Electronics Manufacturing and Electronics Assembly

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Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You
Viscosity is a useful solder paste quality control measurement, but rheology provides a more complete understanding of how paste will roll, fill, release, recover, and remain stable during stencil printing.
AIM Solder

Technical Papers

Redesigning Material Logistics for High-Mix EMS Production

Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education

Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

MORE TECHNICAL PAPERS

Ask the Experts

What Causes Solder Balls During Rework?

Advise and suggestions for assembly using 01005 capacitors.

Selective Printing for BGA Components

PCBA Transport Between Facilities

SOT (Small Outline Transistor) Body Cracks

Shielding Techniques When Removing Components Using Hot Air

Partially Visible or Hidden Solder Connections

Shelf Life Limit for Soldering Old Components

MORE ASK THE EXPERTS

Implementing Automation and Ai for Electronic Card Assembly
AI solutions could be integrated into the automation process to further improve the production operation. This paper discusses the challenges in implementation.
Technical Paper

Challenges of Ultra-Fine Feature Printing Optimization of Pb-Free Solder Paste
Semiconductor manufacturing, flip chip, package on package, system in package, and miniature components may require printing through stencil apertures of 50-100 μm in size.
Technical Paper

Sponsor

Access 100+ Expert Circuit Board Repair & Rework Guides
Circuit Technology Center's guidebook features repair and rework procedures to help technicians improve quality and maintain reliability in accordance with IPC standards.
Circuit Technology Center

The Effect of Thermal Cycling Profile on Thermal Fatigue Performance of an 84-Pin Thin Core BGA
This paper summarizes the findings from a thermal cycling test to evaluate the effect of thermal cycling profile on thermal fatigue performance of low temperature solders.
Technical Paper

Flux Residue Causing Test Issues
We are having issues with flux residues. After wave, we experience many incomplete readings due to flux residues on connector pins.
Board Talk

Automation for Traceability and Reliability
In this study it was demonstrated how process traceability records need to deal with complex and variable inputs as well as challenges among our machine processes.
Technical Paper

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Unlock Operational Success with Insights from Global Leaders
4-part series focused on achieving excellence while facing the operational challenges of advanced electronics and SMT manufacturing. No registration required.
Intraratio

ASEP a Next Generation Electronics Manufacturing Technology
This paper introduces a Application Specific Electronics Package. This enables the integration of PCBs, connectors, high-current conductors, into a single device.
Technical Paper

Variations in SAC 305 Solder
We use SAC 305 bar solder. We want to use a different supplier. Can we mix the new solder in with the current solder in our wave soldering systems?
Board Talk

Sponsor

The Battle for Space Superiority Has Begun
The next conflict may begin in orbit. Learn why resilient space systems and advanced manufacturing matter more than ever.
Summit Interconnect

Methodology for Implementation of Pb-free Materials in Aerospace
This paper will discuss the Pb-free challenges and the “building blocks” to allow cautious and responsible implementation of Pb-free materials.
Technical Paper

Realization of a New Concept for Power Chip Embedding
This paper will focus on the behavior of the power module for operational conditions of a PedEleC (Pedal Electric Cycle) application.
Technical Paper

Reliability of Doped Lead-Free Solder Joints Under Isothermal Aging
This paper presents harsh environment reliability test results for lead-free solder pastes with and without the presence of a variety of dopant elements.
Technical Paper

Sponsor

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura

Rheology and Wetting Characterizations of Flux and Solder Paste
In this paper, we will discuss a solder paste wetting method. A high resolution solder wetting balance was used for the solder paste wettability analysis.
Technical Paper

Can Tape Residue Contaminate a Clean Tank?
We leave masking and Kapton tapes that fall off during cleaning in the bottom of our wash tank. Can the adhesives contaminate the recycled solution? Jim Hall and Phil Zarrow, The Assembly Brothers, address these question and share their own experiences.
Board Talk

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High Temp & Chemical Resistant Epoxy
Master Bond EP62-1AO is an electrically insulating adhesive that withstands harsh chemical environments while delivering thermal conductivity. View full specs.
Master Bond

Reflow Oven Zone Separation Challenges
Some of the zones or our oven profiler are competing to get to the correct temperature. How do I prevent the oven from having competing zones? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk

Latest Industry News

Lenovo Reportedly Sees Higher Memory Prices Becoming the New Normal Into 2030

iPhone Ultra or iPhone Fold? Here's Everything the Leaks Say About Apple's 2026 Foldable

Demand for AI and new materials in China promotes industrial growth

This Breakthrough Study Brings Us One Step Closer To The Holy Grail Of 3D Printing

LG pushes robot strategy from home to factory; data shortage remains a challenge

MORE INDUSTRY NEWS

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Automated Storage for High-Mix EMS Production
High mix electronics manufacturing requires reliable material management. This white paper explains how BMK enhanced traceability, inventory accuracy and picking efficiency using integrated automated storage, digital workflows and reel-level visibility.
Essegi Automation

Sponsor

Salvaging Electronic Components: Ensuring Economic Reuse
Component salvaging provides a reliable and consistent method of harvesting electronic components, reducing electronic waste, minimizing fabrication of new components, and ensuring economic reuse for automated assembly.
BEST Inc.