Optimizing Cleaning Strategies for Advanced Packaging Technologies
The study will utilize various test vehicles with low standoff components, using both No-clean and Water-soluble solder formulations. Two aqueous-based cleaning agents will be evaluated, and cleanliness assessed through visual inspection, SIR, and IC testing following IPC standards.
Technical Paper
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High power atmospheric plasma system
Our 1000 Atmospheric Plasma System is available with PC or PLC control for lab or high speed production use with the same high powered systems. Remove contaminants and increase bond strength!
Plasma Etch
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Reduction of Condensate Residues in the Reflow Process
Increased electronics manufacturing results in an increased amount of condensate residue. The problem is not only to meet the increased cleaning requirements with increasing production, it is much more the absence of knowledge about the condensate residue formation process and how this residue can be minimized and inhibited in its formation.
Technical Paper
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Solder Performance and Reliability Assurance (SPRA) Project
The performance specification of solder requires that any solder being considered meet assembly requirements as well as the interconnects formed with the solder survive specified mechanical shock, thermal cycle, and vibrations environment conditions.
Technical Paper
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Unlock the Potential of Salvaged Devices
Component harvesting is a reliable method of electronic component reclamation, reducing e-waste and ensuring economic reuse for automated assembly.
BEST Inc.
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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Risks Using Flux Only for Soldering BGAs
What are the risks using flux only versus solder paste for placing BGAs in a hybrid lead-free environment? Why would you only use flux, why not solder paste?
Board Talk
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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom
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Gooey Flux Residue Left Behind
After selective soldering connectors there is a small amount of no-clean flux residue left behind. How can I judge how much flux residue can be left behind?
Board Talk
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