Electronics Manufacturing and Electronics Assembly

Sponsor

Gripping Systems from micro assembly to heavy lifting
The first industrial-suited grippers from SCHUNK were a milestone. Since then we have brought countless newly and further developments to market.
SCHUNK

Technical Papers

Flux-Free, Reliable, Efficient: Soldering with Formic Acid

Redesigning Material Logistics for High-Mix EMS Production

Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education

Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse

Digital Warehouse Automation in High-Mix PCB Assembly

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

MORE TECHNICAL PAPERS

Ask the Experts

Question About IPC-6013 Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

Coils Rotated After Reflow

Stencil Pattern for Thermal Pads on QFNs

Component Shifting

What Is Causing Connectors to Bow?

Cleaning No-Clean Solder Paste

Solder Paste Alloy Check

Challenge Wetting Solder to Brass Pins

MORE ASK THE EXPERTS

Issues With SMT Component Alignment
During automatic optical inspection our chip components are shifting. This is not limited to single components and changes daily.
Board Talk

Industry 4.0 for Inspection in the Electronics Industry
This paper investigates how the connected at-line x-ray system can improve production yield and lower costs when connected to the production line.
Technical Paper

Sponsor

Toughened, Non-Drip Epoxy
Master Bond Supreme 121AOND is a toughened, heat curing adhesive for bonding and sealing applications that offers chemical resistance and a high glass transition temperature.
Master Bond

Conductive Cu Paste as a Via Filling Material for Through Glass Via (TGV)
We developed a Cu paste that can be used as a filling material for a through-glass via (TGV). A TGV substrate can be filled with Cu paste without voids.
Technical Paper

Pad-to-Pad Electrical Field Effects on Surface Insulation Resistance
In this paper, we examine the effect that various design factors of SIR test patterns has on the electric field on the surface of the PCB.
Technical Paper

Novel Lead-Free Solder Alloys Based on Sn-Ag-Cu-Sb
In this work, thermal performance of five Sn/3.2Ag/0.7Cu/xSb (x is in the range of 4.5 to 6.5 wt.%) alloys were compared to select the optimized Sb content.
Technical Paper

Sponsor

EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
DL Technology

How To Strip Tin-Lead Solder From SMT Pads for RoHS
Is it possible to scrub the pads of a PCB to bring it back into compliance? 63-37 solder was mistakenly used to hand solder parts.
Board Talk

Technical Cleanliness Assessments to Reduce Manufacturing Defects
This paper will detail a Contamination Assessment Protocol that conforms to the guidelines in VDA19 Part 2 which will not only enable areas with the highest risk of contamination to be targeted for improvement measures but will also provide documentary evidence of the effect of any such improvements.
Technical Paper

Sponsor

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS

A New X-Ray Source Technology for Demanding SMT Inspection
The paper contains data and images from Nano Focus tube, plus data from reliability and stability tests using a real-life system and not test rigs.
Technical Paper

Assembly Optimization for Thin Flip-Chip Chip-Scale Packages
In this study, PC board design and solder stencil designs are evaluated for board attach defectivity for core-less FCCSP packages. It is observed that with properly engineered package materials and mechanical configuration, as well as optimization of PC board pad design, a robust board assembly solution exists for thin FCCSP packages.
Technical Paper

Non-Toxic Stabilization for Mixed Reaction Gold
In this paper a novel gold electrolyte with autocatalytic properties is introduced. It is capable of depositing high layer thicknesses and defect-free ENIG deposits.
Technical Paper

Sponsor

Viscom at SMTA Michigan & Ohio
Join Viscom at SMTA Michigan (8/18/26) and Ohio (8/20/26) to discover the latest advancements in AOI and AXI inspection technology, including our powerful AI solutions.
Viscom SE

Causes of Blowholes
Are old components such as resistors and circuit breakers more likely to cause blowholes during wave soldering compared to newer components?
Board Talk

Fluxless Reflow Technology for Fine-Pitch and SMT-Level Component Attach
The objective to be discussed in this paper is to determine a solution for component attach in a formic acid environment with the appropriate combination of soldering material and equipment.
Technical Paper

Sponsor

TIM1 for EV Battery Thermal Management
AIT's thermal adhesives, grease-gels, & gum-pads offer proven thermal dissipation for a balance of strength, rework ability, & recyclability of EV battery packs.
AI Technology, Inc.

Beyond ECM Additional Reasons for Cleaning Circuit Assemblies
The level of importance of a clean circuit assembly has been demoted. How did the cleanliness of circuit assemblies, once required, get shoved aside?
Technical Paper

Latest Industry News

Probabilistic Computing Is Already Here; Here Is How It Works

From Prototype to Product: Why E-Textile Standards Matter

How Nidec Is Rethinking Gear Design for Humanoid and Mobile Robots

When Career Risks Are Worth Taking

IBM's stock just had its worst day since 1968

MORE INDUSTRY NEWS

Sponsor

Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering

Sponsor

High power atmospheric plasma system
Our 1000 Atmospheric Plasma System is available with PC or PLC control for lab or high speed production use with the same high powered systems. Remove contaminants and increase bond strength!
Plasma Etch

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