Research
Embedded Components from Concept-To-Manufacturing
Copper Foil Elements Affecting Transmission Loss with High Speed Circuits
pH neutral Cleaning Agents - Market Expectation & Field Performance
Reducing Dust Deposition on Electronic Equipment
New Requirements for Sir Measurement
Effects of Mixing Solder Sphere Alloys with Bismuth-Based Pastes
The Development of a 0.3 mm Pitch CSP Assembly Process
Generalizations About Component Flatness at Elevated Temperature
MORE RESEARCH
Latest Industry News
iPhone 12 Production Could Be Delayed
Acer sees PC component shortages
Bio-Ink for 3-D Printing Inside the Body
Covid Seen Driving the Security Sector
U.S. Eases Restrictions on Private Remote-Sensing Satellites
EMS Manufacturing quote complexity drives OEMs to look behind EMS curtain
U.S. Manufacturing Rebounds to 14-Month High
IBM's New AI Tool Parses A Tidal Wave of Coronavirus Research
MORE INDUSTRY NEWS

Nanotechnology for Lead-free Final Finishes



Nanotechnology for Lead-free Final Finishes
Paper describes use of organic metal finish deposited onto copper pads to provide protection against oxidation and preserve solderability.
Materials Tech

DOWNLOAD

Authored By:


Jim Kenny, B. Wessling, Karl Wengenroth
Joe Abys, John Fudala, Robert Farrell
Enthone, West Haven, CT USA

Summary


The use of an Organic Metal finish only a few nano-meters deposited onto copper pads of printed circuit boards provides effective protection against oxidation and preserves solderability. The Nano layer has a thickness of only 50 nm, and contains the Organic Metal (conductive polymer) and a small amount of silver. Being more then 90% (by volume), Organic Metal is the major component of the deposited layer; Ag is present equivalent to a thickness of 4 nm. This Organic Metal - Ag complex final finish performs as well as any of the established surface finishes with a significant reduction in energy and environmental impact

Conclusions


The Organic Metal based Nanofinish is the first described example of a nanoparticulate complex between an Organic Metal and Ag. Although it does not form a closed nanolayer, it completely and effectively protects the Cu and prevents it from being oxidized even after four lead free reflow steps. Its aging resistance and wetting (soldering) performance is excellent and equal to or better than other well-established metallic finishes. This finish should be considered by anyone currently struggling with the cost and soldering inconsistencies of ENIG or attempting to use OSP on demanding multilayer PCBs

Initially Published in the IPC Proceedings

Comments

No comments have been submitted to date.

Submit A Comment


Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Board Talk
Solder Paste Beyond The Shelf Life?
Issues With Fillets on Via Holes?
Can Tape Residue Contaminate a Clean Tank?
Suggested Stencil Wipe Frequency?
Reflow Oven Zone Separation Challenges
When To Use Adhesive To Bond SMT Components
How To Clean a Vintage Circuit Board Assembly?
PCBA Inspection Concerns
MORE BOARD TALK
Ask the Experts
Lifted Lead on SOT Component
Allowable Bow and Twist on Round PC Fab
Mixed MSL Baking
Step Stencil Squeegee Angle
Solder Balling Splash After Reflow
Application Using No-Clean and Water Soluble Fluxes
IPC SOIC Defect Question
Mixed Process Solder Joint Appearance, Smooth or Grainy?
MORE ASK THE EXPERTS