Electronics Manufacturing and Electronics Assembly

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Is your PCB surface finish surviving the wash?
Aqueous cleaning can stain or strip ImSn, ImAg & ENIG finishes. Get test data on protecting surface finish integrity post-reflow.
ZESTRON Americas

Technical Papers

Flux-Free, Reliable, Efficient: Soldering with Formic Acid

Redesigning Material Logistics for High-Mix EMS Production

Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education

Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

MORE TECHNICAL PAPERS

Ask the Experts

Coils Rotated After Reflow

Stencil Pattern for Thermal Pads on QFNs

Component Shifting

What Is Causing Connectors to Bow?

Cleaning No-Clean Solder Paste

Solder Paste Alloy Check

Challenge Wetting Solder to Brass Pins

Class 3 Cleaning Requirements

MORE ASK THE EXPERTS

Novel Lead-Free Solder Alloys Based on Sn-Ag-Cu-Sb
In this work, thermal performance of five Sn/3.2Ag/0.7Cu/xSb (x is in the range of 4.5 to 6.5 wt.%) alloys were compared to select the optimized Sb content.
Technical Paper

How To Strip Tin-Lead Solder From SMT Pads for RoHS
Is it possible to scrub the pads of a PCB to bring it back into compliance? 63-37 solder was mistakenly used to hand solder parts.
Board Talk

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Removal/Milling of Underfilled Parts: AVX1000M
High precision milling with zero adjacent clearance. Auto laser height measurement of board and component. Learn more.
Air-Vac Engineering

Technical Cleanliness Assessments to Reduce Manufacturing Defects
This paper will detail a Contamination Assessment Protocol that conforms to the guidelines in VDA19 Part 2 which will not only enable areas with the highest risk of contamination to be targeted for improvement measures but will also provide documentary evidence of the effect of any such improvements.
Technical Paper

A New X-Ray Source Technology for Demanding SMT Inspection
The paper contains data and images from Nano Focus tube, plus data from reliability and stability tests using a real-life system and not test rigs.
Technical Paper

Assembly Optimization for Thin Flip-Chip Chip-Scale Packages
In this study, PC board design and solder stencil designs are evaluated for board attach defectivity for core-less FCCSP packages. It is observed that with properly engineered package materials and mechanical configuration, as well as optimization of PC board pad design, a robust board assembly solution exists for thin FCCSP packages.
Technical Paper

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Automation in Transition
The world of automation is changing. What does this mean for customers? And what impact is the transformation having on providers? Find out more from a panel of experts.
SCHUNK

Non-Toxic Stabilization for Mixed Reaction Gold
In this paper a novel gold electrolyte with autocatalytic properties is introduced. It is capable of depositing high layer thicknesses and defect-free ENIG deposits.
Technical Paper

Causes of Blowholes
Are old components such as resistors and circuit breakers more likely to cause blowholes during wave soldering compared to newer components?
Board Talk

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Latest 3D AOI System from Viscom
iS6059 PCB Inspection Plus. Its new and faster sensor technology, data processing and analysis functions all stand for the best 3D AOI performance that meets the highest requirements.
Viscom

Fluxless Reflow Technology for Fine-Pitch and SMT-Level Component Attach
The objective to be discussed in this paper is to determine a solution for component attach in a formic acid environment with the appropriate combination of soldering material and equipment.
Technical Paper

Beyond ECM Additional Reasons for Cleaning Circuit Assemblies
The level of importance of a clean circuit assembly has been demoted. How did the cleanliness of circuit assemblies, once required, get shoved aside?
Technical Paper

A Near-Eutectic Sn-Bi Low-Temp Alloy with Thermal Fatigue Resistance
This study reports a new near-eutectic Sn-Bi-based low-temperature solder alloy (Bi+) which can reflow between 165°C and 190°C.
Technical Paper

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EZ-FLO High Precision Ceramic Dispense Tips
The ceramic molding process allows for smaller more precise inner diameters with a glass-like finish, giving you the ultimate control. Learn more.
DL Technology

High Speed Transmission Characteristics on RDL Interposer
This paper presents the demonstration of RDL interposers with fine pitch firing and low loss dielectric layers.
Technical Paper

Removing Warpage from PCBAs
We have populated boards with components on both sides that are warped. Components are varied height. What methods can we use to flatten them? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss their recommendations.
Board Talk

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Precision BGA Rework Services for High-Reliability Electronics
Proven solutions for BGA replacement, reballing, site dressing, and repair that help restore functionality, improve reliability, and extend the life of assemblies.
Circuit Technology Center

Predicting Mid-Chip Solder Balling
Is there a calculation that can be used to predict solder balling? We would like to design our stencil apertures to ensure no mid-chip solder balls. The Assembly Brothers, Jim Hall and Phil Zarrow, discuss design suggestions to prevent solder balling.
Board Talk

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MORE INDUSTRY NEWS

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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura

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Low Outgassing, Glob Top Epoxy
Master Bond EP17HTND-CCM is a glob top epoxy that meets NASA low outgassing specifications and forms high strength bonds to a wide variety of similar/dissimilar substrates.
Master Bond

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