circuit insight
PCB Manufacturability and Reliability for Fine Pitch PCB Server Boards
This paper assesss PCB vendor drill registration capability and will also evaluate PCB reliability using electrochemical migration and via reliability testing.
Technical Paper
What is the Suggested Humidity Level for Electronics Assembly?
I am aware of the suggested humidity level for an electronics assembly facility. Do the same limits apply within a 100,000 class clean room?
Board Talk
Sponsor
Advanced-Interconnections

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
High Thermo-Mechanical Fatigue and Drop Shock Resistant Alloys
High-Ag, low-Ag: Which alloy fits best certain application? Here we present a report on the thermal and mechanical reliability of alloys.
Technical Paper
DRAM damage due to X-Ray Inspections Post PCB Assembly
This paper outlines several mitigation strategies for minimizing radiation dosage during X-ray inspections, particularly in the context of printed circuit boards (PCBs). One key observation is that the PCB itself acts as an effective shield, significantly reducing radiation exposure.
Technical Paper
Understanding and Prediction of Bi Electromigration
This paper will review an effort to describe the expected microstructures in use case settings as well as a model to predict effective Bi boundary layer conditions created during current stress. The estimates will be compared with actual accelerated samples and the impacts of the current stress plus thermal aging on solder joint mechanical performance.
Technical Paper
Sponsor
Circuit-Technology-Center

Don't Let Part Shortages Shut You Down
When critical components are hard to find, your production doesn't have to suffer. Discover proven methods for removing and requalifying components.
Circuit Technology Center
Managing Thermomechanical Behaviour in Automotive Electronics
With high density interconnection designs, advanced packaging, localised self heating, sources of thermomechanical stress are introducing complex failures.
Technical Paper
Cause of Long-Term Soldering Joint Cracking in Automotive Application
We are seeing field returns due to solder joint cracking on the pin of a 16-pin through-hole connector. What might be the cause of the joint cracking?
Board Talk
Sponsor
DL-Technology

Start Micro Dispensing Today
The DL Micro Valve is specifically designed for dispensing micro volumes of material in precise, repeatable patterns. Learn more about the DL Micro Valve.
DL Technology
Developing a Low Palladium Activation System for Electroless Copper Deposition
This paper summarizes experiences gained while developing a new cost effective Palladium containing ionic activation system.
Technical Paper
AI-Powered Real-Time Inspection for Electronic Component Assembly
This paper introduces enhancing the quality of electronic component assembly through real-time, inline inspection utilizing AI-powered deep learning techniques.
Technical Paper
Acid Copper Electroplating Processes for Flash Etching
The focus of this study was to investigate the underlying mechanism of V-pitting and to develop a process to withstand or resist the pitting.
Technical Paper
Sponsor
Uyemura

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
Solder Mask and Low Standoff Component Cleaning – A Connection?
For this study, the authors wanted to assess the impact of different solder mask options on under component cleanliness.
Technical Paper
Hand Soldering Reliability
What are the differences in reliability for SMT machine placement followed by reflow vs. hand placement followed by hand soldering in surface mount?
Board Talk
Sponsor
SEHO

You need clear soldering results?
The SEHO PowerVision AOI system is for fast, automated optical inspection. Designed for THT processes & focusses on 2 points: Continuous quality assurance & cost-efficient production processes.
SEHO Systems GmbH
Investigation of Copper Sinter Material for Die Attach
3 copper powders were tested for their feasibility to use as die attach material for pressure sintering process without prior treatment with reducing agents.
Technical Paper
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Glenbrook-Technologies
Sponsor
Indium-Corporation

The Industry Standard Solder Paste
Looking to Avoid the Void® and enhance SIR performance? Indium8.9HF is your proven, versatile and stable, no-clean, halogen-free, Pb-free solder paste solution.
Indium Corporation
Ormet-TLPS
Sponsor
Air-Vac-Engineering

High Precision Component Milling
Automatic Removal of Electronic Components including Residual Solder on Heat Sensitive Assemblies.
Air-Vac Engineering
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"I've been using the same computer since 1982. They can't replace it without violating the company's age discrimination policy."
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