Electronics Assembly Knowledge, Vision & Wisdom
The Hot Chip Scale Package
The Hot Chip Scale Package
A team building the world's first high-density Chip Scale Package needed to get it out the door. It was still hot when it shipped.
Mysteries of Science

Dr. Gilleo
Mysteries of Science by Dr. Ken Gilleo
Dr. Gilleo is a chemist, inventor and general problem solver. Ken has been tracking industrial forensics and collecting case histories for decades. These cases are taken from the vast world of industry and commercial enterprise.

Check out Dr. Gilleo's eBook, 100 Mysteries Solved by Science. We hope you enjoy these case histories. You need not be an engineer or scientist to understand the problems and appreciate the solutions.
A start up team for a company building the world's first high-density Chip Scale Package, or CSP, was working to deliver a working part to a large computer company. The chip carriers were all made by hand using bench top chemistry and old equipment. 

The team was down to only one chip carrier and one work station computer chip.  With only 4 hours before the order was due to ship. Each of the 302 connections had to be made one-at-a-time under a microscope using an old bonding machine.

The next step was to add the liquid encapsulate and harden the material in an oven. The resin wasn't completely cured in time for shipment so it was pulled from the oven and wrapped in plastic foam to keep it hot enough so the resin would complete the cure while it shipped.

The box was physically hot when the Fed Ex driver came to pick up the shipment and rejected it. How did the team explain the heat and convince the driver to accept it so they could meet their deadline?

Here's the rest of the story.

Thinking quick, one of the team members explained to the Fed Ex driver that the package contained fresh cookies just out of the oven for Grandma. The box made it to the coast, the part worked, and today this company is a highly successful chip manufacturer.
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