Electronics Assembly Knowledge, Vision & Wisdom
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How To Verify Cleanliness After Rework and Prior to Re-coating?
How To Verify Cleanliness After Rework and Prior to Re-coating?
Rework on a coated assembly happens often. I know how to remove the coating and clean the work site, but how do you verify cleanliness of the rework site prior to re-coating? The Assembly Brothers, Phil Zarrow and Jim Hall, answer these questions.
Board Talk
Ask the Experts
Selective Printing for BGA Components
We use common BGA packages on many of our low-end products. To save cost, could we print paste only on the pads that have functional requirements?
Ask the Experts
Solder Column Attachment for Absorbing Large CTE Mismatch
Solder Column Attachment for Absorbing Large CTE Mismatch
Paper reviews commercially off-the-shelf solder columns available, including plain columns, copper wrapped columns and more.
Production Floor
Breakthrough Printing 3D Carbon Fiber Composites
Breakthrough Printing 3D Carbon Fiber Composites
Researchers recently printed 3D carbon fiber composites offering greater control and optimization of the lighter-weight, yet stronger-than-steel material.
Technology Briefing
Predicting Fatigue of Solder Joints
Predicting Fatigue of Solder Joints
Chip resistors were subjected to a high number of short duration power cycles. Environmental conditions and material properties were documented.
Analysis Lab
pH neutral Cleaning Agents - Market Expectation & Field Performance
pH neutral Cleaning Agents - Market Expectation & Field Performance
Study reviews performance of pH neutral cleaning agents compared to alkaline cleaning alternatives and includes field data.
Materials Tech
Assembly Options for Handheld Products
Assembly Options for Handheld Products
Paper covers assembly and material alternatives to make a handheld products as producer friendly, cost effective and reliable as possible.
Production Floor
Ask the Experts
White Discoloration After Ultrasonic Cleaning
We are using halogen free no-clean solder paste with an ultrasonic cleaning system. There is a white discoloration on soldered areas.
Ask the Experts
 Mitigating Tin Whiskers in Alternative Lead-Free Alloys
Mitigating Tin Whiskers in Alternative Lead-Free Alloys
As lead-free alloys shift into high reliability electronics, the issue of tin whisker growth remains a primary concern among those in the industry.
Analysis Lab
Simple Test for Flux Penetration
Simple Test for Flux Penetration
What is a good test for flux penetration through plated hole barrels on plated through hole circuit boards? A simple method is offered.
Board Talk
Programs << Page 1 of 175 >>
 
 
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