Electronics Assembly Knowledge, Vision & Wisdom
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We have over 1000 programs in this database. Programs include:
Analysis Lab, Ask the Experts, Board Talk, Materials Tech, Supply Chain, Production Floor, and Technology Briefing.

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Questions About Humidity Indicator Cards and Baking Components?
Questions About Humidity Indicator Cards and Baking Components?
We run small jobs so a reel of MSD components could be open and closed a number of times. Each time we put a new desiccant pack and humidity card in the MSD bag. If we total the times we open the bag it exceeds 168 hours. If the humidity cards are not pink, do we still have to bake the components?
Board Talk
Ask the Experts
Stencil Cleaning Frequency
What is the industry standard for the amount of time between stencil cleaning?
Ask the Experts
Influence of PCB Surface Features on BGA Assembly Yield
Influence of PCB Surface Features on BGA Assembly Yield
This paper provides insight into the impact of irregularities on BGA package surface mount yield, and guidance on design and to limit their impact.
Production Floor
Smart Textiles Detect Nerve Gas
Smart Textiles Detect Nerve Gas
A chemical engineer at City College of New York recently developed smart textiles with the ability to rapidly detect and neutralize nerve gas.
Technology Briefing
Microstructure and Performance of Micro CU Pillars Assemblies
Microstructure and Performance of Micro CU Pillars Assemblies
Correlations between the shear strength and microstructure of Cu pillars were examined for different solder compositions, and for different aging times.
Analysis Lab
Insulation Resistance of Dielectric Materials
Insulation Resistance of Dielectric Materials
This investigation measures the leakage current within internal PCB layers during exposure of various specimens to a controlled ground-based test environment.
Materials Tech
Expanding IEEE Std 1149.1 Boundary-Scan Architecture
Expanding IEEE Std 1149.1 Boundary-Scan Architecture
This paper discusses the expanded use of boundary-scan testing beyond the typical manufacturing test to capture structural defects.
Production Floor
Ask the Experts
BGA BAll Sheer Testing
We soldered a lead-free BGA. After reflow, we mechanically pulled the BGA component off the circuit board surface. What should we expect?
Ask the Experts
Direct Determination of Phosphorus Content in Electroless Nickel Plating
Direct Determination of Phosphorus Content in Electroless Nickel Plating
Developments in XRF instrument hardware and software have extended the measurement application of electroless plating processes to nearly any substrate.
Analysis Lab
Issues Mixing Silicone and Acrylic Conformal Coatings
Issues Mixing Silicone and Acrylic Conformal Coatings
Our repair PWA assemblies have a silicone based conformal coating. During repair some of the coating is removed. Is there be a compatibility problem with the coatings?
Board Talk
Programs << Page 1 of 189 >>