Electronics Manufacturing and Electronics Assembly

Sponsor

U.S. Marines purchase JewelBox Ultra Compact for X-ray Inspection
The U.S. Marine Corps' 2d Maintenance Battalion has deployed a Glenbrook JewelBox Ultra Compact X-Ray Inspection Station, enabling advanced circuit board inspection and BGA repairs.
Glenbrook Technologies

Technical Papers

Flux-Free, Reliable, Efficient: Soldering with Formic Acid

Redesigning Material Logistics for High-Mix EMS Production

Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education

Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

MORE TECHNICAL PAPERS

Ask the Experts

How Many Fiducials Per Solder Paste Stencil?

Solder Alloy Investigation

Reliability Concerns When Converting to Lead-free

Contamination Using Solvent Dispensers

Mixed Process Solder Joint Appearance, Smooth or Grainy?

What Caused SMT Pads to Oxidize After Reflow

Viscosity of Solder Paste Before Printing

Solder Splashing During Wave Soldering

MORE ASK THE EXPERTS

Extending 3D MRS Sensor Technology to Address Challenging Applications
There is an increasing need for highly accurate 3D inspection and measurement capabilities for applications in SMT, semiconductor and metrology markets.
Technical Paper

High Performance Light and Moisture Dual Curable Encapsulant
This study is focused on liquid glop top encapsulants that are placed over the PCB components and wire bonds as a protective layer.
Technical Paper

Sponsor

Plasma Etch PE-Avenger
The PE-Avenger is an ultra low-cost entry level plasma cleaning system allowing more labs to utilize plasma. It's a low frequency plasma cleaner designed for surface activation and organics removal.
Plasma Etch

How to Set Up a Successful Blind Via Hole Fill DC Plating Process
Successful via fill plating requires a specific electrolyte; the copper concentration is as high 50 - 60 g/L copper with low sulfuric acid at 30 - 60 g/L.
Technical Paper

Risks Using Flux Only for Soldering BGAs
What are the risks using flux only versus solder paste for placing BGAs in a hybrid lead-free environment? Why would you only use flux, why not solder paste?
Board Talk

Gooey Flux Residue Left Behind
After selective soldering connectors there is a small amount of no-clean flux residue left behind. How can I judge how much flux residue can be left behind?
Board Talk

Sponsor

How to Simplify Solder Paste Printing
StikNPeel removable rework stencils simplifies selective printing of solder paste leaving no residue providing cleaner alternative to metal stencils.
BEST Inc.

Ultra Low Profile Copper Foil for Very Low Loss Material
A new almost no profile copper foil has been developed to achieve this property while maintaining a good adhesion with low loss resins. Electrodeposited copper foil production is divided in two steps. First, the foil is plated on a titanium drum from a copper sulfate solution. Then a treatment is applied to increase roughness and ensure oxidation resistance.
Technical Paper

Comparison of Contemporary Stencil Coatings and Under Wipe Solvents
The tests examined the effects of wiping on different sized packages, different wipe frequencies, and different wipe chemistries.
Technical Paper

Sponsor

High Temp & Chemical Resistant Epoxy
Master Bond EP62-1AO is an electrically insulating adhesive that withstands harsh chemical environments while delivering thermal conductivity. View full specs.
Master Bond

Establishing Design Rules for the Laser Depaneling of Printed Circuit Boards
This paper presents design guidelines for laser depaneling such as contour limitations as well as required channel widths and component distances to the cutting edge.
Technical Paper

Surface Finish Can Achieve Robustness Against Copper Creep Corrosion
We evaluate conventional surface finishes i.e., ENIG, ImmSn, HASL, OSP, and novel Ni-free surface finish for their robustness against creep corrosion.
Technical Paper

Requirements for Depaneling and Rescoring Boards with BGA Components
Are there any special requirements for depaneling and rescoring separate panel circuit boards if they contain BGA components?
Board Talk

Sponsor

Viscom at SMTA Michigan & Ohio
Join Viscom at SMTA Michigan (8/18/26) and Ohio (8/20/26) to discover the latest advancements in AOI and AXI inspection technology, including our powerful AI solutions.
Viscom SE

Homogeneous Low Temperature Soldering Technology
This paper presents key findings of enabling LTS technology on AMD’s Client BGA Packages using surface mount technology (SMT).
Technical Paper

The Basics of Metal Thermal Interface Materials (TIMS)
Advancements in metal patterning have improved the effectiveness of metal TIMs by improving their compressibility.
Technical Paper

Sponsor

What are your economic depaneling needs?
Our depaneling machines are high-performance machines for single circuit boards with electronic components. The cutting principles are fast, the best quality.
SCHUNK

Safeguarding Electrical Components with Nano-coating Technology
This study validates the use of plasma-deposited nano-coating layers in protecting against environments that pose significant challenges to electronics.
Technical Paper

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Sponsor

Eliminate Lead Tinning Issues Before They Become Reliability Failures
Learn lead tinning methods, causes of tinning defects, and solutions from the experts at Circuit Technology Center to help ensure dependable solder connections.
Circuit Technology Center

Sponsor

Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS