Electronics Manufacturing and Electronics Assembly

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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS

Technical Papers

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

MORE TECHNICAL PAPERS

Ask the Experts

Critical Part Fixture During Reflow

Causes of Annular Ring Dewetting

Class 2 vs. Class 3

Challenges Placing RF Shields During SMT Assembly

3D AOI Solder Joint Qualification Parameters

Solder Contamination Sources

Removal of Non-functional Pads from Inner Layers

Components Jumping Around During Reflow

MORE ASK THE EXPERTS

Sensors and Process-Performance Interactions for Additive In-Mold Electronics
The study explored printed electronics' suitability for in-mold electronic circuits. The study explored the effects of print parameter variations of direct ink write systems on the final thermoformed traces on PETG, PC, and HIPS samples.
Technical Paper

Flux Residue Causing Test Issues
We are having issues with flux residues. After wave, we experience many incomplete readings due to flux residues on connector pins.
Board Talk

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Discover the power of vAI ProVision from Viscom
Create and optimize 3D AOI and AXI programs in minutes. vAI ProVision boosts inspection depth, quality, and speed. Viscom develops & produces premium inspection systems.
Viscom SE

Understanding PCB Design Variables That Contribute to Warpage
To improve attachment yield rates, an evaluation several PCB design variables that are believed to contribute to warpage during reflow is proposed.
Technical Paper

Overcoming Solder Icicling and Copper Wire Dissolution
Dip soldering remains a common attachment method due to its simplicity, robustness, uniformity and low cost for a number of applications.
Technical Paper

Discrete Event Simulation in Electronics Manufacturing Operations
This paper will provide an overview of discrete event simulation in general, explain the different types of model taxonomy used in academia and industry.
Technical Paper

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KYZEN

Fill the Void V - Mitigation of Voiding for Bottom Terminated Components
Voiding in solder joints is a complex issue. This paper focuses on solutions to voiding for commonly used bottom terminated components (BTCs).
Technical Paper

Variations in SAC 305 Solder
We use SAC 305 bar solder. We want to use a different supplier. Can we mix the new solder in with the current solder in our wave soldering systems?
Board Talk

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Reliable Solder Performance for Less Silver
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AIM Solder

The Origins of Silicon Valley: Why and How It Got Started
The Valley, synonymous with semiconductors, personal computers, and software, was a hub for innovation before the rise of personal computing, or even the transistor.
Technical Paper

Can Tape Residue Contaminate a Clean Tank?
We leave masking and Kapton tapes that fall off during cleaning in the bottom of our wash tank. Can the adhesives contaminate the recycled solution? Jim Hall and Phil Zarrow, The Assembly Brothers, address these question and share their own experiences.
Board Talk

PBGA Solder Stress Analyses Under Random Vibration
Large size commercially available plastic ball grid array chip packaging was tested and analyzed under random vibration to assess its application feasibility on satellite electronics.
Technical Paper

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You need clear soldering results?
The SEHO PowerVision AOI system is for fast, automated optical inspection. Designed for THT processes & focusses on 2 points: Continuous quality assurance & cost-efficient production processes.
SEHO Systems GmbH

Reliability Testing of Consumer Products
We will look at reliability testing of consumer products and which of these test and analytical tools can be used, and how they affect the product development process.
Technical Paper

Additive Manufactured Electronics for Next Generation Microelectronics
This paper will focus on interconnects fabricated using the AME method. Two material sets will be used to fabricate test devices for studying interconnects.
Technical Paper

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6 Common Mistakes of BGA Rework
BGA rework is one of the most challenging procedures you may need to master. Doing it right depends in large part on the skills and knowledge of the rework technician. Learn more ...
Circuit Technology Center

Void Reduction Method for BTC Using Exposed Via in Pad
The method explored in this paper regards the use of exposed via in pad. A dedicated test vehicle was designed for two types of QFN components.
Technical Paper

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The Industry Standard Solder Paste
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Indium Corporation

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Alltemated Inc.