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Our Solutions
Discover Essegi Automation's modular solutions: flexible hardware and software seamlessly integrated into SMT and THT environments.
Essegi Automation
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How AI can Accelerate R&D for Solder Paste Formulations
In this study, AI was used to predict the results of the key characteristics to better select the choice of formulas, to understand the relationship between molecules and to spend time on other aspects of the developments. To be able to exploit AI data in a relevant way, we highlight that the input database itself is crucial to generating reliable output data.
Technical Paper
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Cure for the Grape Effect
We are processing lead-free boards with large components. Our parts are showing the grape effect. What is the best solution for this?
Board Talk
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5 vs 8-Zone Ovens
We are setting up an assembly line for small line production. We prefer a 5-zone oven. Will five zones be enough to ensure a reliable reflow process?
Board Talk
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EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
DL Technology
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Aerosol Jet Printing SIR Patterns on Real World Components
In this study, aerosol jet printing, an additive manufacturing technology for electronics, was used to manufacture surface insulation resistance (SIR) test structures that were tested in the ability to detect cleanliness defects and provide stable results when none are present, as well as their survivability to standard electronics wash processes.
Technical Paper
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Tin Flakes/Splashes in SMT
An increasing of electrical shorts reported in several testers was noticed. Initially, it was found than more of the 80% of the shorts corresponding to thin metal flakes/splashes.
Technical Paper
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Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering
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Top 5 BGA Rework Challenges to Overcome
As BGA component package dimensions continue to get thinner more are being used in handheld device applications. The challenges of BGA rework is discussed.
Technical Paper
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What Causes Solder Balls During Hand Soldering?
To many operators believe the old myth that flux is your friend and you can never have to much flux. That is not true as to much flux will outgas at the end of the hand soldering process creating solder balls around the connection. This is one possible explanation as others have stated other causes as well.
Board Talk
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Unlock the Potential of Salvaged Devices
Component harvesting is a reliable method of electronic component reclamation, reducing e-waste and ensuring economic reuse for automated assembly.
BEST Inc.
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Malcom Paste Mixers
Unlike hand mixing, the Malcom SPS Solder Paste Mixer is a non-contaminating mixer which utilizes pseudo planetary motion to stir the solder paste. The SPS-1 provides uniform consistency.
Seika
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