Electronics Assembly Knowledge, Vision & Wisdom
EOS Exposure of Components in the Soldering Process
EOS Exposure of Components in the Soldering Process
Examines the consequences of electrical overstress caused by electromagnetic interference on power lines and ground in the manufacturing environment.
Analysis Lab

Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.
Submit A Comment
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company


Your E-mail


Your Country


Your Comment



Authored By:
Vladimir Kraz, OnFILTER, Inc.

Summary
This paper examines the nature; the consequences and the mitigation of electrical overstress (EOS) caused by electromagnetic interference (EMI), or electrical noise, on power lines and ground in manufacturing environment.

Conclusions
High-frequency signals on power lines and ground can cause high currents into sensitive devices during soldering resulting in electrical overstress and device damage. Proper analysis of the soldering environment, as well as any environment where conductive objects come in contact with the sensitive devices and implementation of preventive and corrective measures improves yield and reduces EOS-caused failures.

Initially Published in the IPC Proceedings

Comments
No comments have been submitted to date.
Free Newsletter Subscription
Every issue of the Circuit Insight email newsletter will bring you the latest information on the issues affecting you and your company.

Insert Your Email Address

Directory Search


Program Search
Related Programs
bullet Board, Package and Die Thickness Effects Under Thermal Cycling Conditions
bullet Reworkable Edgebond Applied Wafer-Level Chip-Scale Package
bullet Simple Test for Flux Penetration
bullet Problem Meeting Minimum Hole Fill During Wave Soldering
bullet Reactivity of No-Clean Flux Trapped Under Bottom Terminated Components
bullet Component Density on Solder Joint Reliability Under Harsh Environment
bullet Advancement of Solder Paste Inspection (SPI) Tools to Support Industry 4.0 & Package Scaling
bullet Void-Free Soldering with a New Vapor-Phase with Vacuum Technology
bullet Selective Soldering Design for Reliability Using a Novel Test Board and SIR Test Method
bullet Solder Pallets With Titanium Inserts - Yes/No?
More Related Programs