Electronics Manufacturing and Electronics Assembly

Sponsor

Depaneling machine for separating circuit boards
SCHUNK offers solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling.
SCHUNK

Technical Papers

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

MORE TECHNICAL PAPERS

Ask the Experts

What's Causing Cloudy Conformal Coating

What Is Causing Slanted Pins After Reflow

Components Falling Off During Wave Soldering

ESD Ground Wire Gauge

Looking for Long-term Component Storage Options

Question About PPM Defect Rate for Reversed Packages

ESD and Humidification

SMT Target Component Placement

MORE ASK THE EXPERTS

Compatibility and Mechanical Reliability in Low Temperature Soldering for BGA Components
This study investigated the mechanical shock reliability of various SAC and LTS ball-paste combinations, revealing key insights into LTS compatibility and performance. Building on previous research demonstrating superior thermal reliability for LTS ball components soldered with SAC paste.
Technical Paper

Second Round Robin Evaluation of iNEMI Creep Corrosion Qualification Test
The paper reports the results of the iNEMI creep corrosion qualification test and compares them to the first round robin test and recent mixed-flowing gas test results.
Technical Paper

Sponsor

The perfect protection for your electronics
Rehm's ProtectoXP and ProtectoXC systems offer flexible, high-quality coating solutions that shield electronics from moisture, corrosion, and other environmental damage.
Rehm Thermal Systems

Reactivity of No-Clean Flux Trapped Under Bottom Terminated Components
As components reduce in size, the flux residue formation during the reflow soldering process is altered which can impact the reliability of the final assembly.
Technical Paper

Wet-Based vs. Dry-Based Cleaning
For automatic under-stencil cleaning there are many cleaning methods. What factors should we consider to select wet based cleaning versus dry based cleaning?
Board Talk

Influence of Salt Contamination and RH on Creep Corrosion of Immersion Silver
This study provides important insights into the impact of both minor and major contamination on creep corrosion, offering new perspectives on reliability in the field. We hope it will stimulate further research and practical applications in the electronics industry.
Technical Paper

Sponsor

Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron

Modeling a SMT Line to Improve Throughput
With tools to model a large quantity of products and the impact of SMT line configurations, an electronics assembly plant can be analyzed to identify improvement opportunities.
Technical Paper

Connector Bowing During Reflow Process
I have a connector that is bowing during lead-free soldering. When the connector is put through an oven on its own no bowing takes place. What is causing this?
Board Talk

Sponsor

Are Your BGA Rework Operators Competent?
Can every operator handle your BGA rework equally well? In real life, in all but just a few situations, the answer is no. Why is this so?
Circuit Technology Center

Component Density on Solder Joint Reliability Under Harsh Environment
In this study, degradation behavior of lead free solder joint was compared with mounted position and component density of vehicle engine control unit for excavator.
Technical Paper

Seeking Alternatives to Solvent Cleaning
We are using a mix of trichloroethylene and IPA for cleaning in the ratio of 10 to 90. We are looking to eliminate the use of trichloroethylene.
Board Talk

An Investigation in Rinse Water Sustainability
This paper investigates options for improving sustainability in Class II and III manufacturing environments by studying options for reusing and/or recycling rinse water.
Technical Paper

Sponsor

High-Reliability for Low-Temp Processes
Durafuse® LT low-temp, high-rel solder paste is bismuth-free, reduces warpage in large BGAs, enhances thermal cycling, drop shock reliability, and reduces energy use up to 15%.
Indium Corporation

New Interconnection for High Temperature Application: HotPowCon (HPC)
Interconnection technology is capable for resistant joints for SMT components, bigger dies, like MOSFETs or IGBTs and even large area substrates, like baseplate or heat sinks.
Technical Paper

NSOP Reduction for QFN RFIC Packages
NSOP failures are costly as the entire device is rejected if there is one such failure on any bond pad. The paper presents some of the failure modes.
Technical Paper

Sponsor

Let our contract cleaning services help
If you have a technical cleaning question, or if you are facing process challenges or performance challenges, use this technical hotlist form to get help from a KYZEN Technical Care Expert.
KYZEN

Selective Soldering Design for Reliability Using a Novel Test Board and SIR Test Method
The purpose of this research is to develop a test method designed to evaluate the electrochemical reliability of the selective soldering process at the assembly site.
Technical Paper

Latest Industry News

Why a Memory Chip Shortage is Wreaking Havoc on Consumer Electronics Industry

VIEWPOINT 2026: Ross Berntson, President and CEO, Indium Corporation

Compal expects PC shipments to fall this quarter

IDC: India's Wearables Market Declines 4.0% to 114 Million Units in 2025 as Smartwatch Shipments Fall 17.6%

Manufacturing PMI rises on chip, AI demand: S&P

MORE INDUSTRY NEWS

Sponsor

Turnkey Lines: In-Stock & Ready
In-stock, fully integrated SMT lines with Manncorp's U.S.-based support. Skip the wait, cut lead times, and get your operation producing sooner.
Manncorp Inc.

Sponsor

Toughened, Non-Drip Epoxy
Master Bond Supreme 121AOND is a toughened, heat curing adhesive for bonding and sealing applications that offers chemical resistance and a high glass transition temperature.
Master Bond

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