Electronics Manufacturing and Electronics Assembly

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Get the Revisiting Underfill Handbook
Today's underfill applications are constantly evolving. As chip populations increase, dispensing applications must deliver smaller amounts of fluid with precision. Read this handbook.
Nordson Electronics Solutions

Technical Papers

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

Understanding Solder Dross: Causes and Control Strategies

MORE TECHNICAL PAPERS

Ask the Experts

Overlap Solder Joint Failures

How to Re-qualify BGA Spheres

Pick and Place Machine Calibration

Components Falling Off During Reflow

Solder Balling Prediction Formula

Dendritic Growth and Contamination at BGA Sites

Removal of Coatings from PCBs

LED Component Shift During Reflow

MORE ASK THE EXPERTS

Risks Using Flux Only for Soldering BGAs
What are the risks using flux only versus solder paste for placing BGAs in a hybrid lead-free environment? Why would you only use flux, why not solder paste?
Board Talk

Investigation into Lead-Free Low Silver Solder Wire for Electronics
This paper show results using a lead-free solder rework wire alloy in terms of wetting, reduced solder iron tip erosion, reduced IMC growth and reliability.
Technical Paper

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Tech Paper - The Essential Guide for High-Reliability BGA Component Re-balling
This paper outlines best practices and challenges in reballing Ball Grid Array (BGA) components. Download this free tech paper.
Circuit Technology Center

Solder Composition, Surface Finish and Solder Joint Volume on Drop Shock Reliability
Five Pb-free solder alloys on two PCB surface finishes were evaluated for drop shock reliability with two different solder joint volumes (LGA and BGA).
Technical Paper

Optimization of Stencil Apertures to Compensate for Scooping
This study investigates the scooping effect during solder paste printing as a function of aperture width, aperture length and squeegee pressure.
Technical Paper

Embracing a New Paradigm: Electronic Work Instructions (EWI)
To stay competitive in today's evolving global marketplace, manufacturing must recognize and embrace the new EWI paradigm.
Technical Paper

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Corrosion, UV Protection for Power Transmission
Moisture, corrosive gas, oxidation & UV blocking prop-erties. FLUOROSEAL® confor-mal coating for electrical contacts & ceramic insulator protection.
AI Technology, Inc.

Gooey Flux Residue Left Behind
After selective soldering connectors there is a small amount of no-clean flux residue left behind. How can I judge how much flux residue can be left behind?
Board Talk

Fill the Void II: An Investigation into Methods of Reducing Voiding
This paper is a continuation of previous work on voiding. The voiding results are summarized and recommendations made for reduction of voiding.
Technical Paper

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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura

Hand Printing using Nanocoated and other High End Stencil Materials
This study details the effectiveness of nanocoating materials, high end stainless steel stencil materials, as they relate to the manual SMT printing.
Technical Paper

Young Laplace Equation Reveals New Possibilities Thermal Pad Design
This paper shows how the application of the Young-Laplace equation can lead to an understanding of the soldering process of exposed pads and heat slugs.
Technical Paper

Effect of SMT Component Package Design on Cleaning Effectiveness
This paper will discuss the "physics" of liquid entrainment / entrapment / cleaning / rinsing and their effects on component materials.
Technical Paper

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Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.

Requirements for Depaneling and Rescoring Boards with BGA Components
Are there any special requirements for depaneling and rescoring separate panel circuit boards if they contain BGA components?
Board Talk

Contamination and Risks Related to ESD Gloves and Finger Cots
Choosing a protective glove for the production floor is a critical decision and all variable need to be considered.
Technical Paper

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Optimizing BGA Rework: Challenges, Techniques and Quality Control
The complexity of BGA packages introduces challenges during rework requiring innovative methods and inspection practices to ensure performance and reliability. Read more.
BEST Inc.

Investigation Into the Durability of Stencil Coating Technologies
Paper addresses durability of coatings in relation to the number of print cycles and underside wipe cycles and materials used on the underside wipe process.
Technical Paper

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Circuitnet LLC

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Buy SMT Dispensing Needles Online
EZ-FLO needles are machined from stainless steel with smoother internal profile for improved material flow. Chamfered needle tip is finely ground for better release. Buy online.
DL Technology