Electronics Manufacturing and Electronics Assembly

Sponsor

Drop-in SAC305 Alternative: Try REL61
Upgrade your alloy without the downtime. REL61 requires no pot cleaning and your SAC305 scrap value often covers the cost of the changeover. Optimize your process today.
AIM Solder

Technical Papers

The Drawbacks of Internal Recycling Systems for Solder Dross

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

MORE TECHNICAL PAPERS

Ask the Experts

Looking for Long-term Component Storage Options

Question About PPM Defect Rate for Reversed Packages

ESD and Humidification

SMT Target Component Placement

Old Components and Blow Holes

Pin in Paste Solder Dropping

Reusing recovered solder paste

Bottom Side Chip Bonding

MORE ASK THE EXPERTS

The Impact of Harsh Environments and Ionic Contamination on Post-Reflow Circuit Assemblies
Modern electronic assemblies are far more susceptible to this phenomenon. Among the critical issues affecting these assemblies is ionic contamination, which can lead to a series of deleterious processes, including electrochemical migration (ECM).
Technical Paper

The Impact of VIA and Pad Design on QFN Assembly
This paper discusses the impact of the via size and design on QFN voiding and solder protrusion. Do small vias prevent the solder from flowing onto the other side?
Technical Paper

Sponsor

Viscom: Next Level of Inspection at APEX
Viscom Inc. presents its AI-powered inspection software vAI ProVision at APEX Expo 2026 in Anaheim. See live demos of faster AOI and AXI programming at Booth #2836.
Viscom SE

Advances in Power Electronics
This paper details some of the recent advances in power electronics systems and details some of the challenges that need to be overcome.
Technical Paper

Common PCB Design Decisions that Cause Manufacturing Problems
What are the most common design decisions that can have a negative impact on the PCB assembly manufacture and how could we correct them during the design? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this scenario and share their suggestions.
Board Talk

Adding OSP to Pads that are Missing ENIG Plating Process
A fabricator notified us that during the ENIG plating process, several pads had been “skipped”. The fabricator would like to add OSP to the pads that are missing the ENIG.
Board Talk

Sponsor

AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS

Living With PB-Free in High Performance Engineering Design
As Pb-free technology increasingly becomes the standard for electronic interconnects and finishes, engineers must cope with the various challenges posed by this material.
Technical Paper

Advanced Substrate Technology for Heterogeneous Integration
The development of semiconductor technology and multi-function demands of end products has driven IC foundry industry toward 7nm node process.
Technical Paper

Sponsor

Optimizing BGA Rework: Challenges, Techniques and Quality Control
The complexity of BGA packages introduces challenges during rework requiring innovative methods and inspection practices to ensure performance and reliability. Read more.
BEST Inc.

Selective Soldering Design for Reliability Using SIR Test Method
The purpose of this research is to develop a test method designed to evaluate the electrochemical reliability of the selective soldering process at the assembly site.
Technical Paper

Autonomous Vehicles Still Decades Away: 2019
This paper examines the challenges to progress from existing advanced driver-assistance systems to level 4 and 5 autonomous vehicles.
Technical Paper

The Best Method for Reworking Ultra-Micro Chips
We are soldering and reworking 0201s and 01005s using hot air solder rework station with adjustable air flow. The minimum air flow will blow parts.
Board Talk

Sponsor

Malcom Paste Mixers
Unlike hand mixing, the Malcom SPS Solder Paste Mixer is a non-contaminating mixer which utilizes pseudo planetary motion to stir the solder paste. The SPS-1 provides uniform consistency.
Seika

Understanding Creep Corrosion Field Fails
Dendrites, Electrochemical Migration and parasitic leakage, can be caused by process related contamination. This paper explores aspects of the creep corrosion chemical reaction.
Technical Paper

Microstructure and Performance of Micro CU Pillars Assemblies
Correlations between the shear strength and microstructure of Cu pillars were examined for different solder compositions, and for different aging times.
Technical Paper

Sponsor

Contaminant Removal with Plasma
Plasma provides organics removal and other benefits to increase bond strength! Many chamber sizes available, all with a low environmental impact. Learn more.
Plasma Etch

How the Chip Shortage Reshaped the Electronics Supply Chain
The global chip shortage that started in 2020 sent shockwaves through the electronics manufacturing industry, disrupting production lines and forcing companies to rethink their supply chain strategies. This shortage not only delayed production but also highlighted critical vulnerabilities in the electronics supply chain.
Technical Paper

Latest Industry News

The AI Memory Squeeze: Why Japan's Consumer Electronics Face a New Reality

VIEWPOINT 2026: Foad Ghalili, President/CEO, Epoch International Enterprises, Inc.

U.S. launches Peace Corps-backed 'Tech Corps' to help export AI, counter China

Empowering Your Engineering Teams with Engineering Pro: The Smarter Way to Stay Ahead in Electronics Manufacturing

Amazon to spend $12 billion in Louisiana on AI data centers

MORE INDUSTRY NEWS

Sponsor

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp

Sponsor

Simply Double the Production Volume
SEHO SelectLine features the award-winning Synchro and SmartSplit production modes that allow to halve cycle times in batch production and mixed operation. Find out more.
SEHO Systems GmbH

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