Electronics Assembly Knowledge, Vision & Wisdom
Causes and Tests for Pin Holes, Blow Holes and Outgassing
Causes and Tests for Pin Holes, Blow Holes and Outgassing
Bob Willis uses the NPL Defect Database to explain the causes, solutions and tests for outgassing, caused by moisture in the printed board board.
Analysis Lab

Authored By:
Bob Willis - http://www.bobwillis.co.uk
Bob Willis operates a training and consultancy business based in England.
,{url:'http://www.circuitinsight.com/videos/causes_tests_pin_holes-3.mp4'},{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name






Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.

Related Programs
bullet Trouble Soldering a PC104 Connector
bullet Effect of Gold on Reliability of SnAgCu Joints
bullet Fill the Void II: An Investigation into Methods of Reducing Voiding
bullet Wave Solder Pot Contaminated with Lead
bullet Source of Wave Solder Bridging
bullet Review of Tin-Copper and Tin-Nickel Intermetallic Thickness
bullet Syringe Dispensed Solder Paste for Hand Soldering
bullet Solder Bridging Problem on Header Connector
bullet Selective Soldering for Interconnection Technology
bullet Options for Reducing Dross
More Related Programs