Electronics Manufacturing and Electronics Assembly

Sponsor

Low Thermal Resistance Epoxy
Master Bond EP53TC is a thermally conductive, electrically insulating adhesive that combines good physical properties and the ability to transfer heat rapidly and effectively.
Master Bond

Technical Papers

Flux-Free, Reliable, Efficient: Soldering with Formic Acid

Redesigning Material Logistics for High-Mix EMS Production

Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education

Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

MORE TECHNICAL PAPERS

Ask the Experts

Reliability Concerns When Converting to Lead-free

Contamination Using Solvent Dispensers

Mixed Process Solder Joint Appearance, Smooth or Grainy?

What Caused SMT Pads to Oxidize After Reflow

Viscosity of Solder Paste Before Printing

Solder Splashing During Wave Soldering

ENIG Solderability Issues

Solder Paste Mixing

MORE ASK THE EXPERTS

Safeguarding Electrical Components with Nano-coating Technology
This study validates the use of plasma-deposited nano-coating layers in protecting against environments that pose significant challenges to electronics.
Technical Paper

ENEPIG - How the Process Characteristics Influence the Layer Performance
This paper will focus on the comparison of pure Pd and PdP deposits and the interaction with the gold electrolyte type in use.
Technical Paper

Sponsor

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura

Can High Particle Concentrations Impact PCB Assembly?
At our SMT facility we currently control ambient temperature, relative humidity and particle count. Is particle count a good parameter to control? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this question.
Board Talk

Utilizing an Alternative Solder Paste to Improve the PCB Assembly Process
Results from an investigation that studied and characterized a novel lead-free solder paste as compared to traditional solder materials will be presented.
Technical Paper

Effect of Temperature and Stressing on Low Temperature Solder BGA Drop Performance
Simultaneous temperature and current stressing affect the performance of LTS BGA solder joints in drop testing, with increased temperature and current level showing larger impacts.
Technical Paper

Sponsor

iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom

Atmospheric Plasma Surface Engineering of Printed Circuit Boards
Plasma treatment increases the adhesion strength of the conformal coatings through the removal of organic contaminants and surface activation.
Technical Paper

Overcome Nodules and Scratches on Wire Bondable Plating on PCBs
Manufacturing was improved to minimize nodules and scratches. Wire bonds were evaluated to determine the allowable size of nodules and scratches.
Technical Paper

Sponsor

Reimagined EOS/ESD Symposium 2026
Experience the enhanced EOS/ESD Symposium with expanded learning, collaboration, and industry connections. Join experts exploring challenges and solutions in EOS/ESD control. September 28-30.
EOS/ESD Association

Trouble With Skewed DPAK Components
We are having trouble with surface mount DPAC components skewing during reflow. We checked our profile and tried a diagonal hatch aperture.
Board Talk

Minimum Lead to Lead Spacing for Wave Soldered Through-Hole Components
What is the recommended minimum lead-to-lead spacing for through-hole components run through a wave soldering system? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their own suggestions.
Board Talk

Non-Contact Measurement of Conformal Coating Thickness
Conformal coating is designed to provide protection and long-term reliability to printed circuit boards (PCB) in harsh environments where high humidity, high temperature, corrosive gases, or salt spray may be present. This study aims to highlight the application of chromatic confocal microscopy (CCM), an optical technique used to characterize 2D/3D surfaces.
Technical Paper

Sponsor

Need Improved Solder Joint Visibility?
Solder Peel-A-Wayš Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.

Ultra-Low Voiding Halogen-Free No-Clean Lead-Free Solder Paste
The miniaturization trend is driving components with large pads. To alleviate the voiding challenge, a voiding-free solder paste will be the solution.
Technical Paper

3D Aerosol Jet Printed Interconnects on Bare Die
Aerosol Jet Printing can provide many enhancements over traditional bare die attachment techniques. Previous studies have shown that AJ technology offers advantages in the millimeter wave frequency range, such as a significant reduction of insertion loss and the ability to design the line impedance as required.
Technical Paper

Sponsor

Reliable drying of UV materials
Rehm Thermal Systems launches the RDS UV dryer to meet faster hardening demands, enabling efficient, eco-friendly UV coating for electronics and various industries.
Rehm Thermal Systems

Additive Manufacturing-Enabled Wireless Flexible Hybrid Electronics
This paper reports an ensemble of strategies for the successful miniaturization of EEG in a fully-flexible, wearable and wireless platform.
Technical Paper

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What Robotics Companies Think About the U.S. Foreign Robot Ban

Inside Europe's Push for Electronics Resilience: Five Questions with... Alison James

Texas hits pause on 1,800 data center projects to scrutinize power and water demands

China draws up safety rules for autonomous vehicles

Customer Experience Is a Different Game Now. Most Companies Are Still Playing the Old One.

MORE INDUSTRY NEWS

Sponsor

The Battle for Space Superiority Has Begun
The next conflict may begin in orbit. Learn why resilient space systems and advanced manufacturing matter more than ever.
Summit Interconnect

Sponsor

Start Micro Dispensing Today
The DL Micro Valve is specifically designed for dispensing micro volumes of material in precise, repeatable patterns. Learn more about the DL Micro Valve.
DL Technology