Void-Free Soldering With Vapor-Phase Vacuum Tech



Void-Free Soldering With Vapor-Phase Vacuum Tech
This paper explores equipment that has been developed to achieve void-free joints using modern condensation reflow technology.
Production Floor

DOWNLOAD

Authored By:


Claus Zabel
Asscon
Konigsbrunn, Germany

JB Byers
A-Tek Systems Group
Longmont, CO, USA

Summary


Voids in solder joints are largely a function of differential pressure between vapor pressure of the gases inside of the joint and environmental conditions. By entering joints still in their liquid state into decompression chambers, voids can be eliminated. Equipment has been developed to achieve void-free joints under these conditions utilizing modern condensation reflow technology.

Initially Published in the SMTA Proceedings

Comments

No comments have been submitted to date.

Submit A Comment


Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments