Electronics Manufacturing and Electronics Assembly

Sponsor

Refurbished and Demo X-ray Inspection Systems
2024 Demo JewelBox-70T X-ray System and 2024 Demo JewelBox-100T X-ray System Refurbished & Demo Systems on sale with warranty. Learn more.
Glenbrook Technologies

Technical Papers

Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education

Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

MORE TECHNICAL PAPERS

Ask the Experts

Shelf Life Limit for Soldering Old Components

Trays for MLS Baking

Controlling Creep Corrosion

Design Considerations and Impact on Assembly

BGA Placement Paste or Only Flux

BGA BAll Sheer Testing

Hand Soldering at Low Temperature

Spotting After DI Water Cleaning

MORE ASK THE EXPERTS

Reducing Dust Deposition on Electronic Equipment
This work focuses on one aspect of reducing dust accumulation on electronic equipment, specifically by optimizing the cooling air flow.
Technical Paper

Limitations of ROSE Testing Versus Localized Contamination
Recognizing the limitations of ROSE testing versus localized contamination, what can I use to validate the cleanliness of my finished product?
Board Talk

Sponsor

Your Domestic PCB Solution
Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on.
Summit Interconnect

Effect of Matte-Sn Electroplating on Reliability of Lead-free Solder Joints
This study analyzes the impact of electroplating parameters of matte-Sn terminal layer on the thermo-mechanical reliability of solder joints.
Technical Paper

Beyond the Technical Data Sheet
This paper examines process changes and the material properties or performance of polymer composites used in semiconductor packaging and board assembly.
Technical Paper

Reliability of Copper, Gold, Silver and PCC Wirebonds Under Operation
In this paper, a detailed study of the electrical and mechanical degradation of wirebonds under high temperature exposure is presented.
Technical Paper

Sponsor

Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.

Adiabatic & Isothermal Humidification for Electronics Manufacturing
The need for including humidification into a well-rounded electronics manufacturing facilities’ ESD program is discussed.
Technical Paper

Maximum Board Temperature During Tin-Lead
IPC discusses the maximum top-side board temperature for BGAs to be 150 degrees C during a tin-lead wave solder. How is this temperature was determined?
Board Talk

Sponsor

Precision Thermal Control for High-Reliability SMT
Achieve ultra-uniform temperature control with low mass heater technology. Perfect your soldering profiles and save floor space with our compact, high-efficiency systems.
Heller Industries

Impact of BGA Escape Trace Design on Performance of Solder Joint
In this paper, a comprehensive study is presented to demonstrate the impact of different BGA escaping trace design cases on solder joint reliability.
Technical Paper

The Convergence of Technologies and Standards
The Vertical Segments of the Electronic Products Manufacturing Industry are converging and service offerings are consolidating due to advanced technology adoption and market dynamics. The convergence will cause shifts in the flow of materials across the supply chain as well as the introduction of equipment and processes across the segments.
Technical Paper

Board Level Reliability Testing of RF Packages
The paper presents a summary of board level reliability test performed on RF packages, the assembly process, mechanical and environmental tests, and understanding failures.
Technical Paper

Sponsor

Cut SAC305 Costs with REL61TM Lead–Free Alloy
Silver prices have tripled. While silver is 2/3 of SAC305's cost, it's only 1/4 of REL61. Save hundreds of thousands annually with this proven, drop-in alternative.
AIM Solder

Finite Element Analysis of Tin-Bismuth Electromigration of Solder Joints
This paper is based on the planar solder joint approach which affords non-destructive real-time monitoring of the solder joint microstructure in a scanning electron microscope.
Technical Paper

Probe Contact Issues with No-Clean Pin-in-Paste
We are having issues with our no-clean pin in paste process caused by flux residue on the surface of the solder joint. Should all flux vaporize off during reflow?
Board Talk

Sponsor

EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
DL Technology

De-Ionized Water Affected By the Atmosphere
Resistivity readers of the de-ionized water are above 15 megohms. Resistivity results of the samples tested by the outside lab have been approximately 1 megohm.
Board Talk

Latest Industry News

Supply Chain Thinks iPhone Fold Will Ship in 2027, Not 2026

China Has Made A Supercomputer Work Without A GPU — Here's How

Intel begins production of most-advanced chip, inching closer to possible Apple deal

Qualcomm wants to be the chip inside whatever replaces your smartphone, and it just announced two products toward that end

Poland pursues Taiwan investments to end role as assembly hub

MORE INDUSTRY NEWS

Sponsor

Want High-Quality BGA Reballing?
BGA rework and reballing solutions for commercial, military and aerospace perfected over 20-plus years of reliable, repeatable and proven success.
BEST Inc.

Sponsor

Safe and Effective Cleaning with 440-R
Not consumed during the stencil cleaning process so there is no need to monitor concentration. Simply replace with fresh solution every 4-6 weeks. Learn more.
Smart Sonic