Electronics Assembly Knowledge, Vision & Wisdom
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We have over 1000 programs in this database. Programs are sorted by published date, most recent first.


What Causes Solder Icicles During Wave Soldering
What Causes Solder Icicles During Wave Soldering
Why are we getting solder icicles on some leads when we run boards in our wave solder machine? Where should be look first to change our process? The Assembly Brothers, Jim Hall and Phil Zarrow, share their insight and experience.
Board Talk

The Effects of Phosphorus in Lead-Free Solders
The Effects of Phosphorus in Lead-Free Solders
This paper reports on experiments to determine the effects of phosphorus additions on the behavior of a widely used lead-free solder.
Production Floor

Wirelessly Monitor Vital Signs
Wirelessly Monitor Vital Signs
A radar system developed can wirelessly monitor the vital signs of patients, eliminating the need to hook them up to any machines.
Technology Briefing

Grain Refinement for Improved Lead-Free Joint Reliability
Grain Refinement for Improved Lead-Free Joint Reliability
In the study reported in this paper the effect of trace additions of selected elements on the grain structure of pure tin and lead-free solder alloys was observed.
Analysis Lab

Embedded Fibers Enhance Nano-Scale Interconnections
Embedded Fibers Enhance Nano-Scale Interconnections
This paper introduces the use of embedded fibers in the interconnections of chip-to-chip and chip-to-package components.
Materials Tech

Printing of Solder Paste - A Quality Assurance Methodology
Printing of Solder Paste - A Quality Assurance Methodology
This paper describes a method to ensure quality secured data from both solder paste printers and inspection machines in electronic assembly manufacturing.
Production Floor

Reliability of No-clean and Water-soluble Solder Pastes
Reliability of No-clean and Water-soluble Solder Pastes
The purpose of this paper is to highlight the differences between these two families of solder pastes to guide users in their choice.
Analysis Lab

Review of Tin-Copper and Tin-Nickel Intermetallic Thickness
Review of Tin-Copper and Tin-Nickel Intermetallic Thickness
What is the desirable intermetallic layer thickness? I have read that 1 - 2.5 micron thickness of tin-copper and a .4 - .8 micron thickness on tin-nickel.
Board Talk

High and Matched Refractive Index Liquid Adhesives for Optical Device
High and Matched Refractive Index Liquid Adhesives for Optical Device
High and matched refractive index liquid adhesives are required in several electronics devices, where the liquid adhesives are in the optical pathway.
Materials Tech

Breakthrough in Recyclable Plastics
Breakthrough in Recyclable Plastics
A breakthrough from scientists at Lawrence Berkeley Lab could finally provide the solution we’ve been waiting for: truly recyclable plastics.
Technology Briefing

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