Electronics Manufacturing and Electronics Assembly

Sponsor

TIM1 for EV Battery Thermal Management
AIT's thermal adhesives, grease-gels, & gum-pads offer proven thermal dissipation for a balance of strength, rework ability, & recyclability of EV battery packs.
AI Technology, Inc.

Technical Papers

Flux-Free, Reliable, Efficient: Soldering with Formic Acid

Redesigning Material Logistics for High-Mix EMS Production

Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education

Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

MORE TECHNICAL PAPERS

Ask the Experts

How Many Fiducials Per Solder Paste Stencil?

Solder Alloy Investigation

Reliability Concerns When Converting to Lead-free

Contamination Using Solvent Dispensers

Mixed Process Solder Joint Appearance, Smooth or Grainy?

What Caused SMT Pads to Oxidize After Reflow

Viscosity of Solder Paste Before Printing

Solder Splashing During Wave Soldering

MORE ASK THE EXPERTS

Optimizing Cleaning Strategies for Advanced Packaging Technologies
The study will utilize various test vehicles with low standoff components, using both No-clean and Water-soluble solder formulations. Two aqueous-based cleaning agents will be evaluated, and cleanliness assessed through visual inspection, SIR, and IC testing following IPC standards.
Technical Paper

How To Prevent Mid-chip Solder Balls?
Is there a mathematical calculation that can be used to predict solder balling for a given package size?
Board Talk

Sponsor

Micro Dispensing Technology White Paper
The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size.
DL Technology

Reduction of Condensate Residues in the Reflow Process
Increased electronics manufacturing results in an increased amount of condensate residue. The problem is not only to meet the increased cleaning requirements with increasing production, it is much more the absence of knowledge about the condensate residue formation process and how this residue can be minimized and inhibited in its formation.
Technical Paper

Solder Performance and Reliability Assurance (SPRA) Project
The performance specification of solder requires that any solder being considered meet assembly requirements as well as the interconnects formed with the solder survive specified mechanical shock, thermal cycle, and vibrations environment conditions.
Technical Paper

Heterogenous Integration using Fan-out Wafer-level Packaging Technology
An overview of packages having multiple die along with double-sided build up layers will be presented. This technology can provide high module yields.
Technical Paper

Sponsor

Optically Clear Nanosilica Filled Epoxy
Master Bond EP4NS-80 is a low viscosity epoxy for bonding and sealing that possesses excellent dimensional stability, low CTE and minimal shrinkage upon curing.
Master Bond

How to Manage Material Outgassing in Reflow Oven
This study investigates the evaporation of chemicals during the reflow process from preheating until cooling. Different solder pastes are compared.
Technical Paper

The Best Storage Method to Protect Against Corrosion
Which storage method will better protect against corrosion, nitrogen or super dry? You want to do it in compliance with IPC 1602, which covers storage and handling of circuit boards.
Board Talk

Sponsor

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp

Hybrid Sintering for High-power Density Devices Aerospace Applications
This paper presents the results of a study aimed at developing high-power density devices for aerospace applications.
Technical Paper

Extending 3D MRS Sensor Technology to Address Challenging Applications
There is an increasing need for highly accurate 3D inspection and measurement capabilities for applications in SMT, semiconductor and metrology markets.
Technical Paper

High Performance Light and Moisture Dual Curable Encapsulant
This study is focused on liquid glop top encapsulants that are placed over the PCB components and wire bonds as a protective layer.
Technical Paper

Sponsor

Automation in Transition
The world of automation is changing. What does this mean for customers? And what impact is the transformation having on providers? Find out more from a panel of experts.
SCHUNK

How to Set Up a Successful Blind Via Hole Fill DC Plating Process
Successful via fill plating requires a specific electrolyte; the copper concentration is as high 50 - 60 g/L copper with low sulfuric acid at 30 - 60 g/L.
Technical Paper

Risks Using Flux Only for Soldering BGAs
What are the risks using flux only versus solder paste for placing BGAs in a hybrid lead-free environment? Why would you only use flux, why not solder paste?
Board Talk

Sponsor

Safely Remove Underfilled BGAs Without Damaging the Circuit Board
Learn how cold precision milling techniques enable the removal of underfilled BGAs while minimizing risk to components, circuit traces, and board integrity.
Circuit Technology Center

Gooey Flux Residue Left Behind
After selective soldering connectors there is a small amount of no-clean flux residue left behind. How can I judge how much flux residue can be left behind?
Board Talk

Latest Industry News

Agentic AI, Multi‑Physics, and Standards Will Redefine Chips Design

Compal opens new plant in Taoyuan

Electronics overtime hits monthly record for June

Amazon's new Texas data center could become the single largest polluter in the US

Why Jensen Huang's $500 billion AI financing plan faces a big risk from China

MORE INDUSTRY NEWS

Sponsor

AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS

Sponsor

Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
ECD