Electronics Manufacturing and Electronics Assembly

Sponsor

Solve Pad-to-Component Mismatch Without Scrapping Your Assembly
Pad-to-part mismatches can derail production and challenge IPC compliance. The right rework approach can restore reliability and keep builds on track.
Circuit Technology Center

Technical Papers

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

MORE TECHNICAL PAPERS

Ask the Experts

Baking Old PCBs Prior To Reflow

D-PAK With Exposed Copper

Cleanliness Testing

Hand Sanitizer Contamination

Epoxy Wicking up Wire Insulation

Out-gassing and Cleaning

Contamination From Anti-static Foam

Organic Flux Residue Concerns

MORE ASK THE EXPERTS

Hand Soldering Reliability
What are the differences in reliability for SMT machine placement followed by reflow vs. hand placement followed by hand soldering in surface mount?
Board Talk

AI-Powered Real-Time Inspection for Electronic Component Assembly
This paper introduces enhancing the quality of electronic component assembly through real-time, inline inspection utilizing AI-powered deep learning techniques.
Technical Paper

Sponsor

IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
Alltemated

Acid Copper Electroplating Processes for Flash Etching
The focus of this study was to investigate the underlying mechanism of V-pitting and to develop a process to withstand or resist the pitting.
Technical Paper

Solder Mask and Low Standoff Component Cleaning – A Connection?
For this study, the authors wanted to assess the impact of different solder mask options on under component cleanliness.
Technical Paper

Investigation of Copper Sinter Material for Die Attach
3 copper powders were tested for their feasibility to use as die attach material for pressure sintering process without prior treatment with reducing agents.
Technical Paper

Sponsor

Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering

Does HASL or ENIG Reduce Creep Corrosion in Corrosive Environments?
We make electronics equipment used in corrosive environments. Do you recommend the use of HASL versus immersion gold for our application? The Assembly Brothers, Phil Zarrow and Jim Hall, answer this question.
Board Talk

Developments of the X-ray Inspection Technology for PCBAs
This paper provides an overview of some of the latest technical developments in the X-ray inspection technology for the electronics industry.
Technical Paper

Sponsor

Drop-in SAC305 Alternative: Try REL61
Upgrade your alloy without the downtime. REL61 requires no pot cleaning and your SAC305 scrap value often covers the cost of the changeover. Optimize your process today.
AIM Solder

Structural Electronics for Automotive Interiors
This project evaluates structural electronics for automotive interior use. The car interior application is back-seat-control-panel and the structural electronics.
Technical Paper

Cu Conductive Paste as Via Filling Materials for Various Substrates
In this study, we developed a Cu paste that can be used as a filling material for through silicon via (TSV), through glass via (TGV), and organic substrates.
Technical Paper

The Effect of Sb and Ag Addition on the Behavior of Sn-Bi LTS
This study focuses on the changes in melting and solidification behavior of near-eutectic Sn-Bi alloys with Sb (0.5-2wt%) and Ag (0-1wt%) additions.
Technical Paper

Sponsor

Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.

Opens With Assembled QFN Components
We are experiencing opens on assembled QFN components at a rate of 9%. The failure only appears in rows near the component center. What is happening?
Board Talk

Miniaturization of Hearing Aid Electronics Using Embedded Die Packaging
This paper examines the use of second generation embedded die packaging to drive further size reduction in custom hearing instruments.
Technical Paper

Sponsor

Sawa Ecobrid Fully Automatic Stencil Cleaner
This cleaner has 2 ultrasonic cleaning head panels for cleaning the front & back sides together. Ultrasonic energy is applied directly to the stencil.
Seika

AI to Predict Compatibility Between Solder Paste Residues and Coatings
This paper shows how AI is used to predict compatibility results between solder paste residues and coatings. A physical compatibility study is carried out to benchmark some combinations of solder pastes and coatings of the market. Results between AI prediction and the physical tests are compared to choose the right AI model for a good prediction of the compatibilities.
Technical Paper

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MORE INDUSTRY NEWS

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Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
ECD

Sponsor

Automation in Transition
The world of automation is changing. What does this mean for customers? And what impact is the transformation having on providers? Find out more from a panel of experts.
SCHUNK

"It's your attitude, not your aptitude that determines your altitude. That's the philosophy that got me kicked out of pilot school."
Copyright © Randy Glasbergen