEA GmbH
Making Ovens Smarter
KIC
A Full-Line of Programming Solutions
BPM Microsystems
Light-Cure Conformal Coatings
Dymax Corporation
MORE TECHNOLOGY CORNER
Board Talk
Is There a Spacing Spec for SMD Components?
Maximum Board Temperature During Tin-Lead
Is HASL a Good Choice for Surface Finish?
Connector Bowing During Reflow Process
Has My Flux Expired?
Long Term Component Storage
Processing Circuit Boards with BGAs On Both Sides
What Causes Solder Balls During Hand Soldering?
MORE BOARD TALK
Questions and Comments
Dross Contamination After Selective Soldering
The other dimension to consider is the amount of non-volitile ...
Mitch Holtzer, Alpha Assembly Solutions
Seeking Alternatives to Solvent Cleaning
Although I'm no expert I've got lots of "hands-on" at ...
Allan Knox, Knox Associates Design
Seeking Alternatives to Solvent Cleaning
The Assembly Brothers might not take umbrage with what you ...
G. Dill, Flex
Issues With BGA Rework Residue
This is very good advice from Jim & Phil. Proper ...
Russell Claybrook, MicroCare, LLC
How To Rework Warped PCBAs?
I read your web site religiously every time I see ...
Otto Steiner, Compufab Inc
MORE COMMENTS
Cartoon
"I appreciate the effort, but I need you to be more flexible."
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