Electronics Assembly Knowledge, Vision & Wisdom
Nanocopper Based Paste for Solid Copper Via Fill
Nanocopper Based Paste for Solid Copper Via Fill
This paper discusses a nano copper based paste for use in via filling.
Materials Tech

Authored By:
David Ciufo, Sujatha Ramanujan, Janet Heyen, Michael Carmody
Intrinsiq Materials Inc. Rochester, NY

Sunny Patel
Candor Industries Inc., Ontario, CA
,{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Summary
This paper discusses a nano copper based paste for use in via filling. The company manufactures nano copper and disperses the coated nano copper into a paste in combination with micron copper. The resultant paste is injected or fills a via. The via is subsequently sintered by means of photonic sintering, or by heat in a reducing environment. The process will be accomplished in under an hour and results in filled solid copper vias.
Conclusions
The company has developed a nano copper based paste well suited for via filling. With high conductivity, long life, and environmentally cleaner process, the Intrinsiq paste offers an excellent option. This paste can be utilized with standard via fill, and may enable quick turn manufacturing. The next steps include investigating us of a more typical Hydrogen/Nitrogen flow in the oven. In addition, Intrinsiq plans to work with industry standard via fill techniques.
Initially Published in the IPC Proceedings
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Company


E-mail


Country


Comments


Authentication

Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.



Related Programs
bullet How Many Fiducials Pre Solder Paste Stencil?
bullet Improved Reliability of Jet Dispensable Polymeric Coating Material
bullet Rosin vs. Non-Rosin Wave Flux? - More Reliable Electronic Assemblies
bullet Effect of Process Changes and Flux on Mid-Chip Solder Balling
bullet Solder Composition, Surface Finish and Solder Joint Volume on Drop Shock Reliability
bullet Effect of Fine Lead-Free Solder Powder on the Reflow Property Pastes
bullet Electroplating of Cu in TSV and Characteristics of Low Alpha Solder Bump
bullet Bending Strength of Solder Joints as a Function of Joint Length
bullet Fill the Void
bullet Formulation of a New Liquid Flux for High Temperature Soldering
More Related Programs