Electronics Assembly Knowledge, Vision & Wisdom
Programs << Page 1 of 191 >>
We have over 1000 programs in this database. Programs include:
Analysis Lab, Ask the Experts, Board Talk, Materials Tech, Supply Chain, Production Floor, and Technology Briefing.

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Can a CTE Mismatch Cause Reliability Problems?
Can a CTE Mismatch Cause Reliability Problems?
Does usage of BGAs, QFNs or SONs have an increased risk for reliability of solder joints due to the CTE mismatch with the base board material FR4? Jim Hall and Phil Zarrow, The Assembly Brothers, offer their own experiences.
Board Talk
Ask the Experts
Solder Paste Life on the Stencil
Our solder paste has a specified life on the stencil of 10 hours. After 10 hours of manufacturing, do we need to remove all the paste and scrap it?
Ask the Experts
Fine Pitch CU Pillar with Bond on Lead Assembly Challenges for High Performance Flip Chip Package
Fine Pitch CU Pillar with Bond on Lead Assembly Challenges for High Performance Flip Chip Package
A technology featuring Copper Pillar Bond-On-Lead (BOL) with Enhanced processes delivers cost effective, high performance packaging solution.
Production Floor
New Methods Extract Lithium from Water
New Methods Extract Lithium from Water
Researchers discovered a highly efficient way to extract lithium and other metals and minerals from water and published their findings in Science Advances.
Technology Briefing
Mixed Metals Impact on Reliability
Mixed Metals Impact on Reliability
This paper documents the effect of mixing Leaded and Lead Free alloys on BGA devices and how this impacts reliability.
Analysis Lab
Improved Reliability of Jet Dispensable Polymeric Coating Material
Improved Reliability of Jet Dispensable Polymeric Coating Material
The study compares a paste that barely passes SIR at 85C/85RH with polymeric coating material, Silicone conformal coating, and acrylic conformal coating.
Materials Tech
Corrosion Resistant Servers for Free-Air Cooling Data Centers
Corrosion Resistant Servers for Free-Air Cooling Data Centers
This paper describes a corrosion resistant server design suitable for reliable operation in a free-air cooling data center.
Production Floor
Ask the Experts
Solder Paste Past Shelf Life
We have some solder paste that has been in a sealed box at 4 degree Celsius for more than 8 months. The shelf life is 6 months. Can it be used?
Ask the Experts
Help With Lead to Hole Ratio
Help With Lead to Hole Ratio
What is the proper minimum gap between a round conductor lead and the PCB hole that will allow proper solder fill? Where can I find the recommended guideline?
Board Talk
Ask the Experts
What Causes Black Pad?
What is the primary cause of Black Pad and/or pad contamination during the assembly process?
Ask the Experts
Programs << Page 1 of 191 >>