Electronics Manufacturing and Electronics Assembly

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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS

Technical Papers

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

MORE TECHNICAL PAPERS

Ask the Experts

Components Jumping Around During Reflow

Estimating Failure Rate During Rework

Long Term Component Storage

How To Measure Solder Paste Rolling Diameter

Class 3 Pin Contact Question

Solder Paste Print Test Boards

Removing Cleaning Residues Under BTC Packages

BGA Solder Ball Wetting

MORE ASK THE EXPERTS

Reexamination of Thermal Cycling Reliablity of BGA Components
A direct comparison was conducted between SnPb and lead-free solder joints focused on long-term thermal cycling reliability after being exposed to high-temperature aging for a long period of time using two test vehicle designs.
Technical Paper

Test Methods for Electrochemical Consistency in PCB Assembly Processes
This paper will review traditional and emerging methods to characterize flux residues and cleanliness of finished assemblies.
Technical Paper

Sponsor

Cold Precision Milling for Underfilled BGA Removal
Traditional thermal removal methods for underfilled BGAs risk pad cratering, substrate delamination, and damage to nearby circuitry.
Circuit Technology Center

Limitations of ROSE Testing Versus Localized Contamination
Recognizing the limitations of ROSE testing versus localized contamination, what can I use to validate the cleanliness of my finished product?
Board Talk

Simulation and Fault Diagnosis in Post-Manufacturing Mixed Signal Circuits
In this paper, an effective method for predicting circuit failures in post-market circuit boards through simulation and deep learning is proposed and implemented.
Technical Paper

A New Approach to Process Qualification – SIR Testing + Functional Components
The experiment will build test vehicles with soldering materials susceptible to electrical leakage and electrochemical failures. The test vehicles will be tested using a test instrument designed to power and record the outputs of functional and dummy components.
Technical Paper

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Automation in Transition
The world of automation is changing. What does this mean for customers? And what impact is the transformation having on providers? Find out more from a panel of experts.
SCHUNK

Analysis to Predict Deformation and Warpage of Optoelectronics Package Lids
Deformation in optoelectronics lidded electronics packages is studied. Experimental methods provide more realistic measurements of the deformation for actual packages.
Technical Paper

Solderability Testing Protocols and Component Re-Tinning Methods
This paper addresses methods to enhance solderability including: component solderability test methodologies, gold embrittlement and removal of gold plating.
Technical Paper

Sponsor

The perfect protection for your electronics
Rehm's ProtectoXP and ProtectoXC systems offer flexible, high-quality coating solutions that shield electronics from moisture, corrosion, and other environmental damage.
Rehm Thermal Systems

Maximum Board Temperature During Tin-Lead
IPC discusses the maximum top-side board temperature for BGAs to be 150 degrees C during a tin-lead wave solder. How is this temperature was determined?
Board Talk

Probe Contact Issues with No-Clean Pin-in-Paste
We are having issues with our no-clean pin in paste process caused by flux residue on the surface of the solder joint. Should all flux vaporize off during reflow?
Board Talk

CU Core Column Enables Fine Pitch & High-Density 3D Packaging
The diameter, length, and aspect ratio of the Cu core columns and how to optimize the dimensions of the Cu core column is discussed.
Technical Paper

Sponsor

EZ-FLO High Precision Ceramic Dispense Tips
The ceramic molding process allows for smaller more precise inner diameters with a glass-like finish, giving you the ultimate control. Learn more.
DL Technology

ECM and IOT How to Predict, Quantify and Mitigate ECM Failure Potential
There was a time when virtually all circuit assemblies were cleaned. The removal of flux and other process-related contamination was commonplace.
Technical Paper

A Standardized Reliability Evaluation Framework for Connections
The iNEMI Connector Reliability Test Recommendations team recommends work to define test conditions to evaluate the expected degradation of connectors under the stress levels.
Technical Paper

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Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
ECD

Microstructural Evolution During Electromigration in Eutectic Tin-Bismuth BTC Solder Joints
The subject of this follow-up paper is the microstructural evolution of BTC eutectic Sn-Bi solder joints during electromigration. The growth of intermetallic phases at the solder-substrate interfaces and the extent of bismuth electromigration were measured as a function of temperature, current density and time in a bid.
Technical Paper

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MORE INDUSTRY NEWS

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Counterfeit Components Identified With X-ray Inspection
Automated component sourcing and procurement platform relies on real-time X-ray inspection to remove counterfeit components from supply chain.
Glenbrook Technologies

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Seeking Alternatives for Dispensed Adhesives?
No more dispensing, no more curing. PLACE-N-BOND™ Underfilm is pre-formed adhe-sive for automated placement. Learn more.
Alltemated, Inc.

"There's going to be a lot of finger pointing around here and I'd like to put you in charge. You have exquisite hands."
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