circuit insight
Microstructural Evolution During Electromigration in Eutectic Tin-Bismuth BTC Solder Joints
The subject of this follow-up paper is the microstructural evolution of BTC eutectic Sn-Bi solder joints during electromigration. The growth of intermetallic phases at the solder-substrate interfaces and the extent of bismuth electromigration were measured as a function of temperature, current density and time in a bid.
Technical Paper
De-Ionized Water Affected By the Atmosphere
Resistivity readers of the de-ionized water are above 15 megohms. Resistivity results of the samples tested by the outside lab have been approximately 1 megohm.
Board Talk
Sponsor
Essegi-Automation

Our Solutions
Discover Essegi Automation's modular solutions: flexible hardware and software seamlessly integrated into SMT and THT environments.
Essegi Automation
Solder Ball Joint Reliability with Electroless NI-PD-AU Planting
The influence of Pd film thickness in electroless Ni/Pd/Au plating on the solder ball joint reliability after reflow cycles and thermal aging was investigated.
Technical Paper
Accuracy Validation Finds Hidden Problems Affecting DPMO
This paper discusses individual process step validation methods with real examples of improvement that contribute to defect per million opportunities (DPMO) reduction.
Technical Paper
Copper-Tin Intermetallics: Their Importance, Growth Rate and Nature
This paper will review the formation of copper-tin intermetallics, their growth rate, their effect on thermal cycle life, and drop shock performance.
Technical Paper
Sponsor
Uyemura

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
Reliability of Isothermally Aged Doped Low Creep Lead-Free Solder Paste
The primary goal of this study was to find a manufacturable solder paste material that would reduce the effects of aging on the solder joints.
Technical Paper
Insulation Between Overhanging Component Lead and Circuit Conductor
We have a long lead SMT component overhanging the pad. Can solder mask provide insulation between the overhanging component and the circuit conductor?
Board Talk
Sponsor
SEHO

Wave Soldering Processes Rethought
As a pioneer in the development of automated soldering technologies, SEHO is setting global standards today more than ever with outstanding features. Find out more.
SEHO Systems GmbH
Stencil Quality & Technology on Solder Paste Printing Performance
We evaluate the impact of stencil quality by comparing the printing performance of 0.35mm pitch and 01005 pads from different stencil suppliers.
Technical Paper
Investigation of Overprinting BGA Pads
The added benefit of using overprinting stencil design strategy is that this should compel further improvement in paste transfer efficiency and uniformity by raising its area ratio. In this study the circle shape overprint apertures were designed for 0.5mm pitch BGA land patterns that measured to an area ratio value of 0.70.
Technical Paper
Crack Propagation Mechanism Study on Bismuth Contained Base Lead Free Solder
The thermal cycling reliability characteristics of solder containing a small amount of Bismuth which is below 4wt% in accordance with the new requirements were investigated.
Technical Paper
Sponsor
Air-Vac-Engineering

Rework/Removal of Underfilled Parts AVX250/1000M
High precision milling with zero adjacent clearance. Auto laser height measurement of board and component. Learn more.
Air-Vac Engineering
Fabriciton of NiCo Alloy and Rh Coating Using Electroplating Method
The properties of NiCo deposits were analyzed using field emission scanning electron microscopy (FESEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD).
Technical Paper
Blow Holes After Switching from Lead-Free HASL to ENIG
After switching our PCB finish from lead-free HASL to ENIG blow holes started occurring in the solder joints of the through-hole LEDs. The PCBs and LEDs are from the same suppliers as before, only the finish changed.
Board Talk
Sponsor
Smart-Sonic

EPA Verified Stencil Cleaning Systems
Low power density ultrasonic cleaners combined with 440-R-SMT detergent provide safe and effective cleaning of stencils, pallets, oven radiators, misprints and SMD adhesives.
Smart Sonic
Challenges Reliably Soldering Large Ground Pad on LGAs
We are experiencing difficulties reliably soldering large ground pad on land grid array packages using a single large window as a stencil. Should we use all four windows?
Board Talk
Latest Industry News
MSI Says PC Shipments Expected to Fall up to 20%
What Happens To Your Batteries When You Recycle Them?
Survey finds Americans worry about AI data centers, but still want the jobs
Uber ex-CEO Kalanick rebrands latest venture Atoms, expands into mining and transport
IBM, Lam Research Focus High-NA EUV on Sub-1-nm Nodes
MORE INDUSTRY NEWS
Alltemated
Sponsor
Heller-Industries-Inc

Eliminate Voids for High-Reliability Applications
Voids compromise reliability. Achieve near zero-voiding with our vacuum reflow for automotive, micro-bumping, and advanced electronics. Send your boards to see the results.
Heller Industries
AI-Technology-Inc
Sponsor
Viscom

Pioneering 3D X-ray Inspection for Flat Assemblies
Viscom is setting a new standard for high-precision inline X-ray inspection of printed circuit boards with its iX7059 product line. Learn more.
Viscom
Cartoon
"How do I download something from the cloud on a clear, sunny day?"
Copyright © Randy Glasbergen