Research
Fill the Void II: An Investigation into Methods of Reducing Voiding
Final Finish Specifications Review
DFX on High Density Assemblies
Challenges on ENEPIG Finished PCBs
Testing PCBs for Creep Corrosion
Screening of Lower Melting Point Pb-Free Alloys
Hand Printing using Nanocoated and other High End Stencil Materials
Board Processes and Effects on Fine Copper Barrel Cracks
MORE RESEARCH
Latest Industry News
Soldiers could teach future robots how to outperform humans
The iPhone is still breaking sales records during the pandemic
Foxconn says China can no longer be "the world's factory"
The Counterintuitive Way Social Media Can Reduce Stress
Do Engineers Live Longer? A Look at Occupational Factors’ Effect on Longevity
How to Work from Home Successfully
Smartphone shipments in China plunge 35% in July: government data
China handset players launch 5G phones in Taiwan
MORE INDUSTRY NEWS

Copper Foil Elements Affecting Transmission Loss with High Speed Circuits



Copper Foil Elements Affecting Transmission Loss with High Speed Circuits
This study examines possible factors for these inconsistencies such as etched signal trace shape, surface treatment, and grain size.
Analysis Lab

DOWNLOAD

Authored By:


Hiroshi Ono, Ayumu Tateoka,
Shinichi Obata, Hiroaki Kurihara
New Product & Process Development,
Mitsui Mining & Smelting Co., Ltd.

Robert Carter
Eriko Yamato
Oak-Mitsui Technologies LLC

Summary


Large data transmission continues to increase at the rate of 20% worldwide annually due to live video streaming, cloud storage, PDA usage, IOT, and other technologies. Electronic devices are getting smaller yet required to accommodate higher speeds and good signal integrity. With 5G technology on the horizon there is heightened concern for signal loss affecting product performance. It is more important than ever to analyze loss factor at the earliest design stage. This analysis is done for the PCB materials by manufacturing electrical test coupons prior to building the PCB and evaluating the electrical performance. These coupons are designed and built with (TEG, test element group) structures which are ideal for measuring transmission loss. However, often these test PCBs use different lots of raw laminate materials which yield different results. Why? This study examines possible factors for these inconsistencies such as etched signal trace shape, surface treatment, and grain size.

Conclusions


It was found that issues that were not as problematic when device operating speed was in the few GHz range are now critical with speeds going up to 10 plus GHz. Impact of skin effect is prevalent at higher frequencies and effects of materials and inconsistencies in processing can no longer be ignored. As far as trace shape there are 4 sides and both the contributing factor of the circuit and bonding sides need to be taken into account. Thus, finer treatment than brown oxide and ways to bond without roughness treatment would be required in the future. As these areas are not addressed in the PCB CAD drawing, design engineers working on high speed applications need to understand the importance of these factors and select materials as well as control the manufacturing process.

Initially Published in the SMTA Proceedings

Comments

No comments have been submitted to date.

Submit A Comment


Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Board Talk
Cleaning Reballed BGA Components
We Bake, But Still Have Delamination, Why?
Reflow For Rigid Flex
Solder Paste Volume for BGA Rework
Problems With Starved "J" Lead Joints
Delay Before Cleaning Partial Assemblies
Can a CTE Mismatch Cause Reliability Problems?
Solder Paste Transfer Efficiency - What/Why
MORE BOARD TALK
Ask the Experts
Soldering Components with Silver Pads
Environment Impact on Assembly, Printing and Reflow
Solder Balling Prediction Formula
Old Components and Blow Holes
Estimating Failure Rate During Rework
Coating to stop tin whisker growth?
Cleaning an assembled board with IPA
Remove and replace a 240 pin connector
MORE ASK THE EXPERTS