Electronics Manufacturing and Electronics Assembly

Sponsor

Improve BGA Rework Success with Proven Reballing Techniques
Successful BGA reballing depends on precision, process control, and attention to detail. Circuit Technology Center utlizies proven methods and techniques.
Circuit Technology Center

Technical Papers

Redesigning Material Logistics for High-Mix EMS Production

Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education

Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

MORE TECHNICAL PAPERS

Ask the Experts

Shielding Techniques When Removing Components Using Hot Air

Partially Visible or Hidden Solder Connections

Shelf Life Limit for Soldering Old Components

Trays for MLS Baking

Controlling Creep Corrosion

Design Considerations and Impact on Assembly

BGA Placement Paste or Only Flux

BGA BAll Sheer Testing

MORE ASK THE EXPERTS

The Maximum Allowable Compression Load Per Solder Interconnect
An attempt to identify the maximum quantitative allowable compression load per solder ball in a large component configuration with 600μm in solder ball diameter is investigated.
Technical Paper

Cleaning under Bottom Terminated Components
This paper demonstrates continuously detecting the proper quality of rinsing water and the status of chemical filters, which provide the required parameters.
Technical Paper

Sponsor

Is your PCB surface finish surviving the wash?
Aqueous cleaning can stain or strip ImSn, ImAg & ENIG finishes. Get test data on protecting surface finish integrity post-reflow.
ZESTRON Americas

When is it Time to Switch from Manual Assembly to Automation?
We are a new start-up assembling wireless sensors. All assembly is now manual. We are experiencing large reject rates due to hand soldering of components.
Board Talk

Thermal Fatigue Reliability of SAC305 due to Mixed Metallurgy Assembly
This study presents thermal fatigue data generated in thermal cycling for the case of BGA mixed metallurgy assembly.
Technical Paper

Additive Manufacturing for Next Generation Microwave Electronics
The paper will discuss the integration of 3D printing and inkjet printing fabrication technologies for microwave and millimeter-wave applications. With the recent advancements in 3D and inkjet printing technology, achieving resolution down to 50 um, it is feasible to fabricate electronic components and antennas operating in the millimeter-wave regime.
Technical Paper

Sponsor

Depaneling machine for separating circuit boards
SCHUNK offers solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling.
SCHUNK

Calibration of Tweezer Meters Enabling Sub 1 pF and Sub 10 nH
The importance of calibration for two-wire measurement setups is reaffirmed. For tweezer meters, this issue is critical due to the higher offset values, which can be as large as 19 nH.
Technical Paper

Copper Dissolution Testing Report for the Selected Pb-free Solder Alloys
This paper describes the approach for measuring the copper dissolution rates of five Pb-free solder alloys.
Technical Paper

Sponsor

440-R + Ultrasonics = Safe & Efficient Cleaning
Clean any type of solder paste in the same machine using 440-R-SMT Detergent. It is the one detergent that will do it all: stencils, pallets, misprints & SMD adhesives.
Smart Sonic

How Can We Prevent Our 0201 Nozzles From Clogging?
We have a formula stencil that had the apertures enlarged to maintain volume while overprinting the ends to keep solder away from the 0201 nozzle.
Board Talk

Soldering Relays Intrusively in Lead Free Process
We use intrusive reflow soldering on relays using a lead process. We are challenged to solder relays intrusively in a lead-free process.
Board Talk

Impact of Stencil Manufacturing Technology of Multi-level/ Step Stencils
In this paper, we evaluate and compare the print performance of four different step technologies: Chemically etched, Laser weld, Milled, and Electroform.
Technical Paper

Sponsor

Precision Control for BGA Rework
Vacuum sensing electronics provide control for gentle, automatic component removal while a non-contact site cleaning tip's height is accurately monitored and maintained.
Air-Vac Engineering

Electrical Plus Functional Testing in Designing Electronics for Harsh Conditions
This paper proposes a test method and vehicle to characterize soldering materials, assembly process steps, and conformal coating to determine reliability.
Technical Paper

Intermetallic Compounds in Solder Alloys: The Common Misconception
This paper describes the IMCs that occur typically in eutectic, Sn63Pb37, near-eutectic SAC305, and high-performance tin-based Pb-free solder alloys.
Technical Paper

Sponsor

Drop-in SAC305 Alternative: Try REL61TM lead-free alloy
Upgrade your alloy without the downtime. REL61 requires no pot cleaning and your SAC305 scrap value often covers the cost of the changeover. Optimize your process today.
AIM Solder

Reducing Dust Deposition on Electronic Equipment
This work focuses on one aspect of reducing dust accumulation on electronic equipment, specifically by optimizing the cooling air flow.
Technical Paper

Latest Industry News

Amazon's Newest Gambit: Selling AI Chips

EU pledges to diversify and de-risk from China

Why Did Apple Stop Using Stainless Steel For iPhones?

What does resilience even mean?

AI buildout gives tech investors new reasons to watch bond market

MORE INDUSTRY NEWS

Sponsor

What Would You Ask Proven Global Manufacturing Leaders?
In this 4-part series we asked about: Key Drivers of Success, Scaling Operations Effectively, AI in Manufacturing, and Tools to Empower Operations. No registration Required.
Intraratio

Sponsor

Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.