Electronics Manufacturing and Electronics Assembly

Sponsor

What are your economic depaneling needs?
Our depaneling machines are high-performance machines for single circuit boards with electronic components. The cutting principles are fast, the best quality.
SCHUNK Electronic Solutions

Technical Papers

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

MORE TECHNICAL PAPERS

Ask the Experts

Long Term Component Storage

How To Measure Solder Paste Rolling Diameter

Class 3 Pin Contact Question

Solder Paste Print Test Boards

Removing Cleaning Residues Under BTC Packages

BGA Solder Ball Wetting

Requirements for Installing Leaded vs. Lead-free Press Fit Connectors

Maximum Allowable Time Prior to Washing When Using Water Soluble Paste

MORE ASK THE EXPERTS

Probe Contact Issues with No-Clean Pin-in-Paste
We are having issues with our no-clean pin in paste process caused by flux residue on the surface of the solder joint. Should all flux vaporize off during reflow?
Board Talk

CU Core Column Enables Fine Pitch & High-Density 3D Packaging
The diameter, length, and aspect ratio of the Cu core columns and how to optimize the dimensions of the Cu core column is discussed.
Technical Paper

Sponsor

PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies

ECM and IOT How to Predict, Quantify and Mitigate ECM Failure Potential
There was a time when virtually all circuit assemblies were cleaned. The removal of flux and other process-related contamination was commonplace.
Technical Paper

A Standardized Reliability Evaluation Framework for Connections
The iNEMI Connector Reliability Test Recommendations team recommends work to define test conditions to evaluate the expected degradation of connectors under the stress levels.
Technical Paper

Microstructural Evolution During Electromigration in Eutectic Tin-Bismuth BTC Solder Joints
The subject of this follow-up paper is the microstructural evolution of BTC eutectic Sn-Bi solder joints during electromigration. The growth of intermetallic phases at the solder-substrate interfaces and the extent of bismuth electromigration were measured as a function of temperature, current density and time in a bid.
Technical Paper

Sponsor

Capital Expenses Significantly Reduced by Eliminating Dispensed Adhesives and Underfills
Learn how you can potentially save $300K-$900K in capital expense with our PLACE-N-BOND Underfilms. Click here.
Alltemated Inc.

De-Ionized Water Affected By the Atmosphere
Resistivity readers of the de-ionized water are above 15 megohms. Resistivity results of the samples tested by the outside lab have been approximately 1 megohm.
Board Talk

Solder Ball Joint Reliability with Electroless NI-PD-AU Planting
The influence of Pd film thickness in electroless Ni/Pd/Au plating on the solder ball joint reliability after reflow cycles and thermal aging was investigated.
Technical Paper

Sponsor

Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.

Accuracy Validation Finds Hidden Problems Affecting DPMO
This paper discusses individual process step validation methods with real examples of improvement that contribute to defect per million opportunities (DPMO) reduction.
Technical Paper

Copper-Tin Intermetallics: Their Importance, Growth Rate and Nature
This paper will review the formation of copper-tin intermetallics, their growth rate, their effect on thermal cycle life, and drop shock performance.
Technical Paper

Reliability of Isothermally Aged Doped Low Creep Lead-Free Solder Paste
The primary goal of this study was to find a manufacturable solder paste material that would reduce the effects of aging on the solder joints.
Technical Paper

Sponsor

AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS

Insulation Between Overhanging Component Lead and Circuit Conductor
We have a long lead SMT component overhanging the pad. Can solder mask provide insulation between the overhanging component and the circuit conductor?
Board Talk

Stencil Quality & Technology on Solder Paste Printing Performance
We evaluate the impact of stencil quality by comparing the printing performance of 0.35mm pitch and 01005 pads from different stencil suppliers.
Technical Paper

Sponsor

Electronic Assembly Cleaning Basics
Monitoring & effectively controlling chemistry concentration when cleaning electronic assemblies is crucial for maintaining optimal cleanliness results & preventing costly consequences.
KYZEN

Investigation of Overprinting BGA Pads
The added benefit of using overprinting stencil design strategy is that this should compel further improvement in paste transfer efficiency and uniformity by raising its area ratio. In this study the circle shape overprint apertures were designed for 0.5mm pitch BGA land patterns that measured to an area ratio value of 0.70.
Technical Paper

Latest Industry News

AI Server Demand Driving Revenue, Hon Hai says

Gartner Predicts AI Applications Will Drive 50% of Cybersecurity Incident Response Efforts by 2028

Embedded World 2026 Confronts Mounting Integration Complexity

IEEE Young Professionals Help Bridge the U.S. Tech Skills Gap

AI Tools for Engineers: Atoms

MORE INDUSTRY NEWS

Sponsor

Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron

Sponsor

Discover consistency for your operations
Explore the reliable solutions for jet dispensing, conformal coating, plasma treatment, and selective soldering from Nordson.
Nordson Electronics Solutions

"Cost should not prohibit our company from going green. We did it on St. Patrick's Day and it didn't cost much at all!"
Copyright © Randy Glasbergen