Electronics Assembly Knowledge, Vision & Wisdom
RF Capacitor Material for Use in Printed Circuit Board
RF Capacitor Material for Use in Printed Circuit Board
A novel ceramic-functional-particle-filled polymer composite material has been developed for use either discrete elements on the PCBs.
Materials Tech

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Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
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Authored By:
Jin-Hyun Hwang, John Andresakis, Ethan Feinberg, Bob Carter, Yuji Kageyama, Fujio Kuwako
Oak-Mitsui Technologies
Hoosick Falls, NY USA

Summary
A novel ceramic-functional-particle-filled polymer composite material has been developed for the use either in discrete elements on the printed circuit board or in being embedded within the packaging substrate for high frequency circuit applications. This material provides the desired properties such as low loss at high frequencies, about 0.002 or less up to 10GHz, and high dielectric strength, among other improved properties.

The electrical properties were influenced significantly by the ceramic-functional-particle, i.e. type and particle size/distribution in the polymer matrix. Their contributions to the electric strength and temperature stability of capacitance which is an important material issue for practical device application will be discussed. In addition, capacitance tolerance for manufacturing embedded RF capacitor will be presented in terms of etching uniformity to minimize the variation of the capacitor electrode areas.

Conclusions
The ceramic filled organic-based composite material has been used to make RF capacitor laminates to compete with ceramic chip capacitors. Using this material, we successfully achieved low DF of ~0.002 at GHz frequencies up to 10GHz, higher dielectric strength and better TCC by optimizing size of the filler and controlling its distribution in the polymer matrix. This material can be applicable for the use either in discrete RF components or in being embedded within the packaging substrate as an embedded RF capacitor material.

Initially Published in the IPC Proceedings

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