Electronics Manufacturing and Electronics Assembly

Sponsor

Outsourcing Costs More Than You Think
Delays, tariffs, and uncertainty come with overseas PCB assembly. In-house production with Manncorp delivers faster builds, tighter control, and long-term stability.
Manncorp Inc.

Technical Papers

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

MORE TECHNICAL PAPERS

Ask the Experts

Reflow Oven Calibration Schedule

Trichloroethylene Alternative

Is Solder Mask Considered an Insulator

Solder Balls During Selective Soldering

Concerns Replacing High Speed Components with No-Clean Solder

How to Remove Oxidization from SMT Component Leads?

Solder Ball Wrinkles

Assembly Question for Soldering USB Connectors

MORE ASK THE EXPERTS

The Causes of Tiny Solder Balls After Reflow
We have been seeing tiny solder balls across our boards after reflow. It appears that the solder is exploding as the balls are in areas where there is no paste or components.
Board Talk

Development of Si-Interposers for 3D Heterogeneous Integration
This paper will review the status of the ongoing interposer development program and provide details on the process capabilities that have been established.
Technical Paper

Sponsor

Eliminate Worry of Cross Contamination
While Models 529 and 1550 are similar semi-automatic cleaners with single wash and rinse tanks, the Model 2003 includes 2 wash tanks for cleaning multiple applications in one machine.
Smart Sonic

Solder Joint Void Metrology to Monitor Solder Joint Quality
We are showing what could be done when using a 2D X-ray system to collect high resolution images and process them with Deep Learning using AI.
Technical Paper

2nd Generation of indium TIM
A new generation of indium TIM has a protective layer to suppress surface oxidation. This work examines the performance of indium as TIM for BGA packaging.
Technical Paper

Pick-and-Place Feeder density within SMT and Electronics Assembly
To keep up, P&P machine suppliers must increase feeder density in traditional ways or new creative innovations to better serve the end user.
Technical Paper

Sponsor

The "Fried Egg" Effect in Soldering
Burnt-on flux residue that is visible on the solder mask of PCBs after improper reflow settings produces significant challenges to the reliability of finished boards.
KYZEN

Issue with BGAs and SAC Balls After Switching to Low-Temp Solder Paste
If we switch to low temp solder paste, will we have issues with BGAs and SAC balls? We are trying to build a product with low temperature solder.
Board Talk

Effect of EPIG Plating Thicknesses on Solder Joint and Wire Bond Reliability
This study focuses on determining the effects of palladium and gold thicknesses to ensure dependable solder joints and wire bonds.
Technical Paper

Sponsor

Plasma Etch PE-Avenger
The PE-Avenger is an ultra low-cost entry level plasma cleaning system allowing more labs to utilize plasma. It's a low frequency plasma cleaner designed for surface activation and organics removal.
Plasma Etch

Improved Reliability of Jet Dispensable Polymeric Coating Material
The study compares a paste that barely passes SIR at 85C/85RH with polymeric material, Silicone conformal, and acrylic conformal coating.
Technical Paper

Essential Tools to Combat the Ingress of Counterfeit Materials
The tools to ensure that counterfeits are not polluting any given supply chain have not kept pace with the changing needs.
Technical Paper

Investigating the Metric 0201 Assembly Process
This paper will look at the challenges of assembling the M0201 component in a high-volume manufacturing environment.
Technical Paper

Sponsor

Removal/Milling of Underfilled Parts: AVX1000M
High precision milling with zero adjacent clearance. Auto laser height measurement of board and component. Learn more.
Air-Vac Engineering

Wet-Based vs. Dry-Based Cleaning
For automatic under-stencil cleaning there are many cleaning methods. What factors should we consider to select wet based cleaning versus dry based cleaning?
Board Talk

Lessons Learned While Investigating Microvia Reliability Failures
There has been an increasing number of reports concluding that stacked micro vias are failing preferentially when compared to an alternative staggered via design.
Technical Paper

Sponsor

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp

Thermal Cycle Fatigue Life of Low-Temperature Solders
Thermal cycling fatigue is one of the main reliability concerns for solder. For the introduction of low temperature solders with reflow peak temperatures below 200℃, their thermal cycle fatigue life must be characterized. This paper presents a multiple component type test and time to failure data for solder interconnects formed with low temperature solders for BGAs, QFNs, and SMR component types.
Technical Paper

Latest Industry News

North American PCB Bookings Surge in April as Sales Continue to Climb

New AI phase starting: Pegatron

This company builds the iPhone. Now it's launched an electric car.

Photonics: A Foundational Scaling Layer for AI-Era Computing

Redefining teaching in the AI era

MORE INDUSTRY NEWS

Sponsor

iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE

Sponsor

Unlock the Potential of Salvaged Devices
Component harvesting is a reliable method of electronic component reclamation, reducing e-waste and ensuring economic reuse for automated assembly.
BEST Inc.

"Yes, it's cold in here. We're having the company cryogenically frozen until the economy gets better."
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