Electronics Manufacturing and Electronics Assembly

Sponsor

100+ Breakthrough Repair/Rework Guides Illustrated and Online
Free online guidebook, packed with detailed illustrations, will be helpful to anyone who needs to repair or rework circuit board assemblies to IPC standards.
Circuit Technology Center

Technical Papers

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

Understanding Solder Dross: Causes and Control Strategies

MORE TECHNICAL PAPERS

Ask the Experts

Solder Balling Prediction Formula

Dendritic Growth and Contamination at BGA Sites

Removal of Coatings from PCBs

LED Component Shift During Reflow

Initial Screen Print Test Board

Depaneling circuit board that contain BGA components

Legend Marking Discoloration

Conformal Coating Bubbles

MORE ASK THE EXPERTS

Unlocking The Mystery of Aperture Architecture for Fine Line Printing
This paper covers issues of printing for challenging area ratio components and their associated aspect ratio will be investigated.
Technical Paper

Effect of Encapsulation Materials on Tensile Stress
In this paper FEA modeling was performed to observe stress-strain behavior of solder joints during thermal expansion for various potting materials.
Technical Paper

Sponsor

McDry Ultra-Low Humidity Storage Cabinets
McDry dry cabinet for MSL components and desiccators provide optimal ultra-low humidity and moisture-proof storage for IC packages.
Seika

Trouble With Skewed DPAK Components
We are having trouble with surface mount DPAC components skewing during reflow. We checked our profile and tried a diagonal hatch aperture.
Board Talk

Durable Conductive Inks for Robust Printed Electronics
Polymer Thick Film based printed electronics has improved in durability and is now a proven alternative to copper circuitry in many applications.
Technical Paper

Void Reduction in Bottom Terminated Components Using Vacuum Assist
Paper offers results of void experiments using an in-line convection reflow oven and three types of bottom terminated components.
Technical Paper

Sponsor

5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.

Improving properties of a Lead-free Solder Alloy with Doping of Copper
This paper reviews 3 lead-free solder alloys to assess the mechanical and thermal cycle properties by implementing drop tests and thermal cycle tests.
Technical Paper

Challenges for Selecting Appropriate TIM2 Material for CPU
This paper provides a methodology for a potential TIM2 material for applications including automotive, personal computers and internet of things.
Technical Paper

Sponsor

How pH Cleaning Agents Affect Production Performance
Establishing a reliable cleaning process requires a good understanding of all influencing factors, including pH, and defining the correct balance to meet final product reliability.
KYZEN

Minimum Lead to Lead Spacing for Wave Soldered Through-Hole Components
What is the recommended minimum lead-to-lead spacing for through-hole components run through a wave soldering system? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their own suggestions.
Board Talk

Moisture Barrier Bag Issues
Moisture sensitive chip components have been exposed to the atmosphere beyond specification. Can they be packaged and sealed with desiccant?
Board Talk

Effects of Substrate Material and Package Pad Design on Solder-Joint Reliabilty
This paper describes work to improve the solder-joint reliability (SJR) of a 0.8mm pitch, 25mm body BGA package used in automotive under-the-hood applications.
Technical Paper

Sponsor

Beat Rising Silver Prices with AIM REL61
With silver at historic highs, there’s never been a better time to switch. Reduce material costs significantly while maintaining the reliability your applications demand.
AIM Solder

Bi-Based Solders for Low Temperature to Reduce Cost and Improve Yield
The use of BiSnbased solder paste improves the BGA solder joint yield relative to SAC based solder pastes during low temperature reflow soldering.
Technical Paper

Reliability of Polymeric Encapsulation Materials on SnAgCu Solder Joints
This study determined the processability, mechanical and temperature cycle reliability of SAC BGA solder joints reinforced by encapsulation using SJEMs.
Technical Paper

Sponsor

Macurco Doubles Output with Manncorp
Scaled fast. Improved speed and quality. Full control of SMT production in under a year—with no prior in-house experience. See how Manncorp helped Macurco make it happen.
Manncorp Inc.

Effect of Fine Lead-Free Solder Powder on the Reflow Property Pastes
This paper evaluates the effect of particle size distribution and oxidation on the reflow performance of solder paste.
Technical Paper

Latest Industry News

Industry Intelligence Insights February 2026

VIEWPOINT 2026: Przemysław Prolejko, CEO, Assel Electronics Manufacturing Services

Alphabet resets the bar for AI infrastructure spending

Gartner Forecasts Worldwide IT Spending to Grow 10.8% in 2026, Totaling $6.15 Trillion

IBM, Synopsys Move Toward 1.4-nm Node with Heat-Modeling Tech

MORE INDUSTRY NEWS

Sponsor

Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron

Sponsor

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS