Electronics Manufacturing and Electronics Assembly

Sponsor

Turnkey Lines: In-Stock & Ready
In-stock, fully integrated SMT lines with Manncorp's U.S.-based support. Skip the wait, cut lead times, and get your operation producing sooner.
Manncorp Inc.

Technical Papers

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

MORE TECHNICAL PAPERS

Ask the Experts

Solder Balls During Selective Soldering

Concerns Replacing High Speed Components with No-Clean Solder

How to Remove Oxidization from SMT Component Leads?

Solder Ball Wrinkles

Assembly Question for Soldering USB Connectors

BGA Die and Pry Testing

Rise of Bismuth Levels in our Solder Pots

Inspection for Hidden Solder Joints

MORE ASK THE EXPERTS

Thermal Cycle Fatigue Life of Low-Temperature Solders
Thermal cycling fatigue is one of the main reliability concerns for solder. For the introduction of low temperature solders with reflow peak temperatures below 200℃, their thermal cycle fatigue life must be characterized. This paper presents a multiple component type test and time to failure data for solder interconnects formed with low temperature solders for BGAs, QFNs, and SMR component types.
Technical Paper

Optimize the Dispensing Process with True 3D Inspection
The journey toward zero defects in dispensing is challenging but achievable. True 3D inspection technology has have emerged as a powerful ally in this quest to ensure the highest quality levels.
Technical Paper

Sponsor

What Would You Ask Proven Global Manufacturing Leaders?
In this 4-part series we asked about: Key Drivers of Success, Scaling Operations Effectively, AI in Manufacturing, and Tools to Empower Operations. No registration Required.
Intraratio

Voids in SMT Solder Joints – Trends in Automotive Electronics
There is a need for a more extensive coverage of voiding in standards where customer specifications often contain requirements for voiding in SMT solder joints.
Technical Paper

Connector Bowing During Reflow Process
I have a connector that is bowing during lead-free soldering. When the connector is put through an oven on its own no bowing takes place. What is causing this?
Board Talk

Seeking Alternatives to Solvent Cleaning
We are using a mix of trichloroethylene and IPA for cleaning in the ratio of 10 to 90. We are looking to eliminate the use of trichloroethylene.
Board Talk

Sponsor

Reduce Electronics Costs with Strategic Component Recovery
Recovering valuable electronic components can help manufacturers lower expenses, minimize waste, and extend the life of critical inventory. Learn practical methods.
Circuit Technology Center

Conformal Coatings - New Solutions to Existing Problems
This paper describes work carried out by Humiseal to investigate root causes of these problems, and to introduce materials with improved performance.
Technical Paper

Effects of Mixing Solder Sphere Alloys with Bismuth-Based Pastes
In this paper, the effect of mixing solder sphere alloys with Bi-based solder pastes on the component reliability in accelerated thermal cycling is studied.
Technical Paper

Sponsor

High-Reliability for Low-Temp Processes
Durafuse® LT low-temp, high-rel solder paste is bismuth-free, reduces warpage in large BGAs, enhances thermal cycling, drop shock reliability and reduces energy use up to 15%.
Indium Corporation

Hot Air BGA Rework with a Touchless Temperature-Dependent Process
The goal of this paper is to share complex rework process improvements to review and consider how incorporating into their practice can provide benefit.
Technical Paper

Solder Joint Performance Under Shock for ENIG and ENEPIG Surface Plated Tester
This paper discusses the results of a comparative study for solder joint performance - under shock - for ENIG and ENEPIG surface plated tester PCBs.
Technical Paper

Improving Efficiency of Through-Hole PCBAs
We are trying to improve the efficiency of the through-hole of our mixed tech, surface mount through-hole PCBAs. What are our options?
Board Talk

Sponsor

Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
ECD

Materials for Advanced Ball-Attach Processes for Advanced Packages
This paper will discuss advantages of advanced ball-attach materials developed to meet the challenges of advanced packaging.
Technical Paper

Measuring the Impact of Test Methods for High-Frequency Circuit Materials
How can two different test methods provide Dk measurement that are different? When the methods measure the same circuit material in two different directions.
Technical Paper

Sponsor

More than just hot air
Rehm's Vision series Convection Soldering Systems ensure reliable, high-quality electronics production by using precise heat transfer and customizable options for maximum efficiency.
Rehm Thermal Systems

Sustainability is Key for Material and Chemistry Choices
OEMs have started adopting sustainable materials and chemistry technologies for their electronics as a part of better ESG score rankings. Sustainability is becoming a key parameter for material and chemistry choices for the next generation electronics. The use of non-toxic options are being evaluated and preferred.
Technical Paper

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Sponsor

iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE

Sponsor

Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.