Electronics Assembly Knowledge, Vision & Wisdom
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We have over 1000 programs in this database. Programs include:
Analysis Lab, Ask the Experts, Board Talk, Materials Tech, Supply Chain, Production Floor, and Technology Briefing.

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Best Method for Repairing Underfill Arrays?
Best Method for Repairing Underfill Arrays?
What is the best method for removing an SMT array package that has been under-filled and cured. Is there an industry approved method? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this.
Board Talk
Ask the Experts
Hot or Cold DI Water Rinse?
How important is the use of hot water in our cleaning systems? Could we get equal results using a room temperature rinse?
Ask the Experts
Optimization of Stencil Apertures to Compensate for Scooping
Optimization of Stencil Apertures to Compensate for Scooping
This study investigates the scooping effect during solder paste printing as a function of aperture width, aperture length and squeegee pressure.
Production Floor
Automated Program Synthesis
Automated Program Synthesis
Researchers are using a model of programming "automated program synthesis," computers generate pieces of code based on a user's intent.
Technology Briefing
pH Neutral vs. Alkaline Cleaning Agents
pH Neutral vs. Alkaline Cleaning Agents
Study compares material compatibility and cleaning effectiveness of pH-neutral and alkaline technologies at low operating concentrations.
Analysis Lab
Reliability of ENEPIG by Sequential Thermal Cycling and Aging
Reliability of ENEPIG by Sequential Thermal Cycling and Aging
Paper presents the reliability of LGA components assembled with tin-lead solder onto PCBs with an ENEPIG finish and subjected to thermal cycling and aging.
Materials Tech
A Robust Fine Feature Printing Process
A Robust Fine Feature Printing Process
This paper evaluates many fine printing stencil factors that have an increased effect on the transfer efficiency of solder pastes.
Production Floor
Ask the Experts
Conformal Coating & Humidity
Can conformal coating protect a circuit board that will be operating in a humid environment? Is there a specific process?
Ask the Experts
Board, Package and Die Thickness Effects Under Thermal Cycling Conditions
A model that enables the scaling of solder joint failure cycles for board and die or substrate thickness effects under thermal cycling conditions is discussed.
Analysis Lab
Can We Rework Lead-Free Boards with Leaded Solder?
Can We Rework Lead-Free Boards with Leaded Solder?
Can boards built with lead-free be reworked with leaded solder? I realize they may not comply with RoHS, but will they be reliable?
Board Talk
Programs << Page 1 of 173 >>