Electronics Assembly Knowledge, Vision & Wisdom
Final Finish Specifications Review
Final Finish Specifications Review
Specifications are consensus documents agreed upon by a panel of industry participants composed of suppliers, manufacturers, assembly houses and users.
Analysis Lab

Authored By:
George Milad
Uyemura International Corporation
Southington, CT USA
,{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Summary
Specifications are consensus documents that are agreed upon by a panel of interested industry participants composed of suppliers, manufacturers, assembly houses and end users. The IPC Plating Sub-committee 4-14, is no exception. If there is consensus then the committee documents it in a specification. In cases where no consensus is readily arrived at, the committee undergoes its own testing in what is commonly referred to as a "Round Robin" (RR) study.
Conclusions
It is noteworthy that the committee had spent considerable time working an organic solderability preservative (OSP) specification that was designated IPC-4555. After more than one year of struggling with the specification nothing was issued. There was no consensus arrived at. Mostly this was due to the wide assortment of organic products that were used for solderability preservation for the various application; each with its own thickness recommended values.
Initially Published in the IPC Proceedings
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Company


E-mail


Country


Comments


Authentication

Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.



Related Programs
bullet Semi-Additive Process for High Frequency Signal Substrates
bullet Dielectrics for Embedding Active and Passive Components
bullet Via-In Pad Plated Over (VIPPO) Design Considerations
bullet Design and Fabrication of Ultra-Thin Flexible Substrate
bullet Circuit Material Performance for PCBs at Millimeter Wave Frequencies
bullet Computed Tomography on Electronic Components
bullet Calculating PCB Hole Diameters
bullet Optimizing Insulated Metal Substrate Application
bullet Embedded Components from Concept-To-Manufacturing
bullet HDI Structures Using Thin Films and Low Temp Paste
More Related Programs