Electronics Manufacturing and Electronics Assembly

Sponsor

Tough Engineering Changes? Where Can You Turn?
Engineering changes are a reality that need to be dealt with. Do you have qualified rework technicians to do the job efficiently and reliably?
Circuit Technology Center

Technical Papers

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

MORE TECHNICAL PAPERS

Ask the Experts

Solder Contamination Sources

Removal of Non-functional Pads from Inner Layers

Components Jumping Around During Reflow

Estimating Failure Rate During Rework

Long Term Component Storage

How To Measure Solder Paste Rolling Diameter

Class 3 Pin Contact Question

Solder Paste Print Test Boards

MORE ASK THE EXPERTS

Potted Assembly Interfacial Reliability Under Inclined 25000g Mechanical Shock
This study investigates the time and temperature-dependent evolution of interfacial fracture toughness in four distinct potting compounds for printed circuit boards (PCBs). The investigation focuses on the evolution of the interfacial fracture toughness at the potting material-PCB interface.
Technical Paper

The True Business Impact of IIoT Technology
Pitfalls and opportunities in IIoT solution technology, at the device level, the manufacturing execution management system layer, and enterprise business systems layer.
Technical Paper

Sponsor

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura

Requirements on a Class 0 EPA - ESD Equipment and Measurements
The requirements “0 volt” can be achieved, when die maximum value will be required. Today we do not have any ESD material, which requires these limits.
Technical Paper

When is it Time to Switch from Manual Assembly to Automation?
We are a new start-up assembling wireless sensors. All assembly is now manual. We are experiencing large reject rates due to hand soldering of components.
Board Talk

How Can We Prevent Our 0201 Nozzles From Clogging?
We have a formula stencil that had the apertures enlarged to maintain volume while overprinting the ends to keep solder away from the 0201 nozzle.
Board Talk

Sponsor

Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.

Stencil Printing for Challenging Heterogeneous Assembly Applications
A series of Metric 0201 experiments investigating printing process sensitivity to circuit board properties, including pad dimensional accuracy and landscape topography.
Technical Paper

Achieving Solder Reliability for LGA Ceramic Image Sensors
The stencil aperture design has more influence on overcoming CTE mismatch between the ceramic LGA and the FR4 PCB than the reflow oven temperature profile cool down slope.
Technical Paper

Sponsor

Rework/Removal of Underfilled Parts AVX250/1000M
High precision milling with zero adjacent clearance. Auto laser height measurement of board and component. Learn more.
Air-Vac Engineering

Weibull Distribution and Analysis
This paper provides an overview of the Weibull distribution, its variables, types of data required, and interpretations that can be drawn.
Technical Paper

Efficient Thermomechanical Reliability Model for Lead-Free Solder Joints
This study aims to present a new analytical model that accounts for the shape of solder joints, with a special emphasis on the determination of the mechanical properties of the Printed Circuit Boards (PCBs) and components. A simplified elastic-plastic constitutive relationship coupled with a viscoplastic model is used.
Technical Paper

Soldering Relays Intrusively in Lead Free Process
We use intrusive reflow soldering on relays using a lead process. We are challenged to solder relays intrusively in a lead-free process.
Board Talk

Sponsor

440-R + Ultrasonics = Safe & Efficient Cleaning
Low power density ultrasonic cleaners combined with 440-R-SMT detergent provide safe and effective cleaning of stencils, pallets, misprints & SMD adhesives.
Smart Sonic

Rework Practices for MicroLEDs and Other Highly Miniaturized SMT Components
This paper will focus on practices and innovative solutions to successfully repair these miniaturized, sensitive and often fragile components.
Technical Paper

Strain Measuring Technology in Board Level Assembly Process
The study on strain measurement has just started, and there are still many unsolved puzzles, whether about strain gage selection or about measurement methodology.
Technical Paper

Sponsor

Maximize Yield with Patented Vacuum Reflow
Heller's innovative, patented vacuum reflow solves the throughput bottleneck by shortening cycle times for maximum yield and minimal voiding. Experience the speed with us.
Heller Industries

Reexamination of Thermal Cycling Reliablity of BGA Components
A direct comparison was conducted between SnPb and lead-free solder joints focused on long-term thermal cycling reliability after being exposed to high-temperature aging for a long period of time using two test vehicle designs.
Technical Paper

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MORE INDUSTRY NEWS

Sponsor

Pioneering 3D X-ray Inspection for Flat Assemblies
Viscom is setting a new standard for high-precision inline X-ray inspection of printed circuit boards with its iX7059 product line. Learn more.
Viscom

Sponsor

Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.