Electronics Assembly Knowledge, Vision & Wisdom
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We have over 1000 programs in this database. Programs are sorted by published date, most recent first.


Should We Invest in 3D Optical Inspection?
Should We Invest in 3D Optical Inspection?
We are correcting many solder defects. The search for defects is taking too long. Should we go with a 3D AOI system to save inspection time? The Assembly Brothers, Jim Hall and Phil Zarrow, share their experiences and insight.
Board Talk

Testing of Soldering Materials vs. Soldering Processes
Testing of Soldering Materials vs. Soldering Processes
This paper discusses Surface Insulation Resistance (SIR) data of solder pastes and other soldering materials on IPCB-52 coupons.
Production Floor

The 5G Future Is Almost Here
The 5G Future Is Almost Here
Investments in 5G-compatible spectrum show economic promise of 5G wireless technology, slated to be rolled out in developed economies in 2019.
Technology Briefing

The Effects of Solder Powder Size on Solder Paste Performance
The Effects of Solder Powder Size on Solder Paste Performance
Testing was conducted to measure each of these solders paste performance attributes for solder powders in both water-soluble and no clean solder pastes.
Analysis Lab

New-Generation, Low-Temperature Lead-Free Solder
New-Generation, Low-Temperature Lead-Free Solder
In this paper, the roles of additive and bismuth content will be discussed. Eutectic SnBi and three newly designed SnBi-based alloys were experimented upon.
Materials Tech

The Development of a 0.3 mm Pitch CSP Assembly Process
The Development of a 0.3 mm Pitch CSP Assembly Process
A major study looks at different aspects of the stencil printing process and their impact upon the assembly and reliability of CSP components.
Production Floor

Pad Cratering Susceptibility Testing with Acoustic Emission
Pad Cratering Susceptibility Testing with Acoustic Emission
In this study, 6 laminates were subjected to four-point bend testing. Acoustic emission sensors were used to monitor pad cratering during the bend test.
Analysis Lab

Issues With BGA Rework Residue
Issues With BGA Rework Residue
After BGA rework there is an outline of residue on around the pads. Is it necessary to remove this residue to reinstall a new BGA?
Board Talk

Reliability Improvements by the Creation of Intermetallic Connections
Reliability Improvements by the Creation of Intermetallic Connections
The possibilities to combine small and large passive components, and new devices for active components with an increase in reliability is discussed.
Materials Tech

3D Stretchable Circuits
3D Stretchable Circuits
A team has built a stretchable "electronic patch," which can be worn on the skin and used to wirelessly monitor physical and electrical signals.
Technology Briefing

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