Electronics Manufacturing and Electronics Assembly

Sponsor

Viscom at SMTA Michigan & Ohio
Join Viscom at SMTA Michigan (8/18/26) and Ohio (8/20/26) to discover the latest advancements in AOI and AXI inspection technology, including our powerful AI solutions.
Viscom SE

Technical Papers

Flux-Free, Reliable, Efficient: Soldering with Formic Acid

Redesigning Material Logistics for High-Mix EMS Production

Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education

Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

MORE TECHNICAL PAPERS

Ask the Experts

Conformal Coating in Nitrogen Environment

Double Sided Reflow for Micro BGA Components

Baking After Cleaning Hand Placed Parts

Question About IPC-6013 Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

Coils Rotated After Reflow

Stencil Pattern for Thermal Pads on QFNs

Component Shifting

What Is Causing Connectors to Bow?

MORE ASK THE EXPERTS

Hand Soldering Reliability
What are the differences in reliability for SMT machine placement followed by reflow vs. hand placement followed by hand soldering in surface mount?
Board Talk

Flip Chip LED Solder Assembly
A pin transfer process was adapted to assemble flip-chip CSP LEDs with fine pitch solder paste to assemble lateral and vertical LEDs on flat substrates.
Technical Paper

Sponsor

How pH Cleaning Agents Affect Production Performance
Establishing a reliable cleaning process requires a good understanding of all influencing factors, including pH, and defining the correct balance to meet final product reliability.
KYZEN

Modern Methods of PCB Depanelization with a Focus on Low Impact Depanelization
It is easier and more economical to manufacture multiple assemblies simultaneously on a larger panel and then singularize them once they’ve been populated.
Technical Paper

How Does Printed Solder Paste Volume Affect Solder Joint Reliability?
Solder paste and stencil technology has been well studied. It is the aim of this work to correlate printed solder paste volume to solder joint reliability.
Technical Paper

High Thermal, High Temperature Interconnects for Ultra High Power LEDs
For high performance applications, ultra-high power offers cost reduction through fewer LEDs, smaller PCBs, smaller heat sinks and lighter load bearing.
Technical Paper

Sponsor

Eliminate Lead Tinning Issues Before They Become Reliability Failures
Learn lead tinning methods, causes of tinning defects, and solutions from the experts at Circuit Technology Center to help ensure dependable solder connections.
Circuit Technology Center

Does HASL or ENIG Reduce Creep Corrosion in Corrosive Environments?
We make electronics equipment used in corrosive environments. Do you recommend the use of HASL versus immersion gold for our application? The Assembly Brothers, Phil Zarrow and Jim Hall, answer this question.
Board Talk

Molecular Fingerprint of Condensate Residues in the Soldering Process
A range of condensate samples were taken from different process zones of reflow soldering systems and were analyzed using FT-IR spectrometry.
Technical Paper

Sponsor

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp

Implementation of Assembly Processes for Low-Melting Point Solder Pastes
This paper discusses the need for low-temperature solders and process-ability of solder pastes with three novel alloys against the industry standard.
Technical Paper

Low-Voiding High-Reliability Lead-Free Solder Paste for Automotive
A novel lead-free solder paste, Durafuse® HR (DFHR), has been developed using Durafuse® technology. This technology demonstrates the combined merits of each constituent solder powder in the paste. DFHR is based on Sn-Ag-Cu alloy system and contains bismuth (Bi), indium (In), and antimony (Sb).
Technical Paper

iNEMI Board Assembly –Press-Fit Technology Roadmap
A press-fit roadmap team including press-fit manufacture, OEM/ODM and EMS are getting together every two years to identify the future technology trend, future technical challenges and needs and then to find potential solution for next 5 to 10 years in the horizon.
Technical Paper

Sponsor

ASYMTEK Select Coat SL-1040
The SL-1040 Conformal Coating System upgrades the SL-940 and added significant system-level advancements to elevate automation, control, precision & preventative maintenance for better yield.
Nordson Electronics Solutions

Opens With Assembled QFN Components
We are experiencing opens on assembled QFN components at a rate of 9%. The failure only appears in rows near the component center. What is happening?
Board Talk

Study of Lead-Free Solder Materials for Power Module Packaging Assembly
This study focused on the thermal fatigue performance and the microstructural evolution of five lead-free solders under harsh service conditions.
Technical Paper

Sponsor

Gripping Systems from micro assembly to heavy lifting
The first industrial-suited grippers from SCHUNK were a milestone. Since then we have brought countless newly and further developments to market.
SCHUNK

Improving Reliability of High Performing PCB With Advanced Conformal Coating Use
The paper discusses a newly developed conformal coating system that meets the high performance, reliability and cycle time demand based on the hybrid polymer approach.
Technical Paper

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MORE INDUSTRY NEWS

Sponsor

Precision Control for BGA Rework
Vacuum sensing electronics provide control for gentle, automatic component removal while a non-contact site cleaning tip's height is accurately monitored and maintained.
Air-Vac Engineering

Sponsor

Buy SMT Dispensing Needles Online
EZ-FLO needles are machined from stainless steel with smoother internal profile for improved material flow. Chamfered needle tip is finely ground for better release. Buy online.
DL Technology