|
December 11, 2025
|
SIR Test Method for Developing Evidence for the Production Assembly
The purpose of this paper is research on the development of temperature-humidity-bias instrumentation and test board designs for product acceptance. This paper reported research on both test boards and instrumentation for use at the assembly site. The instrument and test board combinations are tools to develop objective evidence.
Analysis Lab
|
|
|
|
| Sponsor |
|
Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
|
|
|
|
|
|
|
|
| Sponsor |
|
Save Without Compromise
Unlike other low-silver alloys, REL61 delivers 10-20% cost savings while improving performance across key metrics - no trade-offs needed.
AIM Solder
|
|
|
|
|
|
| Sponsor |
|
Need a Profiler Plan B?
Tired of having to share a thermal profiler across different soldering operations? Add the affordable V-M.O.L.E. 2 four-channel profiler to the mix for time-saving efficiency.
ECD
|
|
|
|
|
|
|
|
| Sponsor |
|
6 Common Mistakes of BGA Rework
BGA rework is one of the most challenging procedures you may need to master. Doing it right depends in large part on the skills and knowledge of the rework technician. Learn more ...
Circuit Technology Center
|
|
|
|
Reduction of Condensate Residues in the Reflow Process
Increased electronics manufacturing results in an increased amount of condensate residue. The problem is not only to meet the increased cleaning requirements with increasing production, it is much more the absence of knowledge about the condensate residue formation process and how this residue can be minimized and inhibited in its formation.
Production Floor
|
|
| Sponsor |
|
Underfill Epoxy Offers Thermal Conductivity
Master Bond EP29LPTCHT is a low viscosity adhesive that can be used for underfill & encapsulation apps. It offers thermal conductivity & electrical insulation.
Master Bond
|
|
Solder Performance and Reliability Assurance (SPRA) Project
The performance specification of solder requires that any solder being considered meet assembly requirements as well as the interconnects formed with the solder survive specified mechanical shock, thermal cycle, and vibrations environment conditions.
Materials Tech
|
|
