Electronics Manufacturing and Electronics Assembly

Sponsor

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura

Technical Papers

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

MORE TECHNICAL PAPERS

Ask the Experts

ESD and Humidification

SMT Target Component Placement

Old Components and Blow Holes

Pin in Paste Solder Dropping

Reusing recovered solder paste

Bottom Side Chip Bonding

Pick Performance for SMT Placement Machines

Overlap Solder Joint Failures

MORE ASK THE EXPERTS

Autonomous Vehicles Still Decades Away: 2019
This paper examines the challenges to progress from existing advanced driver-assistance systems to level 4 and 5 autonomous vehicles.
Technical Paper

The Best Method for Reworking Ultra-Micro Chips
We are soldering and reworking 0201s and 01005s using hot air solder rework station with adjustable air flow. The minimum air flow will blow parts.
Board Talk

Sponsor

Plasma Clean, Etch and RIE in One Machine
The PE-100 convertible allows you to perform plasma cleaning, isotropic etching and reactive ion etching(RIE) in the same system!
Plasma Etch

Understanding Creep Corrosion Field Fails
Dendrites, Electrochemical Migration and parasitic leakage, can be caused by process related contamination. This paper explores aspects of the creep corrosion chemical reaction.
Technical Paper

Microstructure and Performance of Micro CU Pillars Assemblies
Correlations between the shear strength and microstructure of Cu pillars were examined for different solder compositions, and for different aging times.
Technical Paper

How the Chip Shortage Reshaped the Electronics Supply Chain
The global chip shortage that started in 2020 sent shockwaves through the electronics manufacturing industry, disrupting production lines and forcing companies to rethink their supply chain strategies. This shortage not only delayed production but also highlighted critical vulnerabilities in the electronics supply chain.
Technical Paper

Sponsor

Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.

Process Control of Ionic Contamination in Assembly of Electronic Circuits
This paper reviews a testing protocol based on IPC-TM 650 2.3.25 to enable monitoring of ionic contamination within series production.
Technical Paper

How To Rework Warped PCBAs?
From a large lot, 20 populated boards with components of varied heights on both sides are warped. What methods can they use to flatten them?
Board Talk

Sponsor

In-House Assembly? We're the Experts
The right equipment, expert installation, technical training, and full support—every step made easy. On-site or remote, we set you up for success.
Manncorp Inc.

Novel Pogo-Pin Socket Design for Automated Linearity Testing
A novel pogo-pin block array and corresponding motorized test socket has been designed to stimulate the MCM and acquire full functional test data.
Technical Paper

Jetting Conductive Adhesives with Silver Coated Polymer Particles
Tests performed in this study demonstrate that a conductive adhesive using spherical, polymer silver particles can be used for no-contact jet printing.
Technical Paper

Reduce Pollution of Process Gasses in an Air Reflow Oven
This paper gives detailed information of catalyst systems designed and implemented in SMD production lines to reduce pollution of process gasses.
Technical Paper

Sponsor

Discover the power of vAI ProVision from Viscom
Create and optimize 3D AOI and AXI programs in minutes. vAI ProVision boosts inspection depth, quality, and speed. Viscom develops & produces premium inspection systems.
Viscom SE

The Development of Hybrid Therma-EMI Solutions for Electronics
Test methods to measure the thermal and electromagnetic properties of a material in an application and as fundamental material properties are discussed.
Technical Paper

How Long Solder Paste Can Be Left On a Stencil Without Activity
How long can we leave solder paste on a stencil without any activity? If activity means not printing, then we are talking about a pause or abandoned time.
Board Talk

Sponsor

Cut Your SAC305 Costs with REL61 Alloy
Silver prices have tripled. While silver is 2/3 of SAC305's cost, it's only 1/4 of REL61. Save hundreds of thousands annually with this proven, drop-in alternative.
AIM Solder

Intrusive Soldering vs. Wave Solder
We are wave soldering with top and bottom side preheat. Would a pin in paste, or intrusive soldering, be a better option than wave soldering? The Assembly Brothers, Phil Zarrow and Jim Hall, address this question.
Board Talk

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Quantum's Big Leap Puts Data Centers in the Spotlight

VIEWPOINT 2026: Robert Nami, Director Global Sales and Marketing, Pacific Trinetics Corporation (PTC)

Chinese tech companies progress 'remarkable,’' OpenAI's Altman tells CNBC

The U.S. and China Are Pursuing Different AI Futures

Achieving Zero Runtime Errors

MORE INDUSTRY NEWS

Sponsor

Tech Paper - Keys to Component Lead Tinning Success
This paper examines the challenges and best practices of component tinning, with a focus on temperature control, flux selection, and soldering techniques.
Circuit Technology Center

Sponsor

EZ-FLO High Precision Ceramic Dispense Tips
The ceramic molding process allows for smaller more precise inner diameters with a glass-like finish, giving you the ultimate control. Learn more.
DL Technology

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