Electronics Manufacturing and Electronics Assembly

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100+ Expert Repair & Rework Guides - All in One Place
Take the guesswork out of circuit board repair. This guidebook delivers proven methods to help you repair and rework assemblies to IPC standards.
Circuit Technology Center

Technical Papers

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

MORE TECHNICAL PAPERS

Ask the Experts

Lifted Lead on SOT Component

Ultrasonic Cleaning and Surfactants

Frequency of Temperature and Relative Humidity Tracking

Pin-in-Paste Hole Stencil Printing

Pre-bake in a Vacuum

Considering Plasma Cleaning

Critical Part Fixture During Reflow

Causes of Annular Ring Dewetting

MORE ASK THE EXPERTS

Predicting Mid-Chip Solder Balling
Is there a calculation that can be used to predict solder balling? We would like to design our stencil apertures to ensure no mid-chip solder balls. The Assembly Brothers, Jim Hall and Phil Zarrow, discuss design suggestions to prevent solder balling.
Board Talk

Impact of PCB Manufacturing, Design, and Material to PCB Warpage
This paper will use high temperature warpage metrology to evaluate the impact that PCB manufacturing, design, and material has on BGA and panel area PCB warpage.
Technical Paper

Sponsor

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD

Do We Need to Switch to Type 5 Solder Pastes?
The experiment should find the optimum printer parameters, compare type 4 vs. 4.5 vs. 5 solder paste and 4 different stencils.
Technical Paper

Void Reduction in Reflow Soldering Processes by Sweep Stimulation
The insights of the feasibility study were the basis for the integration of the voidless technique into an industrial production process.
Technical Paper

New-Generation, Low-Temperature Lead-Free Solder
In this paper, the roles of additive and bismuth content will be discussed. Eutectic SnBi and three newly designed SnBi-based alloys were experimented upon.
Technical Paper

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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE

Vapor Phase and Backward Compatibility
We use lead-free solder paste with a melting point of 217 degrees C, along with 230 degree C Galden. We have a new project that uses tin-lead solder. The Assembly Brothers, Phil Zarrow and Jim Hall, offer their suggestions.
Board Talk

Discrete Carbon Nanotube Implementation for use in ESD Tooling
This research illustrates the improvement in volume and surface resistivity for trays and tooling fixtures manufactured usin functionalized carbon nanotubes.
Technical Paper

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Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.

System in Package (SiP) and CSPs Underfilling on Reliability
This paper presents assembly challenges and reliability evaluation by thermal cycling for a 2.5D [aka, System in Package (SiP)] in a fine pitch ball grid array (FPBGA).
Technical Paper

Via-In Pad Plated Over (VIPPO) Design Considerations
This work has evaluates BGA packaging and PCB design parameters to characterize their influence on double-reflow solder separation failure mode for mixed VIPPO BGA pad footprints.
Technical Paper

Wetting and Solidification of Tin on Polycrystalline Intermetallic Substrates
This study analyzes the wetting and interface formation between polycrystalline CuxAly intermetallic substrates and the pure Beta-Sn phase.
Technical Paper

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The Drawbacks of Internal Recycling Systems for Solder Dross
This paper examines the risks and hidden costs of in-house solder dross recycling, highlighting contamination, compliance, quality, safety, and economic challenges that often outweigh perceived savings.
AIM Solder

Should We Measure Solder Paste Thickness?
On average, how many locations should we measure our PCBs to confirm our solder paste thickness? Our PCBs are approximately 10" by 10".
Board Talk

Managing blooming in an adhesives process
If you have ever used a cyanoacrylate adhesive, you may have seen blooming — a chalky, white residue on the surface of your part.
Technical Paper

Sponsor

AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS

High-density PCB Technology Assessment for Space Applications
The goal of the project is to design and qualify HDI PCBs that can provide a platform for assembly and the routing of small pitch AAD for space projects.
Technical Paper

Latest Industry News

Google Expands Partnership with Intel for AI Chips

Intel Enters Pact With Tesla and SpaceX for Terafab

OpenAI looks to take on Anthropic with $100 per month ChatGPT Pro subscriptions

Chip Can Project Video the Size of a Grain of Sand

Samsung weighs Vietnam semiconductor testing facility

MORE INDUSTRY NEWS

Sponsor

Silver Filled Electrically Conductive Epoxy
Master Bond EP3HTSDA-2Med is a silver filled adhesive system with high electrical and thermal conductivity that passes ISO 10993-5 for cytotoxicity.
Master Bond

Sponsor

New SELECT Synchro soldering system
A multi-station selective soldering system that uses a unique, synchronous motion to increase throughput, improve cost-of-ownership, and provide flexibility for electronics manufacturers.
Nordson Electronics Solutions

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