Technical Papers
First Principles of Solder Reflow
Stencil Printing 008004/0201 Aperture Components
Streamline & Improve Conformal Coating Results with Inline Inspection
Extending the Golden Hour in the SMT Assembly Line
High-Performance, Light and Moisture Dual-Cure Automotive Conformal Coating
11 Ways to Get Your PCBs Faster
Best Practices for Disinfecting for COVID-19 of Electronic Products & Assemblies
5G is Turning up the Heat
MORE TECHNICAL PAPERS
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
MORE ASK THE EXPERTS
Latest Industry News
Foxconn to Shift Some Apple Production to Vietnam
GM Opens Up a New Front in Its Battle With Tesla: Batteries
Chinese handset vendors keenly building up inventory
Apple suppliers' exodus from China won't slow down under Biden
Exposing Apple Mini M1 SoC
Taiwan PC monitor shipments to drop in 4Q20, says Digitimes Research
The Best Smartphones
Autonomous Vehicle Software Analyzes and Predicts Driving Events
MORE INDUSTRY NEWS
December 1, 2020
Modify Rework Procedures for Assemblies Fabricated Using OSP?
Modify Rework Procedures for Assemblies Fabricated Using OSP?
Should we modify any rework or repair procedures for circuit board assemblies fabricated using OSP, organic solderability preservatives, bare boards? Jim Hall and Phil Zarrow, the Assembly Brothers, share their own thoughts on this scenario.
Board Talk
Early Design Review of Boundary Scan To Enhancing Testability
Paper reviews what portions of a design can be covered structurally and what are covered functionally, to provide the best diagnostics to discover faults?
Production Floor
6G Mobile Communications to Utilize AI to Control Devices
6G Mobile Communications to Utilize AI to Control Devices
The 6th generation of mobile communications promises higher data rates, shorter latency, and increased densities of terminal devices..
Technology Briefing
Fatigue and Shear Properties of High Reliable Solder Joints
In this study, individual high-reliability SnAgCu based solder joints (Innolot, MaxRel, Ecolloy) were tested to investigate their shear and fatigue properties.
Analysis Lab
Liquid Dispensed Thermal Materials for High Volume Manufacturing
Liquid Dispensed Thermal Materials for High Volume Manufacturing
This paper presents the science behind liquid TIMs identifies key TIM characteristics needed to design and manufacture reliably and efficiently.
Materials Tech
Effect of Process Changes and Flux on Mid-Chip Solder Balling
Paper documents experimental work performed to understand the impact on mid-chip solder balling from the manufacturing process and flux chemistry.
Production Floor
Effect of Fine Lead-Free Solder Powder on the Reflow Property Pastes
This paper evaluates the effect of particle size distribution and oxidation on the reflow performance of solder paste.
Analysis Lab
What Causes Solder Icicles During Wave Soldering
What Causes Solder Icicles During Wave Soldering
Why are we getting solder icicles on some leads when we run boards in our wave solder machine? Where should be look first to change our process?
Board Talk
Embedded Fibers Enhance Nano-Scale Interconnections
This paper introduces the use of embedded fibers in the interconnections of chip-to-chip and chip-to-package components.
Materials Tech
Reduce Energy Loss in Electric Vehicles
Reduce Energy Loss in Electric Vehicles
A new technology has the potential to revolutionize energy storage in electric vehicles and reduce energy loss in the national grid.
Technology Briefing
Electronic Packages and Modules Based on Embedded Die Technologies
This paper describes the use of embedded die technologies and the development of work in the on power electronic applications.
Production Floor
3D Printed Electronics for Printed Circuit Structures
This paper shows working demonstrations of printed circuit structures, the obstacles, and the potential future of 3D printed electronics.
Analysis Lab
Was Sodium Causing Factory Fires?
Was Sodium Causing Factory Fires?
One summer a factory producing coloring dyes was experiencing many alarms signaling a fire. What was causing these fires?
Mysteries of Science
Evaluating Manual and Automated Heat Sink Assembly
This paper illustrates the use of strain gauge testing and Finite Element Analysis as a simulation tool to optimize the heat sink assembly process.
Production Floor
Autonomous Vehicle Software Analyzes and Predicts Driving Events
Autonomous Vehicle Software Analyzes and Predicts Driving Events
Researchers at the Technical University of Munich have now developed a software module that continuously analyzes and predicts events while driving.
Technology Briefing
Bending Strength of Solder Joints as a Function of Joint Length
The effect of joint length on the fracture of copper-solder-copper joints is investigated using double cantilever-beam specimens of various joint lengths.
Analysis Lab
Effect of Bi Content on Properties of Low Silver SAC Solders
Effect of Bi Content on Properties of Low Silver SAC Solders
A systematic study is presented to address the effect of Bi content on soldering and mechanical performance of low silver SAC alloys.
Materials Tech
Rigid-Flex PCB Right the First Time - Without Paper Dolls
The biggest problem with designing rigid-flex hybrid PCBs is making sure everything will fold in the right way, while maintaining good flex-circuit stability and lifespan.
Production Floor
✷ ✷ Supplier Spotlight ✷ ✷
Plex Systems, Inc.
Plex Systems, Inc.
When Plex was founded, we set out ...
Amistar Automation, Inc.
Amistar Automation, Inc.
Founded by experienced veterans in the Factory ...
Hisco, Inc.
Hisco, Inc.
Hisco is a specialty distribution company serving ...
Airtech International, Inc. PCB DIVISION
Airtech International, Inc. PCB DIVISION
Utililizing our unique multilayer manufacturing technology we ...
Technology Corner
3D Visual Inspection
Vision Engineering Inc.
Selective Soldering Systems
Pillarhouse International Ltd
Real-time X-ray Inspection Systems
Glenbrook Technologies Inc.
Smart Thermal Profiler solutions
Solderstar LLC
Component Rework Services
Circuit Technology Center Inc.
MORE TECHNOLOGY CORNER
Board Talk
Modify Rework Procedures for Assemblies Fabricated Using OSP?
What Causes Solder Icicles During Wave Soldering
Review of Tin-Copper and Tin-Nickel Intermetallic Thickness
Can High Particle Concentrations Impact PCB Assembly?
Trouble With Skewed DPAK Components
Moisture Barrier Bag Issues
How to Reduce Voiding on QFN Components
Can Mixing Wave Solder Pallets Cause Contamination?
MORE BOARD TALK
Questions and Comments
Trouble With Skewed DPAK Components
I didn't see if they were all skewing the same ...
Steve Lee, IDA North America
Trouble With Skewed DPAK Components
I already corrected DPAK skewing by breaking the stencil aperture ...
Helio Jose Cantarino, Heson Consultoria, Brazil
How to Reduce Voiding on QFN Components
Through our various studies on ground pad voiding, AIM discovered ...
Logan Jelinske, AIM Solder
How to Reduce Voiding on QFN Components
Adjusting your reflow profile can be a tool to minimize ...
Mitch Holtzer, Alpha Assembly Solutions
How to Reduce Voiding on QFN Components
Voiding occurs because the gases generated by the flux and ...
Alan Woodford, NeoTech
MORE COMMENTS
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