Electronics Manufacturing and Electronics Assembly

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Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
ECD

Technical Papers

Redesigning Material Logistics for High-Mix EMS Production

Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education

Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

MORE TECHNICAL PAPERS

Ask the Experts

Selective Printing for BGA Components

PCBA Transport Between Facilities

SOT (Small Outline Transistor) Body Cracks

Shielding Techniques When Removing Components Using Hot Air

Partially Visible or Hidden Solder Connections

Shelf Life Limit for Soldering Old Components

Trays for MLS Baking

Controlling Creep Corrosion

MORE ASK THE EXPERTS

Realization of a New Concept for Power Chip Embedding
This paper will focus on the behavior of the power module for operational conditions of a PedEleC (Pedal Electric Cycle) application.
Technical Paper

Reliability of Doped Lead-Free Solder Joints Under Isothermal Aging
This paper presents harsh environment reliability test results for lead-free solder pastes with and without the presence of a variety of dopant elements.
Technical Paper

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Master Circuit Board Repair with Proven Industry Methods
Circuit Technology Center's guidebook features more than 100 repair and rework procedures covering everything from damage assessment and troubleshooting.
Circuit Technology Center

Rheology and Wetting Characterizations of Flux and Solder Paste
In this paper, we will discuss a solder paste wetting method. A high resolution solder wetting balance was used for the solder paste wettability analysis.
Technical Paper

Can Tape Residue Contaminate a Clean Tank?
We leave masking and Kapton tapes that fall off during cleaning in the bottom of our wash tank. Can the adhesives contaminate the recycled solution? Jim Hall and Phil Zarrow, The Assembly Brothers, address these question and share their own experiences.
Board Talk

Reflow Oven Zone Separation Challenges
Some of the zones or our oven profiler are competing to get to the correct temperature. How do I prevent the oven from having competing zones? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk

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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS

How the Right Cored Wire Can Optimize Automated Soldering
This study investigates the impact cored wire flux activity and flux core percentage has on soldering performance and speed. Additionally, this research aims to identify optimal soldering parameters by varying preheat time, feed rate, tip temperature, dwell time.
Technical Paper

Pressure-Less Silver Sintering Pastes for Low Porosity Joint and Large Die
Under pressure-less sintering conditions silver sintering pastes for different sized die attachment to form robust silver joints have been developed.
Technical Paper

Sponsor

EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
DL Technology

The Importance of Having a Clean Slate in the SMT Assembly Process
The paper covers an experiment to improve upon the defect ratio of their PCB assembly process by utilizing a bare board cleaner before the paste printer.
Technical Paper

Cleaning Industrial Parts with Plasma
The cleanliness of surfaces is critical for the quality of processes like bonding, coating and printing. That’s why manufacturers may want to consider using atmospheric pressure plasma.
Technical Paper

How To Clean a Vintage Circuit Board Assembly?
A vintage computer board is contaminated with decomposed anti-static foam. The microprocessor and other ICs have a sticky grime on the leads.
Board Talk

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Eliminate Worry of Cross Contamination
While Models 529 and 1550 are similar semi-automatic cleaners with single wash and rinse tanks, the Model 2003 includes 2 wash tanks for cleaning multiple applications in one machine.
Smart Sonic

Low Temperature Solder Joint Shear Strength of Components
This paper studies the effect of several factors on the shear strength of a wide range of components assembled using LTS paste.
Technical Paper

Characterization of SIP Assembly and Reliability Under Thermal Cycles
This paper presents assembly challenges and reliability evaluation of Three-Dimensional Through- Mold Via and System in Package in fine pitch ball grid arrays.
Technical Paper

Sponsor

Electronic Assembly Cleaning Basics
Monitoring & effectively controlling chemistry concentration when cleaning electronic assemblies is crucial for maintaining optimal cleanliness results & preventing costly consequences.
KYZEN

The Maximum Allowable Compression Load Per Solder Interconnect
An attempt to identify the maximum quantitative allowable compression load per solder ball in a large component configuration with 600μm in solder ball diameter is investigated.
Technical Paper

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Enhance Your Hands-On Soldering Skills
Learn how IPC certified training workshops for operator and trainer levels can advance skills and knowledge of your personnel for TH and SMT assembly.
BEST Inc.

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Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering

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