Electronics Assembly Knowledge, Vision & Wisdom
EMI-Caused EOS Sources in Automated Equipment
EMI-Caused EOS Sources in Automated Equipment
This paper analyses sources of EMI-Caused EOS noise, how it affects components and how to mitigate this problem.
Production Floor

Authored By:
Vladimir Kraz
OnFILTER, Inc.
Santa Cruz, CA
,{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Summary
Electrical overstress causes damage to sensitive components, including latent damage. A significant source of EOS is high-frequency noise in automated manufacturing equipment. This paper analyses sources of such noise, how it affects components and how to mitigate this problem.
Conclusions
Electrical overstress is a serious and increasing threat to sensitive devices. Reduction of EOS exposure in assembly is an important way to improving yield and to reduce latent damage to the devices. High-frequency noise (EMI) in automated equipment is a significant source of electrical overstress.

Proper analysis of EMI environment in the facility and inside the tools, setting EOS limits for your process and proactive mitigation of EOS exposure improves yield and reduces EOS-caused failures.
Initially Published in the IPC Proceedings
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Company


E-mail


Country


Comments


Authentication

Please type the number displayed into the box. If you attempt to submit information and receive an error, you may need to refresh the page and insert the information again.



Related Programs
bullet Stencil Printing for Miniaturized Electronics
bullet Environment Impact on Assembly, Printing and Reflow
bullet Twisting Multi-strand Wires
bullet Suggested Stencil Wipe Frequency?
bullet What is the Ideal Stencil Thickness?
bullet A New Line Balancing Method
bullet Stencil Printing Yield Improvements
bullet Jetting Conductive Adhesives with Silver Coated Polymer Particles
bullet Questions About Handling Solder Paste
bullet EMI-Caused EOS Sources in Automated Equipment
More Related Programs
About | Advertising | Contact | Directory | Directory Search | Directory Submit | Privacy | Programs | Program Search | Sponsorship | Subscribe | Terms

Circuit Insight
6 Liberty Square #2040, Boston MA 02109 USA

Jeff Ferry, Publisher | Ken Cavallaro, Editor/Business Manager

Copyright © Circuitnet LLC. All rights reserved.
A Circuitnet Media Publication