circuit insight
November 20, 2025
Continuous Improvement: The Task That Never Ends in the Cleaning World
Continuous Improvement: The Task That Never Ends in the Cleaning World
The job of a cleaning agent is to remove an unwanted contaminant, or simply some kind of “dirt”. How can you efficiently remove that soil while minimizing total waste and improving worker safety? While that answer evolves based on updated impact studies and new regulations, the goal of removing those undesired contaminants remains fixed.
Production Floor
Microalloying Effects of Sb and Ag on the Microstructural of Eutectic Sn-Bi Alloys
In this paper, we will compare the bulk microstructure of eutectic Sn-Bi with Sb and Ag additions to solder joints on Cu substrates and ENIG surface finishes.
Analysis Lab
Sponsor
Uyemura

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Ductile Low Temperature Solders for Mass Production of Assemblies
This paper reports results of the behaviour of Sb in a Sn-Bi alloy and consider the implications of the findings for the reliability of LTS solder joints.
Materials Tech
How to Cost a Board
How to Cost a Board
My boss has asked me to provide a cost matrix so we can quickly quote labor machine time component for the SMT board assembly.
Board Talk
Flip Chip LED Solder Assembly
A pin transfer process was adapted to assemble flip-chip CSP LEDs with fine pitch solder paste to assemble lateral and vertical LEDs on flat substrates.
Production Floor
Sponsor
Circuitnet

e-media Advertising Delivers Results!
Introduce your technology, new products or services in our e-mail newsletter & website to see how a digital advertising campaign can deliver results. Reach over 125,000 professionals.
Circuitnet Media LLC
Modern Methods of PCB Depanelization with a Focus on Low Impact Depanelization
Modern Methods of PCB Depanelization with a Focus on Low Impact Depanelization
It is easier and more economical to manufacture multiple assemblies simultaneously on a larger panel and then singularize them once they’ve been populated.
Analysis Lab
How Does Printed Solder Paste Volume Affect Solder Joint Reliability?
Solder paste and stencil technology has been well studied. It is the aim of this work to correlate printed solder paste volume to solder joint reliability.
Materials Tech
Sponsor
Essegi-Automation

Our Solutions
Discover Essegi Automation's modular solutions: flexible hardware and software seamlessly integrated into SMT and THT environments.
Essegi Automation
Flux Residue Causing Test Issues
We are having issues with flux residues. After wave, we experience many incomplete readings due to flux residues on connector pins.
Board Talk
High Thermal, High Temperature Interconnects for Ultra High Power LEDs
High Thermal, High Temperature Interconnects for Ultra High Power LEDs
For high performance applications, ultra-high power offers cost reduction through fewer LEDs, smaller PCBs, smaller heat sinks and lighter load bearing.
Production Floor
Molecular Fingerprint of Condensate Residues in the Soldering Process
A range of condensate samples were taken from different process zones of reflow soldering systems and were analyzed using FT-IR spectrometry.
Analysis Lab
Sponsor
Glenbrook-Technologies

X-ray Rentals & Rent-to-Own
Rent any of our machine models, with up to 3 months of rental costs applied toward purchasing X-ray equipment. Our flexible plan lets you test the system before committing to purchase.
Glenbrook Technologies
Implementation of Assembly Processes for Low-Melting Point Solder Pastes
Implementation of Assembly Processes for Low-Melting Point Solder Pastes
This paper discusses the need for low-temperature solders and process-ability of solder pastes with three novel alloys against the industry standard.
Materials Tech
iNEMI Board Assembly –Press-Fit Technology Roadmap
iNEMI Board Assembly –Press-Fit Technology Roadmap
A press-fit roadmap team including press-fit manufacture, OEM/ODM and EMS are getting together every two years to identify the future technology trend, future technical challenges and needs and then to find potential solution for next 5 to 10 years in the horizon.
Analysis Lab
Sponsor
Advanced-Interconnections

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
Study of Lead-Free Solder Materials for Power Module Packaging Assembly
Study of Lead-Free Solder Materials for Power Module Packaging Assembly
This study focused on the thermal fatigue performance and the microstructural evolution of five lead-free solders under harsh service conditions.
Materials Tech
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Circuit-Technology-Center
Sponsor
SEIKA-America

SAWA SC-BM500E Automatic Stencil Cleaner
Ultrasonic combined with spray cleaning provides an excellent solution for all kinds of applications including wafer bump and electroform stencils.
Seika
Uyemura
Sponsor
Circuit-Technology-Center

100+ Breakthrough Repair/Rework Guides Illustrated and Online
Free online guidebook, packed with detailed illustrations, will be helpful to anyone who needs to repair or rework circuit board assemblies to IPC standards.
Circuit Technology Center
Cartoon
"I'm sorry if I smell like a farm animal. My boss made me his scapegoat."
Copyright © Randy Glasbergen