Technical Papers
11 Ways to Get Your PCBs Faster
Best Practices for Disinfecting for COVID-19 of Electronic Products & Assemblies
5G is Turning up the Heat
True3D™ Innovations Powered by AI
How to Achieve Maximum Performance For Your Conformal Coatings Process
Openair-Plasma: Versatile and reliable solution for the electronics industry
Scoring Big With Real-Time X-Ray Inspection
How well can you 'Pin Down' defects in the press-fit process?
MORE TECHNICAL PAPERS
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
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Latest Industry News
Print These Electronic Circuits Directly Onto Skin
Compal increasingly asked to diversify production bases
Intel's margins tumble as customers shift to cheaper chips, shares slide 10%
From Foldable Phones to Stretchy Screens
6 Considerations for Integrating Sensors in Vehicles
Bill Gates Says Unhappy Customers Are Good for Your Business. Here's Why.
iPhone 12 review: Upgrade for the camera, not 5G
Apple's shifting supply chain creates boomtowns in rural Vietnam
MORE INDUSTRY NEWS
October 22, 2020
Causes of Blowholes
Causes of Blowholes
Are old components such as resistors and circuit breakers more likely to cause blowholes during wave soldering compared to newer components? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this question.
Board Talk
Impractical Stencil Aperture Designs to Enable M0201 Assembly
Implementation of metric 0201 or M0201 size surface mount passives will help enable the next generation form factor electronic packaging.
Production Floor
Breakthrough Gives Robots Human-like 3D Mental Model of their Environment
Breakthrough Gives Robots Human-like 3D Mental Model of their Environment
MIT engineers have developed a representation of spatial perception for robots that is modeled after the way humans perceive and navigate the world.
Technology Briefing
Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction
Many center pad voiding studies have focused on center pad footprint/stencil aperture designs. This study focuses on I/O pad stencil modifications.
Analysis Lab
Microalloyed Sn-Cu Pb-Free Solder for High Temp
Microalloyed Sn-Cu Pb-Free Solder for High Temp
While susceptibility to tin whisker growth remains a barrier to the transition to Pb-free, there is now general acceptance that there are reliable alternatives.
Materials Tech
Selective Reflow Rework Process
This paper discusses some aspects of the process optimization and changes made to improve the quality of the rework process.
Production Floor
Impact of Thermal Loading on the Structural Intergrity of 3D TSV Package
In this paper, the different types of crack that can happen along the TSV/Si interface has been determined with the study of behaviors of crack.
Analysis Lab
Tips When Moving a Reflow Oven
Tips When Moving a Reflow Oven
After moving a reflow oven to a different site, what steps do you need to perform on the machine for the machine to be certified?
Board Talk
Design and Fabrication of Ultra-Thin Flexible Substrate
This study focuses on an approach based on the use of a polyimide substrate for 2.5D/3D ultra-thin packaging applications.
Materials Tech
Virtual Reality and Augmented Reality for Businesses
Virtual Reality and Augmented Reality for Businesses
A team developed moldable nanomaterials using metamaterials, allowing the commercialization of inexpensive and thin VR and AR devices.
Technology Briefing
Influence of PCB Surface Features on BGA Assembly Yield
This paper provides insight into the impact of irregularities on BGA package surface mount yield, and guidance on design and to limit their impact.
Production Floor
Last Will and Testament of the BGA Void
This paper investigates the impact of voids in BGA and CSP components using thermal cycle testing per the IPC specification for tin-lead solder alloys.
Analysis Lab
Pay Clerk Production Woes
Pay Clerk Production Woes
A company was having quality control problems. Friday morning was when the problems happened, but why just on Fridays?
Mysteries of Science
Selecting Stencil Technologies to Optimize Print Performance
Research has been done to identify individual factors in stencil performance; this paper discusses the real-world application of numerous findings.
Production Floor
The Building Blocks of an AI Strategy
The Building Blocks of an AI Strategy
How does an organization transition from opportunistic and tactical use of artificial intelligence to a more strategic orientation?
Technology Briefing
Impact of Substrate on Materials Reliability of High Power LED Assemblies
What role does the substrate type play in the LED package-to-board assembly reliability? This paper presents a study to help answer this question.
Analysis Lab
Circuit Material Performance for PCBs at Millimeter Wave Frequencies
Circuit Material Performance for PCBs at Millimeter Wave Frequencies
This paper gives an overview of which circuit material properties are important to mmWave frequency applications using PCBs.
Materials Tech
The Challenges of LGA Server Socket Trends
This paper discusses the challenges and some potential solutions for sockets used in the high end server market.
Production Floor
✷ ✷ Supplier Spotlight ✷ ✷
BTU International, Inc.
BTU International, Inc.
BTU International is a market-leading, global supplier ...
EPTAC Corporation
EPTAC Corporation
EPTAC is an internationally recognized leader in ...
Uyemura International Corporation
Uyemura International Corporation
Uyemura USA is best known for our ...
ZESTRON Corporation
ZESTRON Corporation
We are dedicated to continually innovate and ...
Technology Corner
BTU vs. Competitor Reflow Oven Profile Comparison
BTU International, Inc.
THE PACE STORY 2019
PACE Worldwide
VIGON NX 700 Next Gen pH Neutral Cleaning
ZESTRON Corporation
Training and Certification Continues
Blackfox Training Institute
MORE TECHNOLOGY CORNER
Board Talk
Causes of Blowholes
Tips When Moving a Reflow Oven
Assembling Boards with BGAs on Both Sides
Larger Stencil Apertures and Type 4 Paste
5 vs 8-Zone Ovens
Component Moisture Question?
BGA Components and Coplanarity
How To Verify Cleanliness After Rework and Prior to Re-coating?
MORE BOARD TALK
Questions and Comments
Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction
After hearing about this during conversations at the SMTA INT ...
Alan Woodford, NeoTech
Causes of Blowholes
I'm not a believer in the main problem is voids ...
Gregory York, BLT Circuit Services Ltd
Component Moisture Question
Moisture sensitive devices are a class of their own. The ...
Dr. KUTTIYIL THOMAS OOMMEN THARAKAN, VSSC
What is Causing Intermittent BGA Failures?
Given below are the various phases in which a BGA ...
Dr. KUTTIYIL THOMAS OOMMEN THARAKAN, VSSC
BGA Components and Coplanarity
I would also add not only you have the coplanarity ...
Darren Pieczynski, Burton Industries
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