Electronics Manufacturing and Electronics Assembly

We are seeing field returns due to solder joint cracking on the pin of a 16-pin through-hole connector. What might be the cause of the joint cracking? Jim Hall and Phil Zarrow, also known as The Assembly Brothers, address this question.
Board Talk

Assembly and Reliability of a Novel High Density Dual Row MaxQFP
The paper focuses on all aspects of SMT assembly of the MaxQFP. The robustness of the assembly in automotive type board-level thermal cycling will be demonstrated.
Production Floor

A Better Way to Pilot Emerging Technologies
For companies adopting a particular technology, it’s much harder to quantify the value of emerging technologies that are not yet being widely used.
Technology Briefing

CVS Control of Via Fill Acid Copper Electroplating Baths
This paper presents electrochemical techniques for analyzing additives commonly used in via fill plating baths.
Analysis Lab

Development of Materials Informatics Platform
Materials Informatics is one of the hottest technologies because of its potential to reduce the time and costs of discovering innovative materials.
Materials Tech

The Development of Hybrid Therma-EMI Solutions for Electronics
Test methods to measure the thermal and electromagnetic properties of a material in an application and as fundamental material properties are discussed.
Production Floor

Generalizations About Component Flatness
Failure to have completely flat components and circuit boards can lead to opens, shorts, head on pillow, weakened solder joints and stressed solder joints.
Analysis Lab

Hand Soldering Reliability
What are the differences in reliability for SMT machine placement followed by reflow vs. hand placement followed by hand soldering in surface mount?
Board Talk

Attributes of Cored Solder Wire in LED Luminaire Soldering
Reflectivity as a metric to quantify "shininess" is presented. An approach to quantifying "Reflectivity" of solder alloy joints has been developed.
Materials Tech

Solar Desalination System Turns Saltwater to Drinkable Water
New research, just published in the journal Joule, outlines the design for a new solar desalination system that takes in saltwater and heats it with natural sunlight.
Technology Briefing

Reduce Pollution of Process Gasses in an Air Reflow Oven
This paper gives detailed information of catalyst systems designed and implemented in SMD production lines to reduce pollution of process gasses.
Production Floor

Detect PCB Stack-up Error with Machine Learning Methods
With high frequency and high-speed transmission in information industry, PCB customers demand stricter signal transmission integrity of PCB.
Analysis Lab

Lubricant Causes Quality Problems
Cylinder locks coated with a light oil spray started to stick. Did a change in the process affect quality, and if so how?
Mysteries of Science

Assembly Optimization for Thin Flip-Chip Chip-Scale Packages
A robust board assembly recipe is demonstrated for thin FCCSP packages with reflow warpage values of up to 110μm or higher.
Production Floor

Robots Begin to Develop Common Sense Knowledge

MIT engineers are working to give robots a bit of “common sense” when faced with situations that push them off their trained paths.
Technology Briefing

Design Considerations That Influence LED Solder Joint Reliability
In this paper we examine the influence of three factors on thermal-mechanical solder joint reliability of LEDs mounted on an IMS PCB using FEA.
Analysis Lab

Hybrid Conformal Coatings for Mitigating Tin Whiskers

In this stydy, nanoparticles were functionalized to bind them to the polymer structure while avoiding the collection among the particles.
Materials Tech

Jetting Solder Paste Opens Up New Possibilities
Today Jet Printing is no longer seen as a futuristic technology but it has proven itself and the technology is still gaining momentum.
Production Floor

Board Talk

Cause of Long-Term Soldering Joint Cracking in Automotive Application

Hand Soldering Reliability

Does HASL or ENIG Reduce Creep Corrosion in Corrosive Environments?

Opens With Assembled QFN Components

Tips When Moving a Reflow Oven

Issues With SMT Component Alignment

No-Clean Residue Shorts

How To Strip Tin-Lead Solder From SMT Pads for RoHS

MORE BOARD TALK

Questions and Comments

Cause of Long-Term Soldering Joint Cracking in Automotive Application

Consider also the solder alloy. These failures occurred within the ...
Ike Sedberry, ISEDS

Cause of Long-Term Soldering Joint Cracking in Automotive Application

Is the failing pin at the same location, such as ...
Wallace Huson Ables, Dell Technologies

Does HASL or ENIG Reduce Creep Corrosion in Corrosive Environments?

Creep corrosion is a mean thing and you have to ...
Frank Huijsmans, PIEK Int. Education Centre

MORE COMMENTS

"I'm convinced that all corporations are evil, but Bruce Wayne says free market capitalism is the only thing that can save the world."
Copyright © Randy Glasbergen