Gooey Flux Residue Left Behind
After selective soldering connectors there is a small amount of no-clean flux residue left behind. How can I judge how much flux residue can be left behind?
Board Talk
|
|
Ultra Low Profile Copper Foil for Very Low Loss Material
A new almost no profile copper foil has been developed to achieve this property while maintaining a good adhesion with low loss resins. Electrodeposited copper foil production is divided in two steps. First, the foil is plated on a titanium drum from a copper sulfate solution. Then a treatment is applied to increase roughness and ensure oxidation resistance.
Technical Paper
|
|
| Sponsor |
|
Plasma Etch PE-Avenger
The PE-Avenger is an ultra low-cost entry level plasma cleaning system allowing more labs to utilize plasma. It's a low frequency plasma cleaner designed for surface activation and organics removal.
Plasma Etch
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| Sponsor |
|
AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
|
|
|
|
|
|
|
|
| Sponsor |
|
TIM1 for EV Battery Thermal Management
AIT's thermal adhesives, grease-gels, & gum-pads offer proven thermal dissipation for a balance of strength, rework ability, & recyclability of EV battery packs.
AI Technology, Inc.
|
|
Can High Particle Concentrations Impact PCB Assembly?
At our SMT facility we currently control ambient temperature, relative humidity and particle count. Is particle count a good parameter to control? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this question.
Board Talk
|
|
|
|
| Sponsor |
|
Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
ECD
|
|
|
|
