Electronics Manufacturing and Electronics Assembly

Sponsor

SMT Line Builder Tool – Fast & Easy
Skip the guesswork. Our SMT Line Builder gives you instant, expert-recommended setups based on your budget and output. Or send us your BOM—we'll handle it.
Manncorp Inc.

Technical Papers

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

Understanding Solder Dross: Causes and Control Strategies

MORE TECHNICAL PAPERS

Ask the Experts

Dendritic Growth and Contamination at BGA Sites

Removal of Coatings from PCBs

LED Component Shift During Reflow

Initial Screen Print Test Board

Depaneling circuit board that contain BGA components

Legend Marking Discoloration

Conformal Coating Bubbles

Stainless Steel Benches and ESD

MORE ASK THE EXPERTS

Void Reduction in Bottom Terminated Components Using Vacuum Assist
Paper offers results of void experiments using an in-line convection reflow oven and three types of bottom terminated components.
Technical Paper

Improving properties of a Lead-free Solder Alloy with Doping of Copper
This paper reviews 3 lead-free solder alloys to assess the mechanical and thermal cycle properties by implementing drop tests and thermal cycle tests.
Technical Paper

Sponsor

Seven Facilities, One Trusted Source
Partner with the industry leader. Summit is trusted and proven, with 7 integrated facilities to load capacity—from fast-turn prototypes to scalable production requirements.
Summit Interconnect

Challenges for Selecting Appropriate TIM2 Material for CPU
This paper provides a methodology for a potential TIM2 material for applications including automotive, personal computers and internet of things.
Technical Paper

Minimum Lead to Lead Spacing for Wave Soldered Through-Hole Components
What is the recommended minimum lead-to-lead spacing for through-hole components run through a wave soldering system? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their own suggestions.
Board Talk

Moisture Barrier Bag Issues
Moisture sensitive chip components have been exposed to the atmosphere beyond specification. Can they be packaged and sealed with desiccant?
Board Talk

Sponsor

EZ-FLO High Precision Ceramic Dispense Tips
The ceramic molding process allows for smaller more precise inner diameters with a glass-like finish, giving you the ultimate control. Learn more.
DL Technology

Effects of Substrate Material and Package Pad Design on Solder-Joint Reliabilty
This paper describes work to improve the solder-joint reliability (SJR) of a 0.8mm pitch, 25mm body BGA package used in automotive under-the-hood applications.
Technical Paper

Bi-Based Solders for Low Temperature to Reduce Cost and Improve Yield
The use of BiSnbased solder paste improves the BGA solder joint yield relative to SAC based solder pastes during low temperature reflow soldering.
Technical Paper

Sponsor

Discover the power of vAI ProVision from Viscom
Create and optimize 3D AOI and AXI programs in minutes. vAI ProVision boosts inspection depth, quality, and speed. Viscom develops & produces premium inspection systems.
Viscom SE

Reliability of Polymeric Encapsulation Materials on SnAgCu Solder Joints
This study determined the processability, mechanical and temperature cycle reliability of SAC BGA solder joints reinforced by encapsulation using SJEMs.
Technical Paper

Effect of Fine Lead-Free Solder Powder on the Reflow Property Pastes
This paper evaluates the effect of particle size distribution and oxidation on the reflow performance of solder paste.
Technical Paper

Can Silver Cause Solder Embrittlement?
A few of our components have leads with a silver finish. Will silver cause solder embrittlement? Is removal of silver needed or can it be soldered using 63/37 solder? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this question and scenario.
Board Talk

Sponsor

Reclaim Your Factory's Future
Space is a precious resource. With SELECT Synchro, reclaim it, and reimagine your factory's workflow for greater efficiency and scalability.
Nordson Electronic Solutions

3D Printed Electronics for Printed Circuit Structures
This paper shows working demonstrations of printed circuit structures, the obstacles, and the potential future of 3D printed electronics.
Technical Paper

Semi-Additive Process for High Frequency Signal Substrates
A new SAP process for low loss build-up materials with low desmear roughness and excellent adhesion at various processing conditions is covered.
Technical Paper

Sponsor

How to Simplify Solder Paste Printing
StikNPeel removable rework stencils simplifies selective printing of solder paste leaving no residue providing cleaner alternative to metal stencils.
BEST Inc.

Effect of Thermal Cycling on Subsequent Drop Behavior of Assemblies
This paper presents the effect of a priori thermal cycle on subsequent drop to failure behavior of CGAs with 1272 columns.
Technical Paper

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Sponsor

SAWA SC-BM500E Automatic Stencil Cleaner
Ultrasonic combined with spray cleaning provides an excellent solution for all kinds of applications including wafer bump and electroform stencils.
Seika

Sponsor

High power atmospheric plasma system
Our 1000 Atmospheric Plasma System is available with PC or PLC control for lab or high speed production use with the same high powered systems. Remove contaminants and increase bond strength!
Plasma Etch