Electronics Manufacturing and Electronics Assembly

Sponsor

Solve Pad-to-Component Mismatch Without Scrapping Your Assembly
Pad-to-part mismatches can derail production and challenge IPC compliance. The right rework approach can restore reliability and keep builds on track.
Circuit Technology Center

Technical Papers

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

MORE TECHNICAL PAPERS

Ask the Experts

Baking Old PCBs Prior To Reflow

D-PAK With Exposed Copper

Cleanliness Testing

Hand Sanitizer Contamination

Epoxy Wicking up Wire Insulation

Out-gassing and Cleaning

Contamination From Anti-static Foam

Organic Flux Residue Concerns

MORE ASK THE EXPERTS

Understanding and Prediction of Bi Electromigration
This paper will review an effort to describe the expected microstructures in use case settings as well as a model to predict effective Bi boundary layer conditions created during current stress. The estimates will be compared with actual accelerated samples and the impacts of the current stress plus thermal aging on solder joint mechanical performance.
Technical Paper

Managing Thermomechanical Behaviour in Automotive Electronics
With high density interconnection designs, advanced packaging, localised self heating, sources of thermomechanical stress are introducing complex failures.
Technical Paper

Sponsor

IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
Alltemated

Cause of Long-Term Soldering Joint Cracking in Automotive Application
We are seeing field returns due to solder joint cracking on the pin of a 16-pin through-hole connector. What might be the cause of the joint cracking?
Board Talk

Developing a Low Palladium Activation System for Electroless Copper Deposition
This paper summarizes experiences gained while developing a new cost effective Palladium containing ionic activation system.
Technical Paper

AI-Powered Real-Time Inspection for Electronic Component Assembly
This paper introduces enhancing the quality of electronic component assembly through real-time, inline inspection utilizing AI-powered deep learning techniques.
Technical Paper

Sponsor

Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering

Acid Copper Electroplating Processes for Flash Etching
The focus of this study was to investigate the underlying mechanism of V-pitting and to develop a process to withstand or resist the pitting.
Technical Paper

Solder Mask and Low Standoff Component Cleaning – A Connection?
For this study, the authors wanted to assess the impact of different solder mask options on under component cleanliness.
Technical Paper

Sponsor

Drop-in SAC305 Alternative: Try REL61
Upgrade your alloy without the downtime. REL61 requires no pot cleaning and your SAC305 scrap value often covers the cost of the changeover. Optimize your process today.
AIM Solder

Hand Soldering Reliability
What are the differences in reliability for SMT machine placement followed by reflow vs. hand placement followed by hand soldering in surface mount?
Board Talk

Investigation of Copper Sinter Material for Die Attach
3 copper powders were tested for their feasibility to use as die attach material for pressure sintering process without prior treatment with reducing agents.
Technical Paper

Does HASL or ENIG Reduce Creep Corrosion in Corrosive Environments?
We make electronics equipment used in corrosive environments. Do you recommend the use of HASL versus immersion gold for our application? The Assembly Brothers, Phil Zarrow and Jim Hall, answer this question.
Board Talk

Sponsor

Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.

Developments of the X-ray Inspection Technology for PCBAs
This paper provides an overview of some of the latest technical developments in the X-ray inspection technology for the electronics industry.
Technical Paper

Structural Electronics for Automotive Interiors
This project evaluates structural electronics for automotive interior use. The car interior application is back-seat-control-panel and the structural electronics.
Technical Paper

Sponsor

Sawa Ecobrid Fully Automatic Stencil Cleaner
This cleaner has 2 ultrasonic cleaning head panels for cleaning the front & back sides together. Ultrasonic energy is applied directly to the stencil.
Seika

Cu Conductive Paste as Via Filling Materials for Various Substrates
In this study, we developed a Cu paste that can be used as a filling material for through silicon via (TSV), through glass via (TGV), and organic substrates.
Technical Paper

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Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
ECD

Sponsor

Automation in Transition
The world of automation is changing. What does this mean for customers? And what impact is the transformation having on providers? Find out more from a panel of experts.
SCHUNK

"It's your attitude, not your aptitude that determines your altitude. That's the philosophy that got me kicked out of pilot school."
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