Electronics Assembly Knowledge, Vision & Wisdom
PCB Assembly System Set-Up for PoP
PCB Assembly System Set-Up for PoP
This paper will explore the challenges and solutions of PoP assembly for the SMT assembly system.
Production Floor

Authored By:
Gerry Padnos
Juki Automation Systems
Morrisville, NC 27560 USA
,{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Summary
Traditional SMT assembly is a two dimensional process. Each component is placed on the same horizontal plane in different X and Y locations. In Package on Package (PoP) assembly, components are placed on successively higher layers. Since components are stacked on top of each other, traditional solder paste printing cannot be used. The typical SMT method to print solder paste can only be used to print paste on a single horizontal plane.

For PoP, the components that are placed on top of existing components need to have flux or special dipping solder paste applied at the time of assembly. This paper will explore the challenges and solutions of PoP assembly for the SMT assembly system.
Conclusions
The ability to assemble PoP devices requires two main changes from the standard SMT assembly process: application of flux to some or all components and the ability to stack components on top of each other.

While these two requirements are new to the SMT assembly process, the technologies and hardware have been around for many years and are well established. There are several possible assembly processes that can be used depending on the specific application. Adding the ability to assemble PoP devices is not difficult after understanding the basic requirements for PoP assembly as well as the specific application requirements.
Initially Published in the IPC Proceedings
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Company


E-mail


Country


Comments


Authentication

Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.



Related Programs
bullet Why Should We Consider Smart Feeders?
bullet Electronic Packages and Modules Based on Embedded Die Technologies
bullet Evaluating Manual and Automated Heat Sink Assembly
bullet Environment Impact on Assembly, Printing and Reflow
bullet Stencil Pattern for Thermal Pads on QFNs
bullet Trends for Printing Ultra Miniature Chips
bullet Electroplated Copper Filling of Through Hole Influence of Hole Geometry
bullet Stencil Design for Ultra Fine Pitch Printing
bullet FEA and Analysis for BGA-CGA Assemblies Under Thermal Cycling
bullet Twisting Multi-strand Wires
More Related Programs