Electronics Manufacturing and Electronics Assembly

Can we score and de-panel assembled PCBs in one step to create a card edge connector on the PCB. Is there a precedence for doing this? The Assembly Brothers, Jim Hall and Phil Zarrow, share their own experiences with this scenario and offer suggestions.
Board Talk

CGA Trends and Capabilities
The Column Grid Array (CGA) module is a high reliability JEDEC format package, with several options adaptable to end user needs.
Production Floor

Wireless Network Transmits Data from Microelectronic Chips
A research team has developed a wireless communication network that can transmit, receive and decode data from thousands of microelectronic chips.
Technology Briefing

Direct Determination of Phosphorus Content in Electroless Nickel Plating
Developments in XRF instrument hardware and software have extended the measurement application of electroless plating processes to nearly any substrate.
Analysis Lab

Circuit Material Performance for PCBs at Millimeter Wave Frequencies
This paper gives an overview of which circuit material properties are important to mmWave frequency applications using PCBs.
Materials Tech

Applying Lean Philosophies to Supply Chain Management in EMS
A mid-tier EMS company's look at their use of technology, philosophy and partnerships to optimize its systems and facilitate growth.
Production Floor

Selective Soldering Design for Reliability Using SIR Test Method
The purpose of this research is to develop a test method designed to evaluate the electrochemical reliability of the selective soldering process at the assembly site.
Analysis Lab

Delay Before Cleaning Partial Assemblies
We're assembling circuit boards with a water soluble flux. Is it acceptable to leave these partially assembled boards for 3 to 4 days before finishing them?
Board Talk

Manufacture of Aluminum Substrate PCBs
A new fab method that uses an aluminum substrates that house fully tested and burned in components to create a component board is described.
Materials Tech

America Risks Losing Its Status As the Most Innovative Place on Earth
America holds a dominant position the Deep-Tech sectors from Artificial Intelligence to Biotechnology. This dominant position is not a byproduct of geography.
Technology Briefing

Using Rheology as a Measurement Potentially Predictive Tool
The types of rheology measurements studied here show trends that mirror the print volume and volume reproduceability for three pastes.
Production Floor

Advanced Substrate Technology for Heterogeneous Integration
The development of semiconductor technology and multi-function demands of end products has driven IC foundry industry toward 7nm node process.
Analysis Lab

Mystery of the Vanishing Foam
A lab developed a new type of foam mattress. Samples were shipped to a customer, but upon arrival the foam had disappeared. What happened?
Mysteries of Science

Dispensing EMI Shielding Materials: An Alternative to Sputtering
The development of a spray coating process to apply EMI shielding materials to the exterior surfaces of components on strips and larger SiP packages.
Production Floor

Flexible Sensors Provide Versatility or Wearable Electronics

Robots are becoming more agile and wearable electronics' traditional silicon-based sensors won’t make the cut in many applications.
Technology Briefing

Living With PB-Free in High Performance Engineering Design
As Pb-free technology increasingly becomes the standard for electronic interconnects and finishes, engineers must cope with the various challenges posed by this material.
Analysis Lab

Material Selection and Optimization for TMV PoP

Materials selection and parameter optimization to better understand the critical factors with successful TMV PoP assembly are investigated.
Materials Tech

Filling of Microvias and Through Holes by Electrolytic Copper Plating
This paper describes the reasons for development and a roadmap of dimensions for copper filled through holes, microvias and other copper plated structures on PCBs.
Production Floor

Board Talk

V-Score and Depanel in One Step

Delay Before Cleaning Partial Assemblies

Intrusive Soldering Through-Hole Connector

Solder Paste Transfer Efficiency - What/Why

Help With Lead to Hole Ratio

Going Beyond Your Solder Paste Work Life

Vapor Phase and Backward Compatibility

Cause of Damage During Through-hole Component Insertion

MORE BOARD TALK

Questions and Comments

Variations in SAC 305 Solder

Curious, after dross recovery what phosphorus, at such a low ...
Scott E. Fiske, Lockheed Martin Space

Intrusive Soldering Through-Hole Connector

And remember this little tip, as it is the most ...
Richard Stadem, General Dynamics Mission Systems

Vapor Phase and Backward Compatibility

HI Jim and Phil, I love your Board Talk Podcasts. ...
Gerry Partida, Summit Interconnect

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