Electronics Manufacturing and Electronics Assembly

Sponsor

Epoxy Offers Ultra High Heat Transfer
Bond EP5TC-80 is a NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
Master Bond

Technical Papers

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

Understanding Solder Dross: Causes and Control Strategies

MORE TECHNICAL PAPERS

Ask the Experts

Dam & Fill vs. Conformal Coating

Problems With Large Voids

T4 vs T5 Solder Paste Particle Size

How to Eliminate Via Pits

Process Controls When Running Multiple Lines

Blow Holes and Disturbed Joints

No-Clean Flux Residue After Selective Soldering

Mixing Silicone and Acrylic Conformal Coatings

MORE ASK THE EXPERTS

December 23, 2025

Impact of Substrate on Materials Reliability of High Power LED Assemblies
This study examines how substrate choice affects LED solder-joint reliability under thermal cycling, comparing ceramic LEDs assembled on aluminum MCPCB versus FR4 using multiple solder alloys.
Technical Paper

Reflow For Rigid Flex
We have a new PCB assembly that includes a section of flex cable and FR4 circuit board. What are the reflow rules I need to consider?
Board Talk

Sponsor

EPA Verified Stencil Cleaning Systems
Low power density ultrasonic cleaners combined with 440-R-SMT detergent provide safe and effective cleaning of stencils, pallets, oven radiators, misprints and SMD adhesives.
Smart Sonic

Warpage of Flexible-Board Assemblies with BGAs During Reflow
Failure in solder interconnects is a leading cause of reliability failure. Complexity of electronic assembly requires these lead-free interconnects to be reliable.
Technical Paper

Low Melting Temperature Interconnect Thermal Cycling Performance
Low melting temperature for solder interconnection comes with benefits but one disadvantage is inferior thermal cycling performance due to the higher creep rate.
Technical Paper

High-Reliability Solder Alloys’ Impact on Pb-free TF Conductors
The objective of this paper was to identify a solder and thick film combination to improve overall reliability of thick film hybrids.
Technical Paper

Sponsor

PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies

What is Causing Dimples in Blind Via Pads?
Recently we encountered defects on some bare boards from our supplier. The defect is a small dimple. What might be the cause of this defect?
Board Talk

Additive Manufacturing Approach for Integrated, Robust 3D Electronics
This paper focuses on the In-Mold Electronics approach, which facilitates the transition from subtractive to additively printed, robust, and 3D electronic structures.
Technical Paper

Sponsor

Probe Card Manufacturer 'Sees the Unseen' With X-ray
Probe card manufacturer relies on mobile real-time x-ray inspection to verify the quality of its aligned probes at different stages along the assembly line.
Glenbrook Technologies

The Ink Spitting Autowriter
A factory was testing a new auto writing system. It went haywire when a big fork truck passed by. What was causing this?
Mysteries of Science

Effect of Package Warpage and Composite CTE on Failure Modes
This paper gives examples of the BLR TC failure modes and locations of package test vehicles designed to correlate failure modes.
Technical Paper

Low Temperature Solder Hybrid Solder Joint Time Dependent Behavior
This paper will review a model to illustrate the source of “ball drift” and will report empirical results from testing designed to confirm the mechanism.
Technical Paper

Sponsor

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp

High-Temp Vibration Reliability of Thermally Aged Lead-Free Assemblies
In this paper, the reliability of lead-free SAC solder alloys at high temperature and vibration for pristine and thermally aged assemblies is analyzed.
Technical Paper

Impact of Thermal Loading on the Structural Intergrity of 3D TSV Package
In this paper, the different types of crack that can happen along the TSV/Si interface has been determined with the study of behaviors of crack.
Technical Paper

Sponsor

The Smart Alternative to SAC305
Get the cost benefits of a low-silver solution without sacrificing quality. REL61 surpasses SAC305 in key tests like AOI performance—making it the smart choice for your operations.
AIM Solder

Novel TIM Solution with Chain Network Solder Composite
A novel epoxy SAC solder paste TIM system has been developed with the use of non-volatile epoxy flux. Cu filler was added to the solder paste.
Technical Paper

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MORE INDUSTRY NEWS

Sponsor

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD

Sponsor

100+ Breakthrough Repair/Rework Guides Illustrated and Online
Free online guidebook, packed with detailed illustrations, will be helpful to anyone who needs to repair or rework circuit board assemblies to IPC standards.
Circuit Technology Center

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