Electronics Manufacturing and Electronics Assembly

Sponsor

Future-Ready Bonding Technology
ZTACH® ACE Anisotropic Conductive Epoxy – Cures under reflow or UV and can be a replacement for solder, ACF, ACA, and wire bonding. No underfilling required. Find out more.
Action Integrated Resources

Technical Papers

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

MORE TECHNICAL PAPERS

Ask the Experts

Removal of Non-functional Pads from Inner Layers

Components Jumping Around During Reflow

Estimating Failure Rate During Rework

Long Term Component Storage

How To Measure Solder Paste Rolling Diameter

Class 3 Pin Contact Question

Solder Paste Print Test Boards

Removing Cleaning Residues Under BTC Packages

MORE ASK THE EXPERTS

Efficient Thermomechanical Reliability Model for Lead-Free Solder Joints
This study aims to present a new analytical model that accounts for the shape of solder joints, with a special emphasis on the determination of the mechanical properties of the Printed Circuit Boards (PCBs) and components. A simplified elastic-plastic constitutive relationship coupled with a viscoplastic model is used.
Technical Paper

Soldering Relays Intrusively in Lead Free Process
We use intrusive reflow soldering on relays using a lead process. We are challenged to solder relays intrusively in a lead-free process.
Board Talk

Sponsor

Precision Thermal Control for High-Reliability SMT
Achieve ultra-uniform temperature control with low mass heater technology. Perfect your soldering profiles and save floor space with our compact, high-efficiency systems.
Heller Industries

Rework Practices for MicroLEDs and Other Highly Miniaturized SMT Components
This paper will focus on practices and innovative solutions to successfully repair these miniaturized, sensitive and often fragile components.
Technical Paper

Strain Measuring Technology in Board Level Assembly Process
The study on strain measurement has just started, and there are still many unsolved puzzles, whether about strain gage selection or about measurement methodology.
Technical Paper

Reexamination of Thermal Cycling Reliablity of BGA Components
A direct comparison was conducted between SnPb and lead-free solder joints focused on long-term thermal cycling reliability after being exposed to high-temperature aging for a long period of time using two test vehicle designs.
Technical Paper

Sponsor

Latest 3D AOI System from Viscom
iS6059 PCB Inspection Plus. Its new and faster sensor technology, data processing and analysis functions all stand for the best 3D AOI performance that meets the highest requirements.
Viscom

Test Methods for Electrochemical Consistency in PCB Assembly Processes
This paper will review traditional and emerging methods to characterize flux residues and cleanliness of finished assemblies.
Technical Paper

Limitations of ROSE Testing Versus Localized Contamination
Recognizing the limitations of ROSE testing versus localized contamination, what can I use to validate the cleanliness of my finished product?
Board Talk

Sponsor

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp

Simulation and Fault Diagnosis in Post-Manufacturing Mixed Signal Circuits
In this paper, an effective method for predicting circuit failures in post-market circuit boards through simulation and deep learning is proposed and implemented.
Technical Paper

A New Approach to Process Qualification – SIR Testing + Functional Components
The experiment will build test vehicles with soldering materials susceptible to electrical leakage and electrochemical failures. The test vehicles will be tested using a test instrument designed to power and record the outputs of functional and dummy components.
Technical Paper

Analysis to Predict Deformation and Warpage of Optoelectronics Package Lids
Deformation in optoelectronics lidded electronics packages is studied. Experimental methods provide more realistic measurements of the deformation for actual packages.
Technical Paper

Sponsor

Gripping Systems from micro assembly to heavy lifting
The first industrial-suited grippers from SCHUNK were a milestone. Since then we have brought countless newly and further developments to market.
SCHUNK

Solderability Testing Protocols and Component Re-Tinning Methods
This paper addresses methods to enhance solderability including: component solderability test methodologies, gold embrittlement and removal of gold plating.
Technical Paper

Maximum Board Temperature During Tin-Lead
IPC discusses the maximum top-side board temperature for BGAs to be 150 degrees C during a tin-lead wave solder. How is this temperature was determined?
Board Talk

Sponsor

Reclaim Your Factory's Future
Space is a precious resource. With SELECT Synchro, reclaim it, and reimagine your factory's workflow for greater efficiency and scalability.
Nordson Electronic Solutions

Probe Contact Issues with No-Clean Pin-in-Paste
We are having issues with our no-clean pin in paste process caused by flux residue on the surface of the solder joint. Should all flux vaporize off during reflow?
Board Talk

Latest Industry News

Electronics Manufacturing: Demand Holds Firm, but Cost Pressures Intensify

Foldable phone shipments may near 30 million in 2026 as Apple enters market

Amazon acquires startup Rivr to test robots for 'doorstep delivery'

Don't Let New Regulations Overwhelm You — Take Control in 30 Days or Less

Jensen Huang doesn't need a new chip. He needs a new moat.

MORE INDUSTRY NEWS

Sponsor

Enhance Your Hands-On Soldering Skills
Learn how IPC certified training workshops for operator and trainer levels can advance skills and knowledge of your personnel for TH and SMT assembly.
BEST Inc.

Sponsor

Outsourcing Costs More Than You Think
Delays, tariffs, and uncertainty come with overseas PCB assembly. In-house production with Manncorp delivers faster builds, tighter control, and long-term stability.
Manncorp Inc.

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