Electronics Assembly Knowledge, Vision & Wisdom
The Development of Hybrid Therma-EMI Solutions for Electronics
The Development of Hybrid Therma-EMI Solutions for Electronics
Test methods to measure the thermal and electromagnetic properties of a material in an application and as fundamental material properties are discussed.
Production Floor

Authored By:
John Timmerman, Ph.D.
Henkel
Chanhassen, MN, USA

Scott King
Henkel
Chanhassen, MN, USA

Dan Maslyk
Henkel
Irvine, CA, USA
,{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Summary
Products that manage thermal and electromagnetic challenges individually in electronics are well established in the current marketplace, but a need has emerged for materials and solutions that combine these two functionalities. In many new products and designs multiple heat and signal generating components cannot be isolated from each other using traditional means. In these applications a material that transfers heat and absorbs electromagnetic energy can be used to improve signal integrity, prevent crosstalk, and manage operating temperatures. These hybrid materials have various compositions and forms, which range from thin sheets to soft pads to reactive or non-reactive liquid materials.

The mechanical, thermal, electrical, and magnetic properties of these materials depend on their materials of construction as well as the macro and microscopic organization of the components involved. Many test methods exist to measure the thermal and electromagnetic properties of a material both in an application and as fundamental material properties. This paper will expand on these topics in more detail as well as discussing existing and future trends in thermal and electromagnetic materials development.
Conclusions
It was shown that through the right combination of matrix and fillers materials could be formulated to conduct heat and absorb electromagnetic energy in the 1-10GHz range. Increasing material thickness and magnetic loss tangent both significantly improved the amount of absorption for a given material. The material permeability was shown to affect performance through its variation with frequency. Application testing showed the utility of hybrid thermal/EMI absorbing materials. Overall, these materials will continue to find more use in electronics as devices shrink, speeds increase, and component densities grow.
Initially Published in the SMTA Proceedings
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Company


E-mail


Country


Comments


Authentication

Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.



Related Programs
bullet What is the Best Way to Clean Solder Stencils?
bullet Stencil Printing Yield Improvements
bullet The Development of Hybrid Therma-EMI Solutions for Electronics
bullet Tenting Via In Pad - Yes or No?
bullet Jetting Conductive Adhesives with Silver Coated Polymer Particles
bullet Solder Paste Beyond The Shelf Life?
bullet Issues With Solder Paste Transfer Efficiency
bullet Stencil Printing Yield Improvements
bullet Advanced Second Level Assembly Analysis Techniques
bullet Solder Paste Transfer Greater Than 100%
More Related Programs