Electronics Manufacturing and Electronics Assembly

Sponsor

The Industry Standard Solder Paste
Looking to Avoid the Void® and enhance SIR performance? Indium8.9HF is your proven, versatile and stable, no-clean, halogen-free, Pb-free solder paste solution.
Indium Corporation

Technical Papers

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

MORE TECHNICAL PAPERS

Ask the Experts

What Is Causing Slanted Pins After Reflow

Components Falling Off During Wave Soldering

ESD Ground Wire Gauge

Looking for Long-term Component Storage Options

Question About PPM Defect Rate for Reversed Packages

ESD and Humidification

SMT Target Component Placement

Old Components and Blow Holes

MORE ASK THE EXPERTS

Influence of Salt Contamination and RH on Creep Corrosion of Immersion Silver
This study provides important insights into the impact of both minor and major contamination on creep corrosion, offering new perspectives on reliability in the field. We hope it will stimulate further research and practical applications in the electronics industry.
Technical Paper

Modeling a SMT Line to Improve Throughput
With tools to model a large quantity of products and the impact of SMT line configurations, an electronics assembly plant can be analyzed to identify improvement opportunities.
Technical Paper

Sponsor

Significantly Reduce Silver-Driven Costs
REL61 is a proven alloy that slashes costs for mid-to-large manufacturers. Get better thermal stability and lower overhead with AIM’s global technical support.
AIM Solder

Connector Bowing During Reflow Process
I have a connector that is bowing during lead-free soldering. When the connector is put through an oven on its own no bowing takes place. What is causing this?
Board Talk

Component Density on Solder Joint Reliability Under Harsh Environment
In this study, degradation behavior of lead free solder joint was compared with mounted position and component density of vehicle engine control unit for excavator.
Technical Paper

Seeking Alternatives to Solvent Cleaning
We are using a mix of trichloroethylene and IPA for cleaning in the ratio of 10 to 90. We are looking to eliminate the use of trichloroethylene.
Board Talk

Sponsor

Safe and Effective Cleaning with 440-R
VOC-free stencil cleaning chemistry! Cleans any solder paste from any fine-pitch stencil when used as part of the Smart Sonic stencil cleaning process. Learn more.
Smart Sonic

An Investigation in Rinse Water Sustainability
This paper investigates options for improving sustainability in Class II and III manufacturing environments by studying options for reusing and/or recycling rinse water.
Technical Paper

New Interconnection for High Temperature Application: HotPowCon (HPC)
Interconnection technology is capable for resistant joints for SMT components, bigger dies, like MOSFETs or IGBTs and even large area substrates, like baseplate or heat sinks.
Technical Paper

Sponsor

Optimize Your Process on Full SMT Demo Line
Validate your process in our demo lab. Our full line—printing, P&P, reflow, and AOI—is ready to optimize your profile and prove performance. Send us your boards to start.
Heller Industries

NSOP Reduction for QFN RFIC Packages
NSOP failures are costly as the entire device is rejected if there is one such failure on any bond pad. The paper presents some of the failure modes.
Technical Paper

Selective Soldering Design for Reliability Using a Novel Test Board and SIR Test Method
The purpose of this research is to develop a test method designed to evaluate the electrochemical reliability of the selective soldering process at the assembly site.
Technical Paper

Improving Efficiency of Through-Hole PCBAs
We are trying to improve the efficiency of the through-hole of our mixed tech, surface mount through-hole PCBAs. What are our options?
Board Talk

Sponsor

Latest 3D AOI System from Viscom
iS6059 PCB Inspection Plus. Its new and faster sensor technology, data processing and analysis functions all stand for the best 3D AOI performance that meets the highest requirements.
Viscom

Solder-Joint Reliability of a 0.65 mm Pitch Molded Array Package for Automotive
The primary objective of this study was to baseline the solder-joint thermal fatigue life for the POR (plan of record) package.
Technical Paper

Fatigue and Shear Properties of High Reliable Solder Joints
In this study, individual high-reliability SnAgCu based solder joints (Innolot, MaxRel, Ecolloy) were tested to investigate their shear and fatigue properties.
Technical Paper

Sponsor

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp

Advanced in Packaging for Emerging Technologies
A review about latest advances in packaging and drivers for the development of novel packaging technologies will be given in this paper.
Technical Paper

Latest Industry News

Multi-Location Inventory Management for Electronics Manufacturers

VIEWPOINT 2026: Jesper Lykke, CEO, Viscom Inc.

Worldwide Smartphone Market to Decline 13% in 2026, Marking the Largest Drop Ever Due to the Memory Shortage Crisis, according to IDC

'Silent failure at scale': The AI risk that can tip the business world into disorder

Google is building a Minnesota data center powered by wind, solar, and rust

MORE INDUSTRY NEWS

Sponsor

EZ-FLO High Precision Ceramic Dispense Tips
The ceramic molding process allows for smaller more precise inner diameters with a glass-like finish, giving you the ultimate control. Learn more.
DL Technology

Sponsor

Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron