Electronics Manufacturing and Electronics Assembly

Sponsor

Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH

Technical Papers

Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

MORE TECHNICAL PAPERS

Ask the Experts

Hand Soldering at Low Temperature

Spotting After DI Water Cleaning

Cause of Green/Blue Oxide Buildup

Floor Life of MSD Parts

Reflow Oven Calibration Schedule

Trichloroethylene Alternative

Is Solder Mask Considered an Insulator

Solder Balls During Selective Soldering

MORE ASK THE EXPERTS

Enhanced Cleanability Using Fluxes with Decreased Viscosity after Reflow
A series of flux systems have been developed which would result in a reduced viscosity after reflow. This enables a high viscosity, high tack flux to be used.
Technical Paper

Challenges Reliably Soldering Large Ground Pad on LGAs
We are experiencing difficulties reliably soldering large ground pad on land grid array packages using a single large window as a stencil. Should we use all four windows?
Board Talk

Sponsor

Our Solutions
Discover Essegi Automation's modular solutions: flexible hardware and software seamlessly integrated into SMT and THT environments.
Essegi Automation

Copper Foil Elements Affecting Transmission Loss with High Speed Circuits
This study examines possible factors for these inconsistencies such as etched signal trace shape, surface treatment, and grain size.
Technical Paper

Contactless Technology for High Resolution, Speed, Solder Paste Deposition
Ideally, we would have a solder ball dispensing solution that had the throughput of analog solutions with the accuracy of traditional digital solutions.
Technical Paper

Dispensing EMI Shielding Materials: An Alternative to Sputtering
The development of a spray coating process to apply EMI shielding materials to the exterior surfaces of components on strips and larger SiP packages.
Technical Paper

Sponsor

Start Micro Dispensing Today
The DL Micro Valve is specifically designed for dispensing micro volumes of material in precise, repeatable patterns. Learn more about the DL Micro Valve.
DL Technology

Finding the Cause of Cold Solder Joints
We have problems with our wave soldering system, especially cold solder joints. Could this be caused by using a selective soldering frame?
Board Talk

Electromigration in Tin-Bismuth Planar and Bottom Terminated Solder Joints
The electromigration rates and behavior of eutectic Sn-Bi alloy in planar and in BTC solder joints were compared and shown to be similar.
Technical Paper

Sponsor

High Precision Component Milling
Automatic Removal of Electronic Components including Residual Solder on Heat Sensitive Assemblies.
Air-Vac Engineering

Development and Testing of a Lead-Free Low Melting Point Alloy
This paper describes the development and testing procedure of a new lead-free low melting point alloy.
Technical Paper

Advancing Bonding Techniques for Electronic Interconnects
This study focuses on two major bonding techniques: Cu nanoparticle (Cu NP) sintering and Cu-Sn3.0Ag0.5Cu (Cu-SAC305) hybrid paste bonding. Both methods aim to address the limitations of conventional soldering processes, especially in high-temperature, high-power applications.
Technical Paper

Printed Electronics for Medical Devices
This paper will share details about multiple medical sensing applications and the advanced materials and processes used to assemble them for optimal functionality.
Technical Paper

Sponsor

What Would You Ask Proven Global Manufacturing Leaders?
In this 4-part series we asked about: Key Drivers of Success, Scaling Operations Effectively, AI in Manufacturing, and Tools to Empower Operations. No registration Required.
Intraratio

Solder Balls on Neighboring Components After Rework
During the rework of SMT components on conformal coating boards we see solder balls occurring on neighboring components. How can this be eliminated?
Board Talk

Counterfeit Electronics Component Conundrum with Smart Labeling
Electronics manufacturers hurting from supply chain disruptions and component shortages are challenged by the rise in counterfeit components.
Technical Paper

Sponsor

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp

Soldering Challenges Caused by Warpage of Large Integrated Circuits
We found that BGAs exhibit minimum warpage at a reflow temperature of 200-220°C, not MAPSP 210oC the lower temperature of about 180°C that tin-bismuth solders require. The best process production window can be obtained by using a solder alloy with a melting point of 200°C
Technical Paper

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MORE INDUSTRY NEWS

Sponsor

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura

Sponsor

Catch Defects Before They Cost You
3D AOI analyzes true solder height, contour, and volume to expose defects 2D systems miss—reducing false calls, rework, and escapes on ultra-compact components.
Manncorp Inc.

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