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We have over 1000 programs in this database. Programs are sorted by published date, most recent first.
Is There a Spacing Spec for SMD Components?
Is there a minimum spacing requirement or should we apply SMT components to comply with SMT pick and place systems on the market? The Assembly Brothers, Jim Hall and Phil Zarrow, answer this question.
Ultrasonics as an Option for Electronics Assembly Cleaning
Ultrasonic cleaning parameters including frequency, power, time, temperature and chemistries results demonstrate developments in technology.
Flying Cars Surge Forward
After decades of failed projects, a new class of vehicles is finally emerging that could transform the way people and cargo are moved within and between cities.
The Quest for Reliability Standards
Many methods simulate end-use characteristics of equipment, but a clear understanding is required to differentiate between the methods.
Insulation Resistance of Dielectric Materials
This investigation measures the leakage within internal PCB layers during exposure of various specimens to a controlled ground-based test environment.
Cleaning High Reliability Assemblies with Tights Gaps
The purpose of this designed experiment was to evaluate the effectiveness of a variety of cleaning agents under an array of process conditions.
Impact of Lead-Free Components for High Reliability
This paper has discussed some of the issues faced by organizations in the high reliability sector when adopting COTS and lead-free components.
Is HASL a Good Choice for Surface Finish?
We are using a lead-free hot air solder leveling board finish. Our boards have bottom-terminated components. Is this the best choice?
Investigation of Copper Sinter Material for Die Attach
3 different copper powders were tested for their feasibility to use as die attach material for pressure sintering process without prior treatment with reducing agents.
The Sino-American War for 5G Dominance
Chinese telecom giants Huawei and ZTE dominate the 5G generation of wireless technology. Primacy in wireless is a key goal of Beijing’s.
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