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We have over 1000 programs in this database. Programs include:
Analysis Lab, Ask the Experts, Board Talk, Materials Tech, Supply Chain, Production Floor, and Technology Briefing.

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Maximum Time Between Printing and Reflow
Maximum Time Between Printing and Reflow
What is the maximum allowable time for a PCB after it leaves the screen printer but before reflow? We're using water soluble lead-free paste. The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this.
Board Talk
Ask the Experts
Excess Flux Residue After Hand Soldering
We observe an excessive amount of flux after hand soldering using flux cored solder. Is this amount of excess flux normal?
Ask the Experts
Assembly Reliability of TSOP/DFN PoP Stack Package
Assembly Reliability of TSOP/DFN PoP Stack Package
This paper presents thermal cycle reliability evaluations of 2-high and 4-high 3D stacks built with a mix of TSOP and DFN daisy-chain package assembly.
Analysis Lab
Rebooting the IT Revolution
Rebooting the IT Revolution
U.S. dominance has largely been unchallenged throughout but Americans can't afford to remain complacent. What are the opportunities and threats?
Technology Briefing
Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction
Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction
Many center pad voiding studies have focused on center pad footprint/stencil aperture designs. This study focuses on I/O pad stencil modifications.
Analysis Lab
Meeting Future Stencil Printing Challenges with Ultrafine Powder Pastes
Meeting Future Stencil Printing Challenges with Ultrafine Powder Pastes
Paper provides a comparison of the transfer efficiency of solder powder particle sizes with post reflow results in optimal and harsh conditions.
Materials Tech
Alternative to Dead Bug Rework
Alternative to Dead Bug Rework
Dead bugging is when you add components to a circuit board upside-down and run jumper wires to complete the circuits. Here's an alternative.
Production Floor
Ask the Experts
HASL vs. Immersion Gold
For electronic equipment used in corrosive environments hot air solder leveling is suggested as a finish instead of immersion gold. Suggestions?
Ask the Experts
Failure Mechanism in Embedded Capacitors
Failure Mechanism in Embedded Capacitors
Paper covers high temperature life testing on embedded capacitors to precipitate failures as a result of defects in the composite dielectric.
Analysis Lab
Dross Contamination After Selective Soldering
Dross Contamination After Selective Soldering
We have discovered a fine low density dross on PCBs after selective soldering. The dross is difficult to see. Is there an effective way to clean this?
Board Talk
Programs << Page 1 of 171 >>