Electronics Assembly Knowledge, Vision & Wisdom
Jetting Solder Paste Opens Up New Possibilities
Jetting Solder Paste Opens Up New Possibilities
The differences between jet printing and dispensing will be highlighted and technical challenges with broad band technology will be discussed.
Production Floor

Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.
Submit A Comment
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company


Your E-mail


Your Country


Your Comment



Authored By:
Nico Coenen
MYDATA
Taby, Sweden

Summary
Jetting of liquids is becoming the standard in our industry. MYDATA has developed a unique tool to jet solder paste. This non-contact method of applying solder paste has a large number of advantages compared to standard screen printing or dispensing.

The challenges of today's production environment is not only the fact that components getting smaller but the biggest challenge is the combination of small and large components on the same board. Putting the right amount of solder paste for each component will be required to deliver the right quality. Depending on the volume requirements Jet Printing can be an alternative tool to cope with this mix or be used as an add on tool to compliment the screen printer in a high volume environment.

The Jet Printing technology allows to build up the volume by single dots to achieve the right amount for each component. Special applications like pin in paste, applying paste in cavities and many more challenges of today's requirement can be easily accommodated with this technology.

Mixing different types of solder paste with different metal content will be discussed as typically jet printing paste is type 5 versus type 3 or 4 for a screen printer. The differences between jet printing en dispensing will be highlighted and technical challenges with broad band technology will be discussed.

Conclusions
Over the years jetting has gained importance and has become the standard in the industry to apply fluids. A non- contact way has many advantages over a traditional dispensing process. Jet Printing of solder paste can be used in low to mid volume segments to replace a screen printer but can also be added in high volume lines to take care of the challenging deposits or to add solder paste where needed.

Today Jet Printing is no longer seen as a futuristic technology but it has proven itself and the technology is still gaining momentum. With all the developments going on it looks like Jet Printing will increase further the coming years.

Initially Published in the SMTA Proceedings

Comments
No comments have been submitted to date.
Free Newsletter Subscription
Every issue of the Circuit Insight email newsletter will bring you the latest information on the issues affecting you and your company.

Insert Your Email Address

Directory Search


Program Search
Related Programs
bullet Solder Paste Selection for Bottom Termination Components Attach
bullet Surface Insulation Resistance of No-Clean Flux Residues
bullet Solder Joint Reliability of 0.8 mm BGA Packages for Automotive
bullet Solder Paste: Fundamental Material Property / SMT Performance Correlation
bullet Factors Impacting the Reliability of Ultralow Silver Lead Free Alloys
bullet Rheology of Solder Paste: Shelf Life Study
bullet Improved Flux Reliability of Lead-Free Solder Alloy Solder Paste
bullet Implementation of Assembly Processes for Low-Melting Point Solder Pastes
bullet Relative Humidity Dependence of Creep Corrosion on Organic-Acid Flux
bullet How Does Printed Solder Paste Volume Affect Solder Joint Reliability?
More Related Programs