Electronics Manufacturing and Electronics Assembly

We leave masking and Kapton tapes that fall off during cleaning in the bottom of our wash tank. Can the adhesives contaminate the recycled solution? Jim Hall and Phil Zarrow, The Assembly Brothers, address these question and share their own experiences.
Board Talk

Feasibility of Plasmonic Circuits Merged with Silicon Integrated Circuits
Plasmonic signal transmission via nanoscale plasmonic waveguides is a technique with the potential to increase the information transfer capacity in silicon integrated circuits.
Production Floor

Wireless Network Transmits Data from Microelectronic Chips
A research team has developed a wireless communication network that can transmit, receive and decode data from thousands of microelectronic chips.
Technology Briefing

Flux Residue Influence on Surface Insulation Resistance
Two liquid flux and two newly developed products build up the basic models. The results also provide a scientific approach to design highly reliable products.
Analysis Lab

Flux for Cleanable and No-Clean Solder Pastes
Paper provides a description of flux and the role of their constituting ingredients and a tin-bismuth-silver solder paste with cleanable residues.
Materials Tech

The Effects of Phosphorus in Lead-Free Solders
This paper reports on experiments to determine the effects of phosphorus additions on the behavior of a widely used lead-free solder.
Production Floor

Process Reliability Requirements in Matching Reinforcement Material
This paper presents the methodology for evaluation of Underfills and Edgebond materials in combination with no-clean solder paste.
Analysis Lab

A Review of Industry Terminology and Acronyms
What does the term BTC refer to? The Assembly Brothers talk about uniformity of terminology and how we are so good at making acronyms.
Board Talk

Solder Paste: Fundamental Material Property / SMT Performance
Aggressive form factors, reducing pitch, thinner packages, and larger die to package ratios are leading to higher package warpage during SMT reflow.
Materials Tech

Chip Use Light Waves to Perform Math Essential to AI Training
Engineers have developed a new chip that uses light waves, rather than electricity, to perform the complex math essential to training AI.
Technology Briefing

Plasma Polymerization
This paper will discuss the plasma coating process and the equipment used.
Production Floor

Comparison of Active and Passive Temperature Cycling
This paper describes the various accelerated temperature cycling tests, compares and evaluates the related degradation of solder joints.
Analysis Lab

The Suspicious Bicycle
An employee left the plant on his bicycle looking unsteady. His bike seemed to weigh more than 100 pounds. Why was the bike so heavy?
Mysteries of Science

Copper Electrodeposition By Hydrogen Evolution Assisted Electroplacing
A technique called hydrogen evolution assisted electroplating, has shown enhancement to the deposition rate of copper compared to galvanostatic conventional electroplating methods.
Production Floor

Leveraging America's Enormous Deep Tech Advantage

At the same time that America’s ability to manufacture and build have atrophied, it’s advantage in so-called “Deep Technologies” has exploded.
Technology Briefing

Piezoelectric Sensors for Measuring Stress in Semiconductor Applications
Advances in semiconductor technology and device complexity are stepping up the pressure on monitoring and controlling for semiconductor packaging processes.
Analysis Lab

Solder Paste Selection for Bottom Termination Components Attach

Two solder paste chemistries and several printing parameters were evaluated in order to achieve consistent solder paste deposition across the assembly.
Materials Tech

Improved Process Yield with Dynamic "real-time" Dual Head Dispensing
This paper examines proven methods to determine the dot/line positional accuracy along with mass flow rate for both heads during synchronous dispensing.
Production Floor