Electronics Manufacturing and Electronics Assembly

Sponsor

Built to Scale. Proven in Production.
Microsystems World CNC boosted throughput and automation by trading up to a complete inline SMT solution—powered by Manncorp and designed for long-term growth.
Manncorp Inc.

Technical Papers

Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education

Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

MORE TECHNICAL PAPERS

Ask the Experts

Controlling Creep Corrosion

Design Considerations and Impact on Assembly

BGA Placement Paste or Only Flux

BGA BAll Sheer Testing

Hand Soldering at Low Temperature

Spotting After DI Water Cleaning

Cause of Green/Blue Oxide Buildup

Floor Life of MSD Parts

MORE ASK THE EXPERTS

The Convergence of Technologies and Standards
The Vertical Segments of the Electronic Products Manufacturing Industry are converging and service offerings are consolidating due to advanced technology adoption and market dynamics. The convergence will cause shifts in the flow of materials across the supply chain as well as the introduction of equipment and processes across the segments.
Technical Paper

Board Level Reliability Testing of RF Packages
The paper presents a summary of board level reliability test performed on RF packages, the assembly process, mechanical and environmental tests, and understanding failures.
Technical Paper

Sponsor

A Collaborative Model for Hands-On Electronics Manufacturing Education
KYZEN Corporation and the Rochester Institute of Technology (RIT) have established an academic-industry collaboration to integrate real-world electronics manufacturing challenges directly into engineering education.
KYZEN

Finite Element Analysis of Tin-Bismuth Electromigration of Solder Joints
This paper is based on the planar solder joint approach which affords non-destructive real-time monitoring of the solder joint microstructure in a scanning electron microscope.
Technical Paper

Probe Contact Issues with No-Clean Pin-in-Paste
We are having issues with our no-clean pin in paste process caused by flux residue on the surface of the solder joint. Should all flux vaporize off during reflow?
Board Talk

De-Ionized Water Affected By the Atmosphere
Resistivity readers of the de-ionized water are above 15 megohms. Resistivity results of the samples tested by the outside lab have been approximately 1 megohm.
Board Talk

Sponsor

Contaminant Removal with Plasma
Plasma provides organics removal and other benefits to increase bond strength! Many chamber sizes available, all with a low environmental impact. Learn more.
Plasma Etch

Detect PCB Stack-up Error with Machine Learning Methods
With high frequency and high-speed transmission in information industry, PCB customers demand stricter signal transmission integrity of PCB.
Technical Paper

Endocrine Disrupting Chemicals and Bioaccumulative Substances
The re-classification and regulation of EDCs and bioaccumulative substances is expected to multiply the materials that require control or replacement.
Technical Paper

Sponsor

Trusted Solutions for Complex BGA Rework
BGA rework demands precision and proven processes to ensure reliable results. Circuit Technology Center specializes in high-reliability BGA rework and repair.
Circuit Technology Center

Ultrasonics as an Option for Electronics Assembly Cleaning
Ultrasonic cleaning parameters including frequency, power, time, temperature and chemistries results demonstrate developments in technology.
Technical Paper

Design Considerations That Influence LED Solder Joint Reliability
In this paper we examine the influence of three factors on thermal-mechanical solder joint reliability of LEDs mounted on an IMS PCB using FEA.
Technical Paper

Insulation Between Overhanging Component Lead and Circuit Conductor
We have a long lead SMT component overhanging the pad. Can solder mask provide insulation between the overhanging component and the circuit conductor?
Board Talk

Sponsor

Need Improved Solder Joint Visibility?
Solder Peel-A-Wayš Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.

Low Temperature Soldering: Reflow Enhanced Mechanical Reliability
In this work, we further discuss solderability and mechanical reliability of a novel low temperature proprietary alloy (generically called as X46).
Technical Paper

Investigation into Low Temperature Solder Reliability
This paper presents an examination of three low temperature solders and provides a comparison with tin-silver-copper solder.
Technical Paper

Sponsor

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura

Conformal Coating Prevention and Analysis of Resistor Silver Sulfide Corrosion
This paper covers all the long-term test results as a follow-up to an earlier publication reporting interim results and preliminary conclusions. Physical analyses were completed to investigate possible differences in the failure mode at the various FoS test temperatures.
Technical Paper

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MORE INDUSTRY NEWS

Sponsor

Boost Reballing with EZReball Preforms
EZReball reballing preforms provide fast, clean, and accurate reballing of complex BGA packages while eliminating traditional complexities and the need for operator dexterity.
BEST Inc

Sponsor

ISM Storage and Software Integration Solutions
We are specialized in storage solutions and our warehouses ensure efficient production. Patented cases maximize space, facilitating material handling.
Essegi Automation