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Electronic Packages and Modules Based on Embedded Die Technologies

Electronic Packages and Modules Based on Embedded Die Technologies
This paper describes the use of embedded die technologies and the development of work in the on power electronic applications.
Production Floor


Authored By:

Lars Boettcher, Stefan Karaszkiewicz, Andreas Ostmann
Fraunhofer Institute for Reliability and Microintegration (IZM)

Dionysios Manessis
Technical University of Berlin
Berlin, Germany


This paper will describe the use of embedded die technologies for various application fields. The main focus of the development work in the presented European funded project EmPower [1] is on power electronic applications. Here, three different power levels are of interest:
1. 50W single die packages with fast rectifier diodes
2. 500W power modules for electric bicycle application
3. 50kW power modules for HEV and EV application

All three application fields are based on a similar concept, which is called embedded power core. For the higher power modules additionally thermal management is required. Here a construction of IMS substrates and the power core is chosen. This construction enables a double sided cooling and also the electrical isolation of the module to the cooler. The connection between power core and IMS substrates is made by low temperature and low pressure Ag sintering.

All three applications fields will be described in detail. Besides the power core manufacturing, the paper will elaborate on the sintering process for Power Core/IMS interconnections, the microscopically features of the sintered interfaces, and the lateral filling of the sintering gap with epoxy prepregs.

For 500W power modules, which were manufactured using this approach, solder reflow testing and active power cycling results will be discussed in detail.

Additionally the development work toward the realization of the 50kW module will be described.


The presented work within the EmPower project, demonstrates continues development of a new concept in the embedded die technology for power electronic packages and modules. The development work of all three different addressed power classes is described in detail.

For the 50W Schottky diode package a new process flow was developed and successfully applied to create fully symmetric, single die packages. First reliability testing proves the robustness of the developed technology.

For the 500W and 50kW modules the focus of work lies on the sinter lamination technology, which is applied for module finalization, enabling improved thermal management, by providing the option of double sided cooling, and realizing the high current connections to the module.

For all three application areas functional test vehicles were realized or are currently underway. A full reliability assessment will be applied to all of the demonstrators, to demonstrate the robustness of the developed technologies.

Initially Published in the SMTA Proceedings


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