Electronics Manufacturing and Electronics Assembly

Sponsor

Test Instead of Guessing Your Cleaning Process
Compare PCBA cleaning systems neutrally and validate results with analytics. Make safe decisions based on real data- not assumptions. Start your cleaning test today.
ZESTRON Europe

Technical Papers

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

MORE TECHNICAL PAPERS

Ask the Experts

How to Remove Oxidization from SMT Component Leads?

Solder Ball Wrinkles

Assembly Question for Soldering USB Connectors

BGA Die and Pry Testing

Rise of Bismuth Levels in our Solder Pots

Inspection for Hidden Solder Joints

Solution for Warped PCBAs

BGA Component Cleaning Spec

MORE ASK THE EXPERTS

Solder Joint Performance Under Shock for ENIG and ENEPIG Surface Plated Tester
This paper discusses the results of a comparative study for solder joint performance - under shock - for ENIG and ENEPIG surface plated tester PCBs.
Technical Paper

Improving Efficiency of Through-Hole PCBAs
We are trying to improve the efficiency of the through-hole of our mixed tech, surface mount through-hole PCBAs. What are our options?
Board Talk

Sponsor

Counterfeit Components Identified With X-ray Inspection
Automated component sourcing and procurement platform relies on real-time X-ray inspection to remove counterfeit components from supply chain.
Glenbrook Technologies

Materials for Advanced Ball-Attach Processes for Advanced Packages
This paper will discuss advantages of advanced ball-attach materials developed to meet the challenges of advanced packaging.
Technical Paper

Measuring the Impact of Test Methods for High-Frequency Circuit Materials
How can two different test methods provide Dk measurement that are different? When the methods measure the same circuit material in two different directions.
Technical Paper

Sustainability is Key for Material and Chemistry Choices
OEMs have started adopting sustainable materials and chemistry technologies for their electronics as a part of better ESG score rankings. Sustainability is becoming a key parameter for material and chemistry choices for the next generation electronics. The use of non-toxic options are being evaluated and preferred.
Technical Paper

Sponsor

You need clear soldering results?
The SEHO PowerVision AOI system is for fast, automated optical inspection. Designed for THT processes & focusses on 2 points: Continuous quality assurance & cost-efficient production processes.
SEHO Systems GmbH

Using Rheology as a Measurement Potentially Predictive Tool
The types of rheology measurements studied here show trends that mirror the print volume and volume reproduceability for three pastes.
Technical Paper

Solder Boards Not Holding Up to Shock Testing
We are using a vapor phase oven. We have experienced problems with a no-lead BGA that has low silver solder balls. The solder boards do not hold up to shock testing.
Board Talk

Sponsor

actnano Materials with Nordson Equipment
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Nordson Electronic Solutions

Assessing Electronic Devices with 3D X-Ray Imaging and Electron Microscopy
This article presents workflows that combine 3D X-ray microscopy, nanoscale tomography, and electron microscopy for visualization of the interior of electronic devices.
Technical Paper

Feasibility of Plasmonic Circuits Merged with Silicon Integrated Circuits
Plasmonic signal transmission via nanoscale plasmonic waveguides is a technique with the potential to increase the information transfer capacity in silicon integrated circuits.
Technical Paper

The Versatile Preform
This paper discusses attributes within the solder families that the preforms are composed of and considerations when considering solder preforms.
Technical Paper

Sponsor

The Industry Standard Solder Paste
Looking to Avoid the Void® and enhance SIR performance? Indium8.9HF is your proven, versatile and stable, no-clean, halogen-free, Pb-free solder paste solution.
Indium Corporation

Oxide Alternative Process for High Frequency Bonding Applications
This paper highlights the challenges made with conventional Sulphuric-Peroxide based Oxide Replacement bonding enhancement system.
Technical Paper

Common PCB Design Decisions that Cause Manufacturing Problems
What are the most common design decisions that can have a negative impact on the PCB assembly manufacture and how could we correct them during the design? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this scenario and share their suggestions.
Board Talk

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Seven Facilities, One Trusted Source
Partner with the industry leader. Summit is trusted and proven, with 7 integrated facilities to load capacity—from fast-turn prototypes to scalable production requirements.
Summit Interconnect

Adding OSP to Pads that are Missing ENIG Plating Process
A fabricator notified us that during the ENIG plating process, several pads had been “skipped”. The fabricator would like to add OSP to the pads that are missing the ENIG.
Board Talk

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MORE INDUSTRY NEWS

Sponsor

Plasma as a Key Technology
Plasma technology improves electronics manufacturing, reduces oxide layers, prevents delamination & enables environmentally friendly products by using Openair-Plasma ® & PlasmaPlus®.
Plasmatreat GmbH

Sponsor

Speed That Scales With You
High-throughput 10-head MC388HS pick and place machines built for accuracy at high-speed—helping you scale production without compromising placement quality.
Manncorp Inc.