Electronics Manufacturing and Electronics Assembly

Sponsor

Low Thermal Resistance Epoxy
Master Bond EP53TC is a thermally conductive, electrically insulating adhesive that combines good physical properties and the ability to transfer heat rapidly and effectively.
Master Bond

Technical Papers

Flux-Free, Reliable, Efficient: Soldering with Formic Acid

Redesigning Material Logistics for High-Mix EMS Production

Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education

Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

MORE TECHNICAL PAPERS

Ask the Experts

Question About IPC-6013 Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

Coils Rotated After Reflow

Stencil Pattern for Thermal Pads on QFNs

Component Shifting

What Is Causing Connectors to Bow?

Cleaning No-Clean Solder Paste

Solder Paste Alloy Check

Challenge Wetting Solder to Brass Pins

MORE ASK THE EXPERTS

Improving Reliability of High Performing PCB With Advanced Conformal Coating Use
The paper discusses a newly developed conformal coating system that meets the high performance, reliability and cycle time demand based on the hybrid polymer approach.
Technical Paper

Fine Pitch CU Pillar with Bond on Lead Assembly Challenges
A technology featuring Copper Pillar Bond-On-Lead (BOL) with Enhanced processes delivers cost effective, high performance packaging solution.
Technical Paper

Sponsor

What are your economic depaneling needs?
Our depaneling machines are high-performance machines for single circuit boards with electronic components. The cutting principles are fast, the best quality.
SCHUNK

Interconnect Mechanical Performance with Variable UBM and Decreasing Bump Size
Current work seeks to better understand how the indium (In) bump size affects the respective interface kinetics and subsequent mechanical properties.
Technical Paper

No-Clean Residue Shorts
We have a PCBA with a QFN 44 using no-clean flux. We have many test failures during testing. Are the failures due to flux reside between terminations? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk

Issues With SMT Component Alignment
During automatic optical inspection our chip components are shifting. This is not limited to single components and changes daily.
Board Talk

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Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
ECD

Industry 4.0 for Inspection in the Electronics Industry
This paper investigates how the connected at-line x-ray system can improve production yield and lower costs when connected to the production line.
Technical Paper

Conductive Cu Paste as a Via Filling Material for Through Glass Via (TGV)
We developed a Cu paste that can be used as a filling material for a through-glass via (TGV). A TGV substrate can be filled with Cu paste without voids.
Technical Paper

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Handheld Plasma Activation
Plug it in and start cleaning; no gas hookup! Versatile all-in-one solution you can take anywhere and activate almost anything in seconds! Learn more.
Plasma Etch

Pad-to-Pad Electrical Field Effects on Surface Insulation Resistance
In this paper, we examine the effect that various design factors of SIR test patterns has on the electric field on the surface of the PCB.
Technical Paper

Novel Lead-Free Solder Alloys Based on Sn-Ag-Cu-Sb
In this work, thermal performance of five Sn/3.2Ag/0.7Cu/xSb (x is in the range of 4.5 to 6.5 wt.%) alloys were compared to select the optimized Sb content.
Technical Paper

How To Strip Tin-Lead Solder From SMT Pads for RoHS
Is it possible to scrub the pads of a PCB to bring it back into compliance? 63-37 solder was mistakenly used to hand solder parts.
Board Talk

Sponsor

Defluxing Ultra-Fine Pitch CoW Devices? Read This.
DI water falls short on copper pillar packages. Get proven cleaning parameters for CoW devices with <25μm pitch in our white paper.
ZESTRON Americas

Technical Cleanliness Assessments to Reduce Manufacturing Defects
This paper will detail a Contamination Assessment Protocol that conforms to the guidelines in VDA19 Part 2 which will not only enable areas with the highest risk of contamination to be targeted for improvement measures but will also provide documentary evidence of the effect of any such improvements.
Technical Paper

A New X-Ray Source Technology for Demanding SMT Inspection
The paper contains data and images from Nano Focus tube, plus data from reliability and stability tests using a real-life system and not test rigs.
Technical Paper

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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp

Assembly Optimization for Thin Flip-Chip Chip-Scale Packages
In this study, PC board design and solder stencil designs are evaluated for board attach defectivity for core-less FCCSP packages. It is observed that with properly engineered package materials and mechanical configuration, as well as optimization of PC board pad design, a robust board assembly solution exists for thin FCCSP packages.
Technical Paper

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India Adds Pieces to Strengthen Its Electronics Supply Chain Puzzle

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MORE INDUSTRY NEWS

Sponsor

New SELECT Synchro soldering system
A multi-station selective soldering system that uses a unique, synchronous motion to increase throughput, improve cost-of-ownership, and provide flexibility for electronics manufacturers.
Nordson Electronics Solutions

Sponsor

Micro Dispensing Technology Leader
DL Technology LLC develops customized dispensing needles and valves for the electronics assembly, industrial assembly, semiconductor packaging and medical industries.
DL Technology