Reflow Oven Zone Separation Challenges
Some of the zones or our oven profiler are competing to get to the correct temperature. How do I prevent the oven from having competing zones? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk
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How the Right Cored Wire Can Optimize Automated Soldering
This study investigates the impact cored wire flux activity and flux core percentage has on soldering performance and speed. Additionally, this research aims to identify optimal soldering parameters by varying preheat time, feed rate, tip temperature, dwell time.
Technical Paper
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Cleaning Industrial Parts with Plasma
The cleanliness of surfaces is critical for the quality of processes like bonding, coating and printing. That’s why manufacturers may want to consider using atmospheric pressure plasma.
Technical Paper
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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
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Cleaning under Bottom Terminated Components
This paper demonstrates continuously detecting the proper quality of rinsing water and the status of chemical filters, which provide the required parameters.
Technical Paper
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Low Thermal Resistance Epoxy
Master Bond EP53TC is a thermally conductive, electrically insulating adhesive that combines good physical properties and the ability to transfer heat rapidly and effectively.
Master Bond
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Additive Manufacturing for Next Generation Microwave Electronics
The paper will discuss the integration of 3D printing and inkjet printing fabrication technologies for microwave and millimeter-wave applications. With the recent advancements in 3D and inkjet printing technology, achieving resolution down to 50 um, it is feasible to fabricate electronic components and antennas operating in the millimeter-wave regime.
Technical Paper
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