AI to Predict Compatibility Between Solder Paste Residues and Coatings
This paper shows how AI is used to predict compatibility results between solder paste residues and coatings. A physical compatibility study is carried out to benchmark some combinations of solder pastes and coatings of the market. Results between AI prediction and the physical tests are compared to choose the right AI model for a good prediction of the compatibilities.
Technical Paper
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Seven Facilities, One Trusted Source
Partner with the industry leader. Summit is trusted and proven, with 7 integrated facilities to load capacity—from fast-turn prototypes to scalable production requirements.
Summit Interconnect
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Design for Manufacturability - Perspectives from a Manufacturing Engineer
This paper will examine a few key areas of PCB design and manufacturing that can have a substantial impact on product reliability and how to mitigate reliability risks by deploying design for manufacturability (DFM) best practices. It will also explore the dependencies between the design and manufacturing processes.
Technical Paper
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No-Clean Residue Shorts
We have a PCBA with a QFN 44 using no-clean flux. We have many test failures during testing. Are the failures due to flux reside between terminations? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk
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Issues With SMT Component Alignment
During automatic optical inspection our chip components are shifting. This is not limited to single components and changes daily.
Board Talk
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Scaling SMT Traceability
High-mix electronics manufacturing requires precise material control. This whitepaper explains how Tecnimaster improved traceability, inventory accuracy and picking efficiency through integrated automated storage and reel-level tracking.
Essegi Automation
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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
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Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
ECD
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