Electronics Manufacturing and Electronics Assembly

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Get the Revisiting Underfill Handbook
Today's underfill applications are constantly evolving. As chip populations increase, dispensing applications must deliver smaller amounts of fluid with precision. Read this handbook.
Nordson Electronics Solutions

Technical Papers

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

MORE TECHNICAL PAPERS

Ask the Experts

3D AOI Solder Joint Qualification Parameters

Solder Contamination Sources

Removal of Non-functional Pads from Inner Layers

Components Jumping Around During Reflow

Estimating Failure Rate During Rework

Long Term Component Storage

How To Measure Solder Paste Rolling Diameter

Class 3 Pin Contact Question

MORE ASK THE EXPERTS

Method for Accurate PCB Impedance Simulation of Any Specific Stack-Ups
The reasons of inaccurate PCB impedance simulation of the traditional simulator and a novel and cost-effective method for accurate PCB impedance simulation are discussed.
Technical Paper

Immersion Gold Processes Used for Both ENIG and ENEPIG
This paper presents a comparative study for three types of immersion golds used for both ENIG and ENEPIG deposits in the same production line.
Technical Paper

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Reduce Lead Time and Improve Supply Chain.
If value-add lead times are causing delay in Supply Chain, contact Alltemated. Our quick-turn solutions provide an alternative source for value-add needs.
Alltemated Inc.

How To Clean a Vintage Circuit Board Assembly?
A vintage computer board is contaminated with decomposed anti-static foam. The microprocessor and other ICs have a sticky grime on the leads.
Board Talk

i4.0, Are We Really Ready?
This paper evaluates SMT production and inspection machines and attempts to define their potential to act as ‘smart sensors’, the first building blocks towards i4.0.
Technical Paper

Potted Assembly Interfacial Reliability Under Inclined 25000g Mechanical Shock
This study investigates the time and temperature-dependent evolution of interfacial fracture toughness in four distinct potting compounds for printed circuit boards (PCBs). The investigation focuses on the evolution of the interfacial fracture toughness at the potting material-PCB interface.
Technical Paper

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Simply Double the Production Volume
SEHO SelectLine features the award-winning Synchro and SmartSplit production modes that allow to halve cycle times in batch production and mixed operation. Find out more.
SEHO Systems GmbH

The True Business Impact of IIoT Technology
Pitfalls and opportunities in IIoT solution technology, at the device level, the manufacturing execution management system layer, and enterprise business systems layer.
Technical Paper

Requirements on a Class 0 EPA - ESD Equipment and Measurements
The requirements “0 volt” can be achieved, when die maximum value will be required. Today we do not have any ESD material, which requires these limits.
Technical Paper

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Build Your Solution with Manncorp
Get a custom SMT equipment plan in minutes and source your entire line from one trusted supplier—backed by lifetime expert support you won't find anywhere else.
Manncorp Inc.

When is it Time to Switch from Manual Assembly to Automation?
We are a new start-up assembling wireless sensors. All assembly is now manual. We are experiencing large reject rates due to hand soldering of components.
Board Talk

How Can We Prevent Our 0201 Nozzles From Clogging?
We have a formula stencil that had the apertures enlarged to maintain volume while overprinting the ends to keep solder away from the 0201 nozzle.
Board Talk

Stencil Printing for Challenging Heterogeneous Assembly Applications
A series of Metric 0201 experiments investigating printing process sensitivity to circuit board properties, including pad dimensional accuracy and landscape topography.
Technical Paper

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Maintenance: The Basics of Cleaning Series Part 4
This is the final paper in a series and discusses some of the common mistakes in maintenance cleaning applications found in electronic assembly operations.
KYZEN

Achieving Solder Reliability for LGA Ceramic Image Sensors
The stencil aperture design has more influence on overcoming CTE mismatch between the ceramic LGA and the FR4 PCB than the reflow oven temperature profile cool down slope.
Technical Paper

Weibull Distribution and Analysis
This paper provides an overview of the Weibull distribution, its variables, types of data required, and interpretations that can be drawn.
Technical Paper

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Plasma Clean, Etch and RIE in One Machine
The PE-100 convertible allows you to perform plasma cleaning, isotropic etching and reactive ion etching(RIE) in the same system!
Plasma Etch

Efficient Thermomechanical Reliability Model for Lead-Free Solder Joints
This study aims to present a new analytical model that accounts for the shape of solder joints, with a special emphasis on the determination of the mechanical properties of the Printed Circuit Boards (PCBs) and components. A simplified elastic-plastic constitutive relationship coupled with a viscoplastic model is used.
Technical Paper

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Optimizing BGA Rework: Challenges, Techniques and Quality Control
The complexity of BGA packages introduces challenges during rework requiring innovative methods and inspection practices to ensure performance and reliability. Read more.
BEST Inc.

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Micro Dispensing Technology Leader
DL Technology LLC develops customized dispensing needles and valves for the electronics assembly, industrial assembly, semiconductor packaging and medical industries.
DL Technology

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