Electronics Manufacturing and Electronics Assembly

Sponsor

Stop Guessing. Repair Circuit Boards with Confidence.
This guidebook provides proven methods to improve workmanship, enhance reliability, and help technicians perform repairs in accordance with IPC standards.
Circuit Technology Center

Technical Papers

Flux-Free, Reliable, Efficient: Soldering with Formic Acid

Redesigning Material Logistics for High-Mix EMS Production

Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education

Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

MORE TECHNICAL PAPERS

Ask the Experts

Double Sided Reflow for Micro BGA Components

Baking After Cleaning Hand Placed Parts

Question About IPC-6013 Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

Coils Rotated After Reflow

Stencil Pattern for Thermal Pads on QFNs

Component Shifting

What Is Causing Connectors to Bow?

Cleaning No-Clean Solder Paste

MORE ASK THE EXPERTS

High Thermal, High Temperature Interconnects for Ultra High Power LEDs
For high performance applications, ultra-high power offers cost reduction through fewer LEDs, smaller PCBs, smaller heat sinks and lighter load bearing.
Technical Paper

Does HASL or ENIG Reduce Creep Corrosion in Corrosive Environments?
We make electronics equipment used in corrosive environments. Do you recommend the use of HASL versus immersion gold for our application? The Assembly Brothers, Phil Zarrow and Jim Hall, answer this question.
Board Talk

Sponsor

Viscom at SMTA Michigan & Ohio
Join Viscom at SMTA Michigan (8/18/26) and Ohio (8/20/26) to discover the latest advancements in AOI and AXI inspection technology, including our powerful AI solutions.
Viscom SE

Molecular Fingerprint of Condensate Residues in the Soldering Process
A range of condensate samples were taken from different process zones of reflow soldering systems and were analyzed using FT-IR spectrometry.
Technical Paper

Implementation of Assembly Processes for Low-Melting Point Solder Pastes
This paper discusses the need for low-temperature solders and process-ability of solder pastes with three novel alloys against the industry standard.
Technical Paper

Low-Voiding High-Reliability Lead-Free Solder Paste for Automotive
A novel lead-free solder paste, Durafuse® HR (DFHR), has been developed using Durafuse® technology. This technology demonstrates the combined merits of each constituent solder powder in the paste. DFHR is based on Sn-Ag-Cu alloy system and contains bismuth (Bi), indium (In), and antimony (Sb).
Technical Paper

Sponsor

X-ray Rentals & Rent-to-Own
Rent any of our machine models, with up to 3 months of rental costs applied toward purchasing X-ray equipment. Our flexible plan lets you test the system before committing to purchase.
Glenbrook Technologies

iNEMI Board Assembly –Press-Fit Technology Roadmap
A press-fit roadmap team including press-fit manufacture, OEM/ODM and EMS are getting together every two years to identify the future technology trend, future technical challenges and needs and then to find potential solution for next 5 to 10 years in the horizon.
Technical Paper

Opens With Assembled QFN Components
We are experiencing opens on assembled QFN components at a rate of 9%. The failure only appears in rows near the component center. What is happening?
Board Talk

Sponsor

Micro Dispensing Technology White Paper
The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size.
DL Technology

Study of Lead-Free Solder Materials for Power Module Packaging Assembly
This study focused on the thermal fatigue performance and the microstructural evolution of five lead-free solders under harsh service conditions.
Technical Paper

Improving Reliability of High Performing PCB With Advanced Conformal Coating Use
The paper discusses a newly developed conformal coating system that meets the high performance, reliability and cycle time demand based on the hybrid polymer approach.
Technical Paper

Fine Pitch CU Pillar with Bond on Lead Assembly Challenges
A technology featuring Copper Pillar Bond-On-Lead (BOL) with Enhanced processes delivers cost effective, high performance packaging solution.
Technical Paper

Sponsor

Reimagined EOS/ESD Symposium 2026
Experience the enhanced EOS/ESD Symposium with expanded learning, collaboration, and industry connections. Join experts exploring challenges and solutions in EOS/ESD control. September 28-30.
EOS/ESD Association

Interconnect Mechanical Performance with Variable UBM and Decreasing Bump Size
Current work seeks to better understand how the indium (In) bump size affects the respective interface kinetics and subsequent mechanical properties.
Technical Paper

No-Clean Residue Shorts
We have a PCBA with a QFN 44 using no-clean flux. We have many test failures during testing. Are the failures due to flux reside between terminations? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk

Sponsor

Corrosion, UV Protection for Power Transmission
Moisture, corrosive gas, oxidation & UV blocking prop-erties. FLUOROSEAL® confor-mal coating for electrical contacts & ceramic insulator protection.
AI Technology, Inc.

Issues With SMT Component Alignment
During automatic optical inspection our chip components are shifting. This is not limited to single components and changes daily.
Board Talk

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China's economic uncertainty

AI boom drives US$100bn TSMC Arizona buildout

MORE INDUSTRY NEWS

Sponsor

Get the Revisiting Underfill Handbook
Today's underfill applications are constantly evolving. As chip populations increase, dispensing applications must deliver smaller amounts of fluid with precision. Read this handbook.
Nordson Electronics Solutions

Sponsor

Automation in Transition
The world of automation is changing. What does this mean for customers? And what impact is the transformation having on providers? Find out more from a panel of experts.
SCHUNK