Electronics Manufacturing and Electronics Assembly

Sponsor

X-Ray Inspection Verifies Quality of Complex PCBs
A Netherlands-based PCB supplier relies on real-time X-ray inspection to ensure the quality of HDI, hybrid, multi- layer, flex-rigid & other complex boards.
Glenbrook Technologies

Technical Papers

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

MORE TECHNICAL PAPERS

Ask the Experts

Maximum Allowable Time Prior to Washing When Using Water Soluble Paste

What's Causing Cloudy Conformal Coating

What Is Causing Slanted Pins After Reflow

Components Falling Off During Wave Soldering

ESD Ground Wire Gauge

Looking for Long-term Component Storage Options

Question About PPM Defect Rate for Reversed Packages

ESD and Humidification

MORE ASK THE EXPERTS

The Causes of Tiny Solder Balls After Reflow
We have been seeing tiny solder balls across our boards after reflow. It appears that the solder is exploding as the balls are in areas where there is no paste or components.
Board Talk

Rework and Reball Challenges for Wafer-Level Packages
The present work addresses the rework and reball challenges of a specific WLP case study, and suggests improvements for maintaining the true failure signature.
Technical Paper

Sponsor

Seven Facilities, One Trusted Source
Partner with the industry leader. Summit is trusted and proven, with 7 integrated facilities to load capacity—from fast-turn prototypes to scalable production requirements.
Summit Interconnect

Heterogeneous Integration Roadmap: Technology for Systems of the Future
The new Heterogeneous Integration Roadmap provides a long-term vision for the electronics industry, identifying future challenges and potential solutions.
Technical Paper

Reworkable Edgebond Applied Wafer-Level Chip-Scale Package
This paper presents data showing that localized distribution of recrystallized grains is an accurate indicator of solder joint life-cycle degradation and enhancement.
Technical Paper

Moisture Effects in Common Solderable RF Connector Dielectrics
The tendencies of commonly used RF connector polymeric materials to absorb and desorb moisture under various humidity and temperatures are characterized.
Technical Paper

Sponsor

Is My PCB Wash Concentration in Check
Evaluating wash concentration levels through varying testing methods can potentially save process time, reduce overall process costs, and increase cleaning efficacy on PBCs. Read more.
KYZEN

Issue with BGAs and SAC Balls After Switching to Low-Temp Solder Paste
If we switch to low temp solder paste, will we have issues with BGAs and SAC balls? We are trying to build a product with low temperature solder.
Board Talk

Effect of TIM Compression Loads on BGA Reliability
This work aims to provide guidance for the potential trade-offs between thermal performances and second level interconnect reliability.
Technical Paper

Sponsor

Micro Dispensing Technology Leader
DL Technology LLC develops customized dispensing needles and valves for the electronics assembly, industrial assembly, semiconductor packaging and medical industries.
DL Technology

Solder Paste Inspection Tools to Support Industry 4.0 & Package Scaling
This paper evaluates the current state of inline SPI tools from multiple vendors for solder paste measurement accuracy and capability.
Technical Paper

Compatibility and Mechanical Reliability in Low Temperature Soldering for BGA Components
This study investigated the mechanical shock reliability of various SAC and LTS ball-paste combinations, revealing key insights into LTS compatibility and performance. Building on previous research demonstrating superior thermal reliability for LTS ball components soldered with SAC paste.
Technical Paper

Second Round Robin Evaluation of iNEMI Creep Corrosion Qualification Test
The paper reports the results of the iNEMI creep corrosion qualification test and compares them to the first round robin test and recent mixed-flowing gas test results.
Technical Paper

Sponsor

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura

Reactivity of No-Clean Flux Trapped Under Bottom Terminated Components
As components reduce in size, the flux residue formation during the reflow soldering process is altered which can impact the reliability of the final assembly.
Technical Paper

Wet-Based vs. Dry-Based Cleaning
For automatic under-stencil cleaning there are many cleaning methods. What factors should we consider to select wet based cleaning versus dry based cleaning?
Board Talk

Sponsor

AI - Boost your factory's Intelligence
TRI's AI-powered Inspection Solutions to Boost your Production Line's Intelligence. TRI solutions include AI Repair Station, AI Algorithms, AI Training Tools, and more.
Test Research, Inc.

Influence of Salt Contamination and RH on Creep Corrosion of Immersion Silver
This study provides important insights into the impact of both minor and major contamination on creep corrosion, offering new perspectives on reliability in the field. We hope it will stimulate further research and practical applications in the electronics industry.
Technical Paper

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Sponsor

AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS

Sponsor

Reliable Solder Performance for Less Silver
Stop overpaying for silver. REL61 offers equivalent mechanical strength and thermal stability to SAC305 with a decade of field-proven success. Switch without the risk.
AIM Solder