Embedded Components from Concept-To-Manufacturing
Copper Foil Elements Affecting Transmission Loss with High Speed Circuits
pH neutral Cleaning Agents - Market Expectation & Field Performance
Reducing Dust Deposition on Electronic Equipment
New Requirements for Sir Measurement
Effects of Mixing Solder Sphere Alloys with Bismuth-Based Pastes
The Development of a 0.3 mm Pitch CSP Assembly Process
Generalizations About Component Flatness at Elevated Temperature
Latest Industry News
iPhone 12 Production Could Be Delayed
Acer sees PC component shortages
Bio-Ink for 3-D Printing Inside the Body
Covid Seen Driving the Security Sector
U.S. Eases Restrictions on Private Remote-Sensing Satellites
EMS Manufacturing quote complexity drives OEMs to look behind EMS curtain
U.S. Manufacturing Rebounds to 14-Month High
IBM's New AI Tool Parses A Tidal Wave of Coronavirus Research

Lean Flow on the SMT Factory Floor

How can a Lean, agile SMT operation be sustained by turning existing engineering programming and planning functions "upside down"?
Production Floor


Authored By:

Michael Ford
Mentor Graphics
Wilsonville, OR, USA


Today's SMT factories need to be flexible and agile, making continuously variable quantities of larger ranges of products, meeting volatile customer demand changes, without having to resort to the creation and storage of dormant stock. Creating a lean manufacturing flow in this environment is a major challenge for SMT, where experience shows that productivity is inversely proportional to the amount of changes that are needed.

Applying Lean separately to the production processes, and then also to production flow, has often resulted in conflicts so that neither approach has really become mainstream in the SMT area to the extent that might have been expected. A new approach is required, where we explore how a Lean, yet agile SMT operation can be created and sustained by turning existing engineering programming and planning functions "upside down" and using this as a basis to apply the ultimate in Lean thinking for manufacturing.

Initially Published in the SMTA Proceedings


No comments have been submitted to date.

Submit A Comment

Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name

Your Company
Your E-mail

Your Country
Your Comments

Board Talk
Solder Paste Beyond The Shelf Life?
Issues With Fillets on Via Holes?
Can Tape Residue Contaminate a Clean Tank?
Suggested Stencil Wipe Frequency?
Reflow Oven Zone Separation Challenges
When To Use Adhesive To Bond SMT Components
How To Clean a Vintage Circuit Board Assembly?
PCBA Inspection Concerns
Ask the Experts
Lifted Lead on SOT Component
Allowable Bow and Twist on Round PC Fab
Mixed MSL Baking
Step Stencil Squeegee Angle
Solder Balling Splash After Reflow
Application Using No-Clean and Water Soluble Fluxes
IPC SOIC Defect Question
Mixed Process Solder Joint Appearance, Smooth or Grainy?