Electronics Manufacturing and Electronics Assembly

Sponsor

Gripping Systems from micro assembly to heavy lifting
The first industrial-suited grippers from SCHUNK were a milestone. Since then we have brought countless newly and further developments to market.
SCHUNK

Technical Papers

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

MORE TECHNICAL PAPERS

Ask the Experts

Frequency of Temperature and Relative Humidity Tracking

Pin-in-Paste Hole Stencil Printing

Pre-bake in a Vacuum

Considering Plasma Cleaning

Critical Part Fixture During Reflow

Causes of Annular Ring Dewetting

Class 2 vs. Class 3

Challenges Placing RF Shields During SMT Assembly

MORE ASK THE EXPERTS

Via-In Pad Plated Over (VIPPO) Design Considerations
This work has evaluates BGA packaging and PCB design parameters to characterize their influence on double-reflow solder separation failure mode for mixed VIPPO BGA pad footprints.
Technical Paper

Wetting and Solidification of Tin on Polycrystalline Intermetallic Substrates
This study analyzes the wetting and interface formation between polycrystalline CuxAly intermetallic substrates and the pure Beta-Sn phase.
Technical Paper

Sponsor

Discover consistency for your operations
Explore the reliable solutions for jet dispensing, conformal coating, plasma treatment, and selective soldering from Nordson.
Nordson Electronics Solutions

Should We Measure Solder Paste Thickness?
On average, how many locations should we measure our PCBs to confirm our solder paste thickness? Our PCBs are approximately 10" by 10".
Board Talk

Managing blooming in an adhesives process
If you have ever used a cyanoacrylate adhesive, you may have seen blooming — a chalky, white residue on the surface of your part.
Technical Paper

High-density PCB Technology Assessment for Space Applications
The goal of the project is to design and qualify HDI PCBs that can provide a platform for assembly and the routing of small pitch AAD for space projects.
Technical Paper

Sponsor

Your Award-Winning Cored Wire
Our industry-leading, award-winning range of flux-cored wire solder solutions meet the diverse needs of both manual soldering, and rework and robotic soldering applications.
Indium Corporation

Reliable Nickel-Free Surface Finish for High-Frequency-HDI PCB
In this paper, assemblies involving this nickel-less novel surface finish have been subjected to extended thermal exposure, then intermetallics analyses.
Technical Paper

How AI can Accelerate R&D for Solder Paste Formulations
In this study, AI was used to predict the results of the key characteristics to better select the choice of formulas, to understand the relationship between molecules and to spend time on other aspects of the developments. To be able to exploit AI data in a relevant way, we highlight that the input database itself is crucial to generating reliable output data.
Technical Paper

Sponsor

Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
KYZEN

Cure for the Grape Effect
We are processing lead-free boards with large components. Our parts are showing the grape effect. What is the best solution for this?
Board Talk

5 vs 8-Zone Ovens
We are setting up an assembly line for small line production. We prefer a 5-zone oven. Will five zones be enough to ensure a reliable reflow process?
Board Talk

Aerosol Jet Printing SIR Patterns on Real World Components
In this study, aerosol jet printing, an additive manufacturing technology for electronics, was used to manufacture surface insulation resistance (SIR) test structures that were tested in the ability to detect cleanliness defects and provide stable results when none are present, as well as their survivability to standard electronics wash processes.
Technical Paper

Sponsor

What Would You Ask Proven Global Manufacturing Leaders?
In this 4-part series we asked about: Key Drivers of Success, Scaling Operations Effectively, AI in Manufacturing, and Tools to Empower Operations. No registration Required.
Intraratio

Tin Flakes/Splashes in SMT
An increasing of electrical shorts reported in several testers was noticed. Initially, it was found than more of the 80% of the shorts corresponding to thin metal flakes/splashes.
Technical Paper

Top 5 BGA Rework Challenges to Overcome
As BGA component package dimensions continue to get thinner more are being used in handheld device applications. The challenges of BGA rework is discussed.
Technical Paper

Sponsor

Cut Costs and Waste with Smarter Component Reuse
Discover how salvaging and reusing high-value electronic parts can significantly reduce costs while supporting more sustainable operations.
Circuit Technology Center

Combined Alloy and Flux Approach Cost-Effective Reliable Solder Joints
This paper shows alloy and flux properties as well as temperature cycle test results comparing SAC305 and Innolot® solder pastes.
Technical Paper

Latest Industry News

Samsung Reports Record Quarterly Profit on AI Boom

Apple shares sink on report of foldable iPhone delays

Can We Reshape PCB Quality? Perhaps with Automated Micro-Sectioning

The PC Brand With The Highest Customer Satisfaction Rating Isn't Apple

From Defect Images to Die Prediction: How Intel Is Scaling AI in Advanced Manufacturing

MORE INDUSTRY NEWS

Sponsor

Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond

Sponsor

Latest 3D AOI System from Viscom
iS6059 PCB Inspection Plus. Its new and faster sensor technology, data processing and analysis functions all stand for the best 3D AOI performance that meets the highest requirements.
Viscom

"My calender is way overbooked and I'm three months behind in my work -- I don't have time to attend a time management seminar!"
Copyright © Randy Glasbergen