Electronics Manufacturing and Electronics Assembly

Could we print paste only on the pads that have functional requirements? Could we skip printing on 50 or more of the interior pads since they serve no function? The Assembly Brother, Phil Zarrow and Jim Hall, discuss this topic and share their own experiences.
Board Talk

Beyond ECM Additional Reasons for Cleaning Circuit Assemblies
The level of importance of a clean circuit assembly has been demoted. How did the cleanliness of circuit assemblies, once required, get shoved aside?
Production Floor

Wireless Network Transmits Data from Microelectronic Chips
A research team has developed a wireless communication network that can transmit, receive and decode data from thousands of microelectronic chips.
Technology Briefing

Effect of Bias Voltage on Surface Insulation Resistance Measurements
In this study, we analyzed the effect that voltage bias has on dendrite growth both in clean PCBs and PCBs that were contaminated.
Analysis Lab

Flexible Circuit Materials for High Temperature Applications
This paper reports on various flexible materials with recommendations for the best flexible materials for high temperature applications.
Materials Tech

Mechanical Shock and Drop Reliability Evaluation of the BGA Solder Joint Stack-Ups
This paper investigates the Mechanical Shock and Drop Reliability of SnAgCu ball Flip Chip BGA solder joints.
Production Floor

Hybrid Conformal Coatings Used for Mitigating Whisker Growth
In this work, we have synthesized a conformal polyurethane coating consisting of hard (hexamethylene di-isocyanate) and soft (polyol) segments.
Analysis Lab

What is the Suggested Humidity Level for Electronics Assembly?
I am aware of the suggested humidity level for an electronics assembly facility. Do the same limits apply within a 100,000 class clean room?
Board Talk

Formulation of a New Liquid Flux for High Temperature Soldering
This paper presents the development of a new liquid flux. Laboratory and beta-site test results for existing fluxes are compared to this new flux.
Materials Tech

AI and Precision Agriculture Address Farming Problems
Automation with biology and chemistry to create a farming revolution which enabled a fraction of the population to deliver more than had formerly produced.
Technology Briefing

Combing Automated Advanced Process Control with Feedback
This presentation will explore Industry 4.0, and then explore how Advanced Process Control (APC) can increase production yields and reduce defects.
Production Floor

The Perfect Copper Surface
To provide the functionality in today's electronics, printed circuit boards are approaching the complexity of semiconductors.
Analysis Lab

Lightning Stikes in the Chemistry Lab
As a lightning bolt hit near a lab, a blue spark jumped from a radio in the lab room to a student. Was the spark lightning?
Mysteries of Science

Assembly and Reliability of a Novel High Density Dual Row MaxQFP
The paper focuses on all aspects of SMT assembly of the MaxQFP. The robustness of the assembly in automotive type board-level thermal cycling will be demonstrated.
Production Floor

A Better Way to Pilot Emerging Technologies

For companies adopting a particular technology, it’s much harder to quantify the value of emerging technologies that are not yet being widely used.
Technology Briefing

CVS Control of Via Fill Acid Copper Electroplating Baths
This paper presents electrochemical techniques for analyzing additives commonly used in via fill plating baths.
Analysis Lab

Development of Materials Informatics Platform

Materials Informatics is one of the hottest technologies because of its potential to reduce the time and costs of discovering innovative materials.
Materials Tech

The Development of Hybrid Therma-EMI Solutions for Electronics
Test methods to measure the thermal and electromagnetic properties of a material in an application and as fundamental material properties are discussed.
Production Floor

Board Talk

Selective Solder Paste Printing for BGA Components

What is the Suggested Humidity Level for Electronics Assembly?

Cause of Long-Term Soldering Joint Cracking in Automotive Application

Hand Soldering Reliability

Does HASL or ENIG Reduce Creep Corrosion in Corrosive Environments?

Opens With Assembled QFN Components

Tips When Moving a Reflow Oven

Issues With SMT Component Alignment

MORE BOARD TALK

Questions and Comments

Cause of Long-Term Soldering Joint Cracking in Automotive Application

Consider also the solder alloy. These failures occurred within the ...
Ike Sedberry, ISEDS

Cause of Long-Term Soldering Joint Cracking in Automotive Application

Is the failing pin at the same location, such as ...
Wallace Huson Ables, Dell Technologies

Does HASL or ENIG Reduce Creep Corrosion in Corrosive Environments?

Creep corrosion is a mean thing and you have to ...
Frank Huijsmans, PIEK Int. Education Centre

MORE COMMENTS

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