Electronics Manufacturing and Electronics Assembly

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Trailblazing Process News for Conformal Coating
Say goodbye to clogged nozzles and hello to flawless conformal coating with the ASYMTEK Select Coat SL-1040 Ultrasonic Cleaning Station.
Nordson Electronics Solutions

Technical Papers

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible

PCB Rework Evolves, With X-ray a Constant Support

How pH Cleaning Agents Affect Production Performance

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

Understanding Solder Dross: Causes and Control Strategies

MORE TECHNICAL PAPERS

Ask the Experts

HASL Surface Finish and Coplanarity

Dam & Fill vs. Conformal Coating

Mixed MSL Baking

Automatic Insertion Causing Plated Hole Damage

MSD Components Baked Too Long

Adhesion Problems with Conformal Coating

Reliability of Automated Soldering vs. Hand Soldering

Frequency of Checking Solder Paste Viscosity

MORE ASK THE EXPERTS

Chemical Data vs Electrical Data - Which is a Better Reliability Predictor
This study looks to correlate IPC Chemical and Electrical CAF test results. The electrical testing utilized was found within the PCQR2 Database document.
Technical Paper

Status and Outlooks of Flip Chip Technology
Status of flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill is presented in this study.
Technical Paper

Sponsor

Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.

Board Level Failure Analysis Demount Challenges Package Package
Board level FA and component demount experiments for PoP mounted on PCB is discussed. The FA methods includes 2D and 3D X-ray imaging, cross section and DnP test.
Technical Paper

Does HASL or ENIG Reduce Creep Corrosion in Corrosive Environments?
We make electronics equipment used in corrosive environments. Do you recommend the use of HASL versus immersion gold for our application? The Assembly Brothers, Phil Zarrow and Jim Hall, answer this question.
Board Talk

Opens With Assembled QFN Components
We are experiencing opens on assembled QFN components at a rate of 9%. The failure only appears in rows near the component center. What is happening?
Board Talk

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Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron

Advance Board Level Modeling Wafer Level Packages
In this paper it is determined that the effective flexural modulus depends on the stackup and it often does not correlate with the effective tensile modulus.
Technical Paper

Advances Autonomous Driving V2X Technologies
This paper looks at the state of development of V2X and provides a perspective on this and other technologies required to make autonomous driving a reality.
Technical Paper

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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp

Residues on Probing PCBAS-Consistent Connections Across No-Clean Fluxes
In this study, concerns involving the reliability of probing different solder/flux compounds, the land configurations, the contact pressures and probe styles will be discussed in detail.
Technical Paper

Predicting the Reliability of Package-On-Package Interconnections
Package-on-package technologies are being considered to reduce the size, weight, and power of military, space, and satellite electronics.
Technical Paper

No-Clean Residue Shorts
We have a PCBA with a QFN 44 using no-clean flux. We have many test failures during testing. Are the failures due to flux reside between terminations? Jim Hall and Phil Zarrow, The Assembly Brothers, answer this question.
Board Talk

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"Ask the Experts" Program by Circuitnet
Do you have a question or process issue in PCB assembly? The Circuitnet "Ask the Expert's" program has over 100 panel members waiting to answer your question. Submit question now.
Circuitnet Media LLC

Additive Manufacturing Printed Circuit Board Assembly Processes
Utilizing 3D printing, the design process can be shortened and the manufacturing of the jigs and fixtures can replace the cost and lead time of traditional manufacturing.
Technical Paper

Multilayer Ceramic Capacitors: Mitigating Rising Failure Rates
The multilayer ceramic capacitor (MLCC) has become a widely used electronics component both for surface mount and embedded PCB applications.
Technical Paper

Sponsor

Micro Dispensing Technology White Paper
The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size.
DL Technology

Evaluating Rinsing Effectiveness in Spray-In-Air Cleaners
This study was designed to investigate the efficiency of the rinse cycle using both a spray-in-air batch and inline cleaner.
Technical Paper

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MORE INDUSTRY NEWS

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Bring IPC Training to Your Facility
Mobile training center offers IPC certified classes at your company’s facility making solder training effective and convenient for your entire team.
BEST Inc.

Sponsor

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura