Electronics Manufacturing and Electronics Assembly

Sponsor

AEC Grade-0 and MSL Level-1 Conductive Paste & Film Adhesives
240° Tg and ultra-high thermal stability for AEC Grade-0 applications. Proven rapid and snap curing die-attach paste for ultimate productivity.
AI Technology, Inc.

Technical Papers

Redesigning Material Logistics for High-Mix EMS Production

Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education

Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

MORE TECHNICAL PAPERS

Ask the Experts

SOT (Small Outline Transistor) Body Cracks

Shielding Techniques When Removing Components Using Hot Air

Partially Visible or Hidden Solder Connections

Shelf Life Limit for Soldering Old Components

Trays for MLS Baking

Controlling Creep Corrosion

Design Considerations and Impact on Assembly

BGA Placement Paste or Only Flux

MORE ASK THE EXPERTS

Cleaning Industrial Parts with Plasma
The cleanliness of surfaces is critical for the quality of processes like bonding, coating and printing. That’s why manufacturers may want to consider using atmospheric pressure plasma.
Technical Paper

How To Clean a Vintage Circuit Board Assembly?
A vintage computer board is contaminated with decomposed anti-static foam. The microprocessor and other ICs have a sticky grime on the leads.
Board Talk

Sponsor

3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
Plasma Etch

Low Temperature Solder Joint Shear Strength of Components
This paper studies the effect of several factors on the shear strength of a wide range of components assembled using LTS paste.
Technical Paper

Characterization of SIP Assembly and Reliability Under Thermal Cycles
This paper presents assembly challenges and reliability evaluation of Three-Dimensional Through- Mold Via and System in Package in fine pitch ball grid arrays.
Technical Paper

The Maximum Allowable Compression Load Per Solder Interconnect
An attempt to identify the maximum quantitative allowable compression load per solder ball in a large component configuration with 600μm in solder ball diameter is investigated.
Technical Paper

Sponsor

Lower Electronics Costs Through Component Recovery
Recovering electronic components can reduce costs, minimize waste, and maximize inventory. Circuit Technology Center provides component recovery solutions.
Circuit Technology Center

Cleaning under Bottom Terminated Components
This paper demonstrates continuously detecting the proper quality of rinsing water and the status of chemical filters, which provide the required parameters.
Technical Paper

When is it Time to Switch from Manual Assembly to Automation?
We are a new start-up assembling wireless sensors. All assembly is now manual. We are experiencing large reject rates due to hand soldering of components.
Board Talk

Sponsor

Need Improved Solder Joint Visibility?
Solder Peel-A-Wayš Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.

Thermal Fatigue Reliability of SAC305 due to Mixed Metallurgy Assembly
This study presents thermal fatigue data generated in thermal cycling for the case of BGA mixed metallurgy assembly.
Technical Paper

Additive Manufacturing for Next Generation Microwave Electronics
The paper will discuss the integration of 3D printing and inkjet printing fabrication technologies for microwave and millimeter-wave applications. With the recent advancements in 3D and inkjet printing technology, achieving resolution down to 50 um, it is feasible to fabricate electronic components and antennas operating in the millimeter-wave regime.
Technical Paper

Calibration of Tweezer Meters Enabling Sub 1 pF and Sub 10 nH
The importance of calibration for two-wire measurement setups is reaffirmed. For tweezer meters, this issue is critical due to the higher offset values, which can be as large as 19 nH.
Technical Paper

Sponsor

Catch Defects Before They Cost You
3D AOI analyzes true solder height, contour, and volume to expose defects 2D systems miss—reducing false calls, rework, and escapes on ultra-compact components.
Manncorp Inc.

Copper Dissolution Testing Report for the Selected Pb-free Solder Alloys
This paper describes the approach for measuring the copper dissolution rates of five Pb-free solder alloys.
Technical Paper

How Can We Prevent Our 0201 Nozzles From Clogging?
We have a formula stencil that had the apertures enlarged to maintain volume while overprinting the ends to keep solder away from the 0201 nozzle.
Board Talk

Sponsor

Unlock the Potential of Salvaged Devices
Component harvesting is a reliable method of electronic component reclamation, reducing e-waste and ensuring economic reuse for automated assembly.
BEST Inc.

Soldering Relays Intrusively in Lead Free Process
We use intrusive reflow soldering on relays using a lead process. We are challenged to solder relays intrusively in a lead-free process.
Board Talk

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MORE INDUSTRY NEWS

Sponsor

Automated Storage for High-Mix EMS Production
High mix electronics manufacturing requires reliable material management. This white paper explains how BMK enhanced traceability, inventory accuracy and picking efficiency using integrated automated storage, digital workflows and reel-level visibility.
Essegi Automation

Sponsor

Buy SMT Dispensing Needles Online
EZ-FLO needles are machined from stainless steel with smoother internal profile for improved material flow. Chamfered needle tip is finely ground for better release. Buy online.
DL Technology