Technical Papers
Best Practices for Disinfecting for COVID-19 of Electronic Products & Assemblies
5G is Turning up the Heat
True3D™ Innovations Powered by AI
How to Achieve Maximum Performance For Your Conformal Coatings Process
Openair-Plasma: Versatile and reliable solution for the electronics industry
Scoring Big With Real-Time X-Ray Inspection
How well can you 'Pin Down' defects in the press-fit process?
Minimize Signal Loss in HF Circuits
MORE TECHNICAL PAPERS
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
MORE ASK THE EXPERTS
Latest Industry News
Nokia to Build Mobile Network On the Moon
Apple assembler Foxconn aims to supply to about 3 million EVs by 2027
Microsoft Surface makes way into entry-level sector
Is the Biological Nutrient Cycle Possible for Electronics?
5 Post-Covid Changes Supply Execs Should Expect
Throwable Robot Car Always Lands on Four Wheels
China's economic recovery quickens
Material Selection and Optimization for TMV PoP
MORE INDUSTRY NEWS
October 20, 2020
Assembling Boards with BGAs on Both Sides
Assembling Boards with BGAs on Both Sides
What are the pros and cons of assembling circuit boards with BGA components on both sides? Should we first place BGAs on side one or side two? Does it make a difference? The Assembly Brothers, Jim Hall and Phil Zarrow, answer these questions.
Board Talk
Selecting Stencil Technologies to Optimize Print Performance
Research has been done to identify individual factors in stencil performance; this paper discusses the real-world application of numerous findings.
Production Floor
The Building Blocks of an AI Strategy
The Building Blocks of an AI Strategy
How does an organization transition from opportunistic and tactical use of artificial intelligence to a more strategic orientation?
Technology Briefing
Impact of Substrate on Materials Reliability of High Power LED Assemblies
What role does the substrate type play in the LED package-to-board assembly reliability? This paper presents a study to help answer this question.
Analysis Lab
Circuit Material Performance for PCBs at Millimeter Wave Frequencies
Circuit Material Performance for PCBs at Millimeter Wave Frequencies
This paper gives an overview of which circuit material properties are important to mmWave frequency applications using PCBs.
Materials Tech
The Challenges of LGA Server Socket Trends
This paper discusses the challenges and some potential solutions for sockets used in the high end server market.
Production Floor
NASA DOD SAC305/SN100C Copper Dissolution Testing
In lead-free solder alloys, the reaction of the tin/copper is faster than of tin-lead solders/copper, which increases the degradation of the plated copper connections.
Analysis Lab
Larger Stencil Apertures and Type 4 Paste
Larger Stencil Apertures and Type 4 Paste
What is your experience with larger size apertures and type four solder paste for non-collapsible BGA and CGA type solder joints?
Board Talk
Nano Silver Replacement for High Lead Solders
This paper details mechanical and reliability testing of joints made with materials under a range of temperature, pressure and atmosphere.
Materials Tech
Riding a Wave of Business Process Automation
Riding a Wave of Business Process Automation
Businesses are forced to deliver unprecedented solutions in a world where supply chains, sources of talent, costs of capital, and more have been scrambled.
Technology Briefing
3D Assembly Processes a Look at Today and Tomorrow
This paper explores various technologies available today and some that are starting to appear and illustrates some key items for each technology.
Production Floor
Effect of Package Warpage and Composite CTE on Failure Modes
This paper gives examples of the BLR TC failure modes and locations of package test vehicles designed to correlate failure modes.
Analysis Lab
Danger on the Adhesive Coating Line
Danger on the Adhesive Coating Line
A plant worker adjusting rollers on an adhesive line suddenly began to act strangely. What caused the worker's spaced out appearance?
Mysteries of Science
Protecting the Reliability and Integrity of Electronic Products and Assemblies when Disinfecting for SARS-CoV-2
This paper offers guidance for protecting the integrity of electronic products and assemblies when disinfecting equipment surfaces for SARS-CoV-2 virus.
Production Floor
Sensory Integrated Artificial Brain System
Sensory Integrated Artificial Brain System
Recent work combines ultra-fast electronic skin and an ultra-fast nervous system with the latest innovations in vision sensing and AI for robots.
Technology Briefing
Evaluation of 13 Solder Pastes for High Rel
The authors undertook this project to choose the most robust solder paste to support the manufacture of complex high reliability products assembled at a of locations.
Analysis Lab
Material Selection and Optimization for TMV PoP
Material Selection and Optimization for TMV PoP
Materials selection and parameter optimization to better understand the critical factors with successful TMV PoP assembly are investigated.
Materials Tech
High Thermal, High Temperature Interconnects for Ultra High Power LEDs
For high performance applications, ultra-high power offers cost reduction through fewer LEDs, smaller PCBs, smaller heat sinks and lighter load bearing.
Production Floor
✷ ✷ Supplier Spotlight ✷ ✷
AIM Solder
AIM Solder
AIM is a leading global manufacturer of ...
Advanced Assembly
Advanced Assembly
Advanced Assembly's mission is to make PCB ...
Essemtec AG
Essemtec AG
Essemtec AG is a privately held Swiss ...
GoIndustry DoveBid
GoIndustry DoveBid
GoIndustry DoveBid (Go-Dove), a Liquidity Services marketplace, ...
Technology Corner
Viscom@productronica2019
Viscom Inc.
Reflow and Curing Technology
Heller Industries Inc.
Where Soldering is a Passion
SEHO Systems GmbH
SMT Components Storage Solutions
ESSEGI AUTOMATION S.r.l.
Assure X-ray Component Counters
Nordson Dage
MORE TECHNOLOGY CORNER
Board Talk
Assembling Boards with BGAs on Both Sides
Larger Stencil Apertures and Type 4 Paste
5 vs 8-Zone Ovens
Component Moisture Question?
BGA Components and Coplanarity
How To Verify Cleanliness After Rework and Prior to Re-coating?
What is Solder Paste Working Life on a Stencil?
Demise of the Plated-Through Hole?
MORE BOARD TALK
Questions and Comments
Component Moisture Question
Moisture sensitive devices are a class of their own. The ...
Dr. KUTTIYIL THOMAS OOMMEN THARAKAN, VSSC
What is Causing Intermittent BGA Failures?
Given below are the various phases in which a BGA ...
Dr. KUTTIYIL THOMAS OOMMEN THARAKAN, VSSC
BGA Components and Coplanarity
I would also add not only you have the coplanarity ...
Darren Pieczynski, Burton Industries
BGA Components and Coplanarity
The smaller the ball diameter of the BGA, the more ...
Richard Stadem, General Dynamic Mission Systems
Acceptable Rate for Head in Pillow?
Depending on the location of the HiP balls the reflow ...
Ike Sedberry, ISEDS
MORE COMMENTS
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