Electronics Manufacturing and Electronics Assembly

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Technical Papers

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

Understanding Solder Dross: Causes and Control Strategies

MORE TECHNICAL PAPERS

Ask the Experts

Components Falling Off During Reflow

Solder Balling Prediction Formula

Dendritic Growth and Contamination at BGA Sites

Removal of Coatings from PCBs

LED Component Shift During Reflow

Initial Screen Print Test Board

Depaneling circuit board that contain BGA components

Legend Marking Discoloration

MORE ASK THE EXPERTS

Investigation Into the Durability of Stencil Coating Technologies
Paper addresses durability of coatings in relation to the number of print cycles and underside wipe cycles and materials used on the underside wipe process.
Technical Paper

Can High Particle Concentrations Impact PCB Assembly?
At our SMT facility we currently control ambient temperature, relative humidity and particle count. Is particle count a good parameter to control? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this question.
Board Talk

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New SELECT Synchro soldering system
A multi-station selective soldering system that uses a unique, synchronous motion to increase throughput, improve cost-of-ownership, and provide flexibility for electronics manufacturers.
Nordson Electronics Solutions

Conformal Coatings in Preventing Resistor Silver Sulfide Corrosion
The evaluation of conformal coatings to mitigate silver sulfide corrosion of thick film resistors is discussed.
Technical Paper

Improve SMT Yields Using Root Cause Analysis in Stencil Design
Paper covers SMT challenges including practical stencil design recommendations to eliminate defects and improve yields during the printing process.
Technical Paper

Unlocking The Mystery of Aperture Architecture for Fine Line Printing
This paper covers issues of printing for challenging area ratio components and their associated aspect ratio will be investigated.
Technical Paper

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X-ray Rentals & Rent-to-Own
Rent any of our machine models, with up to 3 months of rental costs applied toward purchasing X-ray equipment. Our flexible plan lets you test the system before committing to purchase.
Glenbrook Technologies

Effect of Encapsulation Materials on Tensile Stress
In this paper FEA modeling was performed to observe stress-strain behavior of solder joints during thermal expansion for various potting materials.
Technical Paper

Trouble With Skewed DPAK Components
We are having trouble with surface mount DPAC components skewing during reflow. We checked our profile and tried a diagonal hatch aperture.
Board Talk

Sponsor

Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS

Durable Conductive Inks for Robust Printed Electronics
Polymer Thick Film based printed electronics has improved in durability and is now a proven alternative to copper circuitry in many applications.
Technical Paper

Void Reduction in Bottom Terminated Components Using Vacuum Assist
Paper offers results of void experiments using an in-line convection reflow oven and three types of bottom terminated components.
Technical Paper

Improving properties of a Lead-free Solder Alloy with Doping of Copper
This paper reviews 3 lead-free solder alloys to assess the mechanical and thermal cycle properties by implementing drop tests and thermal cycle tests.
Technical Paper

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Handheld Plasma Activation
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Plasma Etch

Challenges for Selecting Appropriate TIM2 Material for CPU
This paper provides a methodology for a potential TIM2 material for applications including automotive, personal computers and internet of things.
Technical Paper

Minimum Lead to Lead Spacing for Wave Soldered Through-Hole Components
What is the recommended minimum lead-to-lead spacing for through-hole components run through a wave soldering system? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their own suggestions.
Board Talk

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Circuitnet Advertising Delivers Results!
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Circuitnet LLC

Moisture Barrier Bag Issues
Moisture sensitive chip components have been exposed to the atmosphere beyond specification. Can they be packaged and sealed with desiccant?
Board Talk

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Your Domestic PCB Solution
Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on.
Summit Interconnect

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Micro Dispensing Technology Leader
DL Technology LLC develops customized dispensing needles and valves for the electronics assembly, industrial assembly, semiconductor packaging and medical industries.
DL Technology