circuit insight
Automation for Traceability and Reliability
In this study it was demonstrated how process traceability records need to deal with complex and variable inputs as well as challenges among our machine processes.
Technical Paper
ASEP a Next Generation Electronics Manufacturing Technology
This paper introduces a Application Specific Electronics Package. This enables the integration of PCBs, connectors, high-current conductors, into a single device.
Technical Paper
Sponsor
Plasmatreat-GmbH

Plasma as a Key Technology
Plasma technology improves electronics manufacturing, reduces oxide layers, prevents delamination & enables environmentally friendly products by using Openair-Plasma ® & PlasmaPlus®.
Plasmatreat GmbH
Variations in SAC 305 Solder
We use SAC 305 bar solder. We want to use a different supplier. Can we mix the new solder in with the current solder in our wave soldering systems?
Board Talk
Methodology for Implementation of Pb-free Materials in Aerospace
This paper will discuss the Pb-free challenges and the “building blocks” to allow cautious and responsible implementation of Pb-free materials.
Technical Paper
Realization of a New Concept for Power Chip Embedding
This paper will focus on the behavior of the power module for operational conditions of a PedEleC (Pedal Electric Cycle) application.
Technical Paper
Sponsor
Heller-Industries-Inc

Optimize Your Process on Full SMT Demo Line
Validate your process in our demo lab. Our full line—printing, P&P, reflow, and AOI—is ready to optimize your profile and prove performance. Send us your boards to start.
Heller Industries
Reliability of Doped Lead-Free Solder Joints Under Isothermal Aging
This paper presents harsh environment reliability test results for lead-free solder pastes with and without the presence of a variety of dopant elements.
Technical Paper
Rheology and Wetting Characterizations of Flux and Solder Paste
In this paper, we will discuss a solder paste wetting method. A high resolution solder wetting balance was used for the solder paste wettability analysis.
Technical Paper
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
Can Tape Residue Contaminate a Clean Tank?
We leave masking and Kapton tapes that fall off during cleaning in the bottom of our wash tank. Can the adhesives contaminate the recycled solution? Jim Hall and Phil Zarrow, The Assembly Brothers, address these question and share their own experiences.
Board Talk
Reflow Oven Zone Separation Challenges
Some of the zones or our oven profiler are competing to get to the correct temperature. How do I prevent the oven from having competing zones? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk
How the Right Cored Wire Can Optimize Automated Soldering
This study investigates the impact cored wire flux activity and flux core percentage has on soldering performance and speed. Additionally, this research aims to identify optimal soldering parameters by varying preheat time, feed rate, tip temperature, dwell time.
Technical Paper
Sponsor
DL-Technology

Micro Dispensing Technology Leader
DL Technology LLC develops customized dispensing needles and valves for the electronics assembly, industrial assembly, semiconductor packaging and medical industries.
DL Technology
Pressure-Less Silver Sintering Pastes for Low Porosity Joint and Large Die
Under pressure-less sintering conditions silver sintering pastes for different sized die attachment to form robust silver joints have been developed.
Technical Paper
The Importance of Having a Clean Slate in the SMT Assembly Process
The paper covers an experiment to improve upon the defect ratio of their PCB assembly process by utilizing a bare board cleaner before the paste printer.
Technical Paper
Sponsor
Summit-Interconnect

Your Domestic PCB Solution
Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on.
Summit Interconnect
Cleaning Industrial Parts with Plasma
The cleanliness of surfaces is critical for the quality of processes like bonding, coating and printing. That’s why manufacturers may want to consider using atmospheric pressure plasma.
Technical Paper
Latest Industry News
OpenAI’s Jalapeño Will Be Spicy, But the Real Sizzle Is Its Chip Design AI
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Taiwan electronics production jumps 93% in first five months of 2026 on AI boom
Industrial output rises 11.78%
MORE INDUSTRY NEWS
Advanced-Interconnections
Sponsor
Manncorp

Built to Scale. Proven in Production.
Microsystems World CNC boosted throughput and automation by trading up to a complete inline SMT solution—powered by Manncorp and designed for long-term growth.
Manncorp Inc.
Smart-Sonic
Sponsor
Circuit-Technology-Center

Prevent Lead Tinning Problems Before They Impact Reliability
Lead tinning plays a critical role in ensuring solderability, long-term reliability, and performance. Circuit Technology Center helps with common lead tinning challenges.
Circuit Technology Center
Cartoon
"Sometimes a computer just wants to feel appreciated. Pick up some roses and a card during your lunch break."
Copyright © Randy Glasbergen