Electronics Manufacturing and Electronics Assembly

Some of the zones or our oven profiler are competing to get to the correct temperature. How do I prevent the oven from having competing zones? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk

Copper Electrodeposition By Hydrogen Evolution Assisted Electroplacing
A technique called hydrogen evolution assisted electroplating, has shown enhancement to the deposition rate of copper compared to galvanostatic conventional electroplating methods.
Production Floor

Leveraging America's Enormous Deep Tech Advantage
At the same time that America’s ability to manufacture and build have atrophied, it’s advantage in so-called “Deep Technologies” has exploded.
Technology Briefing

Piezoelectric Sensors for Measuring Stress in Semiconductor Applications
Advances in semiconductor technology and device complexity are stepping up the pressure on monitoring and controlling for semiconductor packaging processes.
Analysis Lab

Solder Paste Selection for Bottom Termination Components Attach
Two solder paste chemistries and several printing parameters were evaluated in order to achieve consistent solder paste deposition across the assembly.
Materials Tech

Improved Process Yield with Dynamic "real-time" Dual Head Dispensing
This paper examines proven methods to determine the dot/line positional accuracy along with mass flow rate for both heads during synchronous dispensing.
Production Floor

SIR Test Method for Developing Evidence for the Production Assembly
The purpose of this paper is research on the development of temperature-humidity-bias instrumentation and test board designs forproduct acceptance.
Analysis Lab

Issues With Solder Paste Transfer Efficiency
With transfer efficiency and its relationship to solder paste volume, can you produce a transfer efficiency over 100% of the theoretical volume?
Board Talk

Hi Pot Dielectic Breakdown
How the Electrical Test industry combats requirements and provides solutions to adhere to ever changing requirements is discussed.
Materials Tech

Flexible Sensors Provide Versatility or Wearable Electronics
Robots are becoming more agile and wearable electronics' traditional silicon-based sensors won’t make the cut in many applications.
Technology Briefing

Double Print Stencils Systems
It is useful in Assemblies that require mixed technologies; including SMT / Through Hole, SMT / Glue attach components, Packages requiring die attach / SMT assembly.
Production Floor

Review of Interconnect Stress Testing Protocols
This research analyzes a large population of PCB IST coupons to determine if there is a more effective IST test to find less reliable microvias.
Analysis Lab

Polymer Thick Film That Was Thinned Out
A factory is making circuits using polymer thick film. One day the ink was too thin, making it print poorly. What was causing this?
Mysteries of Science

QFN I/O Pad Solder Paste Overprint on Thermal Pad Void Reduction
QFN SMT components continue to be increasingly used and also becoming smaller for applications further requiring a high level of thermal performance and reliability.
Production Floor

There Actually is an 'I' in Team

Robotic arms handle repetitive and precision movements. This change relieves operators of mundane work. They must adjust to the new work environment.
Technology Briefing

Characterization of Solder Defects in Package on Package
This paper is part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls.
Analysis Lab

Rheology of Solder Paste: Shelf Life Study

This study offers a better understanding of the correlation between rheological properties and shelf life of solder paste exposed to extreme conditions.
Materials Tech

Taking the LED Pick and Place Challenge
There has been a shift in the lighting industry that has carried over to surface mount technology. What is this shift? Is it the LED revolution?
Production Floor