Electronics Manufacturing and Electronics Assembly

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Boost Your Expertise on Technical Cleanliness
Discover ZESTRON whitepapers and webinars with science-based insights on cleaning processes, cleanliness, and long-term reliability. Explore now.
ZESTRON Europe

Technical Papers

Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses

Scaling SMT Traceability

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

MORE TECHNICAL PAPERS

Ask the Experts

Inspection for Hidden Solder Joints

Solution for Warped PCBAs

BGA Component Cleaning Spec

Tin Whiskers and Vapor Phase Reflow

Soldering Station Calibration

Solder Paste Stencil Inactivity

Solder Mask Thickness Tolerance

Question About ESD Ionizer Guns

MORE ASK THE EXPERTS

Intrusive Soldering vs. Wave Solder
We are wave soldering with top and bottom side preheat. Would a pin in paste, or intrusive soldering, be a better option than wave soldering? The Assembly Brothers, Phil Zarrow and Jim Hall, address this question.
Board Talk

Improved Process Yield with Dynamic "real-time" Dual Head Dispensing
This paper examines proven methods to determine the dot/line positional accuracy along with mass flow rate for both heads during synchronous dispensing.
Technical Paper

Sponsor

Plasma as a Key Technology
Plasma technology improves electronics manufacturing, reduces oxide layers, prevents delamination & enables environmentally friendly products by using Openair-Plasma ® & PlasmaPlus®.
Plasmatreat GmbH

Thermal Cycling Dwell Time on Reliability of Pb-free Solder Alloys
This paper presents the initial results from an experimental program designed to compare thermal cycling results for high-performance solder alloys.
Technical Paper

75% IPA/25% DI Extraction Solution on No-Clean Flux Residues
This study is broken into two parts, first a review of the solubility of some critical ions in different ratios of IPA/DI and at different temperatures.
Technical Paper

Component Pressure Exposure Validation in An Inline Wash System
The purpose of this research is to measure what circuit cards and parts on those assemblies are exposed to during the wash and rinse process of inline cleaning.
Technical Paper

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Built to Scale. Proven in Production.
Microsystems World CNC boosted throughput and automation by trading up to a complete inline SMT solution—powered by Manncorp and designed for long-term growth.
Manncorp Inc.

Limits for HASL with Complex Products
What are the limits for the future with more complex products? HASL and the actual HASL process, hot air solder leveling, has been with us since the mid-70s.
Board Talk

Copper Electrodeposition By Hydrogen Evolution Assisted Electroplacing
A technique called hydrogen evolution assisted electroplating, has shown enhancement to the deposition rate of copper compared to galvanostatic conventional electroplating methods.
Technical Paper

Sponsor

Enhance Your Hands-On Soldering Skills
Learn how IPC certified training workshops for operator and trainer levels can advance skills and knowledge of your personnel for TH and SMT assembly.
BEST Inc.

Value-Driven CFX Case Studies Supporting Smart Manufacturing
In this paper, two diverse examples are discussed, illustrating how the adoption of the Connected Factory Exchange (CFX) standard is changing manufacturing.
Technical Paper

Requirements for the Filler Material Solder Paste for Different Technologies
To date, filler materials based on solder pastes have been qualified for the respective technologies to meet the respective requirements. The article is intended to show which important requirements are necessary for the respective evaluation.
Technical Paper

Technologies and Standards to Realize Smart Manufacturing
The future of manufacturing in the Electronics Industry is dependent on the ability to develop and deploy technology platforms to realize Smart Manufacturing and Industry 4.0.
Technical Paper

Sponsor

Get the Revisiting Underfill Handbook
Today's underfill applications are constantly evolving. As chip populations increase, dispensing applications must deliver smaller amounts of fluid with precision. Read this handbook.
Nordson Electronics Solutions

How To Prevent Mid-chip Solder Balls?
Is there a mathematical calculation that can be used to predict solder balling for a given package size?
Board Talk

In-Line Testing of Highly Panelized PCBAs with Parallel Functional Test
The manufacturing process challenges faced by electronics manufactures producing large panels of small boards is discussed.
Technical Paper

Sponsor

iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE

A Method to Investigate PCB Supplier Rework Processes and Best Practices
This paper investigates PCB supplier rework processes, including identifying rework procedures that have potential implications to PCB functionality.
Technical Paper

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Gripping Systems from micro assembly to heavy lifting
The first industrial-suited grippers from SCHUNK were a milestone. Since then we have brought countless newly and further developments to market.
SCHUNK

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Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.

"Sometimes it's smooth sailing, sometimes it gets rough and stormy and sometimes you sink to the bottom with your crew. That's why it's called leadership."
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