Electronics Manufacturing and Electronics Assembly

Sponsor

PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies

Technical Papers

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

MORE TECHNICAL PAPERS

Ask the Experts

Pre-bake in a Vacuum

Critical Part Fixture During Reflow

Causes of Annular Ring Dewetting

Class 2 vs. Class 3

Challenges Placing RF Shields During SMT Assembly

3D AOI Solder Joint Qualification Parameters

Solder Contamination Sources

Removal of Non-functional Pads from Inner Layers

MORE ASK THE EXPERTS

How to Cost a Board
My boss has asked me to provide a cost matrix so we can quickly quote labor machine time component for the SMT board assembly.
Board Talk

Restoration of Lead-Free Bismuth Containing Solder Joints
Bismuth (Bi)-containing solder alloys have emerged as prime candidates to replace traditional lead (Pb)-free alloys such as SAC 305 (Sn-3.0Ag-0.5Cu).
Technical Paper

Sponsor

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura

10 Cloud-based PCB Designing Tools for Remote Work
We have categorized together 10 of the best software tools for PCB outlook for electronics engineers – to buy you time while you are working on your projects.
Technical Paper

ENIG Nickel Corrosion on Wetting Balance Test Results and Intermetallic Formation
This paper attempts to further clarify the effects of nickel corrosion on solder wetting balance test results and the resultant intermetallic formed.
Technical Paper

Sensors and Process-Performance Interactions for Additive In-Mold Electronics
The study explored printed electronics' suitability for in-mold electronic circuits. The study explored the effects of print parameter variations of direct ink write systems on the final thermoformed traces on PETG, PC, and HIPS samples.
Technical Paper

Sponsor

SEHO makes production lines smarter
Improve your work flow and reduce manufacturing costs with creative ideas and innovative solutions for automation, board handling and material management.
SEHO Systems GmbH

Flux Residue Causing Test Issues
We are having issues with flux residues. After wave, we experience many incomplete readings due to flux residues on connector pins.
Board Talk

Understanding PCB Design Variables That Contribute to Warpage
To improve attachment yield rates, an evaluation several PCB design variables that are believed to contribute to warpage during reflow is proposed.
Technical Paper

Sponsor

Contaminant Removal with Plasma
Plasma provides organics removal and other benefits to increase bond strength! Many chamber sizes available, all with a low environmental impact. Learn more.
Plasma Etch

Overcoming Solder Icicling and Copper Wire Dissolution
Dip soldering remains a common attachment method due to its simplicity, robustness, uniformity and low cost for a number of applications.
Technical Paper

Discrete Event Simulation in Electronics Manufacturing Operations
This paper will provide an overview of discrete event simulation in general, explain the different types of model taxonomy used in academia and industry.
Technical Paper

Fill the Void V - Mitigation of Voiding for Bottom Terminated Components
Voiding in solder joints is a complex issue. This paper focuses on solutions to voiding for commonly used bottom terminated components (BTCs).
Technical Paper

Sponsor

Rework/Removal of Underfilled Parts AVX250/1000M
High precision milling with zero adjacent clearance. Auto laser height measurement of board and component. Learn more.
Air-Vac Engineering

Variations in SAC 305 Solder
We use SAC 305 bar solder. We want to use a different supplier. Can we mix the new solder in with the current solder in our wave soldering systems?
Board Talk

The Origins of Silicon Valley: Why and How It Got Started
The Valley, synonymous with semiconductors, personal computers, and software, was a hub for innovation before the rise of personal computing, or even the transistor.
Technical Paper

Sponsor

Pioneering 3D X-ray Inspection for Flat Assemblies
Viscom is setting a new standard for high-precision inline X-ray inspection of printed circuit boards with its iX7059 product line. Learn more.
Viscom

Can Tape Residue Contaminate a Clean Tank?
We leave masking and Kapton tapes that fall off during cleaning in the bottom of our wash tank. Can the adhesives contaminate the recycled solution? Jim Hall and Phil Zarrow, The Assembly Brothers, address these question and share their own experiences.
Board Talk

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Waymo Dominates California AV Test Data

Hon Hai injects new funds into US unit, said to be AI server related

The Next Evolution of Hard Drives Could Be Even More Sci-Fi Than We Thought

Apple's crackdown on AI apps puts it on the wrong side of history

The AI Race Isn't About Intelligence Anymore — It's About Getting Things Done

MORE INDUSTRY NEWS

Sponsor

5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.

Sponsor

Fast PCBs, Fully Assembled
Need it fast? Summit delivers quick-turn PCB fabrication and assembly on compressed timelines—no shortcuts, just speed and precision from one source.
Summit Interconnect