Electronics Assembly Knowledge, Vision & Wisdom
Advanced Printing for Microelectronic Packaging
Advanced Printing for Microelectronic Packaging
Using micro-dispensing it is possible to print in 3D space a wide variety of materials including solders, epoxies, conductive adhesives and ceramic filled polymers.
Production Floor

Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.
Submit A Comment
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name

Your Company

Your E-mail

Your Country

Your Comment

Authored By:
Kenneth H. Church, Xudong Chen, Joshua M. Goldfarb, Casey W. Perkowski, Samuel LeBlanc
nScrypt, Inc.
Orlando, FL USA

Using micro-dispensing with exceptional volume control it is possible to print in 3D space a wide variety of materials and including solders, epoxies, conductive adhesives and ceramic filled polymers. These can be used to build 3D structures and utilizing a 3D Printing approach which is also known as Computer Aided Design and Computer Aided Manufacturing (CAD/CAM).

The advanced technology enables 3D printing of electronics but it also enables smaller solder and adhesive dots; 75 microns and less. It is possible to place these on any package in 3D space. Demonstrations for this technology have shown that it is possible to print less than 50 micron wide lines and dots. Additionally a wide range of materials that will be required in future packaging can be dispensed.

These smaller features provide sub nanoliter volume. This is possible given the less than 100 picoliter volume control during dispensing and including highly viscous materials. Demonstrations of smaller printed dots and lines for electronic circuits and packaging will be shown. In addition, 3D circuitry that is 3D printed and contains no solder will also be shown, demonstrating the future of printed circuits.

Electronic packaging is becoming more complex given the amount of circuitry required in smaller volumes. This will require tighter tolerances in dispensing and in robotic control for placement. The micro-dispensing of dots and lines utilizing the company micro-dispenser has the ability to accurately place and control the volume of solders and epoxies.

This could be enabling for existing and future electronic products. Additionally, micro-dispensing was used to demonstrate 3D electrically functional structures. These devices perform like standard electronic boards, but do not require solder. The monolithic builds will be more rugged and as the technology matures this will also add more functions per volume since an additional dimension will be used more effectively.

Initially Published in the IPC Proceedings

No comments have been submitted to date.
Free Newsletter Subscription
Every issue of the Circuit Insight email newsletter will bring you the latest information on the issues affecting you and your company.

Insert Your Email Address

Directory Search

Program Search
Related Programs
bullet Impact of Alloy Composition on Shear Strength for Low Temperature Lead Free Alloys
bullet Stencil Printing for Challenging Heterogeneous Assembly Applications
bullet Qualitative Model Describing Hot Tear Above VIPPO and Other Design Elements
bullet FEA and Analysis for BGA-CGA Assemblies Under Thermal Cycling
bullet How Many Fiducials Per Stencil
bullet The Development of Hybrid Therma-EMI Solutions for Electronics
bullet Cavity Board SMT Assembly Challenges
bullet Comparison of Reliability of Copper, Gold, Silver and PCC Wirebonds Under Sustained Operation
bullet Stencil Printing Yield Improvements
bullet Jetting Conductive Adhesives with Silver Coated Polymer Particles
More Related Programs