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Cleaning Reballed BGA Components
Cleaning Reballed BGA Components
We currently clean reballed BGAs using an ultrasonic cleaner followed by baking to remove moisture. Is this an acceptable practice? Jim Hall and Phil Zarrow, the Assembly Brothers, offer their own suggestions and expertise.
Board Talk

Fill the Void II: An Investigation into Methods of Reducing Voiding
Fill the Void II: An Investigation into Methods of Reducing Voiding
This paper is a continuation of previous work on voiding. The voiding results are summarized and recommendations made for reduction of voiding.
Production Floor

Revolutionized Energy Storrage in Electric Vehicles
Revolutionized Energy Storrage in Electric Vehicles
Researchers revealed a technology that has the potential to revolutionize energy storage in electric vehicles and reduce energy loss.
Technology Briefing

Final Finish Specifications Review
Final Finish Specifications Review
Specifications are consensus documents agreed upon by a panel of industry participants composed of suppliers, manufacturers, assembly houses and users.
Analysis Lab

DFX on High Density Assemblies
DFX on High Density Assemblies
This paper discusses selection of solder paste based on end product and the need to conduct proper root cause analyses before making any material changes.
Materials Tech

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