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Reflow Oven Zone Separation Challenges
Some of the zones or our oven profiler are competing to get to the correct temperature. How do I prevent the oven from having competing zones? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk
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Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.
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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
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Want High-Reliability BGA Service?
BGA rework and reballing solutions for commercial, military and aerospace perfected over 20-plus years of reliable, repeatable and proven success.
BEST Inc.
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i4.0, Are We Really Ready?
This paper evaluates SMT production and inspection machines and attempts to define their potential to act as ‘smart sensors’, the first building blocks towards i4.0.
Technical Paper
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The True Business Impact of IIoT Technology
Pitfalls and opportunities in IIoT solution technology, at the device level, the manufacturing execution management system layer, and enterprise business systems layer.
Technical Paper
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Seven Facilities, One Trusted Source
Partner with the industry leader. Summit is trusted and proven, with 7 integrated facilities to load capacity—from fast-turn prototypes to scalable production requirements.
Summit Interconnect
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