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Causes of Blowholes
Are old components such as resistors and circuit breakers more likely to cause blowholes during wave soldering compared to newer components?
Board Talk
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Pre & Post Solder AOI for THT
By implementing and automated THT AOI solution, first pass yields improve due to standardized consistent inspection results, increased margins by reducing labor for inspection and rework, production optimization and traceability data is automatically generated for analysis in real time.
Technical Paper
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Speed That Scales With You
High-throughput 10-head MC388HS pick and place machines built for accuracy at high-speed—helping you scale production without compromising placement quality.
Manncorp Inc.
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A Close look at IPC X-Ray Inspection Guidelines for BGAs
The massive amount of measurements and qualitative information provided by CT-Xray systems can now enable more inspections to be easily automated, ultimately reducing the burden on engineers. With access to this impressive technology, tighter processing parameters can be maintained to ultimately ensure higher quality electronic products for a variety of markets.
Technical Paper
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Removing Warpage from PCBAs
We have populated boards with components on both sides that are warped. Components are varied height. What methods can we use to flatten them? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss their recommendations.
Board Talk
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Your Award-Winning Cored Wire
Our industry-leading, award-winning range of flux-cored wire solder solutions meet the diverse needs of both manual soldering, and rework and robotic soldering applications.
Indium Corporation
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Predicting Mid-Chip Solder Balling
Is there a calculation that can be used to predict solder balling? We would like to design our stencil apertures to ensure no mid-chip solder balls. The Assembly Brothers, Jim Hall and Phil Zarrow, discuss design suggestions to prevent solder balling.
Board Talk
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