Electronics Manufacturing and Electronics Assembly

Sponsor

Probe Card Manufacturer 'Sees the Unseen' With X-ray
Probe card manufacturer relies on mobile real-time x-ray inspection to verify the quality of its aligned probes at different stages along the assembly line.
Glenbrook Technologies

Technical Papers

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

MORE TECHNICAL PAPERS

Ask the Experts

Floor Life of MSD Parts

Reflow Oven Calibration Schedule

Trichloroethylene Alternative

Is Solder Mask Considered an Insulator

Solder Balls During Selective Soldering

Concerns Replacing High Speed Components with No-Clean Solder

How to Remove Oxidization from SMT Component Leads?

Solder Ball Wrinkles

MORE ASK THE EXPERTS

Soldering Challenges Caused by Warpage of Large Integrated Circuits
We found that BGAs exhibit minimum warpage at a reflow temperature of 200-220°C, not MAPSP 210oC the lower temperature of about 180°C that tin-bismuth solders require. The best process production window can be obtained by using a solder alloy with a melting point of 200°C
Technical Paper

Innovative Panel Plating for Heterogeneous Integration
This paper will show that improvements in feature density, deposition uniformity and void free via filling can be achieved in large panel processing.
Technical Paper

Sponsor

SMT Line Builder Tool – Fast & Easy
Skip the guesswork. Our SMT Line Builder gives you instant, expert-recommended setups based on your budget and output. Or send us your BOM—we'll handle it.
Manncorp Inc.

Effect of Bias Voltage on Surface Insulation Resistance Measurements
In this study, we analyzed the effect that voltage bias has on dendrite growth both in clean PCBs and PCBs that were contaminated.
Technical Paper

Can Solder Mask Be Considered an Insulator?
Is solder mask considered an insulating material and not a defect if proven the solder mask has dielectric withstanding voltage greater than 500 volts?
Board Talk

The Causes of Tiny Solder Balls After Reflow
We have been seeing tiny solder balls across our boards after reflow. It appears that the solder is exploding as the balls are in areas where there is no paste or components.
Board Talk

Sponsor

EZ-FLO High Precision Ceramic Dispense Tips
The ceramic molding process allows for smaller more precise inner diameters with a glass-like finish, giving you the ultimate control. Learn more.
DL Technology

Development of Si-Interposers for 3D Heterogeneous Integration
This paper will review the status of the ongoing interposer development program and provide details on the process capabilities that have been established.
Technical Paper

Solder Joint Void Metrology to Monitor Solder Joint Quality
We are showing what could be done when using a 2D X-ray system to collect high resolution images and process them with Deep Learning using AI.
Technical Paper

Sponsor

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS

2nd Generation of indium TIM
A new generation of indium TIM has a protective layer to suppress surface oxidation. This work examines the performance of indium as TIM for BGA packaging.
Technical Paper

Pick-and-Place Feeder density within SMT and Electronics Assembly
To keep up, P&P machine suppliers must increase feeder density in traditional ways or new creative innovations to better serve the end user.
Technical Paper

Issue with BGAs and SAC Balls After Switching to Low-Temp Solder Paste
If we switch to low temp solder paste, will we have issues with BGAs and SAC balls? We are trying to build a product with low temperature solder.
Board Talk

Sponsor

What are your economic depaneling needs?
Our depaneling machines are high-performance machines for single circuit boards with electronic components. The cutting principles are fast, the best quality.
SCHUNK

Effect of EPIG Plating Thicknesses on Solder Joint and Wire Bond Reliability
This study focuses on determining the effects of palladium and gold thicknesses to ensure dependable solder joints and wire bonds.
Technical Paper

Improved Reliability of Jet Dispensable Polymeric Coating Material
The study compares a paste that barely passes SIR at 85C/85RH with polymeric material, Silicone conformal, and acrylic conformal coating.
Technical Paper

Sponsor

Enhance Your Hands-On Soldering Skills
Learn how IPC certified training workshops for operator and trainer levels can advance skills and knowledge of your personnel for TH and SMT assembly.
BEST Inc.

Essential Tools to Combat the Ingress of Counterfeit Materials
The tools to ensure that counterfeits are not polluting any given supply chain have not kept pace with the changing needs.
Technical Paper

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Hidden beneath AI chips, Chinese-made circuit boards raise national security concerns in U.S.

Secure Your Supply, Accelerate Your Designs: A Practical Guide to the Memory Super Cycle

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MORE INDUSTRY NEWS

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Circuitnet Advertising Delivers Results!
Introduce your technology, new products or services in our daily e-mail newsletter & website to see how a digital advertising campaign can deliver results. Reach over 200,000 professionals.
Circuitnet LLC

Sponsor

Reliable Solder Performance for Less Silver
Stop overpaying for silver. REL61TM lead-free alloy offers equivalent mechanical strength and thermal stability to SAC305 with a decade of field-proven success. Switch now.
AIM Solder