Electronics Manufacturing and Electronics Assembly

Sponsor

Reliable Solder Performance for Less Silver
Stop overpaying for silver. REL61TM lead-free alloy offers equivalent mechanical strength and thermal stability to SAC305 with a decade of field-proven success. Switch now.
AIM Solder

Technical Papers

Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education

Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

MORE TECHNICAL PAPERS

Ask the Experts

Shelf Life Limit for Soldering Old Components

Trays for MLS Baking

Controlling Creep Corrosion

Design Considerations and Impact on Assembly

BGA Placement Paste or Only Flux

BGA BAll Sheer Testing

Hand Soldering at Low Temperature

Spotting After DI Water Cleaning

MORE ASK THE EXPERTS

Soldering Relays Intrusively in Lead Free Process
We use intrusive reflow soldering on relays using a lead process. We are challenged to solder relays intrusively in a lead-free process.
Board Talk

Impact of Stencil Manufacturing Technology of Multi-level/ Step Stencils
In this paper, we evaluate and compare the print performance of four different step technologies: Chemically etched, Laser weld, Milled, and Electroform.
Technical Paper

Sponsor

Micro Dispensing Technology Leader
DL Technology LLC develops customized dispensing needles and valves for the electronics assembly, industrial assembly, semiconductor packaging and medical industries.
DL Technology

Electrical Plus Functional Testing in Designing Electronics for Harsh Conditions
This paper proposes a test method and vehicle to characterize soldering materials, assembly process steps, and conformal coating to determine reliability.
Technical Paper

Intermetallic Compounds in Solder Alloys: The Common Misconception
This paper describes the IMCs that occur typically in eutectic, Sn63Pb37, near-eutectic SAC305, and high-performance tin-based Pb-free solder alloys.
Technical Paper

Reducing Dust Deposition on Electronic Equipment
This work focuses on one aspect of reducing dust accumulation on electronic equipment, specifically by optimizing the cooling air flow.
Technical Paper

Sponsor

Defluxing Ultra-Fine Pitch CoW Devices? Read This.
DI water falls short on copper pillar packages. Get proven cleaning parameters for CoW devices with <25μm pitch in our white paper.
ZESTRON Americas

Limitations of ROSE Testing Versus Localized Contamination
Recognizing the limitations of ROSE testing versus localized contamination, what can I use to validate the cleanliness of my finished product?
Board Talk

Effect of Matte-Sn Electroplating on Reliability of Lead-free Solder Joints
This study analyzes the impact of electroplating parameters of matte-Sn terminal layer on the thermo-mechanical reliability of solder joints.
Technical Paper

Sponsor

TIM1 for EV Battery Thermal Management
AIT's thermal adhesives, grease-gels, & gum-pads offer proven thermal dissipation for a balance of strength, rework ability, & recyclability of EV battery packs.
AI Technology, Inc.

Beyond the Technical Data Sheet
This paper examines process changes and the material properties or performance of polymer composites used in semiconductor packaging and board assembly.
Technical Paper

Reliability of Copper, Gold, Silver and PCC Wirebonds Under Operation
In this paper, a detailed study of the electrical and mechanical degradation of wirebonds under high temperature exposure is presented.
Technical Paper

Adiabatic & Isothermal Humidification for Electronics Manufacturing
The need for including humidification into a well-rounded electronics manufacturing facilities’ ESD program is discussed.
Technical Paper

Sponsor

AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS

Maximum Board Temperature During Tin-Lead
IPC discusses the maximum top-side board temperature for BGAs to be 150 degrees C during a tin-lead wave solder. How is this temperature was determined?
Board Talk

Impact of BGA Escape Trace Design on Performance of Solder Joint
In this paper, a comprehensive study is presented to demonstrate the impact of different BGA escaping trace design cases on solder joint reliability.
Technical Paper

Sponsor

Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH

The Convergence of Technologies and Standards
The Vertical Segments of the Electronic Products Manufacturing Industry are converging and service offerings are consolidating due to advanced technology adoption and market dynamics. The convergence will cause shifts in the flow of materials across the supply chain as well as the introduction of equipment and processes across the segments.
Technical Paper

Latest Industry News

Built-In Memory. Built-In Confidence.

Amazon AI exec predicts first 'commercially useful' quantum computers in 5-7 years

Beyond Chiplets, CMOS 2.0 Moves Scaling into the Circuit

Reliable Machine Vision Starts at the Circuit Level

AI Is Exposing Major Gaps in Traditional Data Backup Strategies. Here's How to Protect Your Business.

MORE INDUSTRY NEWS

Sponsor

X-ray Rentals & Rent-to-Own
Rent any of our machine models, with up to 3 months of rental costs applied toward purchasing X-ray equipment. Our flexible plan lets you test the system before committing to purchase.
Glenbrook Technologies

Sponsor

SMT Line Builder Tool – Fast & Easy
Skip the guesswork. Our SMT Line Builder gives you instant, expert-recommended setups based on your budget and output. Or send us your BOM—we'll handle it.
Manncorp Inc.

"You're entitled to one week paid vacation if you bring your laptop with you and never turn off your cell phone."
Copyright © Randy Glasbergen