Electronics Manufacturing and Electronics Assembly

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Your Domestic PCB Solution
Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on.
Summit Interconnect

Technical Papers

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

Understanding Solder Dross: Causes and Control Strategies

MORE TECHNICAL PAPERS

Ask the Experts

Pick Performance for SMT Placement Machines

Overlap Solder Joint Failures

How to Re-qualify BGA Spheres

Pick and Place Machine Calibration

Components Falling Off During Reflow

Solder Balling Prediction Formula

Dendritic Growth and Contamination at BGA Sites

Removal of Coatings from PCBs

MORE ASK THE EXPERTS

Risk Mitigation in Hand Soldering
A new validation technology in concert with visual inspection represents a change to the status quo in hand soldering.
Technical Paper

Process Optimization for Fine Feature Solder Paste Dispensing
In this paper the authors evaluate variables in the solder paste dispensing process, and review the impact on dispense quality of the solder paste.
Technical Paper

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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura

Flowers of Sulfur Creep Corrosion Testing of Populated PCBs
Creep corrosion testing of printed circuit boards using a specially designed flowers of sulfur chamber has been pioneered by an iNEMI technical committee.
Technical Paper

The Best Storage Method to Protect Against Corrosion
Which storage method will better protect against corrosion, nitrogen or super dry? You want to do it in compliance with IPC 1602, which covers storage and handling of circuit boards.
Board Talk

Risks Using Flux Only for Soldering BGAs
What are the risks using flux only versus solder paste for placing BGAs in a hybrid lead-free environment? Why would you only use flux, why not solder paste?
Board Talk

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Want High-Reliability BGA Service?
BGA rework and reballing solutions for commercial, military and aerospace perfected over 20-plus years of reliable, repeatable and proven success.
BEST Inc.

Investigation into Lead-Free Low Silver Solder Wire for Electronics
This paper show results using a lead-free solder rework wire alloy in terms of wetting, reduced solder iron tip erosion, reduced IMC growth and reliability.
Technical Paper

Solder Composition, Surface Finish and Solder Joint Volume on Drop Shock Reliability
Five Pb-free solder alloys on two PCB surface finishes were evaluated for drop shock reliability with two different solder joint volumes (LGA and BGA).
Technical Paper

Sponsor

Malcom Paste Mixers
Unlike hand mixing, the Malcom SPS Solder Paste Mixer is a non-contaminating mixer which utilizes pseudo planetary motion to stir the solder paste. The SPS-1 provides uniform consistency.
Seika

Optimization of Stencil Apertures to Compensate for Scooping
This study investigates the scooping effect during solder paste printing as a function of aperture width, aperture length and squeegee pressure.
Technical Paper

Embracing a New Paradigm: Electronic Work Instructions (EWI)
To stay competitive in today's evolving global marketplace, manufacturing must recognize and embrace the new EWI paradigm.
Technical Paper

Gooey Flux Residue Left Behind
After selective soldering connectors there is a small amount of no-clean flux residue left behind. How can I judge how much flux residue can be left behind?
Board Talk

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Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
ECD

Fill the Void II: An Investigation into Methods of Reducing Voiding
This paper is a continuation of previous work on voiding. The voiding results are summarized and recommendations made for reduction of voiding.
Technical Paper

Hand Printing using Nanocoated and other High End Stencil Materials
This study details the effectiveness of nanocoating materials, high end stainless steel stencil materials, as they relate to the manual SMT printing.
Technical Paper

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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp

Young Laplace Equation Reveals New Possibilities Thermal Pad Design
This paper shows how the application of the Young-Laplace equation can lead to an understanding of the soldering process of exposed pads and heat slugs.
Technical Paper

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Sponsor

EZ-FLO High Precision Ceramic Dispense Tips
The ceramic molding process allows for smaller more precise inner diameters with a glass-like finish, giving you the ultimate control. Learn more.
DL Technology

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Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS

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