Electronics Manufacturing and Electronics Assembly

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Technical Papers

Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

MORE TECHNICAL PAPERS

Ask the Experts

Design Considerations and Impact on Assembly

BGA Placement Paste or Only Flux

BGA BAll Sheer Testing

Hand Soldering at Low Temperature

Spotting After DI Water Cleaning

Cause of Green/Blue Oxide Buildup

Floor Life of MSD Parts

Reflow Oven Calibration Schedule

MORE ASK THE EXPERTS

De-Ionized Water Affected By the Atmosphere
Resistivity readers of the de-ionized water are above 15 megohms. Resistivity results of the samples tested by the outside lab have been approximately 1 megohm.
Board Talk

Detect PCB Stack-up Error with Machine Learning Methods
With high frequency and high-speed transmission in information industry, PCB customers demand stricter signal transmission integrity of PCB.
Technical Paper

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ZESTRON Europe

Endocrine Disrupting Chemicals and Bioaccumulative Substances
The re-classification and regulation of EDCs and bioaccumulative substances is expected to multiply the materials that require control or replacement.
Technical Paper

Ultrasonics as an Option for Electronics Assembly Cleaning
Ultrasonic cleaning parameters including frequency, power, time, temperature and chemistries results demonstrate developments in technology.
Technical Paper

Design Considerations That Influence LED Solder Joint Reliability
In this paper we examine the influence of three factors on thermal-mechanical solder joint reliability of LEDs mounted on an IMS PCB using FEA.
Technical Paper

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Heller Industries

Insulation Between Overhanging Component Lead and Circuit Conductor
We have a long lead SMT component overhanging the pad. Can solder mask provide insulation between the overhanging component and the circuit conductor?
Board Talk

Low Temperature Soldering: Reflow Enhanced Mechanical Reliability
In this work, we further discuss solderability and mechanical reliability of a novel low temperature proprietary alloy (generically called as X46).
Technical Paper

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If you have a technical cleaning question, or if you are facing process challenges or performance challenges, use this technical hotlist form to get help from a KYZEN Technical Care Expert.
KYZEN

Investigation into Low Temperature Solder Reliability
This paper presents an examination of three low temperature solders and provides a comparison with tin-silver-copper solder.
Technical Paper

Conformal Coating Prevention and Analysis of Resistor Silver Sulfide Corrosion
This paper covers all the long-term test results as a follow-up to an earlier publication reporting interim results and preliminary conclusions. Physical analyses were completed to investigate possible differences in the failure mode at the various FoS test temperatures.
Technical Paper

Low Temperature SMT Solder Evaluation
Recent advances in alloy "doping" have opened the door to revisit Sn/Bi alloys as a possible alternative to SAC-305 for many applications.
Technical Paper

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ECD

Blow Holes After Switching from Lead-Free HASL to ENIG
After switching our PCB finish from lead-free HASL to ENIG blow holes started occurring in the solder joints of the through-hole LEDs. The PCBs and LEDs are from the same suppliers as before, only the finish changed.
Board Talk

A Comparison of Thermal Cycling and Thermal Shock for Evaluating Solder Joint Reliability
The industry standard for accelerated temperature cycling, IPC-9701B, defines test conditions for characterizing solder interconnect fatigue. The document specifies a maximum cycling ramp rate of 20 °C/minute to avoid thermal shock conditions that can accelerate failure modes other than low cycle fatigue in the bulk solder.
Technical Paper

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J-STD-001 Solder Training Kit
BEST's IPC J-STD-001 Revision H-J training kit features circuit boards representing actual soldering conditions including multilayer boards with challenging thermal conditions.
BEST Inc

Enhanced Cleanability Using Fluxes with Decreased Viscosity after Reflow
A series of flux systems have been developed which would result in a reduced viscosity after reflow. This enables a high viscosity, high tack flux to be used.
Technical Paper

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Unlock Operational Success with Insights from Global Leaders
4-part series focused on achieving excellence while facing the operational challenges of advanced electronics and SMT manufacturing. No registration required.
Intraratio

"Either lead, follow, or get out of the way. But never try to do all three at the same time!"
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