Electronics Manufacturing and Electronics Assembly

Sponsor

Corrosion, UV Protection for Power Transmission
Moisture, corrosive gas, oxidation & UV blocking prop-erties. FLUOROSEAL® confor-mal coating for electrical contacts & ceramic insulator protection.
AI Technology, Inc.

Technical Papers

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

MORE TECHNICAL PAPERS

Ask the Experts

Solder Contamination Sources

Removal of Non-functional Pads from Inner Layers

Components Jumping Around During Reflow

Estimating Failure Rate During Rework

Long Term Component Storage

How To Measure Solder Paste Rolling Diameter

Class 3 Pin Contact Question

Solder Paste Print Test Boards

MORE ASK THE EXPERTS

How Can We Prevent Our 0201 Nozzles From Clogging?
We have a formula stencil that had the apertures enlarged to maintain volume while overprinting the ends to keep solder away from the 0201 nozzle.
Board Talk

Stencil Printing for Challenging Heterogeneous Assembly Applications
A series of Metric 0201 experiments investigating printing process sensitivity to circuit board properties, including pad dimensional accuracy and landscape topography.
Technical Paper

Sponsor

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD

Achieving Solder Reliability for LGA Ceramic Image Sensors
The stencil aperture design has more influence on overcoming CTE mismatch between the ceramic LGA and the FR4 PCB than the reflow oven temperature profile cool down slope.
Technical Paper

Weibull Distribution and Analysis
This paper provides an overview of the Weibull distribution, its variables, types of data required, and interpretations that can be drawn.
Technical Paper

Efficient Thermomechanical Reliability Model for Lead-Free Solder Joints
This study aims to present a new analytical model that accounts for the shape of solder joints, with a special emphasis on the determination of the mechanical properties of the Printed Circuit Boards (PCBs) and components. A simplified elastic-plastic constitutive relationship coupled with a viscoplastic model is used.
Technical Paper

Sponsor

Discover the power of vAI ProVision from Viscom
Create and optimize 3D AOI and AXI programs in minutes. vAI ProVision boosts inspection depth, quality, and speed. Viscom develops & produces premium inspection systems.
Viscom SE

Soldering Relays Intrusively in Lead Free Process
We use intrusive reflow soldering on relays using a lead process. We are challenged to solder relays intrusively in a lead-free process.
Board Talk

Rework Practices for MicroLEDs and Other Highly Miniaturized SMT Components
This paper will focus on practices and innovative solutions to successfully repair these miniaturized, sensitive and often fragile components.
Technical Paper

Sponsor

Fastest 3D AOI in the Market
Experience the latest, fastest AOI on the market: the TR7700QH SII, an Ultra-High-Speed 3D AOI capable of up to 80 cm²/sec. Smart Factory Ready solution.
Test Research, Inc.

Strain Measuring Technology in Board Level Assembly Process
The study on strain measurement has just started, and there are still many unsolved puzzles, whether about strain gage selection or about measurement methodology.
Technical Paper

Reexamination of Thermal Cycling Reliablity of BGA Components
A direct comparison was conducted between SnPb and lead-free solder joints focused on long-term thermal cycling reliability after being exposed to high-temperature aging for a long period of time using two test vehicle designs.
Technical Paper

Test Methods for Electrochemical Consistency in PCB Assembly Processes
This paper will review traditional and emerging methods to characterize flux residues and cleanliness of finished assemblies.
Technical Paper

Sponsor

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS

Limitations of ROSE Testing Versus Localized Contamination
Recognizing the limitations of ROSE testing versus localized contamination, what can I use to validate the cleanliness of my finished product?
Board Talk

Simulation and Fault Diagnosis in Post-Manufacturing Mixed Signal Circuits
In this paper, an effective method for predicting circuit failures in post-market circuit boards through simulation and deep learning is proposed and implemented.
Technical Paper

Sponsor

Beat Rising Silver Prices with AIM REL61
With silver at historic highs, there’s never been a better time to switch. Reduce material costs significantly while maintaining the reliability your applications demand.
AIM Solder

A New Approach to Process Qualification – SIR Testing + Functional Components
The experiment will build test vehicles with soldering materials susceptible to electrical leakage and electrochemical failures. The test vehicles will be tested using a test instrument designed to power and record the outputs of functional and dummy components.
Technical Paper

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Sponsor

SEHO makes production lines smarter
Improve your work flow and reduce manufacturing costs with creative ideas and innovative solutions for automation, board handling and material management.
SEHO Systems GmbH

Sponsor

Keep Production Moving When Parts Are Scarce
Guides offering methods for removing, cleaning, lead conditioning, inspecting, and requalifying components, with emphasis on reliability.
Circuit Technology Center

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