Electronics Manufacturing and Electronics Assembly

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Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.

Technical Papers

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

Understanding Solder Dross: Causes and Control Strategies

MORE TECHNICAL PAPERS

Ask the Experts

Pick and Place Machine Calibration

Components Falling Off During Reflow

Solder Balling Prediction Formula

Dendritic Growth and Contamination at BGA Sites

Removal of Coatings from PCBs

LED Component Shift During Reflow

Initial Screen Print Test Board

Depaneling circuit board that contain BGA components

MORE ASK THE EXPERTS

Young Laplace Equation Reveals New Possibilities Thermal Pad Design
This paper shows how the application of the Young-Laplace equation can lead to an understanding of the soldering process of exposed pads and heat slugs.
Technical Paper

Effect of SMT Component Package Design on Cleaning Effectiveness
This paper will discuss the "physics" of liquid entrainment / entrapment / cleaning / rinsing and their effects on component materials.
Technical Paper

Sponsor

AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS

Requirements for Depaneling and Rescoring Boards with BGA Components
Are there any special requirements for depaneling and rescoring separate panel circuit boards if they contain BGA components?
Board Talk

Contamination and Risks Related to ESD Gloves and Finger Cots
Choosing a protective glove for the production floor is a critical decision and all variable need to be considered.
Technical Paper

Investigation Into the Durability of Stencil Coating Technologies
Paper addresses durability of coatings in relation to the number of print cycles and underside wipe cycles and materials used on the underside wipe process.
Technical Paper

Sponsor

Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
ECD

Can High Particle Concentrations Impact PCB Assembly?
At our SMT facility we currently control ambient temperature, relative humidity and particle count. Is particle count a good parameter to control? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this question.
Board Talk

Conformal Coatings in Preventing Resistor Silver Sulfide Corrosion
The evaluation of conformal coatings to mitigate silver sulfide corrosion of thick film resistors is discussed.
Technical Paper

Sponsor

Prototyping to High-Speed Production
From first builds to 22,000 CPH, Manncorp pick & place machines scale with your budget, space, and output goals—so your line grows as you do. Backed by lifetime support.
Manncorp Inc.

Improve SMT Yields Using Root Cause Analysis in Stencil Design
Paper covers SMT challenges including practical stencil design recommendations to eliminate defects and improve yields during the printing process.
Technical Paper

Unlocking The Mystery of Aperture Architecture for Fine Line Printing
This paper covers issues of printing for challenging area ratio components and their associated aspect ratio will be investigated.
Technical Paper

Effect of Encapsulation Materials on Tensile Stress
In this paper FEA modeling was performed to observe stress-strain behavior of solder joints during thermal expansion for various potting materials.
Technical Paper

Sponsor

"Ask the Experts" Program by Circuitnet
Do you have a question or process issue in PCB assembly? The Circuitnet "Ask the Expert's" program has over 100 panel members waiting to answer your question. Submit question now.
Circuitnet Media LLC

Trouble With Skewed DPAK Components
We are having trouble with surface mount DPAC components skewing during reflow. We checked our profile and tried a diagonal hatch aperture.
Board Talk

Durable Conductive Inks for Robust Printed Electronics
Polymer Thick Film based printed electronics has improved in durability and is now a proven alternative to copper circuitry in many applications.
Technical Paper

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Fast PCBs, Fully Assembled
Need it fast? Summit delivers quick-turn PCB fabrication and assembly on compressed timelines—no shortcuts, just speed and precision from one source.
Summit Interconnect

Void Reduction in Bottom Terminated Components Using Vacuum Assist
Paper offers results of void experiments using an in-line convection reflow oven and three types of bottom terminated components.
Technical Paper

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Start Micro Dispensing Today
The DL Micro Valve is specifically designed for dispensing micro volumes of material in precise, repeatable patterns. Learn more about the DL Micro Valve.
DL Technology

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Plasma Clean, Etch and RIE in One Machine
The PE-100 convertible allows you to perform plasma cleaning, isotropic etching and reactive ion etching(RIE) in the same system!
Plasma Etch