Electronics Assembly Knowledge, Vision & Wisdom
Programs
Previous   Page 1 of 163   Next


We have over 1000 programs in this database. Programs are sorted by published date, most recent first.


Reflow Oven Zone Separation Challenges
Reflow Oven Zone Separation Challenges
We recently purchased an oven profiler. Some of the zones are competing with each other to get to the correct temperature. How do I find prevent the oven from having competing zones while getting an accurate process?
Board Talk

Condensation Testing - A New Approach
Condensation Testing - A New Approach
The data for a range of conformal coatings are correlated back to the material type, and coverage and thickness by cross-sectioning.
Production Floor

The New Reality of Sino-American Relations
The New Reality of Sino-American Relations
Experts have identified four options for resetting America’s China policy: accommodation, collective balancing, comprehensive pressure, and regime change.
Technology Briefing

Additive Manufacturing Printed Circuit Board Assembly Processes
Additive Manufacturing Printed Circuit Board Assembly Processes
Utilizing 3D printing, the design process can be shortened and the manufacturing of the jigs and fixtures can replace the cost and lead time of traditional manufacturing.
Analysis Lab

Embedding Passive and Active Components: PCB Design and Fabrication
Embedding Passive and Active Components: PCB Design and Fabrication
This paper focuses on six basic embedded component structure designs described in IPC-7092.
Materials Tech

Improved SMT and BLR of 0.35 mm Pitch Wafer Level Packages
Improved SMT and BLR of 0.35 mm Pitch Wafer Level Packages
This study shows optimized print process can be achieved using standard materials, while also considering board level reliability.
Production Floor

High-Speed 3D Surface Imaging Technology in Electronics Manufacturing
High-Speed 3D Surface Imaging Technology in Electronics Manufacturing
This paper introduces line confocal technology that was developed to characterize 3D features of surface and material types at sub-micron resolution.
Analysis Lab

PCBA Inspection Concerns
PCBA Inspection Concerns
We inspect PCBAs on a relatively hard ESD mat. Will moving the PCBs on the mat will scratch and stress the soldered components on the bottom side?
Board Talk

Rosin vs. Non-Rosin Wave Flux? - More Reliable Electronic Assemblies
Rosin vs. Non-Rosin Wave Flux? - More Reliable Electronic Assemblies
This paper focuses on the surface insulation resistance (SIR) differences between rosin-containing and rosin-free flux formulations.
Materials Tech

Zero Emission Fuel Cells
Zero Emission Fuel Cells
Researchers have developed a fuel cell that lasts least ten times longer than current technology, making them economical for powering electric vehicles.
Technology Briefing

Free Newsletter Subscription
Every issue of the Circuit Insight email newsletter will bring you the latest information on the issues affecting you and your company.

Insert Your Email Address

Directory Search


Program Search