Electronics Manufacturing and Electronics Assembly

Sponsor

Catch Defects Before They Cost You
3D AOI analyzes true solder height, contour, and volume to expose defects 2D systems miss—reducing false calls, rework, and escapes on ultra-compact components.
Manncorp Inc.

Technical Papers

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

MORE TECHNICAL PAPERS

Ask the Experts

ESD Ground Wire Gauge

Looking for Long-term Component Storage Options

Question About PPM Defect Rate for Reversed Packages

ESD and Humidification

SMT Target Component Placement

Old Components and Blow Holes

Pin in Paste Solder Dropping

Reusing recovered solder paste

MORE ASK THE EXPERTS

Selective Soldering Design for Reliability Using a Novel Test Board and SIR Test Method
The purpose of this research is to develop a test method designed to evaluate the electrochemical reliability of the selective soldering process at the assembly site.
Technical Paper

Improving Efficiency of Through-Hole PCBAs
We are trying to improve the efficiency of the through-hole of our mixed tech, surface mount through-hole PCBAs. What are our options?
Board Talk

Sponsor

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS

Solder-Joint Reliability of a 0.65 mm Pitch Molded Array Package for Automotive
The primary objective of this study was to baseline the solder-joint thermal fatigue life for the POR (plan of record) package.
Technical Paper

Fatigue and Shear Properties of High Reliable Solder Joints
In this study, individual high-reliability SnAgCu based solder joints (Innolot, MaxRel, Ecolloy) were tested to investigate their shear and fatigue properties.
Technical Paper

Advanced in Packaging for Emerging Technologies
A review about latest advances in packaging and drivers for the development of novel packaging technologies will be given in this paper.
Technical Paper

Sponsor

Your Domestic PCB Solution
Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on.
Summit Interconnect

Analysis of Mechanism About Data Retention Characteristic in TANOS Structure
The long-term evaluation of TANOS structure is investigated and the prediction of retention characteristic can be evaluated through the accelerated tests.
Technical Paper

Solder Boards Not Holding Up to Shock Testing
We are using a vapor phase oven. We have experienced problems with a no-lead BGA that has low silver solder balls. The solder boards do not hold up to shock testing.
Board Talk

Sponsor

Corrosion, UV Protection for Power Transmission
Moisture, corrosive gas, oxidation & UV blocking prop-erties. FLUOROSEAL® confor-mal coating for electrical contacts & ceramic insulator protection.
AI Technology, Inc.

Evaluation of High Speed Plating for Copper Post with Flat Top Shape
In developing high-speed electro “copper post” plating bath the shape of the post and the uniformity of the post height throughout the wafer were considered.
Technical Paper

The Impact of Harsh Environments and Ionic Contamination on Post-Reflow Circuit Assemblies
Modern electronic assemblies are far more susceptible to this phenomenon. Among the critical issues affecting these assemblies is ionic contamination, which can lead to a series of deleterious processes, including electrochemical migration (ECM).
Technical Paper

The Impact of VIA and Pad Design on QFN Assembly
This paper discusses the impact of the via size and design on QFN voiding and solder protrusion. Do small vias prevent the solder from flowing onto the other side?
Technical Paper

Sponsor

How to Simplify Solder Paste Printing
StikNPeel removable rework stencils simplifies selective printing of solder paste leaving no residue providing cleaner alternative to metal stencils.
BEST Inc.

Advances in Power Electronics
This paper details some of the recent advances in power electronics systems and details some of the challenges that need to be overcome.
Technical Paper

Common PCB Design Decisions that Cause Manufacturing Problems
What are the most common design decisions that can have a negative impact on the PCB assembly manufacture and how could we correct them during the design? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this scenario and share their suggestions.
Board Talk

Sponsor

Micro Dispensing Technology White Paper
The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size.
DL Technology

Adding OSP to Pads that are Missing ENIG Plating Process
A fabricator notified us that during the ENIG plating process, several pads had been “skipped”. The fabricator would like to add OSP to the pads that are missing the ENIG.
Board Talk

Latest Industry News

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VIEWPOINT 2026: Travis Loving, CEO, ScanCAD International, Inc.

How China plans to dominate global trade long after Trump

US grid battery storage hits record, even as clean energy incentives are rolled back

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MORE INDUSTRY NEWS

Sponsor

Unitech PCB Cleaners
The basic PCB cleaning equipment from Unitech Corp., includes a large surface vacuum that sucks up dust and particles, a small brush to pick up dirt and a soft cloth for wiping down.
Seika

Sponsor

You need clear soldering results?
The SEHO PowerVision AOI system is for fast, automated optical inspection. Designed for THT processes & focusses on 2 points: Continuous quality assurance & cost-efficient production processes.
SEHO Systems GmbH