Technology for Optical Co-Packaging
A practical approach is to use optical transceiver submodules and to attach them onto the package substrate by soldering is discussed in this paper.
Technical Paper
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Seven Facilities, One Trusted Source
Partner with the industry leader. Summit is trusted and proven, with 7 integrated facilities to load capacity—from fast-turn prototypes to scalable production requirements.
Summit Interconnect
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Intrusive Soldering vs. Wave Solder
We are wave soldering with top and bottom side preheat. Would a pin in paste, or intrusive soldering, be a better option than wave soldering? The Assembly Brothers, Phil Zarrow and Jim Hall, address this question.
Board Talk
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Start Micro Dispensing Today
The DL Micro Valve is specifically designed for dispensing micro volumes of material in precise, repeatable patterns. Learn more about the DL Micro Valve.
DL Technology
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You need clear soldering results?
The SEHO PowerVision AOI system is for fast, automated optical inspection. Designed for THT processes & focusses on 2 points: Continuous quality assurance & cost-efficient production processes.
SEHO Systems GmbH
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Limits for HASL with Complex Products
What are the limits for the future with more complex products? HASL and the actual HASL process, hot air solder leveling, has been with us since the mid-70s.
Board Talk
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