Electronics Manufacturing and Electronics Assembly

Sponsor

Your Award-Winning Cored Wire
Our industry-leading, award-winning range of flux-cored wire solder solutions meet the diverse needs of both manual soldering, and rework and robotic soldering applications.
Indium Corporation

Technical Papers

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

MORE TECHNICAL PAPERS

Ask the Experts

Removing Cleaning Residues Under BTC Packages

BGA Solder Ball Wetting

Requirements for Installing Leaded vs. Lead-free Press Fit Connectors

Maximum Allowable Time Prior to Washing When Using Water Soluble Paste

What's Causing Cloudy Conformal Coating

What Is Causing Slanted Pins After Reflow

Components Falling Off During Wave Soldering

ESD Ground Wire Gauge

MORE ASK THE EXPERTS

Electrochemical Reliability as a Function of Component Standoff
The purpose of this paper is to research the activity of flux residues as a function of the standoff height using insulation resistance.
Technical Paper

Finding the Cause of Cold Solder Joints
We have problems with our wave soldering system, especially cold solder joints. Could this be caused by using a selective soldering frame?
Board Talk

Sponsor

Affordable Excellence - iS6052 AOI
The latest addition to Viscom's esteemed lineup of AOI systems. This new system offers a compelling option for manufacturers looking to enhance their PCB inspection processes.
Viscom

Quantifying Environmental Life Cycle Impacts for ICT Products
This paper describes a simplified approach for estimating the environmental impact of Information and Communications Technology (ICT) products.
Technical Paper

Cavity Board SMT Assembly Challenges
This study is to identifies the challenges related to assembly of a package into a cavity on the board, and establish the best known method for SMT assembly success.
Technical Paper

Risk for Ceramic Component Cracking Dependent
The paper discusses the differences of the alloy, based stress in ceramic components due to passive cycle tests, real customer tests, and stress analyses.
Technical Paper

Sponsor

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp

Room Temperature Fast Flow Reworkable Underfill for LGA
With the miniaturization of electronics, Land Grid Array has been widely used in consumer electronics, leaving only 20-30 microns gap left between LGA and the substrate.
Technical Paper

Solder Balls on Neighboring Components After Rework
During the rework of SMT components on conformal coating boards we see solder balls occurring on neighboring components. How can this be eliminated?
Board Talk

Sponsor

Simply Double the Production Volume
SEHO SelectLine features the award-winning Synchro and SmartSplit production modes that allow to halve cycle times in batch production and mixed operation. Find out more.
SEHO Systems GmbH

Protocol Development for Testing Solder Reliability
This paper updates progress in the development of methods for investigating solder joint reliability in a combined environment of vibration and thermal cycle testing.
Technical Paper

Failure Analysis - Using Chromatography and Ion Chromatopgraphy/Mass Spec
From component and fabrication to complete electronic assemblies, IC analysis has been the de facto method for evaluating ionic cleanliness of electronic hardware.
Technical Paper

Assessment of 2nd Level Interconnect Quality in Flip Chip Ball Grid Array Package
Wire bonding is extensively used in the electronic packaging industry. One of the difficulties with flip chip technology is testing its reliability.
Technical Paper

Sponsor

440-R + Ultrasonics = Safe & Efficient Cleaning
Low power density ultrasonic cleaners combined with 440-R-SMT detergent provide safe and effective cleaning of stencils, pallets, misprints & SMD adhesives.
Smart Sonic

Process-Property Relationships for Flexible Additive-Printed Electronics
In this paper, a detailed study of the effect of aerosol-jet process parameters on the resistance, shear strength, and elastic modulus has been presented.
Technical Paper

Can Solder Mask Be Considered an Insulator?
Is solder mask considered an insulating material and not a defect if proven the solder mask has dielectric withstanding voltage greater than 500 volts?
Board Talk

Sponsor

Optimizing BGA Rework: Challenges, Techniques and Quality Control
The complexity of BGA packages introduces challenges during rework requiring innovative methods and inspection practices to ensure performance and reliability. Read more.
BEST Inc.

The Causes of Tiny Solder Balls After Reflow
We have been seeing tiny solder balls across our boards after reflow. It appears that the solder is exploding as the balls are in areas where there is no paste or components.
Board Talk

Latest Industry News

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VIEWPOINT 2026: Michael Sivigny, General Manager, CeTaQ Americas

How Cross-Cultural Engineering Drives Tech Advancement

Gartner Identifies Three Pillars for Deriving Value from AI

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MORE INDUSTRY NEWS

Sponsor

More than just hot air
Rehm's Vision series Convection Soldering Systems ensure reliable, high-quality electronics production by using precise heat transfer and customizable options for maximum efficiency.
Rehm Thermal Systems

Sponsor

AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS

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