Electronics Assembly Knowledge, Vision & Wisdom
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We have over 1000 programs in this database. Programs are sorted by published date, most recent first.


Step Stencil Setup
Step Stencil Setup
When shifting from standard solder paste stencils to step stencils, should we change the pressure or attack angle? Phil Zarrow and Jim Hall, The Assembly Brothers, answer this question and share their own experiences.
Board Talk

Warpage of Flexible-Board Assemblies with BGAs During Reflow and Post-Assembly
Warpage of Flexible-Board Assemblies with BGAs During Reflow and Post-Assembly
Failure in solder interconnects is a leading cause of reliability failure. Complexity of electronic assembly requires these lead-free interconnects to be reliable.
Production Floor

Laser Sensors Detect 3D Objects
Laser Sensors Detect 3D Objects
A method, using two inexpensive cameras on either side of a car windshield, can detect objects with more accuracy and a fraction of the cost is discussed.
Technology Briefing

Via-In Pad Plated Over (VIPPO) Design Considerations
Via-In Pad Plated Over (VIPPO) Design Considerations
This work has evaluates BGA packaging and PCB design parameters to characterize their influence on double-reflow solder separation failure mode for mixed VIPPO BGA pad footprints.
Analysis Lab

Solder Paste Selection for Bottom Termination Components Attach
Solder Paste Selection for Bottom Termination Components Attach
Two solder paste chemistries and several printing parameters were evaluated in order to achieve consistent solder paste deposition across the assembly.
Materials Tech

An Introduction to the Process of Printed Electronics
An Introduction to the Process of Printed Electronics
While following best practices, researchers aim to create processes that ramp up the scale of production for simple circuits and integrated conductive structures.
Production Floor

Innovative BGA Defect Detection Method for Transient Discontinuity
Innovative BGA Defect Detection Method for Transient Discontinuity
This paper summarized the development of this innovative in-situ, real time methodology, which is capable of detecting BGA transient discontinuity.
Analysis Lab

What is Ideal Humidity for Final Assembly?
What is Ideal Humidity for Final Assembly?
What is ideal humidity within a final assembly facility? No soldering involved. The facility is used for final box build.
Board Talk

Surface Insulation Resistance of No-Clean Flux Residues
Surface Insulation Resistance of No-Clean Flux Residues
No-clean fluxes present great benefits, but the activity of the unwashed process residues must be tightly controlled in order to meet reliability standards.
Materials Tech

Securing the Supply Chain of Strategic Minerals
Securing the Supply Chain of Strategic Minerals
A study focuses on 23 "mineral commodity groups" classified as critical based on the likelihood of supply interruption and the cost of such an interruption.
Technology Briefing

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