Electronics Assembly Knowledge, Vision & Wisdom
Programs << Page 1 of 191 >>
We have over 1000 programs in this database. Programs include:
Analysis Lab, Ask the Experts, Board Talk, Materials Tech, Supply Chain, Production Floor, and Technology Briefing.

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Incoming Circuit Boards - How Clean Is Clean?
Incoming Circuit Boards - How Clean Is Clean?
We're having cleanliness issues, our assembly processes are not introducing contaminants. Could it be the result of incoming PCB cleanliness? The Assembly Brothers, Jim Hall and Phil Zarrow, share their insight.
Board Talk
Ask the Experts
QFN Test Failures Caused by Flux
A test engineer claims that test failures are due to flux residue between terminations that affects the capacitance at the joints. Is this a valid claim?
Ask the Experts
Improved SMT and BLR of 0.35 mm Pitch Wafer Level Packages
Improved SMT and BLR of 0.35 mm Pitch Wafer Level Packages
This study shows optimized print process can be achieved using standard materials, while also considering board level reliability.
Production Floor
Quantum Computing Becomes a Real Technology
Quantum Computing Becomes a Real Technology
Researchers are close to building quantum computers powerful enough to do those things that conventional computers cannot dubbed "quantum supremacy."
Technology Briefing
Predicting the Lifetime of the PCB
Predicting the Lifetime of the PCB
This paper examines a concept to enable the prediction of the lifetime of the PCB using accelerated testing methods and finite element simulations.
Analysis Lab
HCFC-225 Phaseout, What Now?
HCFC-225 Phaseout, What Now?
The use restrictions on HCFC-225 are in effect throughout the US. This paper discusses the options for assemblers and component manufacturers.
Materials Tech
Gold Stud Bump Flip Chip Bonding on Interconnect Devices
Gold Stud Bump Flip Chip Bonding on Interconnect Devices
This paper presents the studies on flip chip thermo-compression bonding (TCB) of gold stud bumps on MID substrate.
Production Floor
Ask the Experts
Test Probe Problems After Pin-In-Paste
We are having test probe contact issues with our Pin-In-Paste process. Should all the flux vaporize off in the reflow process? Any suggestions?
Ask the Experts
Wetting and Solidification of Pure Tin on Polycrystalline Intermetallic Substrates
Wetting and Solidification of Pure Tin on Polycrystalline Intermetallic Substrates
This study analyzes the wetting and interface formation between polycrystalline CuxAly intermetallic substrates and the pure Beta-Sn phase.
Analysis Lab
Should We Modify Rework Procedures for Assemblies Fabricated Using OSP?
Should We Modify Rework Procedures for Assemblies Fabricated Using OSP?
Should we modify any rework or repair procedures for circuit board assemblies fabricated using OSP, organic solderability preservatives, bare boards?
Board Talk
Programs << Page 1 of 191 >>