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AI Void Detection - X-Ray Inspection
X-ray Inspection for hidden and buried solder joints. BGA, QFN, THT, and more. High Speed and High Resolution configurations available.
Test Research, Inc.
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From Slave to Master: flexible ISM integrations
ESSEGI AUTOMATION's ISM software integrates with 250+ brands, connecting ERP, MES, WMS, Pick & Place and X-Ray systems. Flexible logic allows it to operate as master or slave in any production flow.
Essegi Automation
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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Wet-Based vs. Dry-Based Cleaning
For automatic under-stencil cleaning there are many cleaning methods. What factors should we consider to select wet based cleaning versus dry based cleaning?
Board Talk
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Modeling a SMT Line to Improve Throughput
With tools to model a large quantity of products and the impact of SMT line configurations, an electronics assembly plant can be analyzed to identify improvement opportunities.
Technical Paper
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SEHO makes production lines smarter
Improve your work flow and reduce manufacturing costs with creative ideas and innovative solutions for automation, board handling and material management.
SEHO Systems GmbH
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Connector Bowing During Reflow Process
I have a connector that is bowing during lead-free soldering. When the connector is put through an oven on its own no bowing takes place. What is causing this?
Board Talk
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Precision Control for BGA Rework
Vacuum sensing electronics provide control for gentle, automatic component removal while a non-contact site cleaning tip's height is accurately monitored and maintained.
Air-Vac Engineering
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