Electronics Manufacturing and Electronics Assembly

Sponsor

New SELECT Synchro soldering system
A multi-station selective soldering system that uses a unique, synchronous motion to increase throughput, improve cost-of-ownership, and provide flexibility for electronics manufacturers.
Nordson Electronics Solutions

Technical Papers

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

MORE TECHNICAL PAPERS

Ask the Experts

Concerns Replacing High Speed Components with No-Clean Solder

How to Remove Oxidization from SMT Component Leads?

Solder Ball Wrinkles

Assembly Question for Soldering USB Connectors

BGA Die and Pry Testing

Rise of Bismuth Levels in our Solder Pots

Inspection for Hidden Solder Joints

Solution for Warped PCBAs

MORE ASK THE EXPERTS

Seeking Alternatives to Solvent Cleaning
We are using a mix of trichloroethylene and IPA for cleaning in the ratio of 10 to 90. We are looking to eliminate the use of trichloroethylene.
Board Talk

Conformal Coatings - New Solutions to Existing Problems
This paper describes work carried out by Humiseal to investigate root causes of these problems, and to introduce materials with improved performance.
Technical Paper

Sponsor

Flexibilized LED Curable Adhesive System
Master Bond LED415DC90 is a one part, dual curing adhesive with excellent strength properties that is used to bond both similar and dissimilar substrates. Download the TDS.
Master Bond

Effects of Mixing Solder Sphere Alloys with Bismuth-Based Pastes
In this paper, the effect of mixing solder sphere alloys with Bi-based solder pastes on the component reliability in accelerated thermal cycling is studied.
Technical Paper

Hot Air BGA Rework with a Touchless Temperature-Dependent Process
The goal of this paper is to share complex rework process improvements to review and consider how incorporating into their practice can provide benefit.
Technical Paper

Solder Joint Performance Under Shock for ENIG and ENEPIG Surface Plated Tester
This paper discusses the results of a comparative study for solder joint performance - under shock - for ENIG and ENEPIG surface plated tester PCBs.
Technical Paper

Sponsor

Neutral Cleaning Tests. Reliable Decisions.
Compare cleaning systems for PCBAs independently and test under production-like conditions. Receive validated results and expert guidance. Request your cleaning tests now.
ZESTRON Europe

Improving Efficiency of Through-Hole PCBAs
We are trying to improve the efficiency of the through-hole of our mixed tech, surface mount through-hole PCBAs. What are our options?
Board Talk

Materials for Advanced Ball-Attach Processes for Advanced Packages
This paper will discuss advantages of advanced ball-attach materials developed to meet the challenges of advanced packaging.
Technical Paper

Sponsor

Your Domestic PCB Solution
Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on.
Summit Interconnect

Measuring the Impact of Test Methods for High-Frequency Circuit Materials
How can two different test methods provide Dk measurement that are different? When the methods measure the same circuit material in two different directions.
Technical Paper

Sustainability is Key for Material and Chemistry Choices
OEMs have started adopting sustainable materials and chemistry technologies for their electronics as a part of better ESG score rankings. Sustainability is becoming a key parameter for material and chemistry choices for the next generation electronics. The use of non-toxic options are being evaluated and preferred.
Technical Paper

Using Rheology as a Measurement Potentially Predictive Tool
The types of rheology measurements studied here show trends that mirror the print volume and volume reproduceability for three pastes.
Technical Paper

Sponsor

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp

Solder Boards Not Holding Up to Shock Testing
We are using a vapor phase oven. We have experienced problems with a no-lead BGA that has low silver solder balls. The solder boards do not hold up to shock testing.
Board Talk

Assessing Electronic Devices with 3D X-Ray Imaging and Electron Microscopy
This article presents workflows that combine 3D X-ray microscopy, nanoscale tomography, and electron microscopy for visualization of the interior of electronic devices.
Technical Paper

Sponsor

Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS

Feasibility of Plasmonic Circuits Merged with Silicon Integrated Circuits
Plasmonic signal transmission via nanoscale plasmonic waveguides is a technique with the potential to increase the information transfer capacity in silicon integrated circuits.
Technical Paper

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Sam Altman is "Delighted" His AI Jobs Apocalypse Prediction was Wrong

Three Signals Shaping the Next Era of the Electronics Industry

Dell wins a $9.7 billion Pentagon software deal after cozying up to Trump

CEOs Are Blaming AI for Layoffs. Nvidia's Jensen Huang Says That's a 'Lazy' Excuse.

Canada's University of Saskatchewan Acquires Quantum Computer

MORE INDUSTRY NEWS

Sponsor

Start Micro Dispensing Today
The DL Micro Valve is specifically designed for dispensing micro volumes of material in precise, repeatable patterns. Learn more about the DL Micro Valve.
DL Technology

Sponsor

SEHO makes production lines smarter
Improve your work flow and reduce manufacturing costs with creative ideas and innovative solutions for automation, board handling and material management.
SEHO Systems GmbH