circuit insight
Surface Treatment Enabling Low Temperature Soldering to Aluminum
An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on Polyester (Al-PET) substrates.
Technical Paper
What Causes Solder Balls During Hand Soldering?
To many operators believe the old myth that flux is your friend and you can never have to much flux. That is not true as to much flux will outgas at the end of the hand soldering process creating solder balls around the connection. This is one possible explanation as others have stated other causes as well.
Board Talk
Sponsor
Master-Bond

Thermally Conductive, Low Outgassing Epoxy
Master Bond EP21AOLV-2LO is an electrically insulating adhesive that meets NASA low outgassing requirements for sealing, coating and encapsulation applications. Ask an expert.
Master Bond
Tin-Bismuth Low Temperature Solder Electromigration Behavior
This paper reviews results reported from accelerated testing compared with cross-sectional results from components on functional systems with known time in service.
Technical Paper
Low Melting Temperature Solder Interconnect Thermal Cycling Performance
Sn-Bi based low melting temperature solder interconnects with elemental tuning presents enhanced interconnect solder joint thermo-mechanical performance.
Technical Paper
Evaluation of Reliability using Autocatalytic Silver Bath on ENEP Layer
It was confirmed that ENEPES with a Ag thickness of 0.3 μm had good reliability both for the solder joint and Ag sintering joint.
Technical Paper
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
3P Production Preparation Process
A Lean Manufacturing methodology is presented as a standardization tool where teams work for the process design of production lines and manufacturing systems.
Technical Paper
The Importance of Conformal Coating Thickness and Edge Coverage
The performance of new silicone and urethane materials, designed for coverage and thickness, is compared with an acrylic and ultra-thin material.
Technical Paper
Sponsor
Nordson-ASYMTEK

actnano Materials with Nordson Equipment
actnano's PFAS-free, cure-free coatings save energy and boost safety. And they are compatible with Nordson conformal coating systems. Upgrade your system today. Learn more!
Nordson Electronic Solutions
Intrusive Soldering Through-Hole Connector
We are SMT soldering a through-hole PC 104 connector. We have tried preforms and are unable to get all of the pins soldered. Phil Zarrow and Jim Hall, The Assembly Brothers, share their own suggestions in this scenario.
Board Talk
Impact of Pb-free Solder Alloy Mixing on Solder Joint Integrity Using BGAs
An investigation was conducted to assess the solder joint integrity (acceptable/nonacceptable) for three different solder alloys on ball grid arrays (BGAs) in a mixed metallurgy configuration as compared to a baseline SAC305 system. Thermal cycle testing using a -55 to +125 ºC range in accordance with the IPC-9701 specification was used.
Technical Paper
How to Cost a Board
My boss has asked me to provide a cost matrix so we can quickly quote labor machine time component for the SMT board assembly.
Board Talk
Sponsor
Manncorp

Keeley Pedals Perfected with Manncorp
Keeley Electronics revolutionizes production with Manncorp pick & place machines, achieving unprecedented speed, precision, and innovation in the guitar pedal industry.
Manncorp Inc.
Increased Reliability of Quad Flat No Lead Wettable Flank Connections
The focus of this study is to investigate the reliability of the immersion tin layers plated by a tailored immersion tin process for QFN flank plating.
Technical Paper
Breakthrough Technology to Improve X-Ray results
The paper contains comparison data from Nano Focus tube, plus data from reliability and stability tests using a real-life system and not test rigs.
Technical Paper
Sponsor
Viscom

Discover the power of vAI ProVision from Viscom
Create and optimize 3D AOI and AXI programs in minutes. vAI ProVision boosts inspection depth, quality, and speed. Viscom develops & produces premium inspection systems.
Viscom
Implementing Automation and Ai for Electronic Card Assembly
AI solutions could be integrated into the automation process to further improve the production operation. This paper discusses the challenges in implementation.
Technical Paper
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Plasma-Etch
Sponsor
DL-Technology

Micro Dispensing Technology White Paper
The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size.
DL Technology
kyzen
Sponsor
Glenbrook-Technologies

Refurbished and Demo X-ray Inspection Systems
2024 Demo JewelBox-70T X-ray System and 2024 Demo JewelBox-100T X-ray System Refurbished & Demo Systems on sale with warranty. Learn more.
Glenbrook Technologies
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