Electronics Assembly Knowledge, Vision & Wisdom
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Is There a Test for Black Pad?
Is There a Test for Black Pad?
We have identified black-pad and are concerned it may extend to assembled PCBs. Is there a nondestructive test that can be performed on assemblies? The Assembly Brothers, Jim Hall and Phil Zarrow, use their expertise in the industry to answer this question.
Board Talk
Ask the Experts
Reworked BGA Bridging at the Corners
Recently reworked BGA components are bridged at the corners. What caused the corners of the BGA component to bridge and how can we prevent it?
Ask the Experts
Returning to Basics in the SMT Screen Printing Process
Returning to Basics in the SMT Screen Printing Process
This paper showcases a new stencil process that was discovered by reverting to the basics.
Production Floor
Harnessing AI-Driven Growth
Harnessing AI-Driven Growth
As AI transforms one industry after another, it will spur economic growth throughout the world, but particularly in the United States.
Technology Briefing
BGA Reballing and Influence on Ball Shear Strength
BGA Reballing and Influence on Ball Shear Strength
This paper focuses on the effect of various parameters that are used to reball a BGA component and their effect on the overall shear strength.
Analysis Lab
Alternative Solvent with Low Global Warming Potential
Alternative Solvent with Low Global Warming Potential
A new low global warming potential fluorinated solvent for precision cleaning is discussed. The paper covers the properties and performance.
Materials Tech
Minimizing Voiding in QFN Packages
Minimizing Voiding in QFN Packages
This paper quantifies the preform requirements and process adjustments needed to minimize voiding in QFN packages.
Production Floor
Ask the Experts
Estimating Failure Rate During Rework
Is there a way to estimate the potential failure rate introduced by hand rework of one SMT part that involves de-soldering and soldering a new part?
Ask the Experts
Reliability of Lead Free Solder Joints in Ball Grid Array Packages
Reliability of Lead Free Solder Joints in Ball Grid Array Packages
This paper investigates the impact of isothermal aging on the long-term reliability of lead-free solder joints.
Analysis Lab
Can a CTE Mismatch Cause Reliability Problems?
Can a CTE Mismatch Cause Reliability Problems?
Does usage of BGAs, QFNs or SONs have an increased risk for reliability of solder joints due to the CTE mismatch with the base board material FR4?
Board Talk
Programs << Page 1 of 174 >>
 
 
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