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Maximum Board Temperature During Tin-Lead
IPC discusses the maximum top-side board temperature for BGAs to be 150 degrees C during a tin-lead wave solder. How is this temperature was determined?
Board Talk
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The Convergence of Technologies and Standards
The Vertical Segments of the Electronic Products Manufacturing Industry are converging and service offerings are consolidating due to advanced technology adoption and market dynamics. The convergence will cause shifts in the flow of materials across the supply chain as well as the introduction of equipment and processes across the segments.
Technical Paper
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Outsourcing Costs More Than You Think
Delays, tariffs, and uncertainty come with overseas PCB assembly. In-house production with Manncorp delivers faster builds, tighter control, and long-term stability.
Manncorp Inc.
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Board Level Reliability Testing of RF Packages
The paper presents a summary of board level reliability test performed on RF packages, the assembly process, mechanical and environmental tests, and understanding failures.
Technical Paper
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De-Ionized Water Affected By the Atmosphere
Resistivity readers of the de-ionized water are above 15 megohms. Resistivity results of the samples tested by the outside lab have been approximately 1 megohm.
Board Talk
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Training for Certified IPC Specialists
BEST's 7711 Training Rework Kit is designed for certification/re-certification of Certified IPC Specialists (CIS) so employees can be tested for speed, accuracy and quality.
BEST Inc
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Low Outgassing, Glob Top Epoxy
Master Bond EP17HTND-CCM is a glob top epoxy that meets NASA low outgassing specifications and forms high strength bonds to a wide variety of similar/dissimilar substrates.
Master Bond
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