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DRAM damage due to X-Ray Inspections Post PCB Assembly
This paper outlines several mitigation strategies for minimizing radiation dosage during X-ray inspections, particularly in the context of printed circuit boards (PCBs). One key observation is that the PCB itself acts as an effective shield, significantly reducing radiation exposure.
Technical Paper
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Understanding and Prediction of Bi Electromigration
This paper will review an effort to describe the expected microstructures in use case settings as well as a model to predict effective Bi boundary layer conditions created during current stress. The estimates will be compared with actual accelerated samples and the impacts of the current stress plus thermal aging on solder joint mechanical performance.
Technical Paper
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Enhance Your Hands-On Soldering Skills
Learn how IPC certified training workshops for operator and trainer levels can advance skills and knowledge of your personnel for TH and SMT assembly.
BEST Inc.
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Remove Underfilled BGAs Without the Risk
Heat-based removal methods can lead to cratering, substrate delamination, and more. Cold precision milling offers a safer solution for BGA removal.
Circuit Technology Center
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Toughened, Non-Drip Epoxy
Master Bond Supreme 121AOND is a toughened, heat curing adhesive for bonding and sealing applications that offers chemical resistance and a high glass transition temperature.
Master Bond
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Hand Soldering Reliability
What are the differences in reliability for SMT machine placement followed by reflow vs. hand placement followed by hand soldering in surface mount?
Board Talk
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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE
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