circuit insight
Can Tape Residue Contaminate a Clean Tank?
We leave masking and Kapton tapes that fall off during cleaning in the bottom of our wash tank. Can the adhesives contaminate the recycled solution? Jim Hall and Phil Zarrow, The Assembly Brothers, address these question and share their own experiences.
Board Talk
PBGA Solder Stress Analyses Under Random Vibration
Large size commercially available plastic ball grid array chip packaging was tested and analyzed under random vibration to assess its application feasibility on satellite electronics.
Technical Paper
Sponsor
Indium-Corporation

Your Award-Winning Cored Wire
Our industry-leading, award-winning range of flux-cored wire solder solutions meet the diverse needs of both manual soldering, and rework and robotic soldering applications.
Indium Corporation
Reliability Testing of Consumer Products
We will look at reliability testing of consumer products and which of these test and analytical tools can be used, and how they affect the product development process.
Technical Paper
Additive Manufactured Electronics for Next Generation Microelectronics
This paper will focus on interconnects fabricated using the AME method. Two material sets will be used to fabricate test devices for studying interconnects.
Technical Paper
Void Reduction Method for BTC Using Exposed Via in Pad
The method explored in this paper regards the use of exposed via in pad. A dedicated test vehicle was designed for two types of QFN components.
Technical Paper
Sponsor
Schunk

Automation in Transition
The world of automation is changing. What does this mean for customers? And what impact is the transformation having on providers? Find out more from a panel of experts.
SCHUNK
Reflow Oven Zone Separation Challenges
Some of the zones or our oven profiler are competing to get to the correct temperature. How do I prevent the oven from having competing zones? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk
Design for Manufacture and Test Using Thermal Cycling Under Bia
There are many factors contributing to electrochemical failures on electronic devices including pitch, electrical field, ionic contamination and environmental conditions.
Technical Paper
Sponsor
DL-Technology

Start Micro Dispensing Today
The DL Micro Valve is specifically designed for dispensing micro volumes of material in precise, repeatable patterns. Learn more about the DL Micro Valve.
DL Technology
Low Temperature SnBi Containing Solder Pastes with Lead-Free Solder Balls
A detailed study has been carried out on low temperature lead-free solder paste that utilizes Bi bearing alloys.
Technical Paper
Method for Accurate PCB Impedance Simulation of Any Specific Stack-Ups
The reasons of inaccurate PCB impedance simulation of the traditional simulator and a novel and cost-effective method for accurate PCB impedance simulation are discussed.
Technical Paper
Immersion Gold Processes Used for Both ENIG and ENEPIG
This paper presents a comparative study for three types of immersion golds used for both ENIG and ENEPIG deposits in the same production line.
Technical Paper
Sponsor
Master-Bond

Low Outgassing, Thermally Conductive Epoxy
Master Bond EP21AOLV-2LO is a low outgassing, thermally conductive, electrically isolating adhesive that can be used for sealing, coating and encapsulating.
Master Bond
How To Clean a Vintage Circuit Board Assembly?
A vintage computer board is contaminated with decomposed anti-static foam. The microprocessor and other ICs have a sticky grime on the leads.
Board Talk
i4.0, Are We Really Ready?
This paper evaluates SMT production and inspection machines and attempts to define their potential to act as ‘smart sensors’, the first building blocks towards i4.0.
Technical Paper
Sponsor
Glenbrook-Technologies

X-ray Rentals & Rent-to-Own
Rent any of our machine models, with up to 3 months of rental costs applied toward purchasing X-ray equipment. Our flexible plan lets you test the system before committing to purchase.
Glenbrook Technologies
Potted Assembly Interfacial Reliability Under Inclined 25000g Mechanical Shock
This study investigates the time and temperature-dependent evolution of interfacial fracture toughness in four distinct potting compounds for printed circuit boards (PCBs). The investigation focuses on the evolution of the interfacial fracture toughness at the potting material-PCB interface.
Technical Paper
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Air-Vac-Engineering
Sponsor
ECD

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
Smart-Sonic
Sponsor
AI-Technology-Inc

TIM1 for EV Battery Thermal Management
AIT's thermal adhesives, grease-gels, & gum-pads offer proven thermal dissipation for a balance of strength, rework ability, & recyclability of EV battery packs.
AI Technology, Inc.
Cartoon
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