Electronics Manufacturing and Electronics Assembly

Sponsor

Your Award-Winning Cored Wire
Our industry-leading, award-winning range of flux-cored wire solder solutions meet the diverse needs of both manual soldering, and rework and robotic soldering applications.
Indium Corporation

Technical Papers

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

MORE TECHNICAL PAPERS

Ask the Experts

Baking Concerns for Stacked Trays of Components

Cleanliness Requirement for Populated Printed Boards

Flux Residue During Pin-in-Paste

Storage To Prevent Corrosion

Manual or Automated Assembly?

Soldering Station Calibration

Exposed Copper Risk

Baking Old PCBs Prior To Reflow

MORE ASK THE EXPERTS

SMT Processing using Printed Anisotropic Conductive Epoxy
There are many options on the market for unpackaged, bare die with advanced capabilities, however these chips are often designed for wire bonding interconnection. This paper discusses three designs successfully transitioned from previously wire-bonded die to bare die direct-to-circuit attachment using standard SMT pick-and-place equipment.
Technical Paper

Minimum Lead to Lead Spacing for Wave Soldered Through-Hole Components
What is the recommended minimum lead-to-lead spacing for through-hole components run through a wave soldering system? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their own suggestions.
Board Talk

Sponsor

Built to Scale. Proven in Production.
Microsystems World CNC boosted throughput and automation by trading up to a complete inline SMT solution—powered by Manncorp and designed for long-term growth.
Manncorp Inc.

Kinetics of a Layer of Bismuth at the Anode of a Sn-Bi Based Solder Joint
Electrical resistance of low temperature solder during current stressing was shown to have the thickness of continuous layers of Bi accumulated at the anode.
Technical Paper

Analyzing 0402 Capacitor Defects With Stencil Printing Misalignment
This study investigated the cause of tombstoning for 0402 capacitors in surface mount technology. Statistical analysis methods were used to determine if there was any difference.
Technical Paper

Temperature Cycling with Bending to Reproduce Typical Product Loads
A new methodology for solder joint reliability prediction taking into account the mechanical load as well as the thermal mismatch load between component, solder & PCB is proposed.
Technical Paper

Sponsor

Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
ECD

Optimization of Robotic Soldering Process: Solder Spread and Spattering
Robotic soldering is a growing market. We will present how cored wires with different flux percentages will affect robotic soldering performance.
Technical Paper

Moisture Barrier Bag Issues
Moisture sensitive chip components have been exposed to the atmosphere beyond specification. Can they be packaged and sealed with desiccant?
Board Talk

Sponsor

Contaminant Removal with Plasma
Plasma provides organics removal and other benefits to increase bond strength! Many chamber sizes available, all with a low environmental impact. Learn more.
Plasma Etch

Pb-Free Water-Soluble Solder Paste Improves Reliability
This paper details a water-soluble lead-free solder paste that has improved voiding performance and washability over previous generations of solder paste.
Technical Paper

Thermal Radiographic Failure Analysis of Capacitor Encapsulant Fracturing
Multiple tantalum capacitors are SMT attached to PCBs. Failures or fractures were observed at contractor SMT assembly lines and not on RTX lines.
Technical Paper

Accelerated Corrosion Testing of DRAM Modules for Data Centers
To investigate corrosion problems in electronic products for server applications, mixed flowing gas (MFG) is widely used as an accelerated testing method.
Technical Paper

Sponsor

iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE

Development of Materials Informatics Platform
Materials Informatics is one of the hottest technologies because of its potential to reduce the time and costs of discovering innovative materials.
Technical Paper

Can Silver Cause Solder Embrittlement?
A few of our components have leads with a silver finish. Will silver cause solder embrittlement? Is removal of silver needed or can it be soldered using 63/37 solder? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this question and scenario.
Board Talk

Sponsor

Automation in Transition
The world of automation is changing. What does this mean for customers? And what impact is the transformation having on providers? Find out more from a panel of experts.
SCHUNK

What is Considered Acceptable PCB Rework and Repair?
An operator attempted to repair three damaged conductors using bus wire overcoated with epoxy. Do you consider this repair acceptable?
Board Talk

Latest Industry News

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AI productivity growth cannot match the computer revolution

AI models that consider user's feeling are more likely to make errors

Apple's success is running into a familiar problem: not enough chips

MORE INDUSTRY NEWS

Sponsor

TIM1 for EV Battery Thermal Management
AIT's thermal adhesives, grease-gels, & gum-pads offer proven thermal dissipation for a balance of strength, rework ability, & recyclability of EV battery packs.
AI Technology, Inc.

Sponsor

Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS