Electronics Manufacturing and Electronics Assembly

Sponsor

Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.

Technical Papers

Flux-Free, Reliable, Efficient: Soldering with Formic Acid

Redesigning Material Logistics for High-Mix EMS Production

Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education

Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

MORE TECHNICAL PAPERS

Ask the Experts

Rework of Underfilled Array Packages

What Causes Solder Balls During Rework?

Advise and suggestions for assembly using 01005 capacitors.

Selective Printing for BGA Components

PCBA Transport Between Facilities

SOT (Small Outline Transistor) Body Cracks

Shielding Techniques When Removing Components Using Hot Air

Partially Visible or Hidden Solder Connections

MORE ASK THE EXPERTS

Impact of Pb-free Solder Alloy Mixing on Solder Joint Integrity Using BGAs
An investigation was conducted to assess the solder joint integrity (acceptable/nonacceptable) for three different solder alloys on ball grid arrays (BGAs) in a mixed metallurgy configuration as compared to a baseline SAC305 system. Thermal cycle testing using a -55 to +125 ºC range in accordance with the IPC-9701 specification was used.
Technical Paper

How to Cost a Board
My boss has asked me to provide a cost matrix so we can quickly quote labor machine time component for the SMT board assembly.
Board Talk

Sponsor

Automation in Transition
The world of automation is changing. What does this mean for customers? And what impact is the transformation having on providers? Find out more from a panel of experts.
SCHUNK

Increased Reliability of Quad Flat No Lead Wettable Flank Connections
The focus of this study is to investigate the reliability of the immersion tin layers plated by a tailored immersion tin process for QFN flank plating.
Technical Paper

Breakthrough Technology to Improve X-Ray results
The paper contains comparison data from Nano Focus tube, plus data from reliability and stability tests using a real-life system and not test rigs.
Technical Paper

Implementing Automation and Ai for Electronic Card Assembly
AI solutions could be integrated into the automation process to further improve the production operation. This paper discusses the challenges in implementation.
Technical Paper

Sponsor

Safe and Effective Cleaning with 440-R
Not consumed during the stencil cleaning process so there is no need to monitor concentration. Simply replace with fresh solution every 4-6 weeks. Learn more.
Smart Sonic

Challenges of Ultra-Fine Feature Printing Optimization of Pb-Free Solder Paste
Semiconductor manufacturing, flip chip, package on package, system in package, and miniature components may require printing through stencil apertures of 50-100 μm in size.
Technical Paper

The Effect of Thermal Cycling Profile on Thermal Fatigue Performance of an 84-Pin Thin Core BGA
This paper summarizes the findings from a thermal cycling test to evaluate the effect of thermal cycling profile on thermal fatigue performance of low temperature solders.
Technical Paper

Sponsor

Cut SAC305 Costs with REL61TM Lead–Free Alloy
Silver prices have tripled. While silver is 2/3 of SAC305's cost, it's only 1/4 of REL61. Save hundreds of thousands annually with this proven, drop-in alternative.
AIM Solder

Flux Residue Causing Test Issues
We are having issues with flux residues. After wave, we experience many incomplete readings due to flux residues on connector pins.
Board Talk

Automation for Traceability and Reliability
In this study it was demonstrated how process traceability records need to deal with complex and variable inputs as well as challenges among our machine processes.
Technical Paper

ASEP a Next Generation Electronics Manufacturing Technology
This paper introduces a Application Specific Electronics Package. This enables the integration of PCBs, connectors, high-current conductors, into a single device.
Technical Paper

Sponsor

What Would You Ask Proven Global Manufacturing Leaders?
In this 4-part series we asked about: Key Drivers of Success, Scaling Operations Effectively, AI in Manufacturing, and Tools to Empower Operations. No registration Required.
Intraratio

Variations in SAC 305 Solder
We use SAC 305 bar solder. We want to use a different supplier. Can we mix the new solder in with the current solder in our wave soldering systems?
Board Talk

Methodology for Implementation of Pb-free Materials in Aerospace
This paper will discuss the Pb-free challenges and the “building blocks” to allow cautious and responsible implementation of Pb-free materials.
Technical Paper

Sponsor

High power atmospheric plasma system
Our 1000 Atmospheric Plasma System is available with PC or PLC control for lab or high speed production use with the same high powered systems. Remove contaminants and increase bond strength!
Plasma Etch

Realization of a New Concept for Power Chip Embedding
This paper will focus on the behavior of the power module for operational conditions of a PedEleC (Pedal Electric Cycle) application.
Technical Paper

Latest Industry News

The Lab Mistake That Might Revolutionize Computing

Apple accuses India of ‘copy-pasting’ rivals’ claims in antitrust investigation

Europe’s Path to Defense Resilience Lies in Technological Independence

A hollow-core fiber cable just carried 51.3 Tb/s across 200 km

This Unexpected Tech Founder Is Now Richer Than Mark Zuckerberg, Larry Ellison and Jensen Huang

MORE INDUSTRY NEWS

Sponsor

Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH

Sponsor

SMT Line Builder Tool – Fast & Easy
Skip the guesswork. Our SMT Line Builder gives you instant, expert-recommended setups based on your budget and output. Or send us your BOM—we'll handle it.
Manncorp Inc.