Optimizing Cleaning Strategies for Advanced Packaging Technologies
The study will utilize various test vehicles with low standoff components, using both No-clean and Water-soluble solder formulations. Two aqueous-based cleaning agents will be evaluated, and cleanliness assessed through visual inspection, SIR, and IC testing following IPC standards.
Technical Paper
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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
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Reduction of Condensate Residues in the Reflow Process
Increased electronics manufacturing results in an increased amount of condensate residue. The problem is not only to meet the increased cleaning requirements with increasing production, it is much more the absence of knowledge about the condensate residue formation process and how this residue can be minimized and inhibited in its formation.
Technical Paper
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Solder Performance and Reliability Assurance (SPRA) Project
The performance specification of solder requires that any solder being considered meet assembly requirements as well as the interconnects formed with the solder survive specified mechanical shock, thermal cycle, and vibrations environment conditions.
Technical Paper
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Let our contract cleaning services help
If you have a technical cleaning question, or if you are facing process challenges or performance challenges, use this technical hotlist form to get help from a KYZEN Technical Care Expert.
KYZEN
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Enhance Your Hands-On Soldering Skills
Learn how IPC certified training workshops for operator and trainer levels can advance skills and knowledge of your personnel for TH and SMT assembly.
BEST Inc.
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Risks Using Flux Only for Soldering BGAs
What are the risks using flux only versus solder paste for placing BGAs in a hybrid lead-free environment? Why would you only use flux, why not solder paste?
Board Talk
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Handheld Plasma Activation
Plug it in and start cleaning; no gas hookup! Versatile all-in-one solution you can take anywhere and activate almost anything in seconds! Learn more.
Plasma Etch
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Gooey Flux Residue Left Behind
After selective soldering connectors there is a small amount of no-clean flux residue left behind. How can I judge how much flux residue can be left behind?
Board Talk
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