circuit insight
Why Uneven Conformal Coating?
We are experiencing an issue with our conformal coating. On matte finish boards the coating is vibrating away from some others and building up in others.
Board Talk
Rheology of Solder Paste: Shelf Life Study
This study offers a better understanding of the correlation between rheological properties and shelf life of solder paste exposed to extreme conditions.
Technical Paper
Sponsor
AI-Technology-Inc

TIM1 for EV Battery Thermal Management
AIT's thermal adhesives, grease-gels, & gum-pads offer proven thermal dissipation for a balance of strength, rework ability, & recyclability of EV battery packs.
AI Technology, Inc.
A Fracture Mechanics-Based Approach to Simulate Die Pick-up Process
This paper provides a procedure to simulate die pick-up process based on contact-debonding fracture mechanics approach.
Technical Paper
Surface Insulation Resistance of No-Clean Flux Residues
No-clean fluxes present great benefits, but the activity of the unwashed process residues must be tightly controlled in order to meet reliability standards.
Technical Paper
Protecting the Reliability and Integrity of Electronic Products and Assemblies
The COVID-19 crisis has prompted increasing inquiries on how to disinfect electronic equipment and assemblies without detrimental impact on the electronics.
Technical Paper
Sponsor
Schunk

Automation in Transition
The world of automation is changing. What does this mean for customers? And what impact is the transformation having on providers? Find out more from a panel of experts.
SCHUNK
Selective Solder Paste Printing for BGA Components
Could we print paste only on the pads that have functional requirements? Could we skip printing on 50 or more of the interior pads since they serve no function? The Assembly Brother, Phil Zarrow and Jim Hall, discuss this topic and share their own experiences.
Board Talk
High-Speed 3D Surface Imaging Technology in Electronics Manufacturing
This paper introduces line confocal technology that was developed to characterize 3D features of surface and material types at sub-micron resolution.
Technical Paper
Sponsor
BEST-Inc.

Unlock the Potential of Salvaged Devices
Component harvesting is a reliable method of electronic component reclamation, reducing e-waste and ensuring economic reuse for automated assembly.
BEST Inc.
Impact of Alloy Composition on Shear Strength for Low Temperature Lead Free Alloys
As assemblies, undergo temperature/power changes during use CTE mismatch causes added stress and strain on the solder joint.
Technical Paper
Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package
Lower-temperature paste can be reflowed under a relatively lower peak temperature profile and outperform SAC305 paste in the current WLP256 application.
Technical Paper
Cleaning and No-Clean Process Control Using the SIR Test Method
This research is to design electrical twin test boards in the waste area of a panel of production boards, which are representative of production hardware.
Technical Paper
Sponsor
Viscom

iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom
What is the Suggested Humidity Level for Electronics Assembly?
I am aware of the suggested humidity level for an electronics assembly facility. Do the same limits apply within a 100,000 class clean room?
Board Talk
Solder Paste Selection for Bottom Termination Components Attach
Two solder paste chemistries and several printing parameters were evaluated in order to achieve consistent solder paste deposition across the assembly.
Technical Paper
Sponsor
Advanced-Interconnections

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
Continuous Improvement: The Task That Never Ends in the Cleaning World
The job of a cleaning agent is to remove an unwanted contaminant, or simply some kind of “dirt”. How can you efficiently remove that soil while minimizing total waste and improving worker safety? While that answer evolves based on updated impact studies and new regulations, the goal of removing those undesired contaminants remains fixed.
Technical Paper
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Circuit-Technology-Center
Sponsor
ECD

Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
ECD
Zestron
Sponsor
Air-Vac-Engineering

Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering
Cartoon
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