Electronics Manufacturing and Electronics Assembly

Sponsor

TIM1 for EV Battery Thermal Management
AIT's thermal adhesives, grease-gels, & gum-pads offer proven thermal dissipation for a balance of strength, rework ability, & recyclability of EV battery packs.
AI Technology, Inc.

Technical Papers

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

MORE TECHNICAL PAPERS

Ask the Experts

Solution for Warped PCBAs

BGA Component Cleaning Spec

Tin Whiskers and Vapor Phase Reflow

Soldering Station Calibration

Solder Paste Stencil Inactivity

Solder Mask Thickness Tolerance

Question About ESD Ionizer Guns

Bottom Terminated Components and Vias

MORE ASK THE EXPERTS

Component Pressure Exposure Validation in An Inline Wash System
The purpose of this research is to measure what circuit cards and parts on those assemblies are exposed to during the wash and rinse process of inline cleaning.
Technical Paper

Limits for HASL with Complex Products
What are the limits for the future with more complex products? HASL and the actual HASL process, hot air solder leveling, has been with us since the mid-70s.
Board Talk

Sponsor

Simply Double the Production Volume
SEHO SelectLine features the award-winning Synchro and SmartSplit production modes that allow to halve cycle times in batch production and mixed operation. Find out more.
SEHO Systems GmbH

Copper Electrodeposition By Hydrogen Evolution Assisted Electroplacing
A technique called hydrogen evolution assisted electroplating, has shown enhancement to the deposition rate of copper compared to galvanostatic conventional electroplating methods.
Technical Paper

Value-Driven CFX Case Studies Supporting Smart Manufacturing
In this paper, two diverse examples are discussed, illustrating how the adoption of the Connected Factory Exchange (CFX) standard is changing manufacturing.
Technical Paper

Requirements for the Filler Material Solder Paste for Different Technologies
To date, filler materials based on solder pastes have been qualified for the respective technologies to meet the respective requirements. The article is intended to show which important requirements are necessary for the respective evaluation.
Technical Paper

Sponsor

Handheld Plasma Activation
Plug it in and start cleaning; no gas hookup! Versatile all-in-one solution you can take anywhere and activate almost anything in seconds! Learn more.
Plasma Etch

Technologies and Standards to Realize Smart Manufacturing
The future of manufacturing in the Electronics Industry is dependent on the ability to develop and deploy technology platforms to realize Smart Manufacturing and Industry 4.0.
Technical Paper

How To Prevent Mid-chip Solder Balls?
Is there a mathematical calculation that can be used to predict solder balling for a given package size?
Board Talk

Sponsor

EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
DL Technology

In-Line Testing of Highly Panelized PCBAs with Parallel Functional Test
The manufacturing process challenges faced by electronics manufactures producing large panels of small boards is discussed.
Technical Paper

A Method to Investigate PCB Supplier Rework Processes and Best Practices
This paper investigates PCB supplier rework processes, including identifying rework procedures that have potential implications to PCB functionality.
Technical Paper

Fill the Void
Several methods of minimizing voids are presented. Printing solder paste with gas escape routes is an excellent way to reduce voiding.
Technical Paper

Sponsor

Automation in Transition
The world of automation is changing. What does this mean for customers? And what impact is the transformation having on providers? Find out more from a panel of experts.
SCHUNK

Artificial Intelligence in Improving Automated Optical Inspection
After reviewing the four AI use cases presented in this paper, it is very apparent the overwhelming benefit AI can have with our AOI process and programs.
Technical Paper

The Best Storage Method to Protect Against Corrosion
Which storage method will better protect against corrosion, nitrogen or super dry? You want to do it in compliance with IPC 1602, which covers storage and handling of circuit boards.
Board Talk

Sponsor

Maintenance: The Basics of Cleaning Series Part 4
This is the final paper in a series and discusses some of the common mistakes in maintenance cleaning applications found in electronic assembly operations.
KYZEN

Risks Using Flux Only for Soldering BGAs
What are the risks using flux only versus solder paste for placing BGAs in a hybrid lead-free environment? Why would you only use flux, why not solder paste?
Board Talk

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MORE INDUSTRY NEWS

Sponsor

Fast PCBs, Fully Assembled
Need it fast? Summit delivers quick-turn PCB fabrication and assembly on compressed timelines—no shortcuts, just speed and precision from one source.
Summit Interconnect

Sponsor

Optically Clear Nanosilica Filled Epoxy
Master Bond EP4NS-80 is a low viscosity epoxy for bonding and sealing that possesses excellent dimensional stability, low CTE and minimal shrinkage upon curing.
Master Bond